CN105220206B - Copper electroplating groove device - Google Patents
Copper electroplating groove device Download PDFInfo
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- CN105220206B CN105220206B CN201510645331.5A CN201510645331A CN105220206B CN 105220206 B CN105220206 B CN 105220206B CN 201510645331 A CN201510645331 A CN 201510645331A CN 105220206 B CN105220206 B CN 105220206B
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- copper electroplating
- electroplating groove
- side wall
- gate
- groove device
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Abstract
The present invention discloses a kind of copper electroplating groove device, including major trough, two secondary slots and Liang Gedang liquid mechanism.The major trough includes the charging side wall being oppositely arranged and discharging side wall, and the charging side wall includes feeding-passage, and the discharging side wall includes tapping channel.For described two pair slots respectively by the charging side wall and the discharging side wall extension, two secondary slots respectively include the gate with the feeding-passage and the setting of tapping channel face.Two secondary slots are respectively cooperating with one Dang Ye mechanism of setting, the Dang Ye mechanisms include liquid barrier and driving device, the liquid barrier is respectively arranged in the secondary slot, the driving device drives width direction back and forth movement of the liquid barrier along the copper electroplating groove device, and the liquid barrier gland is realized gear liquid by the electroplate liquid in the copper electroplating groove in the gate.The copper electroplating groove apparatus structure provided by the invention is simple, gear liquid effect is good, and does not increase the height and width of whole set equipment.
Description
Technical field
The present invention relates to technical field of plating equipment, and in particular to a kind of copper electroplating groove device.
Background technology
Printed wiring board develops towards thin, smart, thin direction, and in order to make finer circuit, wiring board is to surface copper
Thick uniformity requirement improves, and the application of upright plating line can solve the problems, such as electroplating evenness well；Meanwhile in order to improve
Production efficiency, continuous electric plating device is gradually instead of conventional batch electroplating device.Vertical continuous electroplating device quilt as a result,
It proposes, and is used widely in production process of printed circuit board.
In the relevant technologies of vertical continuous plating, the inlet and outlet of copper electroplating groove are complete open type, the whole line of electroplating assembly line
During shutdown, the electroplate liquid in copper slot is flowed out from inlet and outlet, and the copper anode for making copper electroplating groove is exposed outside, and oxidation reaction occurs.Again
When secondary booting is electroplated, large batch of printed wiring board product quality can be caused unqualified.
Simultaneously as the inlet and outlet of copper electroplating groove are complete open type, and it is big in import and export plating flow quantity, in order to make print
Wiring board processed can steadily pass in and out copper electroplating groove, copper slot import and export installation there are two squeeze roll.In the relevant technologies, squeeze roll
Setting simultaneously also have certain gear liquid effect, make electroplate liquid outflow speed it is slow.But there is wiring board between two squeeze rolls
By gap, for a long time shut down after, a large amount of electroplate liquids are flowed out from the gap of squeeze roll, make copper anode is exposed to occur outside
Oxidation needs the plenty of time to clean, waste of resource squeeze roll when being switched on again.
Therefore, it is necessary to providing a kind of new copper electroplating groove device solves above-mentioned technical problem.
Invention content
The purpose of the present invention is overcoming above-mentioned technical problem, provide a kind of gear liquid effect good copper electroplating groove device.
In order to solve the above technical problems, the present invention provides a kind of copper electroplating groove device, including major trough, two secondary slots and two
Dang Ye mechanisms.The major trough includes the charging side wall being oppositely arranged and discharging side wall, and the charging side wall includes feeding-passage, institute
It states discharging side wall and includes tapping channel.Described two pair slots are extended respectively by the charging side wall and the discharging side wall, and two
A secondary slot respectively includes channel plate, and the channel plate respectively includes gate, the gate respectively with the feeding-passage and
The tapping channel face setting.Two secondary slots set a Dang Ye mechanism respectively, and the Dang Ye mechanisms include gear
Liquid plate and driving device.The liquid barrier is respectively arranged in the secondary slot and is connected to the channel plate respectively.The driving dress
Put the width direction back and forth movement for driving the liquid barrier along the copper electroplating groove device, the electroplate liquid in the copper electroplating groove will
The liquid barrier gland realizes gear liquid in the gate.
Preferably, the driving device further includes the gasket with the gate fitted seal.
Preferably, the gasket is set on the liquid barrier, and the gasket is to the frontal plane of projection in the gate direction
Product is more than the gate area.
Preferably, the gasket is loop configuration.
Preferably, the gasket protrudes from the surface setting of the liquid barrier.
Preferably, the gasket is set on the inside of the channel plate, and the gasket ring is set around the gate.
Preferably, the gasket protrudes from the sidewall surfaces setting equipped with the gate.
Preferably, the length of the secondary slot is 80-100mm.
Compared with the relevant technologies, copper electroplating groove device provided by the invention, when the whole line of electroplating assembly line is shut down, the gear
The driving device of liquid mechanism drives the liquid barrier to move at the gate, by the way that the electroplate liquid in major and minor slot is electroplated
Pressure gland to the gate liquid barrier is made to seal the gate realize gear liquid.So as to make the copper of the copper electroplating groove positive
Pole is immersed in always in the electroplate liquid, and oxidation reaction will not occur.The copper electroplating groove apparatus structure letter provided by the invention
List, gear liquid effect are good, and do not increase the height and width of whole set equipment.
Description of the drawings
Fig. 1 is the structure diagram of copper electroplating groove device of the present invention.
Fig. 2 is the mounting structure schematic diagram of gasket in copper electroplating groove device of the present invention.
Specific embodiment
Below in conjunction with drawings and embodiments, the invention will be further described.
With reference to Fig. 1, Fig. 1 is the structure diagram of copper electroplating groove device of the present invention.The copper electroplating groove device 1 includes major trough
11st, two secondary slots 12, Liang Gedang liquid mechanism 13 and squeeze roll 14.Described two pair slots 12 are extended respectively by 11 both ends of major trough
Go out, the squeeze roll 14 is located at 11 both ends of major trough, and in the major trough 11, the Dang Ye mechanisms 13 respectively with it is described
Secondary slot 12 is equipped with.
The major trough 11 includes the charging side wall 111 being oppositely arranged and discharging side wall 112, and the charging side wall 111 includes
Feeding-passage 1111, the discharging side wall 112 include tapping channel 1121, the feeding-passage 1111 and the tapping channel
1121 are oppositely arranged.
It is located in the major trough 11 at the feeding-passage 1111 and tapping channel 1121 and the squeeze roll 14 is set respectively,
The squeeze roll 14 is used to import wiring board in the major trough 11.
Two secondary slots 12 are extended respectively by the charging side wall 111 and the discharging side wall 112, two secondary slots
12 respectively include channel plate 121, and the channel plate 121 respectively includes gate 1211, the gate 1211 respectively with the charging
Channel 1111 and the setting of 1121 face of the tapping channel.
The length of two secondary slots 12 is 80-100mm, when making the electroplate liquid outflow in the major trough 11, is not interfered with
To the whole liquid level in the copper electroplating groove device 1, ensure that copper anode is immersed in the electroplate liquid.In present embodiment, institute
The length for stating secondary slot 12 is the length along feeding-passage to tapping channel direction.
Two secondary slots 12 are respectively cooperating with one Dang Ye mechanism 13 of setting.The Dang Ye mechanisms 13 include liquid barrier
131st, driving device (non-label) and gasket 133, the liquid barrier 131 is respectively arranged in the secondary slot 12, and is abutted respectively
In the inner wall of the channel plate 121, the gasket 133 and 1211 fitted seal of gate.The driving device drives institute
State width direction back and forth movement of the liquid barrier 131 along the copper electroplating groove device 1, the electroplate liquid in the copper electroplating groove device 1
131 gland of liquid barrier is realized into gear liquid in the gate 1211.When the whole line of electroplating assembly line is shut down, the gate is needed
1211 closings；When electroplating assembly line is switched on again, the gate 1211 is needed to open.
In present embodiment, the driving device includes driving motor 1321, rotation axis 1322, the driving motor 1321
The rotation axis 1322 is driven to rotate, so as to drive the liquid barrier 131 round-trip along the width direction of the copper electroplating groove device 1
It moves, 131 gland of liquid barrier is realized gear liquid by the electroplate liquid in the copper electroplating groove device 1 in the gate 1211.
With reference to Fig. 2, Fig. 2 is the mounting structure schematic diagram of gasket in copper electroplating groove device of the present invention.The gasket 133
On the liquid barrier 131, the gasket 133 is more than the gate to the frontal projected area in 1211 direction of gate
1211 areas.
In present embodiment, the gasket 133 is loop configuration, and the gasket 133 protrudes from the liquid barrier
131 surface setting, can strengthen sealing effect.During installation, an annular groove is set (not mark on the liquid barrier 131 first
Number), then the gasket 133 is mounted in the annular groove.
According to identical design principle, the inside of the side wall equipped with the gate 1211 of the pair slot 12 also sets gasket
(not shown), the gasket ring are set around the gate 1211.And the gasket can also be protruded from equipped with the gate
1211 sidewall surfaces setting, for strengthening sealing effect.
Compared with the relevant technologies, copper electroplating groove apparatus structure provided by the invention is simple, gear liquid effect is good, the liquid barrier
It is moved in the copper electroplating groove device width direction, does not increase the height and width of whole set equipment, the constant situation of machine volume
Under ensure that its electrolyte is not lost in when the whole line of electroplating assembly line is shut down, and makes the copper anode of the copper electroplating groove be immersed in institute always
It states in electroplate liquid, oxidation reaction will not occur, save resource, reduce production cost.
The foregoing is merely the embodiment of the present invention, are not intended to limit the scope of the invention, every to utilize this hair
The equivalent structure or equivalent flow shift that bright specification and accompanying drawing content are made directly or indirectly is used in other relevant skills
Art field, is included within the scope of the present invention.
Claims (8)
1. a kind of copper electroplating groove device, including major trough, the major trough includes the charging side wall being oppositely arranged and discharging side wall, described
It feeds side wall and includes feeding-passage, the discharging side wall includes tapping channel, which is characterized in that the copper electroplating groove device also wraps
The two secondary slots each extended over by the charging side wall and the discharging side wall are included, two secondary slots respectively include channel plate,
The channel plate respectively includes gate, and the gate is set respectively with the feeding-passage and the tapping channel face；It is described
Copper electroplating groove device further includes the Dang Ye mechanisms being equipped with respectively with two secondary slots, and the Dang Ye mechanisms include liquid barrier
And driving device, the liquid barrier are respectively arranged in the secondary slot and are connected to the channel plate respectively, the driving device is driven
Move width direction back and forth movement of the liquid barrier along the copper electroplating groove device, the electroplate liquid in the copper electroplating groove will described in
Liquid barrier gland realizes gear liquid in the gate.
2. copper electroplating groove device according to claim 1, which is characterized in that the driving device further includes and the gate
The gasket of fitted seal.
3. copper electroplating groove device according to claim 2, which is characterized in that the gasket is set on the liquid barrier,
The gasket is more than the gate area to the frontal projected area in the gate direction.
4. copper electroplating groove device according to claim 3, which is characterized in that the gasket is loop configuration.
5. copper electroplating groove device according to claim 3, which is characterized in that the gasket protrudes from the liquid barrier
Surface is set.
6. copper electroplating groove device according to claim 2, which is characterized in that the gasket is set on the interior of the channel plate
Side, the gasket ring are set around the gate.
7. copper electroplating groove device according to claim 6, which is characterized in that the gasket is protruded from equipped with the gate
Sidewall surfaces setting.
8. copper electroplating groove device according to any one of claim 1 to 7, which is characterized in that it is described pair slot length be
80-100mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510645331.5A CN105220206B (en) | 2015-09-30 | 2015-09-30 | Copper electroplating groove device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510645331.5A CN105220206B (en) | 2015-09-30 | 2015-09-30 | Copper electroplating groove device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105220206A CN105220206A (en) | 2016-01-06 |
| CN105220206B true CN105220206B (en) | 2018-06-22 |
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ID=54989461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510645331.5A Active CN105220206B (en) | 2015-09-30 | 2015-09-30 | Copper electroplating groove device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105220206B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107385498A (en) * | 2017-07-27 | 2017-11-24 | 肇庆市中南天实业有限公司 | Copper bar is tin plating to use cylinder groove and the tin plating production equipment of full-automatic copper bar and method |
| CN107858713B (en) * | 2017-11-02 | 2019-11-05 | 中国科学院山西煤炭化学研究所 | A kind of device and method preparing expanded graphite electro-coppering |
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| CN201220973Y (en) * | 2008-07-03 | 2009-04-15 | 昆山东威电镀设备技术有限公司 | Water retaining apparatus for circuit board passing through copper bath |
| CN101796223A (en) * | 2007-09-06 | 2010-08-04 | 东丽株式会社 | Web treatment method, treatment bath, continuous electrolytic plating apparatus and method for manufacturing plastic film having plated film |
| CN103966647A (en) * | 2013-01-24 | 2014-08-06 | 昆山博通机械设备有限公司 | Water retaining and absorbing apparatus for plating bath |
| CN204265874U (en) * | 2014-12-02 | 2015-04-15 | 北京欧地安科技有限公司 | A kind of copper covers steel continuous electroplating with closing pilot trench |
| CN205152372U (en) * | 2015-09-30 | 2016-04-13 | 东莞市威力固电路板设备有限公司 | Copper plating bath device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4840911B2 (en) * | 2006-03-30 | 2011-12-21 | 株式会社中央製作所 | Liquid leakage prevention device for treatment tank |
| KR20100081119A (en) * | 2009-01-05 | 2010-07-14 | 주식회사 익스톨 | Electroplating device for printed circuit board |
-
2015
- 2015-09-30 CN CN201510645331.5A patent/CN105220206B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101796223A (en) * | 2007-09-06 | 2010-08-04 | 东丽株式会社 | Web treatment method, treatment bath, continuous electrolytic plating apparatus and method for manufacturing plastic film having plated film |
| CN201220973Y (en) * | 2008-07-03 | 2009-04-15 | 昆山东威电镀设备技术有限公司 | Water retaining apparatus for circuit board passing through copper bath |
| CN103966647A (en) * | 2013-01-24 | 2014-08-06 | 昆山博通机械设备有限公司 | Water retaining and absorbing apparatus for plating bath |
| CN204265874U (en) * | 2014-12-02 | 2015-04-15 | 北京欧地安科技有限公司 | A kind of copper covers steel continuous electroplating with closing pilot trench |
| CN205152372U (en) * | 2015-09-30 | 2016-04-13 | 东莞市威力固电路板设备有限公司 | Copper plating bath device |
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| Publication number | Publication date |
|---|---|
| CN105220206A (en) | 2016-01-06 |
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