CN106149033A - A kind of electroplating cell body for strengthening pcb board electroplating evenness - Google Patents
A kind of electroplating cell body for strengthening pcb board electroplating evenness Download PDFInfo
- Publication number
- CN106149033A CN106149033A CN201610648966.5A CN201610648966A CN106149033A CN 106149033 A CN106149033 A CN 106149033A CN 201610648966 A CN201610648966 A CN 201610648966A CN 106149033 A CN106149033 A CN 106149033A
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- CN
- China
- Prior art keywords
- anode
- negative electrode
- electroplating
- cell body
- thickness
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
Abstract
The present invention provides a kind of electroplating cell body for strengthening pcb board electroplating evenness, the top of described electroplating cell body is anode, negative electrode and anode are staggered relatively, and anode lengths is 10 times of anode thickness, negative electrode is the 1/2 of anode lengths with the vertical range of anode, and the thickness of negative electrode is anode 2 times, and the two ends of negative electrode are raised to anode direction, forming curves between two projections, the bottom lengths of negative electrode is consistent with anode, the edge line of negative electrode jut is 115 125 degree with the angle of cathode bottom intersection, the bottom of negative electrode is scaffold baffle plate, the height of scaffold baffle plate is 2 times of anode thickness, the bottom of electroplating cell body is placed on the base of, the thickness of base is the 1/4 of anode lengths.The present invention utilizes the cell body of particular design, it is possible to obtain stable electroplating evenness, and electroplating evenness can reach more than 95%；The design of cell body simultaneously can ensure that the activity of electroplating liquid medicine, extends the service life of liquid medicine.
Description
Technical field
The present invention relates to the plating link in pcb board manufacturing process, be specifically related to a kind of for strengthening pcb board plating uniformly
The electroplating cell body of property.
Background technology
PCB along with electronic product technology high-speed leap, HDI product, panel computer product, mobile phone products are a series of
Wiring board towards high density, highly integrated, fine rule road, small-bore, lightening direction high speed development, the live width of line layer, spacing
Requiring less and less, the precision requirement of circuit is also more and more higher.Line layer develops into 2mil/ from traditional 100mm/100mm
2mil, live width tolerance from traditional ± 20% develop into ± 5%, thus increasingly higher wanting is proposed to the thick uniformity of electro-coppering
Ask, when electro-coppering thickness ununiformity is even, the thick extreme difference of copper exceedes etch capabilities, cause the position that different Cu is thick under same etching condition
Etch quantity different, cause that circuit local etching is net, etching excessively or simultaneously have that etching is net and etching excessively,
And then affecting impedance, edges of boards are different with plate internal impedance, or the live width between same plate different delivery unit, impedance differ
Sample.Electric plating of whole board copper facing uniformity is one of factor crucial in the influence factor of fine and closely woven circuit etching.Therefore, one is worked out
The electroplating cell body that can strengthen electroplating evenness is most important.
In prior art, the design major part with regard to electroplating bath is all by changing the blue position of titanium, discharge quantity, Yi Jijing
Really calculate jet pipe, nozzle, inflate the parameters such as the direction in hole, quantity, distance to realize the purpose of uniformly-coating, although achieve one
Determine effect, but complex operation, relatively costly, and the uniformity of plating improves little.
Content of the invention
The present invention is directed to the deficiencies in the prior art, provide a kind of electroplating cell body for strengthening pcb board electroplating evenness.
The present invention can be achieved through the following technical solutions:
A kind of electroplating cell body for strengthening pcb board electroplating evenness, the top of described electroplating cell body is anode, negative electrode
Being staggered relatively with anode, and anode lengths being 10 times of anode thickness, negative electrode is anode lengths with the vertical range of anode
1/2, and the thickness of negative electrode is anode 2 times, and the two ends of negative electrode are raised to anode direction, forming curves between two projections, cloudy
The bottom lengths of pole is consistent with anode, and the edge line of negative electrode jut is 115-125 degree with the angle of cathode bottom intersection, and
Negative electrode is adjustable with the area ratio of anode, and the bottom of negative electrode is scaffold baffle plate, and the height of scaffold baffle plate is 2 times of anode thickness,
The bottom of electroplating cell body is placed on base, and the thickness of base is the 1/4 of anode lengths.
The invention have the benefit that by the particular design to electroplating cell body, it is possible to obtain stable electroplating evenness,
And electroplating evenness can reach more than 95%；The design of cell body simultaneously can ensure that the activity of electroplating liquid medicine, extends liquid medicine
Service life.
Brief description
Fig. 1 is the structural representation of a kind of electroplating cell body for strengthening pcb board electroplating evenness.
In accompanying drawing: the 1st, anode of electrolytic cell；2nd, electroplating bath negative electrode；3rd, scaffold baffle plate；4th, base.
Detailed description of the invention
Made an explanation by detailed description of the invention and accompanying drawing to the present invention for the embodiment below.
Embodiment
A kind of electroplating cell body for strengthening pcb board electroplating evenness, the top of described electroplating cell body is anode 1, cloudy
Pole 2 and anode 1 are staggered relatively, and negative electrode 2 is 10cm with the vertical range of anode 1, and the thickness of anode 1 is 2cm, a length of
20cm, and the twice that the thickness of negative electrode 2 is anode 1, and the two ends of negative electrode 2 are raised to anode 1 direction, form song between two projections
Line, the bottom lengths of negative electrode 2 is consistent with anode 1, and bottom the edge line of negative electrode 2 jut and negative electrode 2, the angle of intersection is 120
Degree, and the ratio adjustable of negative electrode 2 and anode 1 area；The bottom of negative electrode 2 is scaffold baffle plate 3, and the height of scaffold baffle plate 3 is
4cm, the bottom of electroplating cell body is placed on base 4, and the thickness of base is 5cm.
The invention have the benefit that by the particular design to electroplating cell body, it is possible to obtain stable electroplating evenness,
And electroplating evenness can reach more than 95%；The design of cell body simultaneously can ensure that the activity of electroplating liquid medicine, extends liquid medicine
Service life.
The foregoing is only highly preferred embodiment of the present invention, not in order to limit the present invention, all essences in the present invention
Any modification, equivalent and the improvement etc. made within god and principle, should be included within the scope of the present invention.
Claims (1)
1. the electroplating cell body being used for strengthening pcb board electroplating evenness, it is characterised in that the top of described electroplating cell body is
Anode, negative electrode is staggered relatively with anode, and anode lengths is 10 times of anode thickness, and negative electrode is anode with the vertical range of anode
The 1/2 of length, and the thickness of negative electrode is anode 2 times, and the two ends of negative electrode are raised to anode direction, form song between two projections
Line, the bottom lengths of negative electrode is consistent with anode, and the edge line of negative electrode jut is 115-125 with the angle of cathode bottom intersection
Degree, the bottom of negative electrode is scaffold baffle plate, and the height of scaffold baffle plate is 2 times of anode thickness, and the bottom of electroplating cell body is placed on base
On, the thickness of base is the 1/4 of anode lengths.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610648966.5A CN106149033A (en) | 2016-08-09 | 2016-08-09 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610648966.5A CN106149033A (en) | 2016-08-09 | 2016-08-09 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106149033A true CN106149033A (en) | 2016-11-23 |
Family
ID=57329446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610648966.5A Pending CN106149033A (en) | 2016-08-09 | 2016-08-09 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106149033A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107090589A (en) * | 2017-06-07 | 2017-08-25 | 东莞市品升电子有限公司 | PCB electroplanting devices and electroplating thickness control method |
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| CN102021638A (en) * | 2010-12-30 | 2011-04-20 | 东莞市宏德电子设备有限公司 | Anode for improving electroplating uniformity |
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| CN1372019A (en) * | 2001-02-28 | 2002-10-02 | 研能科技股份有限公司 | Device and method for controlling electric power line distribution |
| US20050205429A1 (en) * | 2004-03-19 | 2005-09-22 | Gebhart Lawrence E | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
| JP2006249450A (en) * | 2005-03-08 | 2006-09-21 | Nisshin Kasei Kk | Plating method and plating device |
| CN101054701A (en) * | 2007-02-08 | 2007-10-17 | 上海美维科技有限公司 | Method of increasing electroplating evenness |
| CN201016123Y (en) * | 2007-03-06 | 2008-02-06 | 厦门弘信电子科技有限公司 | Cathode guard board structure for flexible circuit board plating technology |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107090589A (en) * | 2017-06-07 | 2017-08-25 | 东莞市品升电子有限公司 | PCB electroplanting devices and electroplating thickness control method |
| CN107090589B (en) * | 2017-06-07 | 2022-03-08 | 陕西克莱铭节能科技有限公司 | PCB electroplating device and electroplating thickness control method |
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Application publication date: 20161123 |