CN205152372U - Copper plating bath device - Google Patents
Copper plating bath device Download PDFInfo
- Publication number
- CN205152372U CN205152372U CN201520775114.3U CN201520775114U CN205152372U CN 205152372 U CN205152372 U CN 205152372U CN 201520775114 U CN201520775114 U CN 201520775114U CN 205152372 U CN205152372 U CN 205152372U
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- passage
- copper electroplating
- liquid barrier
- groove
- wiring board
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Abstract
The utility model discloses a copper plating bath device. Copper plating bath device include the major trough, by the secondary notch that extends at the major trough both ends and the 2nd secondary notch, with the fender liquid mechanism that a secondary notch and the cooperation of the 2nd secondary notch set up. The major trough is including relative the first line board passageway and the the second line board passageway that sets up. A secondary notch include with the first line board passageway is the third circuit board passageway to setting up just, the 2nd secondary notch include with the the second line board passageway fourth circuit board passageway to setting up just. It includes drive arrangement and keeps off the liquid board to keep off liquid mechanism, the drive arrangement drive keep off the liquid board and be reciprocating motion, plating solution in the copper plating bath will keep off liquid plate voltage gai yu liquid is realized keeping off by third circuit board passageway and fourth circuit board passageway. The utility model provides a copper plating bath device simple structure, to keep off liquid effectual to practice thrift manufacturing cost, and need not increase whole set's volume.
Description
Technical field
The utility model relates to technical field of plating equipment, is specifically related to a kind of copper electroplating groove device.
Background technology
Printed circuit board is towards thin, smart, thin future development, and in order to make meticulousr circuit, the uniformity requirement that wiring board effects on surface copper is thick improves, and the application of upright plating line well can solve the problem of electroplating evenness; Meanwhile, in order to enhance productivity, continuous electric plating device instead of conventional batch electroplating device gradually.Thus, vertical continuous electroplating device is suggested, and is used widely in production process of printed circuit board.
In the correlation technique of vertical continuous plating, the import and export of copper electroplating groove are complete open type, and when the whole line of electroplating assembly line is shut down, the electroplate liquid in copper groove flows out from import and export, makes the copper anode of copper electroplating groove outside exposed, and oxidizing reaction occurs.When start is electroplated again, large batch of printed circuit board quality product can be caused defective.
Meanwhile, the import and export due to copper electroplating groove are complete open type, large at import and export electroplate liquid flow, in order to make printed circuit board steadily can pass in and out copper electroplating groove, are provided with two squeeze rolls at the import and export of copper groove.In correlation technique, arranging of squeeze roll also has certain gear liquid effect simultaneously, and the speed that electroplate liquid is flowed out is slow.But the gap having wiring board to pass through between two squeeze rolls, after long-time shutdown, a large amount of electroplate liquid flows out from the gap of squeeze roll, makes copper anode outside exposed and oxidizing reaction occurs, and again needs the plenty of time to clean during start, waste resource.
Therefore, be necessary to provide a kind of new copper electroplating groove device to solve the problems of the technologies described above.
Utility model content
The purpose of this utility model overcomes above-mentioned technical problem, and provide a kind of when not increasing volume, structure is simple, the copper electroplating groove device that gear liquid is effective.
For solving the problems of the technologies described above, the Dang Ye mechanism that the utility model provides a kind of copper electroplating groove device to comprise major trough, the first secondary groove extended respectively by described major trough two ends and the second secondary groove, arrange with described first secondary groove and the second secondary slot fit.Described major trough comprises the feeding side and exit side that are oppositely arranged, and described feeding side comprises first line plate passage, and described exit side comprises the second wiring board passage, the first secondary groove and the second secondary groove respectively by the described feeding side of major trough and described exit side extended.Described first secondary groove comprises first channel plate, and described first channel plate comprises tertiary circuit plate passage, and described tertiary circuit plate passage and described first line plate passage are just to setting.Described second secondary groove comprises second passage plate, and described second passage plate comprises the 4th wiring board passage, and described 4th wiring board passage and described second wiring board passage are just to setting.Described Dang Ye mechanism comprises drive unit and liquid barrier.Described drive unit comprises drive-motor, rotation axis and eccentric wheel, described drive-motor is fixed on described rotation axis one end, described eccentric wheel is fixed on the other end of described rotation axis, described liquid barrier lays respectively in described first secondary groove and described second secondary groove, and is connected to described first channel plate and described second passage plate respectively.Described liquid barrier comprises receiving space, and described eccentric wheel is arranged at described receiving space and drives described liquid barrier along the width to-and-fro movement of described copper electroplating groove device.
Preferably, described liquid barrier comprises supporting track, and described supporting track is located at the inner side-wall of the close described major trough of described liquid barrier, and described rotation axis is by being located at described supporting track, and the direction of described supporting track is identical with described liquid barrier direction of motion.
Preferably, the length of described supporting track equals the length of described liquid barrier.
Preferably, the width of described supporting track is greater than the diameter of described rotation axis.
Preferably, described Dang Ye mechanism also comprises the gasket with described tertiary circuit plate passage or described 4th wiring board passage fitted seal.
Preferably, described gasket is ring structure.
Preferably, described gasket protrudes from the surface setting of described liquid barrier.
Preferably, the length of described first secondary groove and described second secondary groove is respectively 80-100mm.
Compared with correlation technique, the copper electroplating groove device that the utility model provides, when the whole line of electroplating assembly line is shut down, the described drive unit of described Dang Ye mechanism drives described liquid barrier to move to described tertiary circuit plate passage and described 4th wiring board passage place, pass through major trough, the pressure gland of the electroplate liquid in the first secondary groove and the second secondary groove is to described tertiary circuit plate passage and described 4th wiring board passage, gear liquid is realized again by the pressure compaction of electroplate liquid in described major trough and secondary groove, the copper anode of described copper electroplating groove device is immersed in described electroplate liquid all the time, oxidizing reaction can not be there is, its structure is simple, gear liquid is effective.The width of liquid barrier along described copper electroplating groove device in described first secondary groove and the second secondary groove moves, and need not increase the volume of described copper electroplating groove device.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model copper electroplating groove device.
Fig. 2 is the structural representation along the sectional view of A-A line in Fig. 1.
Fig. 3 is the mounting structure schematic diagram of gasket in the utility model copper electroplating groove device.
Embodiment
Below in conjunction with drawings and embodiments, the utility model is described in further detail.
With reference to the structural representation that Fig. 1, Fig. 1 are the utility model copper electroplating groove devices.Described copper electroplating groove device 1 comprises the secondary groove 13 of major trough the 11, first secondary groove 12, second, Dang Ye mechanism 14, squeeze roll 15.The secondary groove 13 of described first secondary groove 12, second is extended by described major trough 11 two ends respectively, and described squeeze roll 15 is positioned at described major trough 11 two ends, and described Dang Ye mechanism 14 is equipped with described first secondary groove 12, described second secondary groove 13 respectively.
Described major trough 11 comprises the feeding side 111 and exit side 112 that are oppositely arranged, and described feeding side 111 comprises first line plate passage 1111, and described exit side 112 comprises the second wiring board passage 1121.Described first line plate passage 1111 in described major trough 11 and the second wiring board passage 1121 place arrange described squeeze roll 15 respectively, and described squeeze roll 15 is for importing wiring board in described copper electroplating groove 11.
The described feeding side 111 of described major trough 11 and described exit side 112 extend respectively and are provided with described first secondary groove 12 and the second secondary groove 13, the length of described first secondary groove 12 and described second secondary groove 13 is respectively 80-100mm, when electroplate liquid in described major trough 11 is flowed out, the overall liquid level in described copper electroplating groove 1 can not be had influence on, ensure that copper anode is immersed in electroplate liquid.In present embodiment, the length of described first secondary groove 12 and described second secondary groove 13 is the length along described first line plate passage 1111 to described second wiring board passage 1121 direction.
Described first secondary groove establishes 12 to comprise first channel plate 121, and described first channel plate 121 comprises tertiary circuit plate passage 1211, and described tertiary circuit plate passage 1211 and described first line plate passage 1111 are just to setting.Described second secondary groove 13 comprises second passage plate 131, and described second passage plate 131 comprises the 4th wiring board passage 1311, and described 4th wiring board passage 1311 and described second wiring board passage 1211 are just to setting.Described first secondary groove 12 and described second secondary groove 13 are equipped with described Dang Ye mechanism 14 respectively.
Described Dang Ye mechanism 14 comprises drive unit (non-label) and liquid barrier 142, gasket 143.Described drive unit drives described liquid barrier 142 to move reciprocatingly along the width of described copper electroplating groove device 1, and described liquid barrier 142 gland realizes keeping off liquid in described tertiary circuit plate passage 1211 and the 4th wiring board passage 1311 by the electroplate liquid in described copper electroplating groove device 1.When the whole line of electroplating assembly line is shut down, described tertiary circuit plate passage 1211 and described 4th wiring board passage 1311 is needed to close; When electroplating assembly line is started shooting again, described tertiary circuit plate passage 1211 and the 4th wiring board passage 1311 is needed to open.In present embodiment, the width of described copper electroplating groove device 1 perpendicular to described first line plate passage 1111 to the direction of described second wiring board passage 1211.
In present embodiment, described drive unit comprises drive-motor 1411, rotation axis 1412 and eccentric wheel 1413, and what described drive-motor 1411 was fixed on states rotation axis 1412 one end, and described eccentric wheel 1413 is fixed on the other end of described rotation axis 1412.Described drive-motor 1411 drives described rotation axis 1412 to rotate, thus drives described eccentric wheel 1413 to rotate.Described liquid barrier 142 lays respectively in described first secondary groove 12 and described second secondary groove 13, and is connected to liquid barrier 142 described in described first channel plate 121 and second passage plate 131 respectively and comprises receiving space, and described eccentric wheel 1413 is located in described receiving space.
With reference to the structural representation that Fig. 2, Fig. 2 are along the sectional view of A-A line in Fig. 1.Described liquid barrier 142 comprises supporting track 1421 and opening (not shown), and described supporting track 1421 and described opening are relatively arranged on the two side of described liquid barrier 142.Described supporting track 1421 is located at the inner side-wall of the close described major trough 11 of described liquid barrier 142, and described rotation axis 1412 is by being located at described supporting track 1421, and the direction of described supporting track 1421 is identical with described liquid barrier direction of motion.Accordingly, the length direction of described opening and the direction of motion of described liquid barrier 142 in the same way, are convenient to described liquid barrier 142 and move.When described drive-motor 1411 drives described rotation axis 1412 to rotate, described rotation axis 1412 drives described eccentric wheel 1413 to rotate, when described eccentric wheel 1413 rotates and the contact internal walls of described receiving space, because the radius of gyration is different, when described eccentric wheel 1413 is rotated, described liquid barrier 142 can be driven to move reciprocatingly along the width of described copper electroplating groove device 1.
The mode that described drive unit drives described liquid barrier 142 to do straight reciprocating motion is not limited thereto, can also be moved reciprocatingly by liquid barrier 142 described in cylinder or oil cylinder pushing, described liquid barrier 142 gland realizes keeping off liquid in described tertiary circuit plate passage 121 and the 4th wiring board passage 131 by the electroplate liquid in described copper electroplating groove device 1.
The length of described supporting track 1421 equals the length of described liquid barrier 142, and namely the length of described supporting track 1421 is equal with the length of the described housing along described liquid barrier 142 direction of motion, can increase the scope of described housing motion track.In present embodiment, the length of described supporting track 1421, the length of liquid barrier 142 are the value along described liquid barrier 142 direction of motion.
The width of described supporting track 1421 is greater than the diameter of described rotation axis 1412, when described housing moves, can reduce described rotation axis 1412 and the friction of described housing, make described housing motion more smooth and easy.
With reference to the mounting structure schematic diagram that Fig. 3, Fig. 3 are gaskets in the utility model copper electroplating groove device.Described Dang Ye mechanism 14 comprises the gasket 143 with described tertiary circuit plate passage 1211 or described 4th wiring board passage 1311 fitted seal, and namely the side away from described major trough 11 of two liquid barriers 142 is equipped with gasket 143.Described gasket 143 is ring structure, and along the direction of motion of described housing, the spacing on the relative both sides of described gasket 143 is greater than the width of described tertiary circuit plate passage 121 and the 4th wiring board passage 131.During installation, first a ring groove (non-label) is set on described liquid barrier 142, then described gasket 143 is arranged in described ring groove.The surface that described gasket 143 protrudes from described liquid barrier 142 is arranged, enhanced leaktightness effect.
The copper electroplating groove device mode of operation provided in the utility model is as follows:
When the whole line of electroplating assembly line is shut down, the electroplate liquid in described major trough 11, along the gap between described squeeze roll 15, flows out from described first line plate passage 1111 and the second wiring board passage 1121, enters the first secondary groove 12 and the second secondary groove 13.Now, start described Dang Ye mechanism 14, drive-motor 1411 in described Dang Ye mechanism 14 runs, described rotation axis 1412 is driven to rotate, described rotation axis 1412 drives described eccentric wheel 1413 to rotate, because of described eccentric wheel 1413 the radius of gyration not etc., therefore can promote described liquid barrier 142 and do straight reciprocating motion.Wherein, described liquid barrier 142 is respectively arranged with described supporting track 1421 and opening in both sides relatively, while described rotation axis 1412 does not do translational motion, makes described liquid barrier 142 do translational motion.Described drive unit drives described liquid barrier 142 to move to described tertiary circuit plate passage 1211 and described 4th wiring board passage 1311 place, and pass through the pressure gland of the described electroplate liquid in described copper electroplating groove device 1 to described tertiary circuit plate passage 1211 and described 4th wiring board passage 1311, described liquid barrier 142, under the liquid pressure effect of electroplate liquid, realizes the sealing with described tertiary circuit plate passage 1211 and the 4th wiring board passage 1311.
When Electroplating Production is carried out in start again, start described Dang Ye mechanism 14, the drive unit of described Dang Ye mechanism 14 drives described liquid barrier 142 to do translational motion, and described tertiary circuit plate passage 1211 and the 4th wiring board passage 1311 are opened.Now, described wiring board enters described first secondary groove 12 by described tertiary circuit plate passage 1211, then through described first line plate passage 1111, under the effect of described squeeze roll 15, enters in described major trough 11 and carry out electroplating technology.After electroplating technology completes, then enter next treatment process through described second wiring board passage 1121 and the 4th wiring board passage 1311.
Compared with correlation technique, the copper electroplating groove device that the utility model provides, by setting up Dang Ye mechanism at described major trough two ends; the pressure compaction of electroplate liquid in described copper electroplating groove device is utilized to realize gear liquid; its structure is simple, and gear liquid is effective, thus the cost cleaned when saving each startup-shutdown.The width of liquid barrier along described copper electroplating groove device in described first secondary groove and the second secondary groove moves, and need not increase the volume of described copper electroplating groove device.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification sheets and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (8)
1. a copper electroplating groove device, comprise major trough, described major trough comprises the feeding side and exit side that are oppositely arranged, described feeding side comprises first line plate passage, described exit side comprises the second wiring board passage, it is characterized in that, described copper electroplating groove device also comprises the first secondary groove and the second secondary groove that are extended respectively by described feeding side and described exit side, described first secondary groove comprises first channel plate, described first channel plate comprises tertiary circuit plate passage, and described tertiary circuit plate passage and described first line plate passage are just to setting; Described second secondary groove comprises second passage plate, and described second passage plate comprises the 4th wiring board passage, and described 4th wiring board passage and described second wiring board passage are just to setting; Described copper electroplating groove device also comprises the Dang Ye mechanism arranged with described first secondary groove and described second secondary slot fit respectively, and described Dang Ye mechanism comprises drive unit and liquid barrier; Described drive unit comprises drive-motor, rotation axis and eccentric wheel, and described drive-motor is fixed on described rotation axis one end, and described eccentric wheel is fixed on the other end of described rotation axis; Described liquid barrier lays respectively in described first secondary groove and described second secondary groove, and is connected to described first channel plate and described second passage plate respectively; Described liquid barrier comprises receiving space, and described eccentric wheel is arranged at described receiving space and drives described liquid barrier along the width to-and-fro movement of described copper electroplating groove device.
2. copper electroplating groove device according to claim 1, it is characterized in that, described liquid barrier comprises supporting track, described supporting track is located at the inner side-wall of the close described major trough of described liquid barrier, described rotation axis is by being located at described supporting track, and the direction of described supporting track is identical with described liquid barrier direction of motion.
3. copper electroplating groove device according to claim 2, is characterized in that, the length of described supporting track equals the length of described liquid barrier.
4. copper electroplating groove device according to claim 2, is characterized in that, the width of described supporting track is greater than the diameter of described rotation axis.
5. copper electroplating groove device according to claim 1, is characterized in that, described Dang Ye mechanism also comprises the gasket with described tertiary circuit plate passage or described 4th wiring board passage fitted seal.
6. copper electroplating groove device according to claim 5, is characterized in that, described gasket is ring structure.
7. copper electroplating groove device according to claim 6, is characterized in that, the surface that described gasket protrudes from described liquid barrier is arranged.
8. copper electroplating groove device according to any one of claim 1 to 7, is characterized in that, the length of described first secondary groove and described second secondary groove is respectively 80-100mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520775114.3U CN205152372U (en) | 2015-09-30 | 2015-09-30 | Copper plating bath device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520775114.3U CN205152372U (en) | 2015-09-30 | 2015-09-30 | Copper plating bath device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205152372U true CN205152372U (en) | 2016-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520775114.3U Active CN205152372U (en) | 2015-09-30 | 2015-09-30 | Copper plating bath device |
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| CN (1) | CN205152372U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105220206A (en) * | 2015-09-30 | 2016-01-06 | 东莞市威力固电路板设备有限公司 | Copper electroplating groove device |
-
2015
- 2015-09-30 CN CN201520775114.3U patent/CN205152372U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105220206A (en) * | 2015-09-30 | 2016-01-06 | 东莞市威力固电路板设备有限公司 | Copper electroplating groove device |
| CN105220206B (en) * | 2015-09-30 | 2018-06-22 | 东莞市威力固电路板设备有限公司 | Copper electroplating groove device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |