CN200999265Y

CN200999265Y - Baffle plate for electric plating

Info

Publication number: CN200999265Y
Application number: CNU2007200671459U
Authority: CN
Inventors: 程凡雄; 宋景勇; 黄伟
Original assignee: SHANGHAI MEADVILLE ELECTRONICS CO Ltd
Current assignee: SHANGHAI MEADVILLE ELECTRONICS CO Ltd
Priority date: 2007-02-08
Filing date: 2007-02-08
Publication date: 2008-01-02
Anticipated expiration: 2017-02-08

Abstract

A baffle for electroplating is provided, which comprises a plate with windowing and a rid positioned on at least one side of the plate and connected with the plate. When electroplating, the baffle laying ribs on the plate is used, which can block the power line rounding the baffle edge and eliminate the electroplating edge effect of the baffle to be beneficial for improving the evenness of the electroplated layer thickness.

Description

Be used for galvanized baffle plate

Technical field

The utility model relates to a kind of galvanized baffle plate that is used for, and is specially adapted to improve the homogeneity of (printed circuit board etc.) galvanization coating thickness.

Background technology

The homogeneity of plated metal layer thickness is one of Key Performance Indicator of weighing electroplating quality.It is an important indicator that directly influences the subsequent machining technology quality of printed circuit board.Such as for common printed circuit board, the homogeneity with good copper electroplating layer thickness can access more uniform etching performance, because help the making of fine-line; And for encapsulating carrier plate, electroplate as final surface-treated nickel metal layer, the electrolytic coating thickness with excellent homogeneity can obtain reliable welding property, also could improve the yield rate of product.

In the prior art,, generally use baffle plate in order to improve the homogeneity of electrolytic coating thickness.This baffle plate is to make with insulating material, is placed between the anode and cathode in the interior electroplate liquid of plating tank, blocks a part of power line in order to reach the uniform distribution of power line by baffle plate, improves the homogeneity of electrolytic coating with this.This baffle plate is near more from negative electrode (by electronplate), and is big more to the electric force lines distribution influence.In using the electroplating process of baffle plate, its coating inhomogeneous is mainly derived from power line by the result who concentrates the fringing effect that is brought at electronplate (printed board) edge.Common baffle plate is usually designed to planar shaped, then according to reality by the area size of electronplate (printed board), hollow out goes out to be slightly less than by the window of electronplate (printed board) area on baffle plate, prolonging power line with this arrives by the distance at electronplate edge, reduction is reached for this reason and weakens the purpose of electroplating fringing effect by the power line intensity at electronplate edge.

In production application, when using the planar shaped baffle plate, thick partially easily by the coating of electronplate (printed board) lower part.When reason is to use the planar shaped baffle plate, can be by electronplate (printed board) top near liquid level, and also the height of baffle plate generally surpasses liquid level, therefore, do not have power line to walk around baffle plate top and concentrates on by the top of electronplate; And the bottom of baffle plate is bigger from liquid bottom surface distance, so the base that power line can be walked around baffle plate concentrates on by the bottom of electronplate, thereby makes by the coating of electronplate bottom thick partially.As shown in Figure 1, negative electrode is by electronplate among Fig. 1, is the two sides galvanization coating by electronplate, and two baffle plates are seated in the both sides of negative electrode (by electronplate) respectively, clearly shows power line and walk around the base of baffle plate and be mapped on the negative electrode (by electronplate) from Fig. 1.Therefore, thicker by the thickness of coating of electronplate bottom than the thickness of top coating.For improvement, though can be by the lengthening baffle plate avoiding or to reduce the power line of walking around the baffle plate base, behind the baffle plate lengthening to this problem, can increase the difficulty of installing, and when the size of baffle plate increases, the bottom that makes the base of baffle plate run into plating tank easily, will influence (or can't) plating.

Summary of the invention

The purpose of this utility model is the defective at above-mentioned baffle plate existence described in the prior art, a kind of galvanized baffle plate that is used for is provided, use baffle plate of the present utility model, neither increase the difficulty of operation, can reduce the plating fringing effect of baffle plate again effectively, raising is improved by the performance of electronplate product by the homogeneity of electronplate galvanization coating.

Baffle plate of the present utility model to achieve the above object, the technical scheme that is adopted is: it comprises and has the plate body of windowing, and places the rib that with plate body connect together of plate body at least on one side.

Structure as above-mentioned the utility model baffle plate, when using the utility model baffle plate to electroplate, the one side that plate body is equipped with rib puts in the base in the electroplate liquid in the plating tank as baffle plate, perhaps the plate body both sides are equipped with the limit of rib, the limit that perhaps plate body three limits is equipped with rib puts in base in the electroplate liquid and side in the plating tank as baffle plate; Rib on this plate body has been blocked the power line that can walk around baffle edge (base or walk around dual-side), has eliminated the plating fringing effect, makes consistent with the thickness of coating of other parts by the thickness of coating of the bottom coating of surfacing and two sides.Therefore, improved integral body by the homogeneity of surfacing thickness of coating.Support plate with a 16*20 inch is an example, and the gauge control of electroless nickel layer is at 10 microns, and criterion of acceptability is the 5-15 micron, and the poorest error is no more than 10 microns.As above-mentioned planar shaped baffle plate used in the prior art, after electroplating, the thickness distribution of nickel coating is between the 6-17 micron, and error is 11 microns, has exceeded the limit of error of criterion of acceptability; After adopting the baffle plate that has a rib of the present utility model, utilize identical plating condition to electroplate, the thickness distribution of its nickel coating is in the 8-13 micron, and error only is 5 microns, meets qualified standard fully.Obviously, adopt baffle plate of the present utility model to improve the homogeneity of galvanization coating, improved by the product performance of electronplate and yield rate.

Description of drawings

Fig. 1 is the structural representation of the utility model baffle plate one embodiment;

Fig. 2 is the sectional view of Figure 1A-A face;

Fig. 3 is the synoptic diagram of another example structure of the utility model baffle plate;

Fig. 4 is the sectional view of Fig. 3 B-B face;

Fig. 5 is to use the prior art baffle plate to electroplate the distribution plan of power line;

Fig. 6 is to use the utility model baffle plate to electroplate the distribution plan of power line.

Embodiment

Further specify structure of the present utility model and characteristic below in conjunction with accompanying drawing.

Among the embodiment as shown in Figure 1, 2, baffle plate of the present utility model comprises and has 2 the plate body 1 of windowing, and places to go up on one side on the plate body 1 and rib 3 that plate body 1 links together.The longitudinal cross-section of baffle plate (A-A section) is L-shaped, as shown in Figure 2.

Among another embodiment shown in Fig. 3,4, baffle plate of the present utility model comprises and has 2 the plate body 1 of windowing, and places the rib 3 that links together with plate body 1 on three limits on the plate body 1.The cross section of baffle plate (B-B section) is  shape, as shown in Figure 4.

The described height that places the rib 3 that links together with plate body 1 on the plate body 1 can less than, or equal, or greater than by electronplate by the distance of surfacing to baffle surface.In the present embodiment, the size of baffle plate is wide is: 25.4 centimetres～610 centimetres; Height is: 25.4 centimetres～610 centimetres, its baffle surface to by electronplate be 0.5 centimetre～20 centimetres by the distance of surfacing, the height of rib is 0.5 centimetre～20 centimetres.

In the present embodiment, describedly place on the plate body 1 and rib and the angle between the baffle plate that plate body 1 links together can be between 0 °-180 °.

Fig. 5 is to use the baffle plate in the technology formerly, the trend of power line in plating tank.In the present embodiment, requirement is two-sided coating by electronplate (printed circuit board), placed in the electroplate liquid in the plating tank as negative electrode by electronplate, put two anodes in the electroplate liquid of surfacing with respect to two, put a baffle plate of windowing between two anodes and two are by surfacing respectively, what power line passed that windowing of baffle plate be mapped to negative electrode is formed coating on the surfacing; Expose liquid level by demonstrating baffle plate top among Fig. 1, do not have power line and walk around the problem that baffle edge is mapped to negative electrode top, also cause by the problem of surfacing top coating thickening with regard to not existing because of electroplating fringing effect; But the lower surface of baffle plate is on the liquid bottom surface, and the lower surface that the power line is here walked around baffle plate is mapped on the bottom of negative electrode, has caused by the thickening of the coating of surfacing bottom, makes that the thickness evenness of coating is relatively poor;

Fig. 6 is to use the trend of baffle plate of the present utility model power line when electroplating, and the plating condition is described identical with Fig. 1.But employed baffle plate is equipped with the rib that links together with baffle plate on the base, from Fig. 2, demonstrate obviously, under the lower surface of baffle plate, do not have power line to walk around, therefore, just do not exist by the coating of surfacing yet because the ununiformity that fringing effect caused of baffle plate.Rib shown in Figure 6 and the angle between the plate body are 90 °.

When the width of baffle plate during, in order to eliminate the power line of walking around the baffle plate dual-side, prevent that the fringing effect of negative electrode both sides from causing by the thickening of surfacing both sides coating, so that cause the ununiformity of thickness of coating less than the width of plating tank.Employed baffle plate is equipped with rib 3 on three limits of plate body 1 shown in Fig. 3,4.

Claims

1. one kind is used for galvanized baffle plate, and it comprises and have the plate body of windowing, and it is characterized in that comprising placing the rib that with plate body connect together of plate body at least on one side.