KR102438116B1 - Pcb plating apparatus - Google Patents

Abstract

The present invention immerses the printed circuit board in the plating solution filled in the plating tank of the plating apparatus for printed circuit board, and rotates the anode electrode immersed in the plating solution in performing plating on both sides of the printed circuit board, so that the surface and the through hole of the printed circuit board are constant. It relates to a printed circuit board plating apparatus for improving plating efficiency by mixing and stirring a plating accelerating additive and a plating solution to promote plating put into a plating bath at the same time as forming a plating layer of uniform thickness. The present invention is an anode electrode installed inside the plating bath; and a printed circuit board installed by clamping the holder installed in the front lower part of the fixed frame fixed to the transfer means on the upper part of the plating bath and clamping forceps for the cathode inserted in the holder, and immersing the holder in the plating solution of the plating bath to provide a printed circuit A plating apparatus for plating a substrate, wherein a holder with a printed circuit board is disposed between the cylindrical anode electrode installed inside the plating tank and the cylindrical anode electrode, and each of the anode electrodes is installed under the plating tank In combination with a servo motor, the anode electrode is rotated to perform plating of the printed circuit board mounted on the holder, and at the same time, the plating promoting additive and the plating solution supplied into the plating bath are stirred by the rotation of the anode electrode. do.

Description

Printed Circuit Board Plating Equipment {PCB PLATING APPARATUS}

The present invention relates to a printed circuit board plating apparatus, and more particularly, an anode electrode immersed in a plating liquid in performing plating on both sides of a printed circuit board by immersing the printed circuit board in a plating solution filled in a plating bath of a printed circuit board plating apparatus is rotated to form a plating layer of constant and uniform thickness on the surface and through-holes of the printed circuit board, and at the same time, mixing and stirring of the plating promoting additive and the plating solution to promote the plating put into the plating bath is performed. It relates to a printed circuit board plating apparatus for improving plating efficiency.

A Printed Circuit Board (PCB) electrically connects mounted components through a wiring pattern formed on an insulating material such as a phenolic resin insulating plate or an epoxy resin insulating plate, supplies power, and mechanically fixes the parts at the same time. As to be performed, the printed circuit board includes a single-sided PCB in which wiring is formed on only one side of the insulating substrate, a double-sided PCB in which wiring is formed on both sides, and an MLB (Multi Layered Board) in which wiring is formed in multiple layers.

In the process of manufacturing a double-sided PCB or MLB, in forming a circuit pattern on both sides at the same time or forming a protective layer composed of gold (Au), nickel (Ni), etc. on the contact pad formed on the outermost layer, both sides of the PCB It may include a process of proceeding with the plating at the same time.

In a conventional plating apparatus for plating a printed circuit board, a plurality of boards are put into a plating tank, and a plating solution sprayed from a nozzle performs plating on the board. Because several printed circuit boards are contained, the plating solution is locally stagnant due to the non-uniformity of the flow in the plating bath, or the flow of the plating solution flowing into the gap formed between the boards is not smoothly formed. Therefore, plating is not performed uniformly, which causes poor quality of the substrate.

According to the prior art Korean Patent Registration No. 10-1316727 proposed in order to solve this problem, in the vertical continuous plating apparatus, the printed circuit board contained in the plating bath is hung on a hanger, and the printed circuit board is continuously moved while being immersed in the plating solution. The plating is made uniform by making copper plating by electrochemical reaction by the plating solution sprayed by the plating solution spraying device installed at both ends, and the electrochemical reaction is a cathode that is a reduction electrode directly connected to the printed circuit board. and the printed circuit board and the anode installed side by side.

However, in the prior art, when the plating solution is sprayed through the plating solution spraying device while the printed circuit board is suspended from the clamp installed on the hanger, the plating solution sprayed from the nozzle of the plating solution jetting device has resistance to the plating solution filled in the plating tank. The plating solution is not properly passed through the through hole of the printed circuit board, so the plating solution is always filled in the through hole of the printed circuit board while the printed circuit board is immersed in the plating solution. However, since the plating layer is formed thickly on the inner peripheral surface of the pinhole and the plating layer is formed non-uniformly as a whole, plating deviation of the printed circuit board occurs. It also increases the defect rate.

In addition, when processing a printed circuit board, burrs that cannot be completely cut off and are likely to break are often left inside the through hole, and these burrs remain inside the through hole during plating to maintain a temporarily attached state by the plating layer. Therefore, the thickness of the plating layer inside the through hole is different, and when a printed circuit board is mounted on a device after plating is completed, if the burr falls from the product board for some reason, the removed burr often shorts the terminals of the product board, so the reliability of the product This causes dropping problems.

In order to solve this problem, in the past, a fixed frame coupled with a hanger for hanging a printed circuit board was vibrated by a vibrating motor. It is formed and the plating efficiency is improved, but it is difficult to transmit vibration to the lower end of the printed circuit board hanging from the hanger of the fixed frame, so that the plating layer is non-uniformly formed as it goes to the lower part of the printed circuit board. In order to compensate for this, it may be considered that a striking device such as a separate cam device for applying a vibration force to the lower part of the printed circuit board may be provided. Because the width of left and right vibration of the printed circuit board is narrow, sufficient vibration force cannot be applied to the printed circuit board, so foreign substances and burrs inside the through hole cannot be removed, so the plating thickness inside the through hole is not constant. The problem that cannot produce printed circuit boards is pointed out.

In addition, as described above, the plating solution spraying device is installed between the cathode, which is a reduction electrode directly connected to the printed circuit board, and the anode installed in parallel with the printed circuit board to spray the plating solution on the printed circuit board, so that the printed circuit board and the anode As it interferes with the electron movement between For this reason, when an additive for accelerating plating is added to the plating solution, a separate mixing and stirring device for mixing the plating solution and the plating promoting additive must be installed in the plating tank. A problem in that the current density is lowered may be pointed out because the stirring device interferes with the movement of electrons occurring between the circuit board and the anode.

An object of the present invention is to provide a plating apparatus for a printed circuit board capable of further improving plating quality by reducing plating deviation. It is a technical task to improve the reliability of plating by not interfering with the movement of electrons between and the cathode.

In addition, the present invention makes it a technical task to prevent the loss of electron movement by adjusting the distance between the anode and the cathode according to the thickness of the printed circuit board.

The present invention is an anode electrode installed inside the plating bath; and a printed circuit board installed by clamping the holder installed in the front lower part of the fixed frame fixed to the transfer means on the upper part of the plating bath and clamping forceps for the cathode inserted in the holder, and immersing the holder in the plating solution of the plating bath to provide a printed circuit A plating apparatus for plating a substrate, wherein a holder with a printed circuit board is disposed between the cylindrical anode electrode installed inside the plating tank and the cylindrical anode electrode, and each of the anode electrodes is installed under the plating tank In combination with a servo motor, the anode electrode is rotated to perform plating of the printed circuit board mounted on the holder, and at the same time, the plating promoting additive and the plating solution supplied into the plating bath are stirred by the rotation of the anode electrode. do.

In the present invention, the plating is performed while rotating the anode electrode by a servo motor, so that the plating solution is uniformly applied to the surface of the printed circuit board and inside the through hole to achieve a constant plating, thereby reducing the plating thickness deviation and further improving the plating quality. By simultaneously performing mixing and stirring of the plating solution and the plating accelerating additive with the improvement effect, bubbles caused by various gases generated or attached to the electrode surface are rapidly removed, thereby improving the current efficiency and sufficiently promoting the electrochemical reaction of the plating solution. It has the effect of efficiently performing plating of a double-sided printed circuit board.

In addition, the present invention omits the plating solution spraying means, the plating solution stirring device, and the vibration generating device inside the plating tank so as not to interfere with the movement of electrons between the anode electrode and the cathode electrode. It has the effect of improving the reliability of plating and the speed of plating by improving the current density generated between the anode and the cathode at the same time as reducing the cost of the plating.

In addition, the present invention controls the distance between the anode electrode and the cathode electrode according to the thickness of the printed circuit board to prevent loss of electron movement, thereby uniformly distributing the current density over the entire area between the anode electrode and the cathode electrode. By allowing the electrochemical action to occur uniformly over the entire area of the printed circuit board, it has the effect of improving the plating quality of the printed circuit board by improving the uniform plating efficiency.

1 is an overall configuration diagram of a printed circuit board plating apparatus according to the present invention.
FIG. 2 is a perspective view illustrating the installation configuration of the anode electrode and the holder of the printed circuit board plating apparatus according to the present invention.
3 is a plan sectional view showing an embodiment of the rotational operation of the anode electrode of the printed circuit board plating apparatus according to the present invention.
4 is a plan cross-sectional view showing another embodiment of the rotating operating state of the anode electrode of the printed circuit board plating apparatus according to the present invention.
5 is an overall configuration diagram of a printed circuit board plating apparatus according to another embodiment of the present invention.
6 is a plan view in cross-sectional view of the rotational operation of the anode electrode and the holder according to the embodiment according to FIG.
7 is a cross-sectional configuration diagram of another embodiment of a printed circuit board plating apparatus according to the present invention.

The present invention rotates the anode electrode immersed in the plating bath without installing a vibration generating device, plating solution spraying means, or plating solution stirring device to agitate the plating solution and at the same time allow the plating solution to pass through the through hole Plating of a double-sided printed circuit board To provide a printed circuit board plating apparatus that efficiently performs, it will be described in detail with reference to the accompanying drawings.

1 is an overall configuration diagram of a printed circuit board plating apparatus according to the present invention, and FIG. 2 is a perspective view of the installation configuration of the anode electrode and the holder of the printed circuit board plating apparatus according to the present invention.

According to this, the anode electrodes 20 and 21 provided in the plating bath 10; A printed circuit installed by clamping the holder 40 installed in the front lower part of the fixing frame 31 fixed to the transfer means 30 at the upper portion of the plating tank 10 and the clamping forceps 41 for the cathode electrode fitted in the holder 40 . In the plating apparatus 200 comprising a; and performing plating on a printed circuit board 50 by immersing the holder 40 in a plating solution of a plating bath 10, the plating bath ( 10) A holder 40 on which a printed circuit board 50 is mounted is disposed between the cylindrical anode electrode 20 and the cylindrical anode electrode 21 installed therein, the anode electrodes 20 and 21, respectively. is coupled with the servo motors 60 and 61 installed under the plating bath to rotate the anode electrodes 20 and 21 to perform plating of the printed circuit board 50 mounted on the holder 40 and at the same time to perform plating. It can be configured to stir the plating promoting additive and the plating solution supplied to the inside of the tank 10 by rotation of the anode electrodes 20 and 21, and the conveying means 30 is provided by a conveying rail or conveying chain not shown. It is a freely transportable device.

In the above, the servo motors 60 and 61 for rotating the holder 40 are preferably provided as a forward and reverse servo motor, and the forward and reverse rotation angle, forward and reverse rotation time, and operation time can be programmed by a program of the control unit not shown. The anode electrodes 20 and 21, respectively, the rotation shafts 20A and 21A protruding downwardly under each of the driving shafts 60A and 61A of the servo motors 60 and 61 are coupled with each other. do.

When the anode electrodes 20 and 21 are rotated by the servo motors 60 and 60A, anode power must always be supplied to each of the anode electrodes 20 and 21 through the tongs 41 for the cathode electrode to the printed circuit board. An electrochemical action with the cathode electrode supplied to 50 occurs.

To this end, in the present invention, the anode electrodes 20 and 21, the circular electrodes 20-1 and 21-1 protruding from the upper portions, respectively, are brought into electrical surface contact with the fixed connector E connected to the external power source, so that the positive power source is provided. This is always supplied to the electrode surface coated on the circumferential surface of the anode electrodes 20 and 21 through the circular electrodes 20-1 and 21-1.

And, a plurality of stirring blades 20-2, 21-2 are formed protruding at a predetermined interval on the circumferential surface of each of the anode electrodes 20 and 21, and the stirring blades 20-2, 21- 2) Each micro-hole (20-2') (21-2') is drilled in the anode electrode (20, 21) when rotating, the micro-hole (20-2) drilled in the stirring blade (20-2) (21-2) Through the ') (21-2'), the plating solution and/or the plating promoting additive can be mixed and stirred finely, and the rotation resistance of the anode electrodes 20 and 21 is reduced to promote smooth rotation and at the same time, the plating solution and The plating promoting additive can be smoothly mixed.

The electrode surface coated on the stirring blades 20-2 and 21-2 is the holder by coating the surface of each of the stirring blades 20-2 and 21-2 to perform the anode electrode function. By allowing electrons to move closer to the printed circuit board 50 mounted on the 40 , the current density can be improved, thereby improving the plating quality and speeding the plating.

The lower one side of the tongs 41 for the cathode electrode inserted into the long hole 40-1 drilled in the upper frame of the holder 40 may be installed by being fixed to the inner surface of the long hole 40-1, and the holder 40 ), the fitting round bar 42 protruding downward from the center of the lower portion of the plating bath 10 is inserted into the fitting hole 11 drilled in the center of the lower portion, so that the holder 40 can be designed to be mounted without shaking, as will be described later. When the holder 40 is raised by the operation of the cylinder 70 , the fitting round bar 42 can be easily separated from the fitting hole 11 .

In order to mount the printed circuit board 50 to the holder 40 stably and without shaking, the printed circuit board 50 may be placed in the center of the holder 40 to be mounted.

That is, by pressing the spring of the tongs 41 for the cathode electrode inserted into the long hole 40-1 drilled in the upper frame of the holder 40 formed in a rectangular frame shape, spread the lower side of the tongs 41 for the cathode electrode, then a plurality of Clamping the upper part of the printed circuit board 50 in which the through hole 51 of The substrate 50 may be disposed.

The anode electrodes 20, 21 and the stirring blades 20-2 and 21-2 allow the wave force of the plating solution to smoothly reach the holder 40, and at the same time mix the plating solution with the plating promoting additive. A plurality of stirring blades 40A are formed to protrude at regular intervals around the holder 40 so that stirring can be achieved, and the printed circuit board 50 is stably mounted on the holder 40 without shaking. It can be mounted by placing the printed circuit board 50 in the center.

Therefore, the wave force of the plating solution generated while the anode electrodes 20 and 21 rotates can greatly enhance the mixing force while colliding with the stirring blade 40A installed around the holder 40, thereby greatly improving the electrolysis efficiency. of course, smooth plating can be performed without a vibration generating device, a plating solution spraying device, or a plating solution stirring device, thereby greatly reducing the manufacturing cost for manufacturing the plating device equipment, and by rotating the anode electrodes 20 and 21 The plating solution smoothly passes into the through-hole 51 by the undulating force of the plating solution, so that plating of a uniform thickness is performed on the entire inner circumferential surface of the through-hole 51 .

In particular, when the plating defect rate increases due to a decrease in the concentration of the plating solution injected into the plating tank 10 during plating while mixing the plating solution as described above, a liquid plating promoting additive or supplementary plating solution is transferred to the plating solution by a pump (P3) to promote plating. ) is supplied into the plating bath 10, and at this time, the plating accelerating additive supplied into the plating bath 10 is mixed and stirred as described above by the rotating anode electrodes 20 and 21, so that a separate The plating solution and the plating promoting additive are easily mixed without a mixing stirring device, and the plating solution spraying device that is installed between the anode electrodes 20 and 21 and the printed circuit board 50 is unnecessary, and accordingly, the anode electrode 20 ) 21 and the printed circuit board 50 is free to move between the electrons, it is possible to greatly improve the current density.

In the drawing, P1 is a plating solution supply pump, P2 is a circulation pump, and the plating solution is recirculated into the plating tank 10 through the filter F by the circulation pump P2. An upper fixed stem 43 may be fixedly installed on the upper frame of the upper frame, and in another embodiment according to FIG. 5 to be described later, the upper fixed stem 43 is changed to a rotating shaft 43-1, and the rotating shaft 43-1 The upper part is fitted in the front lower part of the fixed frame 31 and is freely rotatably installed by the bearing 31-1, and the fitting round bar 42 protruding downward from the center of the lower part of the holder 40 is extended to the lower part to elongate the rotation shaft. By changing to (42-1), the holder 40 can be designed to be rotatably coupled with the drive shaft 62A of the servo motor 62 for rotating the holder 40 .

At this time, the rotation shaft 42-1 of the holder 40 and the drive shaft 62A of the servo motor 62 are coupled to each other in a concave-convex shape or by magnetizing the rotation shaft 42-1 and the driving shaft 62A to combine them with each other by magnetic force. or a separate, non-illustrated automatic coupling device to enable pin coupling and separation of the rotation shaft 42-1 and the drive shaft 62A to provide mutual coupling and separation, and the rotation shaft 42-1 ) is inserted into the fitting hole 11 drilled in the lower surface of the plating bath 10 and can be freely rotated by a bearing.

Therefore, when the holder 40 is raised by the cylinder 70, the rotation shaft 42-1 of the holder 40 can be freely separated from the drive shaft 62A of the servo motor 62, and the holder 40 ) when the rotation shaft 42-1 of the servo motor 60 and the drive shaft 62A of the servo motor 60 are coupled to each other in a concave-convex shape or by magnetic force, they are coupled without separation from each other to promote the rotation of the holder 40 .

After plating is completed on the printed circuit board 50 mounted on the holder 40 immersed in the plating bath 10 , the holder 40 is raised by the upper cylinder 70 and then transferred to the transfer means 30 . will be transported by

In the present invention having such a configuration, plating is performed while mixing and stirring the plating solution and the plating promoting additive while rotating the anode electrodes 20 and 21 in the same direction while the holder 40 is fixed as shown in FIG. As shown in 4, in a state in which the holder 40 is fixed, the anode electrode 20 and the anode electrode 21 are rotated in opposite directions to perform plating while mixing and stirring the plating solution and the plating promoting additive. 50) allows the plating solution to pass through the inside of the through-hole 51 with a strong wave force to remove foreign substances and burrs generated inside the through-hole 51, and at the same time, uniformly plated the entire inner circumferential surface of the through-hole 51 with a uniform thickness this will be done

In addition, as shown in FIGS. 5 and 6, the holder 40 disposed between the anode electrode 20 and the anode electrode 21 can be rotated by the servo motor 62, but the anode electrode 20 and the anode electrode (21) and the holder 40 are rotated in the same direction or in opposite directions at the same time, or the anode electrode 20 and the anode electrode 21 are fixed and the holder 40 is rotated to rotate the anode electrode 20 ) and the anode electrode 21 and/or the wave force generated by the rotational force of the holder 40 and the stirring blades 20-2, 21-2, and 40A more rapidly by mixing and stirring caused by the collision of the plating solution with each other It can also improve the plating efficiency.

In the case of the above embodiment, when the holder 40 disposed between the anode electrode 20 and the anode electrode 21 is rotated, the anode electrode 20 and the anode electrode 21 are positioned outside the rotation radius of the holder 40. It is preferable to place

7 is a cross-sectional configuration diagram of another embodiment of a printed circuit board plating apparatus according to the present invention.

According to this, the rotation shafts 20A and 21A protruding downward from both lower ends of the anode electrodes 20 and 21 are inserted into the guide holes 11-1 and 11-2 of the plating bath 10, The expansion and contraction sealing members 11-1' and 11-2' are provided between the outer peripheral surface of the bearing provided around the rotation shafts 20A and 21A and the guide long holes 11-1 and 11-2, and the servo A printed circuit board ( 50) can be adjusted.

This is because when the thickness of the printed circuit board 50 is thin in design, the distance between the electrode surfaces of the anode electrodes 20 and 21 and the printed circuit board 50 is increased. At this time, by operating the cylinder (S) Printing with the anode electrodes 20 and 21 by pushing the servo motors 60 and 61 with the piston S1 to make the distance between the electrode surfaces of the anode electrodes 20 and 21 and the printed circuit board 50 closer. It is possible to improve the current density by smoothing the movement of electrons with the circuit board 50 , and the telescopic sealing members 11-1 ′ and 11-2 ′ are adapted to the movement of the rotation shafts 20A and 21A. Since the guide long holes 11-1 and 11-2 are kept sealed while increasing or decreasing accordingly, leakage of the plating solution can be prevented.

When the anode electrodes 20 and 21 are moved, the circular electrodes 20-1 and 21-1 are also moved, but the circular electrodes 20-1 and 21-1 are always connected to the fixed connector ( E) can be maintained in an electrically interviewed state.

Although the embodiment has been described above, it is merely an example and does not limit the present invention, and those of ordinary skill in the art to which the present invention pertains are not exemplified above in a range that does not depart from the essential characteristics of the present embodiment. It can be seen that various modifications and applications are possible.

And, the differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

10: plating tank 10-1: additive supply passage
20, 21: anode electrode 20-1, 21-1, 40A: stirring blade
20-2', 21-2': fine hole 30: transport means
40: holder 41: tongs for cathode electrode
50: printed circuit board 51: through hole 60, 61, 62: servo motor 70, S: cylinder
200: plating device

Claims (5)

anode electrodes 20 and 21 installed inside the plating bath 10; A printed circuit installed by clamping the holder 40 installed in the front lower part of the fixing frame 31 fixed to the transfer means 30 at the upper portion of the plating tank 10 and the clamping forceps 41 for the cathode electrode fitted in the holder 40 . In the plating apparatus 200 comprising a; and performing plating on a printed circuit board 50 by immersing the holder 40 in a plating solution of a plating bath 10, the plating bath ( 10) A holder 40 on which a printed circuit board 50 is mounted is disposed between the cylindrical anode electrode 20 and the cylindrical anode electrode 21 installed therein, the anode electrodes 20 and 21, respectively. to perform plating of the printed circuit board 50 mounted on the holder 40 while rotating the anode electrodes 20 and 21 by combining with the servo motors 60 and 61 installed under the plating bath 10 . At the same time, the plating accelerating additive and the plating solution supplied to the inside of the plating tank 10 are agitated by rotation of the anode electrodes 20 and 21,
The two anode electrodes 20 and 21, respectively, protruding from the upper portions of the circular electrodes 20-1 and 21-1 are brought into electrical surface contact with the fixed connector E connected to the external power source so that the positive power is always in contact. It is supplied to the electrode surface coated on the circumferential surface of the anode electrode 20 and 21 through the circular electrodes 20-1 and 21-1,
A plurality of stirring blades 20-2 and 21-2 are formed to protrude at regular intervals on the circumferential surface of each of the anode electrodes 20 and 21, but the stirring blades 20-2 and 21-2 Each is configured by drilling micro-holes (20-2') (21-2'),
The stirring blades 20-2 and 21-2 are configured by coating electrodes on the surface of each, and while rotating the anode electrodes 20 and 21 in the same direction while mixing and stirring the plating solution and the plating promoting additive, plating is performed. or to perform plating while rotating the anode electrode 20 and the anode electrode 21 in opposite directions while the holder 40 is fixed,
The anode electrodes 20, 21 and the stirring blades 20-2 and 21-2 allow the wave force of the plating solution to smoothly reach the holder 40 while rotating the plating solution and the plating promoting additive. A plurality of stirring blades 40A are protruded at regular intervals around the holder 40 so that mixing and stirring can be made, and the holder 40 disposed between the anode electrode 20 and the anode electrode 21 is operated by a servo motor. (62), but the anode electrode 20, the anode electrode 21, and the holder 40 are rotated in the same direction or in opposite directions at the same time, or the anode electrode 20 and the anode electrode 21 ) is a printed circuit board plating apparatus, characterized in that configured to rotate the holder 40 in a fixed state. delete delete delete According to claim 1, wherein the anode electrode 20, 21, the lower both ends of the downwardly protruding rotation shafts (20A) (21A) are sandwiched in the guide long holes (11-1, 11-2) of the plating bath (10) However, the expansion and contraction sealing members 11-1' and 11-2' are installed between the outer circumferential surface of the bearing installed around the rotation shafts 20A and 21A and the guide long holes 11-1 and 11-2. and a servomotor (60) (61) on one side of the printed circuit board plating apparatus, characterized in that it is configured by coupling a piston (S1) protruding and retracting by a cylinder (S).

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