KR20100081119A - Electroplating device for printed circuit board - Google Patents

Abstract

PURPOSE: An electroplating device is provided to improve productivity by executing successive plating for a plurality of PCBs without a separate lead terminal. CONSTITUTION: A plating bath(10) stores an electroplating solution. A plurality of conducting rollers(20) are serially arranged towards the longitudinal direction of the plating bath. A part of the conducting roller is dipped in the solution. The conducting roller comprises a driving drum, a plurality of cathode rods, and a fixing plate. The driving drum has a rotary shaft. A plurality of cathode loads are arranged in the exterior of the driving drum with a uniform interval. A fixing plate is combined in two ends of the driving drum. A substrate transport device(60) is arranged inside the plating bath in order to transfer a PCB.

Description

Electroplating Device for PCP {Electroplating device for Printed Circuit Board}

The present invention relates to an electroplating apparatus, and more particularly, to implement a device to continuously apply a thin plated film to a circuit pattern implemented on a printed circuit board (hereinafter, simply referred to as 'PCB'). An electroplating apparatus for a PCB.

In general, small-sized, light-weight electronic products such as mobile phones require many circuits inside, but it is well known that high-density circuits are built to have high performance even at a small size. A high density circuit embedded in an electronic product forms a pattern of a circuit on a thin printed circuit board (PCB), and installs an element in a surface-mounted pattern to perform a necessary function.

In forming a pattern on a thin plate PCB, conventionally, a thin plate PCB, which is a plated body, is dipped in a plating bath containing a highly conductive electrolyte to form a copper film by an electroplating method, and then through an etching or etching process that leaves only necessary portions. The method of forming circuit patterns is widely adopted.

A representative example of a conventional electroplating apparatus for a PCB performing the plating process is shown in FIG. 1.

As shown in the drawing, a device for performing electroplating for a conventional PCB, the plating bath 1, the electrolyte is accommodated, and the cathode is located in the center of the plating bath 1 and connected to the negative electrode terminal 11a of the external rectifier 11 It consists of a configuration including a plurality of anode bars (3) located on the left and right sides of the rod (9) and the plating bath (1) and connected to the anode terminal (11b) of the rectifier (11).

In FIG. 1, the cathode rod 9 is connected to a PCB 10, which is a plated body, and the PCB 10 is immersed in an electrolyte solution contained in the plating bath 1. In addition, a plurality of copper balls 8 or baskets 7 containing copper balls are electrically connected to the anode rods 3. Therefore, when power is applied to both terminals 11a and 11b of the rectifier 11, plating is performed by thinly depositing copper ions generated at the anode on the surface of the PCB 10, which is the plated body of the cathode, through the electrolyte.

In order to plate a plurality of PCBs at once using the conventional electroplating apparatus, circuit patterns implemented on each PCB must be electrically connected to each other. To this end, conventionally, a separate lead terminal (not shown) is used to electrically connect the circuit patterns implemented on the unit PCB, and the leads are removed in the process of cutting the PCB, which is a post process.

As described above, in the conventional electroplating method, the lead terminal is required as a medium for electrically temporary connecting the plurality of PCBs as described above in performing plating on the plurality of plated objects. Accordingly, since the production cost of the product is high and a separate additional process of removing the lead is required, problems such as a decrease in productivity and an increase in defective rate due to the additional process are pointed out.

In addition, the above-described conventional electroplating method is not suitable for mass production because the continuous plating operation is not possible and the quantity of the plated material that can be plated through one electroplating is also limited. Has its drawbacks.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electroplating apparatus for a PCB capable of performing continuous plating on a plurality of PCBs without a lead terminal electrically connecting the plurality of PCBs.

As a preferable aspect for solving the above technical problem, the present invention, the plating bath for receiving the electrolyte; An accommodation tank accommodating the plating tank therein; A plurality of energizing rollers rotatably mounted in a form in which a part thereof is immersed in the electrolyte contained in the plating bath, and a plurality of conducting rollers arranged in series in the longitudinal direction of the plating bath; And a plated body, which is installed at a predetermined distance from the conducting roller, in the plating vessel under the conduction roller, and is transferred from one side of the plating vessel to the other side while the PCB to be plated introduced from one side of the conducting roller is sequentially contacted with the plurality of conducting rollers. And a substrate transfer device for transferring a PCB to be plated to be able to be formed, wherein the energizing roller comprises: a driving drum having a rotating shaft, a plurality of cathode rods disposed at equal intervals along the circumferential direction on the outer surface of the driving drum, It provides an electroplating device for a PCB, characterized in that consisting of a fixed plate coupled to both ends of the drive drum with the drive drum therebetween to place the cathode rod on the drive drum.

Here, the electrolyte is continuously supplied into the plating bath, the receiving tank is large enough to accommodate the plating bath, the electrolyte is continuously supplied to the plating bath and overflowed from the plating bath It may flow to the bottom of the reservoir through the separation space between the plating vessel side wall and the reservoir side wall.

At this time, the pump and return pipe for returning the electrolyte flowed to the bottom of the reservoir back into the plating tank; may further include.

Preferably, in order to maintain the flow toward the bottom side of the reservoir without scattering the electrolyte overflowed from the plating tank to the outside of the reservoir, It is preferable to install an air knife (air knife) for vertically injecting high-pressure air below the separation space.

In one aspect of the present invention, the substrate transfer device is composed of a belt body and a plurality of feeding rollers supporting the movement of the belt body, and the belt body has recessed grooves for fixing the PCB mounting, which is a plated body, at regular intervals. The formed configuration is preferred.

In addition, the cathode rod applied to the present invention preferably has a ground surface having a fine concavo-convex pattern on the outermost curved portion, and is configured such that both side surfaces are covered with an insulator based on the ground surface, and in this case, the cathode rod is made of titanium. While the ground plane is preferably to adopt a configuration coated by any one selected from iridium, platinum, chromium.

As another preferable aspect for solving the above technical problem, the present invention, the plating bath containing the electrolyte; An accommodation tank accommodating the plating tank therein; A plurality of energizing rollers rotatably mounted in a form in which a part thereof is immersed in the electrolyte contained in the plating bath, and a plurality of conducting rollers arranged in series in the longitudinal direction of the plating bath; Installed at a predetermined distance from the conduction roller in the plating tank under the conduction roller, the PCB being a plated body introduced from one side of the plating tank is sequentially contacted with the plurality of conducting rollers to be transferred from one side of the plating tank to the other side. A substrate transfer device for transferring a PCB to be plated so as to be able to be transferred; Inlets and outlets respectively formed on one side wall and the other side wall of the plating bath and the receiving bath at a height corresponding to the installation position of the substrate transfer device; And a pair of guide rollers installed near each of the inlet and outlet sides to lead the PCB to be plated into the plating bath or to draw the PCB to be plated out to the outside of the plating bath. The roller comprises a driving drum having a rotating shaft, a plurality of cathode rods disposed at equal intervals in the circumferential direction on the outer surface of the driving drum, and a driving drum disposed therebetween to arrange the plurality of cathode rods on the driving drum. It provides an electroplating device for a PCB, characterized in that consisting of a fixed plate coupled to both ends.

Here, the electrolyte is continuously supplied into the plating tank, the receiving tank is large enough to accommodate the plating bath, the electrolyte is continuously supplied to the plating bath and overflowed from the plating bath is It may flow to the bottom of the reservoir through the space between the plating vessel side wall and the reservoir side wall.

At this time, the pump and return pipe for returning the electrolyte flowed to the bottom of the reservoir back into the plating tank; may further include.

Preferably, in order to maintain the flow toward the bottom side of the reservoir without scattering the electrolyte overflowed from the plating tank to the outside of the reservoir, It is preferable to install an air knife (air knife) for vertically injecting high-pressure air below the separation space.

In one aspect of the present invention, the substrate transfer device is composed of a belt body and a plurality of feeding rollers supporting the movement of the belt body, and the belt body has recessed grooves for fixing the PCB mounting, which is a plated body, at regular intervals. The formed configuration is preferred.

In addition, the cathode rod applied to the present invention preferably has a ground surface having a fine concavo-convex pattern on the outermost curved portion, and is configured such that both side surfaces are covered with an insulator based on the ground surface, and in this case, the cathode rod is made of titanium. While the ground plane is preferably to adopt a configuration coated by any one selected from iridium, platinum, chromium.

The electroplating apparatus for a PCB according to the present invention has a structure in which a continuous plating process is possible without a lead electrically connecting a plurality of PCBs unlike a conventional plating method by a continuous feeding method. Accordingly, it is possible to expect a cost reduction due to the omission of the lead, and since the additional process of removing the lead is not required, problems such as a decrease in productivity and an increase in the defective rate due to the addition of the process can be solved.

In addition, as a continuous feeding method, unlike the prior art, the continuous processing is possible without being limited to the quantity of the plated object to be plated in one process, and thus, the time and quantity required for the plating process, that is, the product Mass productivity can be improved more. That is, it has a structural advantage that is very suitable for mass production in performing the PCB plating process.

Hereinafter, a preferred embodiment for implementing an electroplating apparatus for a PCB according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. In addition, terms to be described below are terms defined in consideration of functions within the present invention, and may be changed according to a user's or operator's intention or custom. Therefore, the definition should be made based on the contents throughout the specification.

2 is a schematic configuration diagram schematically showing the overall configuration of the electroplating apparatus for a PCB according to the first embodiment of the present invention, Figure 3 is a perspective view of a first embodiment of the present invention according to FIG. 4 is a perspective view of the energizing roller shown in FIG. 3, FIG. 5 is a cross-sectional view of the energizing roller shown in FIG. 4, and FIG. 6 schematically shows the overall configuration of an electroplating apparatus for a PCB according to a second embodiment of the present invention. It is a schematic block diagram shown.

First, referring to FIGS. 2 to 3, the electroplating apparatus for a PCB according to the present invention includes a plating bath 10 in which an electrolyte is accommodated and a portion of the plating bath 10 in which the electrolyte is immersed in the electrolyte of the plating bath 10. 10) includes an energizing roller 20 rotatably mounted therein. The plating bath 10 is accommodated in the receiving tank 12 having a volume large enough to accommodate this, the energizing roller 20 is plated for the plated body in the plating tank 10 Do this.

Referring again to FIGS. 2 to 3, the plating bath 10 is in the form of an open top container having a volume sufficient to accommodate a sufficient electrolyte, and an anode connected to the anode terminal of an external rectifier (not shown). A rod (not shown).

The anode rod is electrically connected to a basket (not shown) containing a reaction metal, such as copper, tin, silver, palladium, nickel, and the like, deposited on a PCB, which is to be plated, and the basket is immersed in an electrolyte. Therefore, when a current is applied to the anode rod, the reaction metal is oxidized by an electrical reaction and is present in the electrolyte in an ionic state.

In the embodiment of the present invention, the plating bath 10 is accommodated in the receiving tank 12 having a volume large enough to accommodate the plating bath 10, and the plating bath 10 is good inside. The electrolyte is continuously supplied from the outside to secure the plating property.

Accordingly, the electrolyte solution continuously supplied to the plating bath and overflowed from the plating bath passes through the space 14 between the sidewall of the plating bath 10 and the side wall of the receiving tank 12. ) Can be flowed to the bottom side.

Preferably, the receiving tank 12 and the plating bath 10 is connected via a return pipe 40, the return pipe 40 is the electrolyte back to the bottom of the receiving tank 12, the plating bath ( 10) A pump 42 is installed to return to the inside.

Therefore, due to the provision of sufficient electrolyte from the outside of the electrolyte contained in the plating bath 10, the electrolyte flowing to the bottom side of the receiving tank 12 by overflowing the upper end of the side wall of the plating bath 10 is transferred to the return pipe ( 40) and the pump 42 may be supplied back into the plating bath 10.

In the present invention, an air knife 50 that vertically injects high pressure air vertically below the separation space may be installed directly above the separation space between the plating tank 10 and the accommodation tank 12.

In this case, when the electrolyte flows from the plating bath 10 and flows to the bottom side of the container 12, the electrolyte is contained in the container by the air injected at a high pressure from the air knife 50. It is possible to maintain a good flow toward the bottom of the receiving tank 12 without scattering outward.

The conduction rollers 20 are arranged in series in the plating bath 10 so that good plating property can be secured through plating in multiple stages. In the present invention, the energizing roller 20 has a plurality of negative electrode rods 24 corresponding to the positive electrode rods, and the negative electrode rod 24 is disposed on the outer surface of the driving drum 22 constituting the energizing roller 20. In a state of being installed at appropriate intervals in the circumferential direction of the drive drum 22, it is in contact with the PCB 30, which is the plated body being moved in the plating bath 10 while being rotated by the drive drum 22, so as to be locally energized.

Therefore, the PCB 30 which is the plated body in which the cathode rod 24 is being moved in the plating vessel while power is applied to the anode rod of the plating vessel 10 and the cathode rod 24 of the conducting roller, respectively. When locally contacted with the electricity supply, ions of the reactive metal generated in the anode rod are deposited thinly on the circuit pattern formed on the PCB 30, which is the plated body in contact with the cathode rod, through the electrolyte, thereby plating the circuit pattern.

Specifically, as shown in FIGS. 4 to 5, the energizing roller 20 includes a plurality of the cathode rods spaced at appropriate intervals according to the driving drum 22 having the rotating shaft 220 and the outer surface of the driving drum 22. (24). The negative electrode rod 24 is detachably mounted on the driving drum through fixing plates 26a and 26b installed at both sides of the driving drum 22, and the fixing plates 26a and 26b are mounted on the negative electrode rod 24. A conductor, such as a copper plate 265, in electrical contact with both ends is received therein.

At this time, the copper plate 265 is electrically connected to the external power line (L) that is drawn through the rotary shaft 220, and thus to the copper plate inside the fixed plate (26b) through the external power line (L) (- When power is applied, the negative power is transferred to each negative electrode 24 through the copper plate 260 so that the negative electrode 24 has a negative power.

The fixing plate 26a of any one of the pair of fixing plates 26a and 26b facing each other so that the cathode rod 24 can be fixedly mounted on the driving drum 22 via the fixing plates 26a and 26b. ), Grooves 260a are formed at appropriate intervals, and holes 260b are formed at other fixing plates 26b at intervals corresponding to the grooves 260a. At one end of the cathode rod 24, a protrusion 241 fitted into the groove 260a is formed, and at the other end of the cathode rod 24, a coupling groove 242 is formed to match the hole 260b when the cathode rod 242 is assembled. do.

In this case, the protrusion formed at one end of the cathode rod 24 is first inserted into the groove 260a of the fixing plate 26a, and the fastening groove 242 formed at the other end is the hole 260b of the other fixing plate 26b. In the state of being aligned with, using the fastening member (B), for example, the bolt through the hole and the hole at the same time, it is possible to simply mount and fix the negative electrode 24 on the drive drum through the disk-shaped drum. .

In the first embodiment of the present invention, any one of a plurality of holes 260b formed in the fixing plate 26b and the groove 26a of the other fixing plate 26a at a position corresponding thereto, and the groove corresponding thereto. Depending on whether the negative electrode 24 is positioned, the distance between the negative electrode 24 and the other negative electrode 24 on the drive drum 22 can be adjusted appropriately.

In this case, the cathode rod 24 and the other cathode rod 24 adjacent thereto are spaced so that continuous plating can be performed in consideration of the overall width of the circuit pattern formed on the PCB 30 to be processed. It is preferable to construct.

Preferably, a ground surface 240 of a fine uneven pattern is formed in the outermost curved portion of the cathode rod 24 (see partial enlarged view of FIG. 4). The uneven pattern of the ground plane 240 may have a structure in which unit unevenness having a width of several tens of microns to several millimeters is formed in a continuous pattern in the longitudinal direction of the negative electrode rod 24 at the outermost curved portion of the negative electrode rod 24. .

In this case, since it is possible to cope with the fine circuit pattern due to the recent high functionalization and high integration, it is possible to solve the plating failure due to the poor contact between the cathode rod 24 and the fine circuit pattern formed on the PCB 30 during plating.

In the present invention, the cathode rod 24 is preferably made of titanium having excellent electrical conductivity, and the surface of the ground surface 240 having the uneven pattern is coated with one of metal selected from iridium, platinum, and chromium thinly. It is good to improve electrical conductivity by treating. In addition, by covering the both sides of the cathode rod 24 with an insulator 244 such as PVC, based on the ground plane 240 having the uneven pattern, the other region outside the cathode plane 24 outside the ground plane during plating. It is preferable to prevent the deposition of metal ions on the substrate.

Furthermore, a substrate transfer device 60 for transferring a PCB, which is a plated body, is installed in the plating tank 10 under the conduction roller 20. The substrate transfer device 60 has a predetermined distance from the cathode rod positioned at the lowermost end of the cathode rod 24 constituting the energizing roller 20 in the plating bath 10, specifically, the thickness of the PCB 30, which is a plated body. Are spaced apart by a corresponding distance.

Accordingly, when the PCB 30, which is a plated body, is placed on the substrate transfer apparatus on one side of the plating vessel 10, the PCB 30 is transferred from one side of the plating vessel 10 to the other side through the substrate transfer apparatus 60. In this process, plating is performed while sequentially contacting the lowermost cathode rods 24 of the plurality of conducting rollers 20 arranged in series in the plating bath.

The substrate transfer device 60 applied in the present invention includes a belt body 62 on which the PCB 30 as a plated body is placed, and a plurality of feeding rollers 64 supporting the movement while the belt body 62 is moved. do. At this time, a mounting protrusion 620 for fixing the PCB 30, which is a plated body, is formed to protrude at regular intervals on the belt body 62.

Therefore, when the PCB 30 is moved from one side to the other side of the plating bath 10 while being placed on the substrate transfer device 60, the ground plane and the belt body 62 of the cathode rod 24 of the energization roller 20. There is no local pressure between them, so they don't cause problems such as being pushed out of their position or getting out of their designated position.

Preferably, the mounting protrusion 620 formed on the belt body 62 is formed of the other cathode rod 24 adjacent to the ground plane 240 of the cathode rod 24 formed on one energizing roller 20. It has a spaced interval corresponding to the length of the arc (弧) connecting the ground plane 240.

In this case, if the belt body 62 and the energizing roller 20 are moved and rotated at the same speed, the belt body 62 and the other negative electrode 24 adjacent to one negative electrode 24 on the one conductive roller 20 are rotated. Since one PCB 30 placed on the substrate transfer device 60 and the other PCB 30 located behind the substrate transfer device are connected to the two neighboring negative electrode rods 24 in turn, the substrate transfer device 60 is connected. Even if a plurality of PCBs are continuously transferred through the current through the contact with the cathode rod 24 can be made clearly.

In supplying the PCB 30 to be plated to one side of the substrate transfer apparatus 60 or withdrawing the PCB 30 which has been plated from the substrate transfer apparatus 60, the one side and the other side of the plating vessel 10 are removed. The operator may be positioned at both ends of the substrate transfer device to supply the PCB to be plated by hand and take out the plated PCB from the plating bath by hand. However, this requires a separate management manpower.

Accordingly, although not shown in the drawing, the PCB to be plated is moved in a vertical direction at a position close to both ends of the substrate transfer device 60 and placed on the substrate transfer device 60, or the plated PCB is pulled out of the plating bath. By installing a vertical moving device, such as a vertically moved conveyor or a PCB adsorption device that is moved in the vertical direction in the state of the adsorption, it is also a good way to avoid the consumption of manpower caused by the manual work.

More preferably, as in the second embodiment shown in FIG. 6, one side wall of the plating bath 10 and the receiving tank 12 having a height corresponding to the installation position of the substrate transfer device 60 is provided. Inlets 100, 120 and outlets 102 and 122 are formed on the other side walls to allow the plated body to be drawn into and out of the plating bath 10, respectively, and the inlets 100, 120 and outlet 102 are formed. It may be a configuration in which a pair of guide rollers (70a, 70b) is provided close to the (122) side.

In the case of the second embodiment, the PCB 30, which is the plated body, is introduced into the plating bath 10 and transferred to the substrate transfer device 60, or the PCB 30, which has been plated, is transferred from the substrate transfer device 60. Since the process of drawing out the plating bath 10 is made on the same plane, it is possible to supply the PCB 30 to the plating bath or to withdraw it from the plating bath more continuously and more stably. As a result, continuous PCB supply and withdrawal is possible, which further improves the mass productivity of the product, and is therefore suitable when mass production is required.

The electroplating apparatus for a PCB according to the present invention has a structure in which a continuous plating process is possible without a lead electrically connecting a plurality of PCBs unlike a conventional plating method by a continuous feeding method. Accordingly, it is possible to expect a cost reduction due to the omission of the lead, and since the additional process of removing the lead is not required, problems such as a decrease in productivity and an increase in the defective rate due to the addition of the process can be solved.

In addition, as a continuous feeding method, unlike the prior art, the continuous processing is possible without being limited to the quantity of the plated object to be plated in one process, and thus, the time and quantity required for the plating process, that is, the product Mass productivity can be improved more. That is, it has a structural advantage that is very suitable for mass production in performing the PCB plating process.

While the invention has been shown and described with respect to specific embodiments thereof, it will be appreciated that the invention can be modified and modified in various ways without departing from the spirit or scope of the invention as set forth in the claims below. It will be apparent to those skilled in the art that the art can be easily understood.

1 is a view showing a schematic configuration of a conventional PCB electroplating apparatus.

Figure 2 is a schematic configuration diagram schematically showing the overall configuration of the electroplating apparatus for a PCB according to a first embodiment of the present invention.

3 is a perspective view of a first embodiment of the present invention according to FIG. 2;

4 is a perspective view of the energizing roller shown in FIG.

5 is a cross-sectional view of the energizing roller shown in FIG.

Figure 6 is a schematic configuration diagram schematically showing the overall configuration of the electroplating apparatus for a PCB according to a second embodiment of the present invention.

<Description of Signs of Major Parts of Drawings>

10 ... Plating tank 12 ... Staining tank

20 ... Power Roller 22 ... Drive Drum

24 ... cathode rods 26a, 26b ...

30 ... PCB 40 ... Return Pipe

42 pump 50 air knife

60 ... substrate feeder 62 ... belt

64 ... feeding roller 240 ... ground

244 Insulator 70a, 70b ... Guide Roller

Claims (14)

A plating bath containing an electrolyte solution; An accommodation tank accommodating the plating tank therein; A plurality of energizing rollers rotatably mounted in a form in which a part thereof is immersed in the electrolyte contained in the plating bath, and a plurality of conducting rollers arranged in series in the longitudinal direction of the plating bath; And Installed at a predetermined distance from the conduction roller in the plating tank under the conduction roller, the PCB to be plated introduced from one side of the plating tank is sequentially contacted with the plurality of conducting rollers to be transferred from one side of the plating tank to the other side. It includes; a substrate transfer device for transferring the PCB to be plated to be so that, The energization roller, A driving drum with a rotating shaft, A plurality of cathode rods disposed at equal intervals along the circumferential direction on the outer surface of the driving drum; Electrolytic plating apparatus for a PCB, characterized in that consisting of a fixed plate coupled to both ends of the drive drum with a drive drum therebetween to place the plurality of cathode rods on the drive drum. The method of claim 1, The electrolyte is continuously supplied into the plating bath, The reservoir is large enough to accommodate the plating vessel, The electrolytic solution continuously supplied to the plating bath and flows from the plating bath flows to the bottom of the receiving tank through a space between the plating tank sidewall and the receiving tank sidewall. The method of claim 2, The electroplating apparatus for a PCB further comprising a pump and return pipe for returning the electrolyte flowed to the bottom of the reservoir back into the plating tank. The method of claim 3, wherein In order to maintain the flow toward the bottom side of the reservoir without scattering the electrolyte overflowed from the plating vessel to the outside of the reservoir, the space below the separation space below the separation space between the plating vessel and the reservoir. Electrolytic plating device for a PCB, characterized in that the air knife (air knife) for injecting high-pressure air vertically is installed. The method of claim 1, The substrate transfer device, Consists of a belt body and a plurality of feeding rollers supporting the movement of the belt body, Electroplating device for a PCB, characterized in that the belt body is formed in the groove grooves for fixing the PCB mounting fixed plated body at regular intervals. The method of claim 1, The cathode rod has a ground plane of a fine uneven pattern on the outermost curved portion, Electroplating apparatus for a PCB, characterized in that both side portions are coated with an insulator based on the ground plane. The method of claim 6, The cathode rod is made of titanium, Electroplating device for a PCB, characterized in that the ground plane of the cathode rod is coated by any one selected from iridium, platinum, chromium. A plating bath containing an electrolyte solution; An accommodation tank accommodating the plating tank therein; A plurality of energizing rollers rotatably mounted in a form in which a part thereof is immersed in the electrolyte contained in the plating bath, and a plurality of conducting rollers arranged in series in the longitudinal direction of the plating bath; Installed at a predetermined distance from the conduction roller in the plating tank under the conduction roller, the PCB to be plated introduced from one side of the plating tank is sequentially contacted with the plurality of conducting rollers to be transferred from one side of the plating tank to the other side. A substrate transfer device for transferring a PCB to be plated so as to be able to be transferred; Inlets and outlets respectively formed on one side wall and the other side wall of the plating bath and the receiving bath at a height corresponding to the installation position of the substrate transfer device; And And a pair of guide rollers installed in close proximity to the inlet and the outlet, respectively, to introduce the PCB to be plated into the plating bath or to draw the PCB to be plated out of the plating bath. The energization roller, A driving drum with a rotating shaft, A plurality of cathode rods disposed at equal intervals along the circumferential direction on the outer surface of the driving drum; Electrolytic plating apparatus for a PCB, characterized in that consisting of a fixed plate coupled to both ends of the drive drum with a drive drum therebetween to arrange the plurality of cathode rods on the drive drum. The method of claim 8, The electrolyte is continuously supplied into the plating bath, The reservoir is large enough to accommodate the plating vessel, The electrolytic solution continuously supplied to the plating bath and flows from the plating bath flows to the bottom of the receiving tank through a space between the plating tank sidewall and the receiving tank sidewall. The method of claim 9, The electroplating apparatus for a PCB further comprising a pump and return pipe for returning the electrolyte flowed to the bottom of the reservoir back into the plating tank. The method of claim 10, In order to maintain the flow toward the bottom side of the reservoir without scattering the electrolyte overflowed from the plating vessel to the outside of the reservoir, the space below the separation space below the separation space between the plating vessel and the reservoir. Electrolytic plating device for a PCB, characterized in that the air knife (air knife) for injecting high-pressure air vertically is installed. The method of claim 8, The substrate transfer device, Consists of a belt body and a plurality of feeding rollers supporting the movement of the belt body, Electroplating device for a PCB, characterized in that the belt body is formed in the groove grooves for fixing the PCB mounting fixed plated body at regular intervals. The method of claim 8, The cathode rod has a ground plane of a fine uneven pattern on the outermost curved portion, Electroplating apparatus for a PCB, characterized in that both side portions are coated with an insulator based on the ground plane. The method of claim 13, The cathode rod is made of titanium, Electroplating device for a PCB, characterized in that the ground plane of the cathode rod is coated by any one selected from iridium, platinum, chromium.

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