TWI668335B - Plating device and plating method - Google Patents

Abstract

The invention discloses an electroplating device, which comprises a tank body, a bearing unit and a movable unit. The tank stores the plating solution. The carrying unit can be movably suspended in the tank, and the carrying unit carries the object to be plated. The movable unit is movably located in the tank. Among them, the movable unit performs a swinging motion in a controlled manner to disturb the plating solution. Thereby, the electroplating device of the present invention can improve the efficiency and quality of electroplating.

Description

Electroplating device and electroplating method

The invention relates to an electroplating device and electroplating method, in particular to a novel electroplating device and electroplating method.

With the miniaturization of the printed circuit board, it faces many difficulties in the manufacturing process. It is necessary to overcome the thresholds of smaller through holes and increased aspect ratio to ensure the effectiveness and function of the circuit board.

At present, the current circuit board plating methods include vertical continuous plating and gantry plating. Both use nozzles in the form of jet flow as their stirring method. This method is difficult to ensure that the jet flow of each nozzle is consistent. It is offset by the plating liquid in the tank, and the mixing efficiency is not good. And the nozzle mechanism and pipeline must occupy a considerable volume in the tank. And its pump and filter also need to occupy considerable space.

Furthermore, the current electroplating tanks are relatively large, and the minimum amount of circulating electroplating solution that must be established during copper plating is large, thereby increasing production costs.

The technical problem to be solved by the present invention is to provide an electroplating device and electroplating method in view of the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide an electroplating device, which includes a tank, a carrying unit, and at least one movable unit. The tank stores the plating solution. The carrying unit can be movably suspended in the tank, and the carrying unit carries the object to be plated. At least one movable unit is movably located in the tank. Among them, at least one movable unit is controlled to perform a swinging motion to disturb the plating solution.

In order to solve the above technical problems, another technical solution adopted by the present invention Yes, a method for electroplating is provided, which includes the following steps: carrying an object to be plated through a carrying unit; suspending the carrying unit in the tank; and swinging by controlling at least one movable unit to disturb the plating solution in the tank .

One of the beneficial effects of the present invention is that the electroplating device and the electroplating method provided by the present invention can be movably suspended in the trough through the "bearing unit, and the carrier unit carries the object to be plated", "the movable unit can be movably The technical solution of "locating in the tank" and "the movable unit is controlled to swing to disturb the electroplating solution" to provide a novel electroplating device and electroplating method, and at the same time, can also improve the efficiency and quality of electroplating.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and explanation only, and are not intended to limit the present invention.

1‧‧‧Electroplating device

10‧‧‧Slot body

11‧‧‧ Bearing unit

12‧‧‧ Activity Unit

120‧‧‧ linkage

121, 121A, 121B‧‧‧Anode

13‧‧‧Drive unit

14‧‧‧Filter unit

15‧‧‧Circulation unit

16‧‧‧Temporary storage unit

2‧‧‧plating solution

3‧‧‧ Objects to be plated

θ‧‧‧ included angle

FIG. 1 is a schematic top view of a plating apparatus according to a first embodiment of the invention.

2 is a schematic cross-sectional view of an electroplating apparatus according to a first embodiment of the invention.

3 is a schematic top view of an electroplating apparatus according to a second embodiment of the invention.

4 is another schematic top view of an electroplating apparatus according to a second embodiment of the invention.

5 is a schematic top view of an electroplating apparatus according to a third embodiment of the invention.

6 is a schematic side view of an electroplating apparatus according to a third embodiment of the invention.

7 is a schematic top view of a plating apparatus according to a fourth embodiment of the invention.

8 is a schematic structural diagram of a plating apparatus according to a fifth embodiment of the invention.

9 is a first flow chart of the electroplating method of the present invention.

10 is a second flow chart of the electroplating method of the present invention.

The following are specific specific examples to illustrate the implementation of the "plating apparatus and plating method" disclosed by the present invention. The disclosed content understands the advantages and effects of the present invention. The present invention can be implemented or applied through other different specific embodiments. Various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are declared in advance. The following embodiments will further describe related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" as used herein may include any combination of any one or more of the associated listed items, depending on the actual situation.

[First embodiment]

Please refer to FIGS. 1 and 2, which are a schematic top view and a schematic cross-sectional view of an electroplating apparatus according to a first embodiment of the present invention. As shown in the figure, this embodiment provides an electroplating apparatus 1 including a tank 10, a carrying unit 11 and at least one movable unit 12. The tank 10 stores the plating solution 2. The carrying unit 11 can be movably suspended in the tank 10, and the carrying unit 11 carries the object 3 to be plated. At least one movable unit 12 is movably located in the tank 10. Among them, at least one movable unit 12 performs a swinging motion in a controlled manner to disturb the plating solution 2.

Specifically, the electroplating device 1 of the present invention includes a tank 10, a carrying unit 11 and at least one movable unit 12. The tank body 10 may be a liquid storage tank that stores the plating solution 2. The bearing unit 11 may be an existing jig or jig for clamping and fixing the object 3 to be plated (which may be a metal plate, but not limited to this), and the bearing unit 11 may be suspended in the tank body 10 and dipped In the plating solution 2. In this embodiment, the movable unit 12 is taken as an example, but not limited to this; the movable unit 12 is detachable and can be suspended or arranged movably in the tank 10 and immersed in the plating solution 2.

Therefore, when the electroplating apparatus 1 of the present invention performs the electroplating process, the movable unit 12 It will be controlled to carry out continuous swinging motion to continuously disturb the electroplating solution 2 in the tank 10 and increase the flow rate of the electroplating solution 2, so that the electroplating solution 2 can be continuously and uniformly on the surface of the object 3 to be plated The flow can further completely fill the micro-vias on the surface of the object 3 to be plated with the electroplating material of the electroplating solution 2 without leaving air holes, thereby improving the polarization effect and the drop of the concentration gradient of the chemical solution in the electroplating process.

Thereby, the electroplating device 1 of the present invention can provide a novel electroplating device in the technical field through the above structural design; at the same time, it can also improve the efficiency and quality of electroplating.

In one of the preferred embodiments, at least one movable unit 12 includes a linking member 120 located in the tank 10 and an anode member 121 movably connected to the linking member 120. The linking member 120 is controlled to drive the anode member 121 to proceed Swing to move. That is to say, the movable unit 12 of the present invention includes a linking member 120 and an anode member 121. The linking member 120 may be like a linking structure of a louver, but not limited to this; the anode member 121 may be a soluble or insoluble anode and its anode Bags, ion exchange membranes (ion-exchange membranes), and their structural supports, but not limited to this. The linking member 120 can be suspended from the tank body 10, and the anode member 121 is pivotally connected to the linking member 120 and is located in the tank body 10. Therefore, the actuator 120 (such as a motor, but not limited to this) drives the linkage member 120 to drive the anode member 121 to swing, so as to continuously disturb the plating solution 2 in the tank 10, so that the plating solution 2 can continue and It flows evenly on the surface of the object 3 to be plated, so that the electroplating substance in the plating solution 2 can completely fill the micro through holes on the surface of the object 3 to be plated without leaving air holes.

It is worth mentioning that although the above description can understand the embodiments, advantages and effects of the present invention; however, the above-mentioned examples are only one of the feasible embodiments and are not intended to limit the present invention.

[Second Embodiment]

Please refer to FIGS. 3 and 4, which are respectively a top schematic view and another top schematic view of an electroplating apparatus according to a second embodiment of the invention. As shown in the figure, the electroplating of this embodiment The device operates in the same way as the electroplating device of the first embodiment described above, which will not be repeated here. It is worth noting that in this embodiment, at least one movable unit 12 further includes a plurality of anode members 121A, 121B, A plurality of anode members 121A, 121B are juxtaposed with each other and movably connected to the linking member 120. The linking member 120 is driven to carry a plurality of anode members 121A and 121B to perform a symmetrical swing operation to disturb the plating solution 2.

For example, the at least one movable unit 12 of the present invention may further include a plurality of anode members 121A, 121B, which can be connected to the linking member 120 in parallel with each other. Therefore, when the electroplating apparatus 1 of the present invention performs the electroplating process, the linking member 120 is controlled to drive the plurality of anode members 121A, 121B to perform continuous swinging motions, and the swinging motions swing symmetrically, for example, clockwise Rotate in the direction or counterclockwise to continuously disturb the plating solution 2 in the tank 10 and increase the flow rate of the plating solution 2 so that the plating solution 2 can flow continuously and evenly on the surface of the object 3 to be plated Then, the electroplating substance in the electroplating solution 2 can completely fill the micro-through holes on the surface of the object 3 to be plated without leaving air holes.

In a preferred embodiment, at least one movable unit 12 further includes a plurality of anode members 121A, 121B, and the plurality of anode members 121A, 121B are juxtaposed with each other and movably connected to the linking member 120. The linking member 120 is driven to carry a plurality of anode members 121A, 121B to perform an asymmetrical swing operation to disturb the plating solution 2.

That is to say, the plurality of anode members 121A, 121B of at least one movable unit 12 of the present invention can also be driven by the linking member 120 to exhibit an asymmetrical swing motion, for example, one of the anode members 121A rotates clockwise, and the other An anode member 121B rotates counterclockwise to continuously disturb the plating solution 2 in the tank 10 and increase the flow rate of the plating solution 2 so that the plating solution 2 can continuously and uniformly flow on the surface of the object 3 to be plated Then, the electroplating substance in the electroplating solution 2 can completely fill the micro-through holes on the surface of the object 3 to be plated without leaving air holes.

It is worth mentioning that although the above description can understand the embodiments, advantages and effects of the present invention; however, the above-mentioned examples are only one of the feasible embodiments and are not intended to limit the present invention.

[Third Embodiment]

Please refer to FIGS. 5 and 6, which are a schematic top view of a plating apparatus according to a third embodiment of the present invention and a side schematic view of the plating apparatus according to a third embodiment of the present invention. As shown in the figure, the electroplating apparatus of this embodiment is similar to the electroplating apparatus of the above embodiments in the same manner of operation, which is not repeated here. It is worth noting that in this embodiment, at least one movable unit 12 A plurality of anode members 121 are included, and the plurality of anode members 121 are juxtaposed with each other and connected to the linking member 120. The linking member 120 is driven to carry a plurality of anode members 121 in a reciprocating swing motion in the first direction or the second direction to disturb the plating solution 2.

For example, the at least one movable unit 12 of the present invention may further include a plurality of anode members 121. As shown in FIG. 5, a plurality of anode members 121 may be arranged obliquely and arranged side by side on the linking member 120 in a left-right arrangement manner, wherein an angle θ may be formed between each anode member 121 and the linking member 120, the angle θ is between 0 to 179 degrees, and the angle θ formed by each anode member 121 and the linking member 120 may be the same as each other, partially the same, or different from each other; the linking member 120 may be a movable element suspended from the tank 10. Therefore, when the electroplating apparatus 1 of the present invention performs the electroplating process, the linkage member 120 can be driven to swing left and right by an actuating device (such as a motor, but not limited to this), so that the linkage member 120 drives the multiple anode members 121 toward The first direction (for example, the left-right direction) performs a reciprocating swing motion, thereby achieving the effect of disturbing the plating solution 2 so that the plating solution 2 can continuously flow on the surface of the object 3 to be plated.

In addition, as shown in FIG. 6, a plurality of anode members 121 of the present invention can also be arranged obliquely and arranged on the linking member 120 in a stacking manner; wherein, an angle θ can be formed between each anode member 121 and the linking member 120, The included angle θ is between 0 and 179 degrees, and the included angle θ formed by each anode member 121 and the linking member 120 may be the same as each other, partially the same, or different from each other. Therefore, when the electroplating apparatus 1 of the present invention performs the electroplating process, the actuating device can drive the linking member 120 to swing up and down, so that the linking member 120 drives the plurality of anode members 121 to reciprocate in the second direction (for example, up and down direction) Pendulum The action moves to further disturb the plating solution 2.

It is worth mentioning that although the above description can understand the embodiments, advantages and effects of the present invention; however, the above-mentioned examples are only one of the feasible embodiments and are not intended to limit the present invention.

[Fourth embodiment]

Please refer to FIG. 7, which is a schematic top view of a plating apparatus according to a fourth embodiment of the present invention. As shown in the figure, the electroplating apparatus of this embodiment is similar to the electroplating apparatus of the above embodiments in the same manner of operation, which will not be repeated here. It is worth noting that in this embodiment, the electroplating apparatus 1 further includes The driving unit 13 is suspended from the tank 10 and movably connected to the carrying unit 11. The driving unit 13 is controlled to drive the carrying unit 11 to perform a rotation motion. Among them, the rotation motion and the swing motion are synchronized and the same.

Specifically, the electroplating device 1 of the present invention further includes a driving unit 13, which may be similar to the driving device of the blind, but is not limited thereto. The driving unit 13 can also be suspended from the tank 10 and can be movably connected to the carrying unit 11. Therefore, in the electroplating apparatus 1 of the present invention, during the electroplating process, the linking member 120 drives the anode member 121 to swing and continuously disturbs the electroplating solution 2 in the tank 10, while the driving unit 13 can also be controlled to drive The carrying unit 11 performs a turning motion; and, the turning direction of the carrying unit 11 may be the same as the swing direction of the anode member 121. In this way, not only can the electroplating solution 2 flow continuously and uniformly on the surface of the object 3 to be plated, but also completely fill the micro-vias on the surface of the object 3 to be plated without leaving air holes, the electric field can also be balanced efficacy.

In addition, the electroplating apparatus 1 of this embodiment is not limited to the above-mentioned embodiment, that is, the rotation direction of the carrying unit 11 can also be different from the swing direction of the anode member 121.

It is worth mentioning that although the above description can understand the embodiments, advantages and effects of the present invention; however, the above-mentioned examples are only one of the feasible embodiments and are not intended to limit the present invention.

[Fifth Embodiment]

Please refer to FIG. 8, which is a schematic structural diagram of an electroplating apparatus according to a fifth embodiment of the present invention. As shown in the figure, the electroplating apparatus of this embodiment is similar to the electroplating apparatus of the above embodiments in the same manner of operation, which will not be repeated here. It is worth noting that in this embodiment, the electroplating apparatus 1 further includes The filtering unit 14, the circulation unit 15 and the temporary storage unit 16. The filter unit 14 communicates with one end of the tank 10. The circulation unit 15 communicates with the filter unit 14. The temporary storage unit 16 communicates with the tank 10 and the circulation unit 15 respectively. The circulation unit 15 obtains the plating solution 2 in the tank 10 through the temporary storage unit 16, and filters the plating solution 2 through the filter unit 14 and supplies the filtered plating solution 2 into the tank 10.

For example, the electroplating apparatus 1 of the present invention may further include a filtering unit 14, a circulation unit 15 and a temporary storage unit 16. The filtering unit 14 can be a filtering component, the circulating unit 15 can be a circulating pump, and the temporary storage unit 16 can be a liquid temporary storage tank, which stores the plating solution 2, but not limited to this. The filter unit 14 may be located at the lower end of the tank body 10 and connected to the tank body 10 and communicate with the inside of the tank body 10. The temporary storage unit 16 may be located at the lower end of the tank body 10 and connected to the tank body 10 and communicate with the interior of the tank body 10. The circulation unit 15 is located between the filter unit 14 and the temporary storage unit 16 and is connected to and communicated with the filter unit 14 and the temporary storage unit 16.

Therefore, during the electroplating process of the electroplating apparatus 1, the temporary storage unit 16 can supply the electroplating solution 2 into the tank 10 from the upper end of the tank 10; and the filter unit 14 can suck or receive the tank 10 from the lower end of the tank 10 The plating solution 2 in the system is filtered to remove foreign substances or impurities, and then the filtered plating solution 2 is sent to the circulation unit 15. Finally, the circulation unit 15 sends the filtered plating solution 2 to the temporary storage unit 16 for storage or re-supply into the tank 10. Wherein, the temporary storage unit 16 is used to supply the plating solution 2 to the installation position and direction of the transport port of the tank 10, and can be appropriately changed in accordance with the installation manner of the movable unit 12 in the foregoing embodiments to make the electroplating The effect can be more significant.

It is worth mentioning that although the above description can understand the embodiments of the present invention Formula, advantages and effects; however, the above-mentioned examples are only one of the feasible embodiments and are not intended to limit the present invention.

The above embodiments explain the overall operation of the electroplating apparatus 1 of the present invention, and also explain the electroplating method of the present invention at the same time. However, in order to make the steps of the electroplating method of the present invention clearer and clearer, the following description will be given.

Please refer to FIG. 9 and FIG. 10, which are the first flowchart and the second flowchart of the electroplating method of the present invention. As shown in the figure, the electroplating method of the present invention may include the following steps: Step S40: carrying the object to be plated by the carrying unit; Step S41: by suspending the carrying unit in the tank; and Step S42: by controlling at least one movable unit Swing motion is performed to disturb the plating solution in the tank.

The step S42 of disturbing the electroplating solution in the tank by controlling at least one movable unit further includes the following steps: Step S420: controlling the linking member to drive the multiple anode members to perform symmetrical or asymmetrical oscillation To disturb the plating solution.

The electroplating method of the present invention further includes the following steps: Step S43: driving the carrier unit to rotate by controlling the driving unit.

It is worth mentioning that although the above description can understand the embodiments, advantages and effects of the present invention; however, the above-mentioned examples are only one of the feasible embodiments and are not intended to limit the present invention.

[Beneficial effect of embodiment]

One of the beneficial effects of the present invention is that the electroplating device and the electroplating method provided by the present invention can be movably suspended in the tank body 10 through the "bearing unit 11, and the bearing unit 11 carries the object 3 to be plated", The unit 12 can be movably located in the tank 10 "and" the movable unit 12 is controlled to swing, to disturb the plating solution 2 ”technical solution to provide a novel electroplating device and electroplating method, and at the same time, it can also improve the efficiency of electroplating.

Furthermore, the electroplating apparatus 1 and the electroplating method provided by the present invention pass "the movable unit 12 can be movably located in the tank 10", "the at least one movable unit 12 includes the linking member 120 located in the tank 10 and the movable The anode 121 connected to the link 120, the link 120 is controlled to drive the anode 121 to perform a swing motion "and" the movable unit 12 is controlled to swing to disturb the electroplating solution 2 "and other novel technical solutions, to To provide users with a novel electroplating apparatus 1 and electroplating method. During the electroplating process, the anode member 121 can continuously disturb the electroplating solution 2 by the driving of the linking member 120, so that the electroplating solution 2 can be sustained and uniform It flows on the surface of the object 3 to be plated, so that the electroplating substance in the plating solution 2 can completely fill the micro-through holes on the surface of the object 3 to be plated without leaving air holes. This can not only solve the problems existing in the prior art At the same time, it can also improve the efficiency and quality of electroplating.

The content disclosed above is only a preferred and feasible embodiment of the present invention, and therefore does not limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the description and drawings of the present invention are included in the present invention. Within the scope of patent application.

Claims (9)

An electroplating device includes: a tank which stores an electroplating solution; a carrying unit which can be movably suspended in the tank; the carrying unit carries an object to be plated; and at least one movable unit which can Actively located in the tank; wherein, at least one of the movable units is controlled to perform a pendulum motion to disturb the plating solution; wherein, at least one of the movable units includes a linking member located in the tank and movably connected For at least one anode member of the linking member, the linking member is controlled to drive at least one anode member to perform the swing motion. The electroplating apparatus according to claim 1, wherein at least one of the movable units further includes a plurality of anode members, the plurality of anode members are juxtaposed with each other and movably connected to the linking member; wherein, the linking member is driven to A plurality of anode members are driven to perform a symmetrical swing operation to disturb the plating solution. The electroplating apparatus according to claim 1, wherein at least one of the movable units further includes a plurality of anode members, the plurality of anode members are juxtaposed with each other and movably connected to the linking member; wherein, the linking member is driven A plurality of the anode members are driven to perform an asymmetrical swing operation to disturb the plating solution. The electroplating device according to claim 1, further comprising a driving unit suspended from the tank and movably connected to the carrying unit. The driving unit is controlled to drive the carrying unit to perform a rotation motion. The electroplating apparatus according to claim 4, wherein the turning movement and the swinging movement are synchronized and the same. The electroplating device according to claim 1, further comprising: a filtering unit communicating with one end of the tank; a circulation unit communicating with the filtering unit; and a temporary storage unit respectively communicating with the tank And the circulation unit is connected; wherein, the circulation unit obtains the plating solution in the tank through the temporary storage unit, and filters the plating solution through the filter unit and supplies the filtered plating solution into the tank. An electroplating method includes the following steps: carrying an object to be plated through a carrying unit; suspending the carrying unit in a trough body; and performing a pendulum motion by controlling at least one movable unit to disturb the trough body An electroplating solution; wherein at least one of the movable units includes a linking member located in the tank and at least one anode member movably connected to the linking member, the linking member is controlled to drive at least one of the anode members to perform the Swing to move. The electroplating method according to claim 7, wherein, by controlling at least one of the movable units to perform the pendulum motion to disturb the plating solution in the tank, the plating solution is continuously on the surface of the object to be plated The flow step further includes the following step: controlling the linkage member to drive the anode members to perform a symmetrical swing or an asymmetrical swing to disturb the plating solution. The electroplating method as described in claim 7, further comprising the following step: driving the carrying unit to perform a rotation by controlling a driving unit.