CN106167913B - Plating bath device - Google Patents
Plating bath device Download PDFInfo
- Publication number
- CN106167913B CN106167913B CN201610031542.4A CN201610031542A CN106167913B CN 106167913 B CN106167913 B CN 106167913B CN 201610031542 A CN201610031542 A CN 201610031542A CN 106167913 B CN106167913 B CN 106167913B
- Authority
- CN
- China
- Prior art keywords
- cell body
- anode
- spoiler
- flow
- plating bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007747 plating Methods 0.000 title claims description 40
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 210000005056 cell body Anatomy 0.000 claims description 35
- 239000012530 fluid Substances 0.000 claims description 14
- 210000001364 upper extremity Anatomy 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 abstract description 24
- 239000011148 porous material Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000012545 processing Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
Abstract
The embodiment of the invention discloses an electroplating bath device, which comprises a bath body, an orifice plate, an electroplating liquid flow pipe, two groups of anode boxes and two spoilers, wherein the orifice plate is arranged on the bath body; wherein, the pore plate and the bottom of the groove body form a space for accommodating the electroplating solution flow pipe, and a plurality of holes are arranged on the pore plate; the electroplating solution flow pipe penetrates through one wall surface of the tank body so as to inject electroplating solution into the tank body; the two groups of anode boxes are respectively arranged in the tank body and close to two opposite wall surfaces; the two spoilers are arranged between the two groups of anode boxes and externally connected with a power mechanism so as to push the two spoilers to move back and forth and disturb the electroplating solution in the tank body; a circuit board fixture can be accommodated between the two spoilers to clamp the circuit board to be plated.
Description
Technical field
The present invention relates to a kind of plating bath arrangement, more particularly to a kind of plating bath arrangement for having disturbance ability, suitable for electricity
The electroplating process of road plate.
Background technology
The microminiaturization of printed circuit board (PCB) (printed circuit board, or abbreviation circuit board) is also encountered by many systems
Difficulty in journey, therefore be the technology people of many electronic products of Come and mobile science and technology in recent years with the microminiaturization of related semiconductor circuit
The research emphasis of member.For example, commonly used copper facing (copper plating) step in circuit board process, in the skill of microminiaturization
Become important technical threshold in art.It is that a circuit board is immersed in a kind of plating cupric electrolysis for existing general plating copper technology
In liquid (copper plating solution), then through electrolysis (electrolysis) mode, by cathode copper
Micro through hole (micro via) that (electrolytic copper) is inserted on circuit board, electroplating ventilating hole (plated through
Hole, PTH), high-aspect-ratio (aspect ratio, AR) copper post (Cu-pillar) or cover uniformly and entirely particular surface
Region.However, with the microminiaturization of circuit board, through hole diminishes, the ratio of width to height improves, copper post or thin wire (fine line
Patterning efficiency and function that the threshold necessarily overcome just can ensure that circuit board) are all turned into.Interconnected with existing high density
For (high density interconnection, HDI) circuit board process, wherein, how cathode copper to be fully filled with micro-
Through hole is key problem without staying gas hole (void), more than improves the quality of circuit board, while also reduces expense with improving
Process rate.
Existing circuit board electroplating mode is electroplated using vertical continuous formula, and the fluid control design case of electroplating bath is jet flow side
Formula, its shortcoming be jet flow mechanism too strong in electroplating process can hinder filling hole balance it is uniform, or even dry film is sprayed sometimes
From plated plate；Along with plated sheet material is typically to be clamped in a manner of double fastener or four folders, easily cause conductive and flow field uneven
Situation, and then produce copper post and jump result of plating (missing bump) and the uniformity difference, therefore volume production can not be applied to.Again
Person, existing electroplating cell body is larger, and required plating liquid measure is more during copper facing, increases cost of manufacture.Therefore, prior art is often
It is about 1 to be limited to copper post plating depth-to-width ratio:The practice limit that the 1 practice limit and thin wire plating is about 15um × 15um.
It is not deposited for the microminiaturization circuit board of high request to use.
On the other hand, because this area circuit board process is totally different and complicated, therefore, many process apparatus are often only capable of being applicable
A particular step in a particular process, and different step in same processing procedure or not even with the step in processing procedure and can not
Intercommunication shares, therefore not only equipment investment is expensive, and placement equipment is carried out to perform processing procedure in manufacturing space that also must be bigger.
In view of this, how to improve electroplating bath design, different processing procedures or step can be suitably used for using elasticity with increase, and
Reduce cell body reduces spent cost to reduce required plating liquid measure, is for this area important issue.
The content of the invention
Embodiments of the invention propose an electroplating bath；The electroplating bath includes a cell body, an orifice plate, a plating fluid flow tube, two
Group anode cassette and two flow spoilers；Wherein, the orifice plate is arranged at the cell body close to the place of bottom, and one is formed with the cell body bottom
Space sets multiple holes to house the plating fluid flow tube on the orifice plate；The plating fluid flow tube is penetrated by a wall of the cell body,
So that electroplate liquid is injected into the cell body；Two groups of anode cassettes are respectively arranged in the cell body close to two relative walls, every group of anode
Box is also comprising an insoluble anode (insoluble anode) and an anode shade (anode shield), two groups of anode cassettes
Anode shade set face-to-face；Two flow spoiler is arranged between two groups of anode cassettes, and each flow spoiler is also disturbed comprising multi-disc
Flowing plate, the upper and lower ends of the multi-disc spoiler are linked respectively with two connecting rods and fixed, the external engine of two flow spoiler
Structure, to promote two flow spoiler to carry out returning the movement covered, to be disturbed to the electroplate liquid in cell body；Can between two flow spoiler
A circuit board tool is housed to clamp circuit board to be plated.
The beneficial effects of the present invention are the electroplating bath design that embodiments of the invention propose, can increase and use elastic energy
Suitable for different processing procedures or step, and reduce cell body and reduce spent cost to reduce required plating liquid measure.
Brief description of the drawings
Fig. 1 show the schematic cross-sectional view of an embodiment of the electroplating bath of the present invention.
Fig. 2 show the top view of Fig. 1 embodiment.
Fig. 3 show the flow direction schematic diagram of the electroplate liquid of Fig. 1 embodiment.
Wherein, description of reference numerals is as follows：
110 cell bodies
120 plating fluid flow tubes
121 electroplate liquid tap holes
130 orifice plates
131 holes
140 anode cassettes
150 flow spoilers
151 spoilers
160 circuit board tools
Embodiment
Hereinafter, with reference to accompanying drawing, describe in detail according to embodiments of the invention, so that those skilled in the art are easy to
Understand.Described creation can use the embodiment of a variety of changes, when being not limited to only these embodiments.The present invention omits
The description of prior art part (well-known part), and identical label represents identical element in the present invention.
Fig. 1 show the schematic cross-sectional view of an embodiment of the electroplating bath of the present invention, the electroplating bath is cut so that it is presented
Internal composition structure.As shown in figure 1, the electroplating bath of the present embodiment includes a cell body 110, one plating fluid flow tube 120, an orifice plate
130th, two groups of flow spoilers 150 of anode cassette 140 and two.Wherein, the cell body 110 is open type cell body on one, and the upper limb of its wall can
For putting；The orifice plate 130 is arranged at the cell body 110 close to the place of bottom, and a space is formed with accommodating with the bottom of cell body 110
The plating fluid flow tube 120, multiple holes 131 are set on the orifice plate 130；The plating fluid flow tube 120 by the cell body 110 a wall
Penetrate, electroplate liquid is injected into the cell body 110, multiple holes 131 that the electroplate liquid can pass through on the orifice plate 130 are flowed from bottom to top
Go out；Two groups of anode cassettes 140 are respectively arranged at the both sides in the cell body 110, close to two relative walls, every group of anode cassette 140
Also comprising an insoluble anode (insoluble anode) and an anode shade (anode shield) (not shown), this two
The anode shade of group anode cassette is set face-to-face；Two flow spoiler 150 is arranged between two groups of anode cassettes 140, each flow-disturbing
Device 150 also includes multi-disc spoiler 151, and is respectively linked the upper and lower ends of the multi-disc spoiler 151 admittedly by two connecting rods
It is fixed, the external actuating unit (not shown) of two flow spoiler 150, to promote two flow spoiler 150 to carry out returning the movement covered, with
Electroplate liquid in cell body 110 is disturbed；A circuit board tool (not shown) can be housed between two flow spoiler 150 to press from both sides
Hold circuit board to be plated.
It is worth noting that, two groups of anode cassettes 140, two flow spoiler 150 and the circuit for clamping circuit board to be plated
Plate tool (not shown) can all be inserted cell body 110 by the top of cell body 110, and be held on the upper of cell body wall with suspending way
Edge.Furthermore the part that the plating fluid flow tube 120 is located at the lower section of orifice plate 130 also sets up multiple electroplate liquid tap holes upward
121, flowed into so that place of the electroplate liquid from cell body 110 close to bottom is uniform.
Fig. 2 show the top view of Fig. 1 embodiment.As shown in Fig. 2 electroplating bath includes a cell body 110, one plating liquid stream
130, two groups of pipe 120, orifice plate flow spoilers 150 of anode cassette 140 and two, in figure and show that a circuit board tool 160 clamping is treated
The circuit board of plating, it is placed between two flow spoiler 150.It is worth noting that, the multi-disc spoiler 151 of two flow spoiler 150
To be arranged in parallel, and between the connecting rod can shape have angle, to reach the optimum efficiency of flow-disturbing.It is worth noting that, should
Two flow spoilers 150 are external promoting the actuating unit (not shown) of flow spoiler 150 to be carried out in a manner of low-frequency
Movement is covered in returning for rule, for example, in a preferred embodiment, the frequency can be between 0-10Hz.This disturbance purpose be by
Discharged in electroplating process in caused hydrogen weight electroplate liquid.Also, movement is covered in returning for two flow spoiler 150, can along with this
The parallel direction in the surface of circuit board to be plated up and down or moves left and right.
Fig. 3 show the flow direction schematic diagram of the electroplate liquid of Fig. 1 embodiment.As shown in figure 3, when the electroplate liquid certainly should
, can be from multiple holes 131 of the orifice plate 130 under after multiple electroplate liquid tap holes 131 outflow that plating fluid flow tube 120 is set upward
And upper flowing, then the flow direction from bottom to top cover disturbance by returning for two flow spoiler 150 again, can be equably to be plated
The surface flow of circuit board, improve the effect of plating.
In summary, the electroplating bath design that embodiments of the invention propose, can increase and can be suitably used for different systems using elasticity
Journey or step, and reduce cell body and reduce spent cost to reduce required plating liquid measure.
Therefore, electroplating bath of the invention really can borrow proposed technical scheme, reach desired purpose and effect, meet
The novelty of patent of invention, the creative necessary condition with practicality.
However, accompanying drawing set forth above and explanation, only presently preferred embodiments of the present invention, non-is to limit this
The implementation of invention, its institute's spirit under this invention of all those skilled in the art, the change or modification made, should all cover following
In the range of claims of this case.
Claims (9)
1. a kind of plating bath arrangement, comprising：
One cell body, an orifice plate, a plating fluid flow tube, two groups of anode cassettes and two flow spoilers；
Wherein, the orifice plate is arranged at the cell body close to the place of bottom, forms a space with the cell body bottom to house the plating
Fluid flow tube, multiple holes are set on the orifice plate；
The plating fluid flow tube is penetrated by a wall of the cell body, and an electroplate liquid is injected into the cell body；
Two groups of anode cassettes are respectively arranged at the both sides in the cell body, close to two relative walls；
Two flow spoiler is arranged between two groups of anode cassettes, two flow spoiler can an external actuating unit to promote two flow-disturbing
Device carries out returning the movement covered, to be disturbed to the electroplate liquid in cell body；A circuit board tool can be housed between two flow spoiler
To clamp circuit board to be plated.
2. plating bath arrangement as claimed in claim 1, wherein every group of anode cassette also include an insoluble anode and an anode
Shade, and the anode shade of two groups of anode cassettes is set face-to-face.
3. plating bath arrangement as claimed in claim 1, wherein each flow spoiler also includes multi-disc spoiler, the multi-disc flow-disturbing
The upper and lower ends of the multi-disc spoiler are linked and fixed to be arranged in parallel by plate respectively by two connecting rods, the multi-disc spoiler
Between the connecting rod can shape have angle.
4. plating bath arrangement as claimed in claim 1, wherein two flow spoiler are external promoting the power of flow spoiler
Mechanism is carried out returning for rule in a manner of low-frequency and covers movement.
5. plating bath arrangement as claimed in claim 4, the wherein low frequency are between 0-10Hz.
6. plating bath arrangement as claimed in claim 4, wherein returning for two flow spoiler cover movement, can along with the circuit to be plated
The parallel direction in the surface of plate up and down or moves left and right.
7. plating bath arrangement as claimed in claim 1, the part that wherein the plating fluid flow tube is located at below the orifice plate is also set up
Multiple electroplate liquid tap holes upward.
8. plating bath arrangement as claimed in claim 1, wherein two groups of anode cassettes all can be with hanging sides with two flow spoiler
Formula is placed in the upper limb of the cell body wall.
9. plating bath arrangement as claimed in claim 1, wherein the circuit board tool can be placed in the cell body with suspending way
The upper limb of wall.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104116086A TWI615511B (en) | 2015-05-20 | 2015-05-20 | Plating tank |
| TW104116086 | 2015-05-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106167913A CN106167913A (en) | 2016-11-30 |
| CN106167913B true CN106167913B (en) | 2018-02-13 |
Family
ID=57359008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610031542.4A Active CN106167913B (en) | 2015-05-20 | 2016-01-19 | Plating bath device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106167913B (en) |
| TW (1) | TWI615511B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI663293B (en) * | 2018-06-22 | 2019-06-21 | 先豐通訊股份有限公司 | Gaseous agitating device of electroplating system |
| TWI668335B (en) * | 2018-08-22 | 2019-08-11 | 華紹國際有限公司 | Plating device and plating method |
| CN109735892A (en) * | 2019-03-20 | 2019-05-10 | 广东天承科技有限公司 | A kind of VCP electroplanting device |
| JP7355566B2 (en) | 2019-09-11 | 2023-10-03 | 株式会社荏原製作所 | Plating treatment equipment, pretreatment equipment, plating equipment, plating treatment method, and pretreatment method |
| CN110629263B (en) * | 2019-11-11 | 2021-08-27 | 生益电子股份有限公司 | PCB electroplating device |
| CN110629264B (en) * | 2019-11-11 | 2021-09-24 | 生益电子股份有限公司 | PCB electroplating device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080003247U (en) * | 2007-02-07 | 2008-08-12 | 장관섭 | An anodizing of Electrolyte agitation system |
| CN205821499U (en) * | 2016-07-07 | 2016-12-21 | 台湾先进系统股份有限公司 | Plating bath arrangement |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5650899B2 (en) * | 2009-09-08 | 2015-01-07 | 上村工業株式会社 | Electroplating equipment |
| TWM424336U (en) * | 2011-08-30 | 2012-03-11 | Triallian Corp | Electroplating tank |
| CN203474939U (en) * | 2013-04-27 | 2014-03-12 | 株式会社荏原制作所 | Electroplating device |
-
2015
- 2015-05-20 TW TW104116086A patent/TWI615511B/en active
-
2016
- 2016-01-19 CN CN201610031542.4A patent/CN106167913B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080003247U (en) * | 2007-02-07 | 2008-08-12 | 장관섭 | An anodizing of Electrolyte agitation system |
| CN205821499U (en) * | 2016-07-07 | 2016-12-21 | 台湾先进系统股份有限公司 | Plating bath arrangement |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201641751A (en) | 2016-12-01 |
| CN106167913A (en) | 2016-11-30 |
| TWI615511B (en) | 2018-02-21 |
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