CN211079399U - A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it - Google Patents
A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it Download PDFInfo
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- CN211079399U CN211079399U CN201921849688.5U CN201921849688U CN211079399U CN 211079399 U CN211079399 U CN 211079399U CN 201921849688 U CN201921849688 U CN 201921849688U CN 211079399 U CN211079399 U CN 211079399U
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Abstract
Disclosed are a conductive brush for a tin stripping apparatus and a tin stripping apparatus including the same, which may include a cathode plate and a conductive brush that is in contact with a PCB plate during a tin stripping process to apply a voltage to the PCB plate. The conductive brush may include: a brush handle electrically connected to an external power source; brush filaments fixed and electrically connected to the brush holder; a support member overlapping the brush filaments and fixed to the brush holder together with the brush filaments to support the brush filaments; and a fixing part including a cover plate covering the brush wire and a portion of the support part and coupled to the brush holder to fix the brush wire and the support part between the brush holder and the fixing part. The tin stripping device adopting the conductive brush can accelerate the tin stripping speed and improve the tin stripping effect.
Description
Technical Field
The utility model relates to a metallic coating's removal technical field specifically, relates to a move back tin equipment that is used for moving back tin equipment's electrically conductive brush and contains it.
Background
Printed Circuit Boards (PCBs) are one of the important components in the electronics industry and are the supports for electronic components. Generally, in a process of manufacturing a printed circuit board, after a wiring pattern is formed by screen printing or a photochemical method, a conductive pattern is plated with tin to form a corrosion-resistant metal protective layer for protecting the wiring pattern, thereby protecting the wiring pattern from corrosion damage during a subsequent alkaline etching process. After the completion of the alkaline etching, it is necessary to remove the tin protective layer formed on the surface of the wiring pattern and the copper-tin alloy formed at the interface between the tin protective layer and the base material Cu for the subsequent processing.
In the tin stripping process, a specific tin stripping solution (also referred to as a tin stripping solution) is usually used to dissolve the tin plating layer. The tin stripping solution used for dissolving the tin coating is required to react with the tin coating, but does not damage the substrate of the PCB or has a reaction speed with the substrate which is much lower than that with the tin coating. Specifically, in the actual production process, the tin stripping solution is sprayed on the surface of the PCB by a nozzle under a certain pressure to strip tin, or the PCB containing a tin coating is soaked in the tin stripping solution and combined with mechanical action to realize the purpose of tin stripping. However, the above-mentioned tin stripping method has problems that the PCB substrate is easily corroded, the tin is easily oxidized, and/or the tin stripping efficiency is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a move back tin equipment.
An object of the utility model is to provide a can solve the back tin equipment of at least one problem in the above problem.
The utility model provides a lead electric brush for moving back tin equipment, this move back tin equipment can include the negative plate and move back tin technology period and the conductive brush that contacts with the PCB board in order to exert voltage to the PCB board. The conductive brush may include: a brush handle electrically connected to an external power source; brush filaments fixed and electrically connected to the brush holder; a support member overlapping the brush filaments and fixed to the brush holder together with the brush filaments to support the brush filaments; and a fixing part including a cover plate covering the brush wire and a portion of the support part and coupled to the brush holder to fix the brush wire and the support part between the brush holder and the fixing part.
In an embodiment according to the present invention, the brush filaments may include: a first filament secured and electrically connected to a first surface of the handle; and the second filament is secured to and electrically connected to a second surface of the handle opposite the first surface. The support member may include: a first support member overlapping the first filaments and fixed to a first surface of the brush holder together with the first filaments; and a second support member overlapping the second filaments and fixed to the second surface of the handle together with the second filaments, wherein the second support member is located between the first and second filaments. The cover plate may include: a first cover plate covering the first filament and the first support member and coupled to the first surface of the handle to fix the first filament and the first support member between the first surface of the handle and the first cover plate; and a second cover plate covering the second filament and the second support member and coupled to the second surface of the handle to fix the second filament and the second support member between the second surface of the handle and the second cover plate.
In an embodiment according to the invention, the cover plate and the handle may comprise a plurality of holes corresponding to each other, respectively, the cover plate being fixed to the handle by means of said plurality of holes corresponding to each other by means of screws and nuts.
In an embodiment according to the invention, the cover plate and the brush handle may be bonded to each other by means of a conductive glue. The conductive adhesive can be silver-based conductive adhesive, copper-based conductive adhesive or graphite-based conductive adhesive.
In an embodiment according to the present invention, the brush wire may be a carbon fiber wire, a carbon fiber cloth, a conductive cloth, or a titanium foil.
In an embodiment according to the invention, the filaments may comprise a first portion located between the cover plate and the handle and a second portion extending from the first portion beyond the edge of the handle. The first portion may be carbon fiber cloth or conductive cloth, and the second portion may be carbon fiber filaments or conductive filaments extending from the first portion.
In an embodiment according to the invention, both ends of the handle may comprise protrusions. The protrusions may be respectively inserted into fixing grooves on sidewalls of the tin-stripping bath facing each other.
In an embodiment according to the present invention, the support member may be a silicone sheet, a PVC sheet, or a hot melt adhesive film. The brush handle can be a titanium plate or a copper plate. The cover plate may be a titanium plate, a copper plate, a stainless steel plate, or an aluminum plate.
In an embodiment according to the invention, the conductive brush may further comprise a sealing portion at least partially covering the brush handle and the cover plate to isolate the brush handle and the cover plate from the solder stripping solution during the solder stripping process.
The utility model also provides a tin equipment moves back, moves back tin equipment and can include the tin groove subassembly that moves back. The tin stripping groove component can comprise: the tin stripping tank is used for containing tin stripping liquid; the electrode part is arranged in the tin stripping tank and comprises a cathode plate and the conductive brush; and the conveying part is arranged in the tin stripping tank and comprises a plurality of thin row roller groups. The conductive brush may be disposed alternately with the thinning roller group and extend in a direction parallel to an extending direction of the thinning roller group.
Through adopting according to the utility model discloses a tin speed can be accelerated to the conductive brush of embodiment, the tin effect is moved back in the improvement. In addition, the tin stripping equipment adopting the conductive brush can easily realize stripping of tin layers with different thicknesses, and reduce the contact of tin and air during the tin stripping process so as to prevent Sn2+Is oxidized into Sn by oxygen in the air4+The simple electrochemical tin stripping device is provided, so that the pollution caused by tin stripping is avoided or reduced, the recycling of tin stripping liquid is easily realized, and the cost is saved.
Drawings
These and/or other aspects will become apparent and more readily appreciated from the following description of the exemplary embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a perspective view of a tin stripping apparatus according to an exemplary embodiment of the present inventive concept;
fig. 2 is a cross-sectional view of a tin stripping apparatus taken along line I-I' of fig. 1, according to an exemplary embodiment of the present inventive concept;
fig. 3 is a cross-sectional view of a tin stripping apparatus taken along line II-II' of fig. 1, according to an exemplary embodiment of the present inventive concept;
fig. 4 is a cross-sectional view of a conductive brush according to an exemplary embodiment of the present invention; and
fig. 5 is a schematic view of a handle and cover plate of a conductive brush according to an exemplary embodiment of the present invention.
Detailed Description
The principles of the present invention will be described in further detail below with reference to the accompanying drawings and exemplary embodiments to make the technical solutions of the present invention clearer.
Fig. 1 is a perspective view of a tin stripping apparatus according to an exemplary embodiment of the present inventive concept. In the drawings, the X-axis, the Y-axis, and the Z-axis are not limited to three axes of a rectangular coordinate system, and may be explained in a broader sense. For example, the X, Y, and Z axes may be perpendicular to each other, or may represent different directions that are not perpendicular to each other.
Referring to fig. 1, a tin stripping apparatus 1000 according to an exemplary embodiment of the present inventive concept may include a tin stripping bath assembly 1100 and a solution bath 1200.
As shown in fig. 1, the tin stripping bath assembly 1100 may at least partially overlap the solution bath 1200 in the Z-direction and may be disposed above the solution bath 1200. Tin stripping assembly 1100 may include inlet ports 1171 and 1172 disposed at a side wall thereof. The tin stripping bath assembly 1100 may be an assembly that includes an electrolytic bath (or tin stripping bath) for performing a tin stripping process. During the tin stripping process, the tin stripping liquid is injected into the tin stripping tank assembly 1100 through the liquid inlets 1171 and 1172, the PCB to be tin stripped is provided into the tin stripping tank assembly, and then the tin plating layer and the copper-tin alloy layer on the PCB are stripped by an electrochemical method by using the tin stripping liquid. The specific structure of the tin stripping assembly 1100 will be described in detail later with reference to fig. 2 and 3.
As shown in fig. 1, the solution tank 1200 may be disposed at a lower portion of the tin stripping tank assembly 1100, and the solution tank 1200 may include a liquid inlet 1221 and a liquid outlet 1222 disposed at side walls thereof. The solution tank 1200 may be used to contain a tin stripping solution for stripping tin-plated and tin-copper alloy layers on a PCB.
In an embodiment according to the present disclosure, the tin stripping bath assembly 1100 and the solution bath 1200 may be disposed in fluid communication with each other. Specifically, the tin stripping bath assembly 1100 and the solution bath 1200 may be separate assemblies, respectively, or may be integrally formed with each other, and the tin stripping bath assembly 1100 and the solution bath 1200 may be in fluid communication with each other through a preset fluid passage. For example, the fluid pathway may be a flow-through channel disposed at the interface between the tin stripping bath assembly 1100 and the solution bath 1200, or may be a fluid delivery line for connecting the tin stripping bath assembly 1100 and the solution bath 1200.
According to the exemplary embodiment of the present invention, during the tin stripping process, the tin stripping solution is first conveyed into the solution tank 1200 through the inlet 1221 provided on the side wall of the solution tank 1200, and then conveyed into the interior of the tin stripping tank assembly 1100 through the circulating pump 1300 via the inlets 1171 and 1172 provided on the side wall of the tin stripping tank assembly 1100. Next, the tin stripping solution after the predetermined tin stripping time in the tin stripping bath assembly 1100 can be transferred to the solution bath 1200 located below the tin stripping bath assembly 1100. Next, the tin stripping solution transferred into the solution tank 1200 may be transferred again into the tin stripping tank assembly 1100 by the circulation pump 1300 disposed on the solution tank 1200 and separated from the tin stripping tank assembly 1100, so that the tin stripping solution is circulated for a predetermined time. Under the condition, the tin stripping liquid can be fully used to reduce the consumption of the tin stripping liquid and simultaneously realize the purpose of reducing the cost. Then, the tin stripping liquid circulated in the solution tank 1200 for a predetermined time can be discharged through the liquid outlet 1222 provided on the side wall thereof for subsequent processing.
As shown in fig. 1, the tin stripping apparatus 1000 according to an exemplary embodiment of the present inventive concept may further include a filter 1400. A filter 1400 can be disposed on the solution tank 1200 and separate from the tin stripping tank assembly 1100. The tin stripping solution can be delivered to the tin stripping bath 1110 after passing through the filter 1400. The filter 1400 may be used to filter impurities (e.g., brush wires of a brush (see fig. 2 and 3)) in the solder stripping solution to prevent the impurities from entering the solder stripping solution together with the solder stripping solution into the solder stripping assembly 1100 to damage or contaminate the PCB.
Although the tin stripping apparatus 1000 according to the embodiment of the present invention has been described in detail by referring to fig. 1, embodiments according to the present invention are not limited thereto. For example, the tin stripping apparatus 1000 may not include the solution tank 1200. In this case, the tin stripping liquid can be transported to the interior of the tin stripping assembly 1100 through a liquid inlet arranged on the tin stripping assembly 1100, and after a predetermined tin stripping time, the tin stripping liquid can be discharged from the tin stripping assembly 1100 through a liquid outlet arranged on the tin stripping assembly 1100.
Next, a specific structure of the tin stripping apparatus 1000 according to an embodiment of the present invention will be described in more detail with reference to fig. 2 and 3.
Fig. 2 is a cross-sectional view of a tin stripping apparatus taken along line I-I' of fig. 1, according to an exemplary embodiment of the present inventive concept. Fig. 3 is a cross-sectional view of a tin stripping apparatus taken along line II-II' of fig. 1, according to an exemplary embodiment of the present inventive concept.
Referring to fig. 2 and 3, the tin stripping assembly 1100 may include a tin stripping bath 1110, a housing 1120, a transfer portion 1130, and an electrode portion 1140.
The tin stripping groove 1110 may have a "L" shape (as shown in fig. 3) when viewed in a cross section parallel to a plane defined by the Y-direction and the Z-direction, in particular, the tin stripping groove 1110 may have a bottom plate and side walls protruding from edges of the bottom plate and extending in a direction perpendicular to the bottom plate, and may have an opening at a top portion, wherein the bottom plate of the tin stripping groove 1110 may be integrally formed with the bottom of the tin stripping assembly 1100, or may be in contact with the bottom of the tin stripping assembly 1100, in addition, as shown in fig. 2, a pair of opposing side walls of the tin stripping groove 1110 and a corresponding pair of opposing side walls of the housing 1120 are provided with openings as a feed inlet and a discharge outlet, respectively, to provide a board to be stripped of tin through the feed inlet into the tin stripping groove 1110 and to deliver the board to an external discharge outlet of a PCB according to the present invention, however, the tin stripping groove 1110 may also include a PCB board discharge outlet.
As shown in fig. 2, the conveyance 1130 may include a dilution roller (or referred to as a conveyance roller) 1131 and a manger roller 1132. The conveying portion 1130 may be used to convey (e.g., in the X direction) the PCB to be solder-stripped from the inlet of the solder stripping tank assembly 1100 to the outlet of the solder stripping tank assembly 1100 via the solder stripping tank 1110. In other words, the conveying part 1130 may provide a supporting force for the PCB and a driving force for the movement of the PCB during the solder stripping process.
Specifically, the draining rollers 1131 may be disposed at the feeding inlet and the discharging outlet of the solder stripping tank assembly 1100, so as to convey the PCB to be solder stripped from the feeding inlet into the solder stripping tank 1110, and send the solder stripped PCB out of the discharging outlet. The wicking roller 1131 may also be disposed in the solder stripping groove 1110 to support and move the PCB toward the dispensing opening. Each of the chop rollers 1131 may include a chop roller shaft (or referred to as a transfer line reel shaft, a line reel shaft) and at least one roller (or referred to as a roller plate, a line reel plate) that fits over the chop roller shaft. Both ends of the thin exhaust roller 1131 may be respectively connected to a pair of sidewalls facing each other of the tin-stripping bath 1110 where no opening is provided. In addition, the time consumed by the PCB passing through the solder stripping tank can be adjusted by controlling the rotation speed of the rare earth roller 1131, and further, the time for performing the solder stripping treatment on the PCB can be adjusted. In this case, different PCB traveling speeds may be provided by the jog wheel 1131 according to the tin layer thickness of the PCB and the like.
In addition, as shown in fig. 2, the thinning roller 1131 may be divided into a plurality of thinning roller groups, and each thinning roller group may include an upper thinning roller and a lower thinning roller disposed symmetrically to each other with respect to the traveling direction of the PCB panel. The number of the thin row roller groups can be set according to actual needs, and is not particularly limited. The plurality of thin line roller groups may be disposed to be spaced apart from each other by a predetermined distance in a traveling direction of the PCB board. In the tin stripping process, the upper surface and the lower surface of the PCB are respectively contacted with the upper thin row roller and the lower thin row roller. Thus, the PCB board can be more stably supported and transferred. In addition, the material forming the rarefaction roller 1131 is not particularly limited. In an embodiment according to the present invention, the roller shaft of the rarefaction roller 1131 may be made of, for example, a metal material with a relatively large density, so as to avoid being affected by the resistance caused by the solder stripping liquid.
In addition, the conveying part 1130 may further include a water blocking roller 1132. The water retaining roller 1132 may be respectively disposed at the discharge port and the feed port of the tin stripping tank assembly 1100 to prevent or reduce the outflow of the tin stripping liquid. Preferably, the water-blocking rollers 1132 may be respectively disposed at openings of the side walls of the tin stripping groove 1110 corresponding to the discharge port and the feed port, and may be disposed at the inner surfaces of the side walls of the tin stripping groove 1110. Similar to the rarefied exhaust roller 1131, the water blocking roller 1132 may also be divided into a plurality of water blocking roller groups, and each of the water blocking roller groups may include an upper water blocking roller and a lower water blocking roller that are symmetrically disposed with respect to a traveling direction of the PCB panel. In this case, a water retaining roller set may be disposed at the inlet and outlet of the tin stripping groove assembly 1100. Except supporting the PCB and making the PCB advance towards the export, water blocking roller 1132 can also prevent or reduce the tin solution that moves back in the tin bath and leak to guarantee to move back the stability of the liquid level in the tin bath and ensure to move back the steady progress of tin technology. Under the condition, when the tin stripping process is carried out, the PCB is soaked into the tin stripping liquid, so that the contact between tin and air can be reduced in the tin stripping process, and the problem that tin is oxidized is further avoided. In addition, embodiments according to the present inventive concept are not limited thereto, for example, the at least one water blocking roller set may also be disposed in the tin stripping bath 1110, and in particular, between openings of the tin stripping bath 1110 corresponding to a feed inlet and a discharge outlet of the tin stripping apparatus (e.g., disposed at an intermediate position of the tin stripping bath 1110). In this case, since the water blocking roller has a relatively large weight, it is possible to prevent the PCB from being adversely affected by buoyancy during the travel, and thus to stably transfer the PCB.
In addition, although not shown in fig. 1 to 3, the transfer part 1130 may further include a driver providing a driving force for the rarefied exhaust roller 1131 and the water stop roller 1132.
Referring to fig. 2 and 3, the electrode part 1140 may include a cathode plate 1141 and a conductive brush 1142.
Specifically, the tin stripping bath 1110 may define a space where the tin stripping process is actually performed. As shown in fig. 2 and 3, a portion of the transfer portion 1130, a cathode plate 1141, and a conductive brush 1142 may be disposed in the tin stripping bath 1110. The tin stripping solution and the PCB board may also be located within the tin stripping bath 1110 during the tin stripping process.
In an embodiment according to the present invention, since the PCB board generally employs double-sided wiring, the cathode plate 1141 may be disposed at the bottom and top of the tin stripping bath 1110 and include an upper cathode plate 1141a and a lower cathode plate 1141 b. The upper cathode plate 1141a and the lower cathode plate 1141b may face each other and be disposed at the bottom and the top of the tin stripping bath 1110, respectively, parallel to the PCB plate traveling direction, and the transferring part 1130 may be located between the upper cathode plate 1141a and the lower cathode plate 1141b facing each other. In other words, the transferring portion 1130 and the cathode plate 1141 may be disposed parallel to each other. However, according to an embodiment of the present invention is not limited thereto, for example, the cathode plate 1141 may include only the upper cathode plate 1141a disposed at the top of the tin stripping bath 1110.
Specifically, as shown in fig. 2 and 3, one end of the cathode plate fixing rod 1143 may be connected to one side wall of the tin stripping bath 1110, and the other end of the cathode plate fixing rod 1143 may be connected to the other side wall of the tin stripping bath 1110 facing the one side wall. The cathode plate 1141 may be connected to the cathode plate fixing rod 1143 by cathode taps 1145, for example, portions of the cathode plate fixing rod 1143 near both ends may be connected to the cathode plate 1141 by cathode taps 1145, respectively.
In addition, the cathode plug 1145 may be used to adjust a distance between the cathode plate and the anode plate (in the embodiment of the present invention, the PCB is used as an anode in the tin stripping process) in addition to connecting the cathode plate 1141 and the cathode plate fixing rod 1143. In other words, cathode plate 1141 (e.g., upper cathode plate 1141a and/or lower cathode plate 1141b) may be moved toward and/or away from the anode plate (or transport portion 1130) by cathode peg 1145 to enable adjustment of the pole pitch, which in turn may control the rate of stripping. When the pole pitch is reduced, the tin stripping rate can be increased and the power consumption can be reduced, but too small a pole pitch can make tin stripping non-uniform and increase the risk of short circuit. When the pole pitch is increased, the tin stripping rate is slowed down and the power consumption is increased. In an embodiment according to the invention, the pole pitch may be about 5cm to about 15 cm.
Referring again to fig. 2 and 3, a conductive brush 1142 may be disposed adjacent to the transmitting portion 1130 and between the upper cathode plate 1141a and the lower cathode plate 1141 b. However, when cathode plate 1141 includes only upper cathode plate 1141a, conductive brush 1142 may be located between upper cathode plate 1141a and the bottom plate of tin stripping bath 1110.
As shown in fig. 2 and 3, the conductive brushes 1142 may be arranged alternately with the chop roller 1131 in the direction of travel of the PCB. In other words, the conductive brushes 1142 may be respectively disposed between the rarefaction rollers 1131 (or rarefaction roller groups). The conductive brushes 1142 may be disposed to be spaced apart from each other at a predetermined interval in a PCB board traveling direction (e.g., X direction), and may extend in a direction (e.g., Y direction) parallel to an extending direction of the rare roller 1131 (or rare roller group). In other words, both ends of the conductive brush 1142 may be respectively connected to a pair of side walls (as shown in fig. 3) facing each other of the tin stripping bath 1110 where no opening is provided.
During the tin stripping process, the conductive brush 1142 may contact the PCB to apply a voltage to the PCB, thereby using the PCB as an anode, thereby achieving electrochemical tin stripping.
Additionally, conductive brush 1142 may include a brush handle (e.g., 1142a-1 and 1142b-1 shown in FIG. 3) and brush filaments (e.g., 1142a-2 and 1142b-2 shown in FIG. 3). The brush holders and the brush filaments may be electrically connected to each other.
As shown in fig. 2 and 3, the conductive brushes 1142 may be divided into a plurality of conductive brush groups. Each of the conductive brush groups may include upper and lower conductive brushes 1142a and 1142b, and the upper and lower conductive brushes 1142a and 1142b may be in contact with upper and lower surfaces of the PCB board, respectively. Each of the conductive brush groups may be alternately arranged with each of the thinning roller groups in a traveling direction of the PCB board. The upper and lower conductive brushes 1142a and 1142b in each conductive brush group may partially overlap each other, in other words, the upper and lower conductive brushes 1142a and 1142b are staggered from each other by a predetermined distance (for example, the width of the non-overlapped portions of the upper and lower conductive brushes 1142a and 1142b is about 3mm to 5mm) when viewed in a plan view. In this case, the travel resistance of the PCB board can be reduced. Further, when viewed in a cross-sectional view, the upper conductive brush 1142a and the lower conductive brush 1142b may be partially overlapped, and specifically, the brush filaments 1142a-2 of the upper conductive brush 1142a and the brush filaments 1142b-2 of the lower conductive brush 1142b may be partially overlapped (for example, overlapped length is 5 mm). Therefore, the conductive brush can be ensured to be fully contacted with the PCB, and simultaneously, the conductive brush and the PCB can generate mechanical action in the tin stripping process so as to accelerate the tin stripping rate.
The conductive brush 1142 will be described in detail below with reference to fig. 4 and 5.
As shown in fig. 4, the conductive brush 1142 may include a brush shaft 1142-1, brush filaments 1142-2, a support member 1142-3, and a fixing member.
The handle 1142-1 may be connected to an external power source to receive a predetermined voltage from the external power source. The brush holder 1142-1 may apply the received voltage to the PCB board through the brush filaments 1142-2. Thus, the brush handle 1142-1 may be made of a conductive material such as titanium, copper, aluminum, or alloys thereof. For example, in embodiments according to the invention, the brush holder 1142-1 may be a titanium plate or a copper plate.
The filaments 1142-2 may be secured to the handle 1142-1 and electrically connected to the handle 1142-1. Specifically, the filaments 1142-2 may be directly connected at one end to the handle 1142-1 and at the other end may be in contact with the PCB. Since the brush wires 1142-2 directly contact the PCB, the brush wires 1142-2 may be made of a conductive and flexible material (such as carbon fiber wires, carbon fiber cloth, conductive cloth, titanium foil, etc.), thereby preventing the conductive brush 1142 from damaging the PCB.
The support member 1142-3 may overlap the filaments 1142-2 and be secured to the handle 1142-1 with the filaments 1142-2. Since the brush filaments 1142-2 have flexibility, the supporting member 1142-3 may serve to support the brush filaments 1142-2 to ensure that the brush filaments 1142-2 can be stably contacted with the PCB board. In addition, the support member 1142-3 may be made of an insulating material (such as a silicone sheet, a PVC sheet, or a hot melt adhesive film). In this case, since the supporting member 1142-3 may function to shield the brush wires 1142-2, it is possible to prevent (or slow) the brush wires 1142-2 from being oxidized in a case where the brush wires 1142-2 are not in contact with the PCB, and thus it is possible to improve the lifespan and the use effect of the brush wires 1142-2.
The securing members may be used to secure the filaments 1142-2 and support members 1142-3 to the handle 1142-1 and include a cover plate 1142-4. A cover 1142-4 may cover the filaments 1142-2 and a portion of the support member 1142-3 and be coupled to the handle 1142-1 to secure the filaments 1142-2 and the support member 1142-3 between the handle 1142-1 and the cover 1142-4. In an embodiment according to the present invention, the cover plate 1142-4 may be made of a conductive metal material, for example, a titanium plate, a copper plate, a stainless steel plate, or an aluminum plate.
Specifically, in an embodiment in accordance with the present invention, as shown in fig. 4, the brush filaments 1142-2 may include first and second brush filaments 1142-2a and 1142-2b, respectively, disposed on surfaces of the brush handle 1142-1 facing away from each other.
Similarly, the support member 1142-3 may also include a first support member 1142-3a and a second support member 1142-3b corresponding to the first and second brush filaments 1142-2a and 1142-2b, respectively. In detail, the first support member 1142-3a may overlap the first brush filaments 1142-2a and be fixed to one surface of the brush holder 1142-1 together with the first brush filaments 1142-2 a. The second support member 1142-3b may overlap the second brush filaments 1142-2b and be fixed to the other surface of the brush holder 1142-1 opposite to the one surface together with the second brush filaments 1142-2 b. In addition, the second support member 1142-3b may be positioned between the first brush filaments 1142-2a and the second brush filaments 1142-2 b.
The cover plate 1142-4 may include a first cover plate 1142-4a and a second cover plate 1142-4b disposed corresponding to the first brush filaments 1142-2a and the second brush filaments 1142-2b, respectively. The first cover plate 1142-4a may cover the first brush filaments 1142-2a and the first support member 1142-3a and be coupled to one surface of the brush handle 1142-1 to fix the first brush filaments 1142-2a and the first support member 1142-3a between the one surface of the brush handle 1142-1 and the first cover plate 1142-4 a. A second cover plate 1142-4b may cover the second brush filaments 1142-2b and the second support member 1142-3b and be coupled to the other surface of the brush holder 1142-1 opposite to the one surface to fix the second brush filaments 1142-2b and the second support member 1142-3b between the other surface of the brush holder 1142-1 and the second cover plate 1142-4 b.
As shown in fig. 5, the brush handle 1142-1 may have protrusions at both ends in a length direction thereof. The protrusions may be respectively inserted into fixing grooves on the sidewalls of the tin-stripping bath 1110 facing each other, thereby fixing the conductive brush 1142 into the tin-stripping bath 1110.
The cover plate 1142-4 and the handle 1142-1 may include a plurality of holes corresponding to each other, respectively. In this case, the cover plate 1142-4 may be fixed to the brush holder 1142-1 via the plurality of holes corresponding to each other by screws and nuts (refer to 1142-5 in fig. 4). However, the embodiment according to the utility model is not limited thereto, for example, the cover plate 1142-4 and the brush holder 1142-1 may be coupled to each other by a conductive paste. For example, the conductive paste may be a silver-based conductive paste, a copper-based conductive paste, or a graphite-based conductive paste.
When the cover plate 1142-4 and the brush holder 1142-1 may be coupled to each other by the screw and the nut through the plurality of holes corresponding to each other, a portion of the brush wire 1142-2 between the cover plate 1142-4 and the brush holder 1142-1 may be a carbon fiber cloth or a conductive cloth, and another portion of the brush wire 1142-2 extending from the portion beyond an edge of the brush holder may be a carbon fiber wire or a conductive wire extending from the portion. Thus, the brush filaments 1142-2 are prevented from loosening and falling off. However, when the cover plate 1142-4 and the brush holder 1142-1 may be combined with each other by a conductive paste, the arrangement of the brush filaments 1142-2 is not particularly limited. In addition, the length of the other portion of the filaments 1142-2 extending from the portion beyond the edge of the handle can be set according to practical needs, too short a length will prevent the filaments from stably contacting the PCB board, and too long a length will increase the resistance.
Further, during the tin stripping process, since the conductive brush 1142 is entirely immersed in the tin stripping liquid, in order to avoid corrosion of the metal conductor of the conductive brush by the tin stripping liquid, a sealing portion (not shown) may also be provided outside the conductive brush. The sealing portion may at least partially cover the brush holder 1142-1 and the cover plate 1142-4 of the conductive brush 1142 to isolate the brush holder 1142-1 and the cover plate 1142-4 from the solder stripping solution during the solder stripping process. However, embodiments according to the present invention are not limited thereto, and for example, when the brush holder 1142-1 and the cover plate 1142-4 are formed of metallic titanium, since titanium is not easily corroded by the tin stripping liquid, the sealing portion may be omitted.
Additionally, the conductive brush 1142 may further include an electrical connection 1142-6 electrically connecting the brush handle 1142-1 to an external power source. However, in another embodiment in accordance with the present invention, electrical connections 1142-6 may be omitted.
According to the utility model discloses an in the embodiment, come to reduce tin and air contact in the tin process of moving back through soaking the PCB board in moving back the tin liquid, and then avoided the tin to be oxidized the problem. However, stripping tin by immersion reduces the stripping rate. Therefore, according to the utility model discloses an in the embodiment, can further utilize electrochemical method to accelerate reaction rate through the tin equipment that moves back that has above-mentioned electrically conductive brush to can take place mechanical action through electrically conductive brush and PCB board and further accelerate the tin speed that moves back, and then solved and soaked the reaction rate reduction problem that moves back the tin.
In addition, the tin stripping bath assembly 1100 may further include a liquid inlet pipe 1150 disposed at the bottom of the tin stripping bath 1110. The tin stripping liquid is injected into the tin stripping tank 1110 from liquid inlets 1171 and 1172 on the side wall of the tin stripping tank 1110 through a liquid inlet pipe 1150 (as shown by the arrow in fig. 2). Then, the solder stripping solution injected into the solder stripping tank 1110 gradually fills the internal space of the solder stripping tank 1110, so that the electrode portion 1140 and the transmitting portion 1130 in the solder stripping tank 1110 are immersed in the solder stripping solution. As shown by arrows in fig. 2 and 3, after the predetermined time of tin stripping treatment, the tin stripping liquid overflows through an opening at the top of the tin stripping bath 1110 to a gap between the side wall of the tin stripping bath 1110 and the inner surface of the housing 1120, and then flows into the solution bath 1200 through the gap via a fluid passage between the tin stripping bath assembly 1100 and the solution bath 1200. In addition, the tin-stripping solution flowing into the solution tank 1200 may be re-injected into the tin-stripping tank 1110 by the circulation pump 1300, so that the tin-stripping solution is recycled to more fully utilize the tin-stripping solution. After a predetermined cycle time, the tin stripping solution can be drained from the solution tank 1200.
Further, referring to fig. 3, the solution tank 1200 may further have an inclined bottom surface. Specifically, the horizontal height of the portion of the bottom surface of the solution tank 1200 overlapping the tin stripping tank assembly 1100 is higher than the horizontal height of the portion of the bottom surface thereof overlapping the circulation pump 1300. In this way, the liquid level of the tin stripping liquid at the portion of the solution tank 1200 overlapping the circulation pump 1300 can be ensured, and thus the circulation of the tin stripping liquid can be stably performed.
In addition, the tin stripping apparatus according to the embodiment of the present invention may further include a power supply device (not shown), a support assembly 1500, a condensing device (not shown), a heating apparatus (not shown), and the like.
Specifically, the power supply device may be disposed outside the tin stripping apparatus, and may supply voltages of respective polarities to the cathode plate 1141 and the conductive brush 1142 during the tin stripping process, respectively. During the tin stripping process, the supply current can be regulated by the power supply device, so that the tin layers with different thicknesses can be stripped.
A condensing device (not shown) and a heating apparatus (not shown) may also be included in the solution tank 1200 to achieve temperature control of the tin stripping solution for improving tin stripping efficiency.
According to the utility model discloses an embodiment, through adopting above-mentioned electrically conductive brush, can take place mechanical action through electrically conductive brush and PCB board and further accelerate back tin speed, and then solved and soaked the reaction rate reduction problem that moves back tin. In addition, the tin stripping device adopting the conductive brush can realize at least one of the following effects: the stripping of tin layers with different thicknesses is easily achieved; reducing tin to air contact during tin stripping process, thereby preventing Sn2+Is oxidized into Sn by oxygen in the air4+(ii) a Provides a simple electrochemical tin stripping device; the pollution caused by tin stripping is avoided or reduced; the tin stripping liquid is easily recycled, the cost is saved, the energy consumption is reduced, and the tin recovery efficiency is also improved.
Although the tin stripping apparatus according to the exemplary embodiments of the present inventive concept has been described above with reference to the accompanying drawings, the present invention is not limited thereto. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the inventive concept.
Claims (10)
1. A conductive brush for a tin stripping apparatus, the tin stripping apparatus comprising a cathode plate and a conductive brush in contact with a PCB plate during a tin stripping process to apply a voltage to the PCB plate, the conductive brush comprising:
a brush handle electrically connected to an external power source;
brush filaments fixed and electrically connected to the brush holder;
a support member overlapping the brush filaments and fixed to the brush holder together with the brush filaments to support the brush filaments;
and a fixing part including a cover plate covering the brush wire and a portion of the support part and coupled to the brush holder to fix the brush wire and the support part between the brush holder and the fixing part.
2. The conductive brush according to claim 1,
the brush silk includes: a first filament secured and electrically connected to a first surface of the handle; and the second filaments are secured to and electrically connected to a second surface of the handle opposite the first surface;
the support member includes: a first support member overlapping the first filaments and fixed to a first surface of the brush holder together with the first filaments; and a second support member overlapping the second filaments and fixed to the second surface of the handle together with the second filaments, wherein the second support member is located between the first and second filaments; and
the cover plate includes: a first cover plate covering the first filament and the first support member and coupled to the first surface of the handle to fix the first filament and the first support member between the first surface of the handle and the first cover plate; and a second cover plate covering the second filament and the second support member and coupled to the second surface of the handle to fix the second filament and the second support member between the second surface of the handle and the second cover plate.
3. The conductive brush of claim 1 or 2, wherein the cover plate and the brush holder respectively include a plurality of holes corresponding to each other, and the cover plate is fixed to the brush holder by screws and nuts through the plurality of holes corresponding to each other.
4. The conductive brush as claimed in claim 1 or 2, wherein the cap plate and the brush holder are coupled to each other by a conductive paste,
wherein the conductive adhesive is silver-based conductive adhesive, copper-based conductive adhesive or graphite-based conductive adhesive.
5. The conductive brush according to claim 1 or 2, wherein the brush filaments are carbon fiber filaments, carbon fiber cloth, conductive cloth, or titanium foil.
6. A conductive brush according to claim 3, wherein the filaments comprise a first portion located between the cover plate and the handle and a second portion extending from the first portion beyond the edge of the handle,
the first part is carbon fiber cloth or conductive cloth, and the second part is carbon fiber wires or conductive wires extending from the first part.
7. The conductive brush according to claim 1 or 2,
both ends of the brush holder include protruding portions respectively inserted into fixing grooves on side walls of the tin-stripping grooves facing each other.
8. The conductive brush according to claim 1 or 2, wherein the support member is a silicone sheet, a PVC sheet, or a hot-melt adhesive film,
the brush handle is a titanium plate or a copper plate, and
the cover plate is a titanium plate, a copper plate, a stainless steel plate or an aluminum plate.
9. The conductive brush of claim 1 or 2, further comprising a sealing portion at least partially covering the brush handle and the cover plate to isolate the brush handle and the cover plate from the solder stripping solution during the solder stripping process.
10. The tin stripping device is characterized by comprising a tin stripping groove component,
the tin stripping groove component comprises:
the tin stripping tank is used for containing tin stripping liquid;
an electrode portion disposed in a tin stripping bath, comprising a cathode plate and the conductive brush according to any one of claims 1 to 9; and
a conveying part which is arranged in the tin stripping tank and comprises a plurality of thin row roller groups,
wherein the conductive brush is alternately disposed with the thin row roller set and extends in a direction parallel to an extending direction of the thin row roller set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921849688.5U CN211079399U (en) | 2019-10-30 | 2019-10-30 | A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921849688.5U CN211079399U (en) | 2019-10-30 | 2019-10-30 | A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211079399U true CN211079399U (en) | 2020-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921849688.5U Active CN211079399U (en) | 2019-10-30 | 2019-10-30 | A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it |
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| Country | Link |
|---|---|
| CN (1) | CN211079399U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110725001A (en) * | 2019-10-30 | 2020-01-24 | 昆山金易得环保科技有限公司 | A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it |
-
2019
- 2019-10-30 CN CN201921849688.5U patent/CN211079399U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110725001A (en) * | 2019-10-30 | 2020-01-24 | 昆山金易得环保科技有限公司 | A move back tin equipment that is used for moving back tin equipment's conductive brush and contains it |
| CN110725001B (en) * | 2019-10-30 | 2023-11-17 | 昆山金易得环保科技有限公司 | Conductive brush for tin stripping equipment and tin stripping equipment comprising conductive brush |
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Address after: Room 905, Science Plaza, Enterprise Science Park, Qianjin East Road, Kunshan Development Zone, Suzhou, Jiangsu Province, 215000 Patentee after: Suzhou Jinyide Environmental Protection Technology Co.,Ltd. Address before: 215335 Qianjin East Road, Kunshan Development Zone, Suzhou, Jiangsu Patentee before: KUNSHAN KING-LEAD ENVIRONMENTAL PROTECTION TECHNOLOGY CO.,LTD. |