CN105220206A - Copper electroplating groove device - Google Patents
Copper electroplating groove device Download PDFInfo
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- CN105220206A CN105220206A CN201510645331.5A CN201510645331A CN105220206A CN 105220206 A CN105220206 A CN 105220206A CN 201510645331 A CN201510645331 A CN 201510645331A CN 105220206 A CN105220206 A CN 105220206A
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- copper electroplating
- sidewall
- electroplating groove
- groove device
- gate
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Abstract
The present invention discloses a kind of copper electroplating groove device, comprises major trough, two secondary grooves and Liang Gedang liquid mechanism.Described major trough comprises the charging sidewall and discharging sidewall that are oppositely arranged, and described charging sidewall comprises feeding-passage, and described discharging sidewall comprises tapping channel.Described two secondary grooves are extended by described charging sidewall and described discharging sidewall respectively, and two described secondary grooves comprise with described feeding-passage and tapping channel respectively just to the gate arranged.Two described secondary grooves are equipped with a described Dang Ye mechanism respectively, described Dang Ye mechanism comprises liquid barrier and drive unit, described liquid barrier is located in described secondary groove respectively, described drive unit drives described liquid barrier along the width back and forth movement of described copper electroplating groove device, and described liquid barrier gland is realized gear liquid in described gate by the electroplate liquid in described copper electroplating groove.Described copper electroplating groove apparatus structure provided by the invention is simple, gear liquid is effective, and does not increase height and the width of whole set equipment.
Description
Technical field
The present invention relates to technical field of plating equipment, be specifically related to a kind of copper electroplating groove device.
Background technology
Printed circuit board is towards thin, smart, thin future development, and in order to make meticulousr circuit, the uniformity requirement that wiring board effects on surface copper is thick improves, and the application of upright plating line well can solve the problem of electroplating evenness; Meanwhile, in order to enhance productivity, continuous electric plating device instead of conventional batch electroplating device gradually.Thus, vertical continuous electroplating device is suggested, and is used widely in production process of printed circuit board.
In the correlation technique of vertical continuous plating, the import and export of copper electroplating groove are complete open type, and when the whole line of electroplating assembly line is shut down, the electroplate liquid in copper groove flows out from import and export, makes the copper anode of copper electroplating groove outside exposed, and oxidizing reaction occurs.When start is electroplated again, large batch of printed circuit board quality product can be caused defective.
Meanwhile, the import and export due to copper electroplating groove are complete open type, large at import and export electroplate liquid flow, in order to make printed circuit board steadily can pass in and out copper electroplating groove, are provided with two squeeze rolls at the import and export of copper groove.In correlation technique, arranging of squeeze roll also has certain gear liquid effect simultaneously, and the speed that electroplate liquid is flowed out is slow.But the gap having wiring board to pass through between two squeeze rolls, after long-time shutdown, a large amount of electroplate liquid flows out from the gap of squeeze roll, makes copper anode outside exposed and is oxidized, and again needs the plenty of time to clean during start, waste resource squeeze roll.
Therefore, be necessary to provide a kind of new copper electroplating groove device to solve the problems of the technologies described above.
Summary of the invention
The object of the invention is to overcome above-mentioned technical problem, provide a kind of and keep off the effective copper electroplating groove device of liquid.
For solving the problems of the technologies described above, the invention provides a kind of copper electroplating groove device, comprising major trough, two secondary grooves and Liang Gedang liquid mechanism.Described major trough comprises the charging sidewall and discharging sidewall that are oppositely arranged, and described charging sidewall comprises feeding-passage, and described discharging sidewall comprises tapping channel.Described two secondary grooves are extended by described charging sidewall and described discharging sidewall respectively, and two described secondary grooves comprise channel plate respectively, and described channel plate comprises gate respectively, described gate respectively with described feeding-passage and described tapping channel just to setting.Two described secondary grooves arrange a described Dang Ye mechanism respectively, and described Dang Ye mechanism comprises liquid barrier and drive unit.Described liquid barrier is located at respectively in described secondary groove and is also connected to described channel plate respectively.Described drive unit drives described liquid barrier along the width back and forth movement of described copper electroplating groove device, and described liquid barrier gland is realized gear liquid in described gate by the electroplate liquid in described copper electroplating groove.
Preferably, described drive unit also comprises the gasket with described gate fitted seal.
Preferably, described gasket is located on described liquid barrier, and described gasket is greater than described gate area to the frontal projected area in described gate direction.
Preferably, described gasket is ring structure.
Preferably, described gasket protrudes from the surface setting of described liquid barrier.
Preferably, described gasket is located at the inner side of described channel plate, and described gasket ring is arranged around described gate.
Preferably, described gasket protrudes from the sidewall surfaces setting being provided with described gate.
Preferably, the length of described secondary groove is 80-100mm.
Compared with correlation technique; copper electroplating groove device provided by the invention; when the whole line of electroplating assembly line is shut down; the described drive unit of described Dang Ye mechanism drives described liquid barrier to move to described gate place, makes described liquid barrier seal described gate realize gear liquid by pressure gland to the described gate of electroplating the electroplate liquid in major and minor groove.Thus make the copper anode of described copper electroplating groove be immersed in described electroplate liquid all the time, can not oxidizing reaction be there is.Described copper electroplating groove apparatus structure provided by the invention is simple, gear liquid is effective, and does not increase height and the width of whole set equipment.
Accompanying drawing explanation
Fig. 1 is the structural representation of copper electroplating groove device of the present invention.
Fig. 2 is the mounting structure schematic diagram of gasket in copper electroplating groove device of the present invention.
Embodiment
Below in conjunction with drawings and embodiments, the invention will be further described.
With reference to the structural representation that Fig. 1, Fig. 1 are copper electroplating groove devices of the present invention.Described copper electroplating groove device 1 comprises major trough 11, two secondary grooves 12, Liang Gedang liquid mechanism 13 and squeeze roll 14.Described two secondary grooves 12 are extended by described major trough 11 two ends respectively, and described squeeze roll 14 is positioned at described major trough 11 two ends, and is positioned at described major trough 11, and described Dang Ye mechanism 13 is equipped with described secondary groove 12 respectively.
Described major trough 11 comprises the charging sidewall 111 and discharging sidewall 112 that are oppositely arranged, and described charging sidewall 111 comprises feeding-passage 1111, and described discharging sidewall 112 comprises tapping channel 1121, and described feeding-passage 1111 and described tapping channel 1121 are oppositely arranged.
Be positioned at described feeding-passage 1111 in described major trough 11 and tapping channel 1121 place arranges described squeeze roll 14 respectively, described squeeze roll 14 is for importing wiring board in described major trough 11.
Two described secondary grooves 12 are extended by described charging sidewall 111 and described discharging sidewall 112 respectively, two described secondary grooves 12 comprise channel plate 121 respectively, described channel plate 121 comprises gate 1211 respectively, described gate 1211 respectively with described feeding-passage 1111 and described tapping channel 1121 just to setting.
The length of two described secondary grooves 12 is 80-100mm, when the electroplate liquid in described major trough 11 is flowed out, can not have influence on the overall liquid level in described copper electroplating groove device 1, ensure that copper anode is immersed in described electroplate liquid.In present embodiment, the length of described secondary groove 12 is the length along feeding-passage to tapping channel direction.
Two described secondary grooves 12 are equipped with a described Dang Ye mechanism 13 respectively.Described Dang Ye mechanism 13 comprises liquid barrier 131, drive unit (non-label) and gasket 133, described liquid barrier 131 is located in described secondary groove 12 respectively, and be connected to the inwall of described channel plate 121 respectively, described gasket 133 and described gate 1211 fitted seal.Described drive unit drives described liquid barrier 131 along the width back and forth movement of described copper electroplating groove device 1, and described liquid barrier 131 gland realizes keeping off liquid in described gate 1211 by the electroplate liquid in described copper electroplating groove device 1.When the whole line of electroplating assembly line is shut down, described gate 1211 is needed to close; When electroplating assembly line is started shooting again, described gate 1211 is needed to open.
In present embodiment, described drive unit comprises drive-motor 1321, rotation axis 1322, described drive-motor 1321 drives described rotation axis 1322 to rotate, thus driving described liquid barrier 131 along the width back and forth movement of described copper electroplating groove device 1, described liquid barrier 131 gland realizes keeping off liquid in described gate 1211 by the electroplate liquid in described copper electroplating groove device 1.
With reference to the mounting structure schematic diagram that Fig. 2, Fig. 2 are gaskets in copper electroplating groove device of the present invention.Described gasket 133 is located on described liquid barrier 131, and described gasket 133 is greater than described gate 1211 area to the frontal projected area in described gate 1211 direction.
In present embodiment, described gasket 133 is ring structure, and the surface that described gasket 133 protrudes from described liquid barrier 131 is arranged, can enhanced leaktightness effect.During installation, first a ring groove (non-label) is set on described liquid barrier 131, then described gasket 133 is arranged in described ring groove.
According to identical principle of design, gasket (not shown) is also established in the inner side being provided with the sidewall of described gate 1211 of described secondary groove 12, and described gasket ring is arranged around described gate 1211.And described gasket also can protrude from the sidewall surfaces setting being provided with described gate 1211, for enhanced leaktightness effect.
Compared with correlation technique; copper electroplating groove apparatus structure provided by the invention is simple, gear liquid is effective; described liquid barrier moves at described copper electroplating groove device width; do not increase height and the width of whole set equipment; when ensure that when machine volume is constant that the whole line of electroplating assembly line is shut down, its electrolytic solution does not run off, and makes the copper anode of described copper electroplating groove be immersed in described electroplate liquid all the time, oxidizing reaction can not occur; saving resource, reduces production cost.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification sheets of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (8)
1. a copper electroplating groove device, comprise major trough, described major trough comprises the charging sidewall and discharging sidewall that are oppositely arranged, described charging sidewall comprises feeding-passage, and described discharging sidewall comprises tapping channel, it is characterized in that, described copper electroplating groove device also comprises two the secondary grooves extended respectively by described charging sidewall and described discharging sidewall, two described secondary grooves comprise channel plate respectively, and described channel plate comprises gate respectively, described gate respectively with described feeding-passage and described tapping channel just to setting; Described copper electroplating groove device also comprises the Dang Ye mechanism that described secondary slot fit is arranged with two respectively, described Dang Ye mechanism comprises liquid barrier and drive unit, described liquid barrier is located at respectively in described secondary groove and is also connected to described channel plate respectively, described drive unit drives described liquid barrier along the width back and forth movement of described copper electroplating groove device, and described liquid barrier gland is realized gear liquid in described gate by the electroplate liquid in described copper electroplating groove.
2. copper electroplating groove device according to claim 1, is characterized in that, described drive unit also comprises the gasket with described gate fitted seal.
3. copper electroplating groove device according to claim 2, is characterized in that, described gasket is located on described liquid barrier, and described gasket is greater than described gate area to the frontal projected area in described gate direction.
4. copper electroplating groove device according to claim 3, is characterized in that, described gasket is ring structure.
5. copper electroplating groove device according to claim 3, is characterized in that, the surface that described gasket protrudes from described liquid barrier is arranged.
6. copper electroplating groove device according to claim 2, is characterized in that, described gasket is located at the inner side of described channel plate, and described gasket ring is arranged around described gate.
7. copper electroplating groove device according to claim 6, is characterized in that, described gasket protrudes from the sidewall surfaces being provided with described gate and arranges.
8. copper electroplating groove device according to any one of claim 1 to 7, is characterized in that, the length of described secondary groove is 80-100mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510645331.5A CN105220206B (en) | 2015-09-30 | 2015-09-30 | Copper electroplating groove device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510645331.5A CN105220206B (en) | 2015-09-30 | 2015-09-30 | Copper electroplating groove device |
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| Publication Number | Publication Date |
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| CN105220206A true CN105220206A (en) | 2016-01-06 |
| CN105220206B CN105220206B (en) | 2018-06-22 |
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| CN201510645331.5A Active CN105220206B (en) | 2015-09-30 | 2015-09-30 | Copper electroplating groove device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107385498A (en) * | 2017-07-27 | 2017-11-24 | 肇庆市中南天实业有限公司 | Copper bar is tin plating to use cylinder groove and the tin plating production equipment of full-automatic copper bar and method |
| CN107858713A (en) * | 2017-11-02 | 2018-03-30 | 中国科学院山西煤炭化学研究所 | A kind of apparatus and method for preparing expanded graphite electro-coppering |
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| CN204265874U (en) * | 2014-12-02 | 2015-04-15 | 北京欧地安科技有限公司 | A kind of copper covers steel continuous electroplating with closing pilot trench |
| CN205152372U (en) * | 2015-09-30 | 2016-04-13 | 东莞市威力固电路板设备有限公司 | Copper plating bath device |
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2015
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2007270193A (en) * | 2006-03-30 | 2007-10-18 | Chuo Seisakusho Ltd | Liquid leakage-preventing device for process tank |
| CN101796223A (en) * | 2007-09-06 | 2010-08-04 | 东丽株式会社 | Web treatment method, treatment bath, continuous electrolytic plating apparatus and method for manufacturing plastic film having plated film |
| CN201220973Y (en) * | 2008-07-03 | 2009-04-15 | 昆山东威电镀设备技术有限公司 | Water retaining apparatus for circuit board passing through copper bath |
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| CN103966647A (en) * | 2013-01-24 | 2014-08-06 | 昆山博通机械设备有限公司 | Water retaining and absorbing apparatus for plating bath |
| CN204265874U (en) * | 2014-12-02 | 2015-04-15 | 北京欧地安科技有限公司 | A kind of copper covers steel continuous electroplating with closing pilot trench |
| CN205152372U (en) * | 2015-09-30 | 2016-04-13 | 东莞市威力固电路板设备有限公司 | Copper plating bath device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107385498A (en) * | 2017-07-27 | 2017-11-24 | 肇庆市中南天实业有限公司 | Copper bar is tin plating to use cylinder groove and the tin plating production equipment of full-automatic copper bar and method |
| CN107858713A (en) * | 2017-11-02 | 2018-03-30 | 中国科学院山西煤炭化学研究所 | A kind of apparatus and method for preparing expanded graphite electro-coppering |
| CN107858713B (en) * | 2017-11-02 | 2019-11-05 | 中国科学院山西煤炭化学研究所 | A kind of device and method preparing expanded graphite electro-coppering |
Also Published As
| Publication number | Publication date |
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| CN105220206B (en) | 2018-06-22 |
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