CN201169649Y - Transmission mechanism for circuit board electric plating machine - Google Patents

Transmission mechanism for circuit board electric plating machine Download PDF

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Publication number
CN201169649Y
CN201169649Y CNU200820078897XU CN200820078897U CN201169649Y CN 201169649 Y CN201169649 Y CN 201169649Y CN U200820078897X U CNU200820078897X U CN U200820078897XU CN 200820078897 U CN200820078897 U CN 200820078897U CN 201169649 Y CN201169649 Y CN 201169649Y
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China
Prior art keywords
support body
guide rail
plating
circuit card
motor
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Expired - Lifetime
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CNU200820078897XU
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Chinese (zh)
Inventor
赵永先
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Individual
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Individual
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Priority to CNU200820078897XU priority Critical patent/CN201169649Y/en
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Publication of CN201169649Y publication Critical patent/CN201169649Y/en
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Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a transmission mechanism applied to an electroplating machine of a circuit board, comprising an electric motor and a linkage device, wherein the linkage device is arranged on an electroplated bath, the electric motor is fixed outside the electroplated bath and is connected with the linkage device; the linkage device and a plank to be plated connected on the linkage device are driven by the electric motor to reciprocate inside the electroplated bath, thereby improving the liquidity and the uniformity of a plating solution; meanwhile, a plating layer on the hole plating inner wall is smooth due to the flow of the plating solution. The transmission mechanism solves the problems in the prior static plating process that the hole plating layer is not even and the plating quality is not stable, improves the hole plating stability, has good plating effect and stable double surface conductivity, and is widely applied to various small and medium electroplating machines.

Description

Be used for the transmission rig on the circuit card electroplating machine
Technical field
The utility model relates to a kind of transmission rig, particularly a kind of transmission rig that is used on the circuit card electroplating machine.
Background technology
The minitype circuit board electroplating machine is a kind of electroplating device commonly used in PCB (Printed circuit board, the printed circuit board (PCB)) industry, and existing electroplating machine electroplating process mainly comprises: 1, with plated material with need to electroplate that sheet material is static respectively to be suspended in the electrolytic plating pool; 2, plated material and need are electroplated the positive and negative direct current of the corresponding connection of sheet material, utilize the orientation of electric current in electrolytic plating pool to move, finish the electroplating process that needs to electroplate sheet material.This electro-plating method is when electroplating general planar products, and coating evenly, reliable in quality, result of use be good, is extensively promoted and uses.But along with development of science and technology; the various small-sized appearance that need to electroplate sheet material; particularly need carry out the very little via hole in aperture when electroplating; existing this plating mode then can not fine satisfied use needs; occur to electroplate through regular meeting that uneven coating in the back aperture is even, the situation of double-side conduction unstable properties; the board quality of electroplating out can't be guaranteed, have a strong impact on the use properties and the work-ing life of institute's converted products.How avoiding the generation of this situation, improve the galvanized electroplating quality of via hole, guarantee the stable, reliable of electrolytic coating, is the problem that the utility model need solve.
Summary of the invention
In view of above-mentioned deficiency of the prior art, the utility model aims to provide a kind of can guarantee that via hole is electroplated the time, and quality of coating is stable, be used for the transmission rig on the circuit card electroplating machine reliably.
The utility model is achieved through the following technical solutions:
A kind of transmission rig that is used on the circuit card electroplating machine comprises motor and interlinkage, and interlinkage is located on the electrolytic plating pool, and motor is fixed on outside the electrolytic plating pool, and motor is connected with interlinkage.
Described interlinkage comprises linkage assembly and the movable stand that is connected with linkage assembly, and movable stand is located on the pool wall of electrolytic plating pool, and the other end of linkage assembly is connected with motor.
Described linkage assembly comprises driving lever and follower lever, and described driving lever is fixedlyed connected with motor, and the driving lever the other end and follower lever one end flexibly connect, and the other end of follower lever and movable stand flexibly connect.
The described driving lever the other end is connected by the standing bolt of bearing with follower lever one end, and the follower lever the other end is connected on the movable stand by split pin.
Described movable stand comprise guide rail, support body and be connected guide rail and support body between wheel, guide rail is fixed on the inboard of electroplating pool wall, support body is positioned at the guide rail top, wheel is provided with the groove that is complementary with the guide rail shape.
Described support body is a tetragon, and the central authorities of support body are connected with crossbeam.
A kind of transmission rig that is used on the circuit card electroplating machine described in the utility model, realize needing to electroplate the to-and-fro movement of sheet material in electrolytic plating pool by two linkage assemblys and movable stand, improved the aperture penetration power of plated material electronics, efficiently solve when via hole is electroplated in the static before electroplating process, electrolytic coating is inhomogeneous in the aperture, the electroplating quality problem of unstable, make that the via hole electroplating quality is reliable, electroplating effect good, the double-side conduction stable performance, have advantage simple in structure, easy to use, be highly suitable in the various small-sized electroplating machines and use.
Description of drawings
Fig. 1 is a structure cut-away view of the present utility model.
Embodiment
Be further described below in conjunction with 1 pair of the utility model of accompanying drawing:
A kind of transmission rig that is used on the circuit card electroplating machine described in the utility model comprises motor 1 and interlinkage, and interlinkage comprises linkage assembly and the movable stand that is connected with linkage assembly.
Wherein movable stand comprise two guide rails 11, tetragon support body 8 and be connected guide rail 11 and support body 8 between four wheels 7.Guide rail 11 is fixed on two relative pool walls in the electrolytic plating pool 10, and the direction of guide rail 11 is identical with the direction of motion of linkage assembly.Wheel 7 is connected on the support body 8, and support body 8 is placed on the guide rail 11 by wheel 7, and support body 8 central authorities are connected with crossbeam 9, and can hang on the crossbeam 9 needs galvanized sheet material.Wheel 7 is provided with the groove that is complementary with the guide rail shape with guide rail 11 position contacting, and groove makes wheel 7 to move along the direction of guide rail 11, and the motion that can not produce the vertical guideway direction.
Linkage assembly is one two linkage assembly, comprise driving lever 2 and follower lever 4, driving lever 2 one ends are fixedlyed connected with the rotation axis of motor 1, driving lever 2 the other ends are connected with the standing bolt 3 of follower lever 4 one ends by the bearing of inlaying 13, and follower lever 4 the other ends pass an end that is connected support body 8 behind the pool wall of electrolytic plating pool 10 by split pin 6.
Motor 1 is fixed on the outside of electrolytic plating pool 10, and motor 1 is connected with external source by lead.
During plating, plated material 12 is suspended on electrolytic plating pool 10 two ends, needing to electroplate sheet material 5 is fixed on the crossbeam 9 of support body 8, needing to electroplate sheet material 5 is fully immersed in the electroplate liquid, motor 1 energising rear motor axle rotation, motor shaft drives driving lever 2 and rotates, driving lever 2 flexibly connects by bearing 13 with follower lever 4 one ends, and follower lever 4 the other ends also flexibly connect by split pin 6 with support body 8, do whole translation rotation so can drive follower lever 4 in the time of driving lever 2 rotations, make tetragon support body 8 that follower lever 4 the other ends connect under the restriction of wheel 7 grooves, can only do the to-and-fro movement of horizontal direction along guide rail 11, and need to electroplate sheet material 5 in such moving back and forth in the process, the electronics of plated material 12 can make things convenient for, enter into the aperture that needs to electroplate sheet material 5 smoothly, improve the galvanized plating performance in aperture, increased the plating reliability, thereby solved the galvanized quality problems of via hole fully.

Claims (6)

1, a kind of transmission rig that is used on the circuit card electroplating machine is characterized in that, comprises motor and interlinkage, and described interlinkage is located on the electrolytic plating pool; Described motor is fixed on outside the electrolytic plating pool, and motor is connected with interlinkage.
2, the transmission rig that is used on the circuit card electroplating machine according to claim 1, it is characterized in that, described interlinkage comprises linkage assembly and the movable stand that is connected with linkage assembly, and described movable stand is located on the pool wall of electrolytic plating pool, and the other end of linkage assembly is connected with motor.
3, the transmission rig that is used on the circuit card electroplating machine according to claim 2 is characterized in that, described linkage assembly comprises driving lever and follower lever, and described driving lever is fixedlyed connected with motor, and the driving lever the other end and follower lever one end flexibly connect; The other end of described follower lever and movable stand flexibly connect.
4, the transmission rig that is used on the circuit card electroplating machine according to claim 3 is characterized in that, the described driving lever the other end is connected by the standing bolt of bearing with follower lever one end, and the follower lever the other end is connected on the movable stand by split pin.
5, according to claim 2, the 3 or 4 described transmission rigs that are used on the circuit card electroplating machine, it is characterized in that, described movable stand comprise guide rail, support body and be connected guide rail and support body between wheel, described guide rail is fixed on the inboard of electroplating pool wall; Described support body is positioned at the guide rail top; Described wheel is provided with the groove that is complementary with the guide rail shape.
6, the transmission rig that is used on the circuit card electroplating machine according to claim 5 is characterized in that, described support body is a tetragon, and the central authorities of support body are connected with crossbeam.
CNU200820078897XU 2008-02-02 2008-02-02 Transmission mechanism for circuit board electric plating machine Expired - Lifetime CN201169649Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU200820078897XU CN201169649Y (en) 2008-02-02 2008-02-02 Transmission mechanism for circuit board electric plating machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU200820078897XU CN201169649Y (en) 2008-02-02 2008-02-02 Transmission mechanism for circuit board electric plating machine

Publications (1)

Publication Number Publication Date
CN201169649Y true CN201169649Y (en) 2008-12-24

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CNU200820078897XU Expired - Lifetime CN201169649Y (en) 2008-02-02 2008-02-02 Transmission mechanism for circuit board electric plating machine

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CN (1) CN201169649Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102453944A (en) * 2010-10-19 2012-05-16 上海嘉捷通电路科技有限公司 Novel removable electroplating device
CN103290459A (en) * 2012-03-05 2013-09-11 无锡宏联电镀设备有限公司 Up-and-down reciprocating type cathode moving device with vibration function
CN103590079A (en) * 2012-08-14 2014-02-19 亚洲电镀器材有限公司 Electroplating method
CN108149291A (en) * 2017-12-25 2018-06-12 珠海市鸿天万达电子科技有限公司 A kind of heavy nickel golden clothes are put
CN112048755A (en) * 2020-09-10 2020-12-08 四川睿杰鑫电子股份有限公司 Electroplating device and electroplating method for micro-holes on PCB
CN114980530A (en) * 2022-06-21 2022-08-30 江西鸿宇电路科技有限公司 Chemical copper deposition method for printed circuit board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102453944A (en) * 2010-10-19 2012-05-16 上海嘉捷通电路科技有限公司 Novel removable electroplating device
CN103290459A (en) * 2012-03-05 2013-09-11 无锡宏联电镀设备有限公司 Up-and-down reciprocating type cathode moving device with vibration function
CN103290459B (en) * 2012-03-05 2015-05-13 无锡宏联电镀设备有限公司 Up-and-down reciprocating type cathode moving device with vibration function
CN103590079A (en) * 2012-08-14 2014-02-19 亚洲电镀器材有限公司 Electroplating method
CN108149291A (en) * 2017-12-25 2018-06-12 珠海市鸿天万达电子科技有限公司 A kind of heavy nickel golden clothes are put
CN108149291B (en) * 2017-12-25 2019-07-09 珠海市鸿天万达电子科技有限公司 A kind of heavy nickel golden clothes are set
CN112048755A (en) * 2020-09-10 2020-12-08 四川睿杰鑫电子股份有限公司 Electroplating device and electroplating method for micro-holes on PCB
CN112048755B (en) * 2020-09-10 2023-04-11 四川睿杰鑫电子股份有限公司 Electroplating device and electroplating method for micro-holes on PCB
CN114980530A (en) * 2022-06-21 2022-08-30 江西鸿宇电路科技有限公司 Chemical copper deposition method for printed circuit board
CN114980530B (en) * 2022-06-21 2023-11-24 江西鸿宇电路科技有限公司 Chemical copper deposition device and chemical copper deposition method for printed circuit board

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20090313

Address after: Beijing city Chaoyang District kanijima Road 8, zip code: 100018

Patentee after: Beijing torch Technology Co. Ltd.

Address before: Lane 25-1-231, East Street, Gansu, Wuwei, China: 733000

Patentee before: Zhao Yongxian

ASS Succession or assignment of patent right

Owner name: BEIJING TONGZHI WEIYE SCIENCE AND TECHNOLOGY CO.,

Free format text: FORMER OWNER: ZHAO YONGXIAN

Effective date: 20090313

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Addressee: Beijing torch Technology Co. Ltd.

Document name: Notification to Pay the Fees

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20081224

DD01 Delivery of document by public notice
DD01 Delivery of document by public notice

Addressee: Beijing torch Technology Co. Ltd.

Document name: Notification of Expiration of Patent Right Duration