CN203007458U - PCB (Printed Circuit Board) electroplating bath with movable cathode - Google Patents
PCB (Printed Circuit Board) electroplating bath with movable cathode Download PDFInfo
- Publication number
- CN203007458U CN203007458U CN 201220649045 CN201220649045U CN203007458U CN 203007458 U CN203007458 U CN 203007458U CN 201220649045 CN201220649045 CN 201220649045 CN 201220649045 U CN201220649045 U CN 201220649045U CN 203007458 U CN203007458 U CN 203007458U
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- China
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- plating tank
- negative electrode
- pcb
- cathode
- pcb plating
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Abstract
The utility model relates to an electroplating bath, and in particular relates to a PCB (Printed Circuit Board) electroplating bath with a movable cathode. The PCB electroplating bath comprises a rectangular bath body, wherein the rectangular bath body comprises a bath bottom as well as two width side walls and two length side walls which are arranged at the bath bottom through encircling; each width side wall is provided with an anode slot; the two length side walls are respectively provided with a plurality of uniformly distributed fixed board necks; the periphery of each fixed board neck is provided with a cathode moving frame; the cathode moving frame can move back and forth parallel to an anode; the cathode moving frame is fixedly provided with a cathode fixing board; the cathode fixing board is clamped inside each fixed board neck of the two length side walls; the cathode moving frame capable of moving back and forth parallel to the anode can drive a cathode board on the cathode fixing board to move back and forth parallel to the anode, so that the cathode board is uniformly plated, via-filling electroplating can be realized, and the PCB electroplating bath is suitable for via hole and blind hole filling electroplating.
Description
Technical field
The utility model relates to plating tank, is specifically related to movably PCB plating tank of a kind of negative electrode.
Background technology
PCB plays the effect of junction circuit element in electronics, be requisite operation in the PCB manufacturing process and electroplate, and increases hole copper and face copper thickness by galvanizing process, improves erosion resistance and the electroconductibility of pcb board; The electroplating device of simultaneous adaptation through hole and blind hole can reduce production costs greatly; And in electroplating process, be the homogeneity of assurance through hole through-hole plating and the super filling of planarization and filling perforation plating, need to fully stir the plating solution in plating tank, so that each additive concentration keeps evenly.
In prior art, negative electrode is all to be fixed in plating tank, can not move, and can not guarantee the homogeneity of cathodic coating, more can not guarantee the homogeneity of through hole through-hole plating and the super filling of planarization and filling perforation plating.
Summary of the invention
The purpose of this utility model is to solve the deficiencies in the prior art, provides a kind of negative plate to be subjected to plating evenly, can realize that filling perforation electroplates, and is applicable to movably PCB plating tank of negative electrode that through hole and blind hole filling perforation electroplate.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of negative electrode is the PCB plating tank movably, this PCB plating tank comprises the rectangle cell body, described rectangle cell body comprises bottom land and is located in two broad side walls and two long sidewalls of bottom land, described broad side walls is provided with the anode slot, described two long sidewalls are respectively equipped with several equally distributed retaining plate draw-in grooves, described retaining plate draw-in groove periphery is provided with the movable cathode frame, and the movable cathode frame is fixed with the negative electrode retaining plate, and described negative electrode fixing board card is located in the retaining plate draw-in groove of described two long sidewalls.
Wherein, this PCB plating tank also comprises motor, and described motor drives and connects described movable cathode frame.
Described broad side walls is provided with several perpendicular to the hydrojet passage of bottom land direction, and described hydrojet passage is provided with several equally distributed nozzles, and described anode slot is arranged between adjacent two hydrojet passages.
Wherein, described negative electrode retaining plate is provided with the negative plate slot.
Wherein, described bottom land is provided with the heating zone.
Wherein, this PCB plating tank comprises recycle pump, and described bottom land is provided with the circulation fluid outlet, and the water inlet of described recycle pump is communicated with described circulation fluid outlet, and the water outlet of described recycle pump is communicated with described hydrojet passage.
Wherein, described long sidewall is provided with thermowell.
Wherein, described bottom land is provided with waste liquid outlet.
the beneficial effect that the utility model is obtained is: this kind negative electrode is the PCB plating tank movably, this PCB plating tank comprises the rectangle cell body, described rectangle cell body comprises bottom land and is located in two broad side walls and two long sidewalls of bottom land, described broad side walls is provided with the anode slot, described two long sidewalls are respectively equipped with several equally distributed retaining plate draw-in grooves, described retaining plate draw-in groove periphery is provided with the movable cathode frame, the movable cathode frame can be parallel to anode and move around, the movable cathode frame is fixed with the negative electrode retaining plate, described negative electrode fixing board card is located in the retaining plate draw-in groove of described two long sidewalls, the movable cathode frame is parallel to anode and moves around and can drive negative plate on the negative electrode retaining plate and be parallel to anode and move around, make negative plate be subjected to plating evenly, can realize the filling perforation plating, being applicable to through hole and blind hole filling perforation electroplates.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Reference numeral:
1-rectangle cell body
2-anode slot
3-negative electrode retaining plate
4-retaining plate draw-in groove
5-movable cathode frame
6-hydrojet passage
7-nozzle
8-heating zone
9-thermowell
10-motor
The outlet of 11-circulation fluid.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is described further.
a kind of negative electrode is the PCB plating tank movably, this PCB plating tank comprises rectangle cell body 1, described rectangle cell body 1 comprises bottom land and is located in two broad side walls and two long sidewalls of bottom land, described broad side walls is provided with anode slot 2, described two long sidewalls are respectively equipped with several equally distributed retaining plate draw-in grooves 4, the outer movable cathode frame 5 that is arranged with of described retaining plate draw-in groove 4, movable cathode frame 5 can be parallel to anode and move around, movable cathode frame 5 is fixed with negative electrode retaining plate 3, described negative electrode retaining plate 3 is arranged in the retaining plate draw-in groove 4 of described two long sidewalls, movable cathode frame 5 is parallel to anode and moves around and can drive negative plate on negative electrode retaining plate 3 and be parallel to anode and move around, make negative plate be subjected to plating evenly, can realize the filling perforation plating, being applicable to through hole and blind hole filling perforation electroplates.
This PCB plating tank also comprises motor, and described motor drives and connects described movable cathode frame 5, drives movable cathode frame 5 by motor and is parallel to anode and moves around, and can increase work efficiency.
Described broad side walls is provided with several perpendicular to the hydrojet passage 6 of bottom land direction, and described hydrojet passage 6 is provided with several equally distributed nozzles 7, and nozzle 7 can be designed to different shapes as required, and described anode slot 2 is arranged between adjacent two hydrojet passages 6.Nozzle 7 not only can guarantee the uniformity coefficient of electroplate liquid, and nozzle 7 can carry out hydrojet over against the negative plate that is fixed on the negative electrode retaining plate, particularly when negative plate can be parallel to the positive plate that is inserted in anode slot 2 and moves around along with movable cathode frame 5, can make negative plate be subjected to plating evenly, can realize the filling perforation plating, be applicable to through hole and blind hole filling perforation and electroplate.
Broad side walls between adjacent two hydrojet passages 6 is provided with anode slot 2, and positive plate is inserted in described anode slot 2, facilitates the fixing of positive plate and takes out.
Described negative electrode retaining plate 3 is provided with the negative plate slot, and negative plate is inserted in described negative plate slot.
Described bottom land is provided with heating zone 8, to keep the needed temperature of tank liquor.
Described long sidewall is provided with thermowell 9, in order to detect constantly the temperature of rectangle cell body 1 interior electroplate liquid.
This PCB plating tank also comprises recycle pump, and described bottom land is provided with circulation fluid outlet 11, and circulation fluid outlet 11 is positioned at four corners of cell body bottom, so that evenly discharge opeing, the electroplate liquid density unevenness of avoiding discharge opeing to cause that whirlpool causes is even, affects electroplating quality.The water inlet of described recycle pump is communicated with described circulation fluid outlet 11, and the water outlet of described recycle pump is communicated with described hydrojet passage 6, realizes the circulation of electroplate liquid, saves electroplate liquid.
Described bottom land is provided with waste liquid outlet, is convenient to the discharge of electroplating effluent.
Should be noted that at last; above embodiment is only in order to illustrate the technical solution of the utility model; but not to the restriction of this practicality protection domain; although with reference to preferred embodiment, the utility model is described in detail; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement the technical solution of the utility model, and not break away from essence and the scope of technical solutions of the utility model.
Claims (8)
1. negative electrode PCB plating tank movably, this PCB plating tank comprises the rectangle cell body, described rectangle cell body comprises bottom land and is located in two broad side walls and two long sidewalls of bottom land, described broad side walls is provided with the anode slot, it is characterized in that: described two long sidewalls are respectively equipped with several equally distributed retaining plate draw-in grooves, described retaining plate draw-in groove periphery is provided with the movable cathode frame, the movable cathode frame is fixed with the negative electrode retaining plate, and described negative electrode fixing board card is located in the retaining plate draw-in groove of described two long sidewalls.
2. a kind of negative electrode according to claim 1 PCB plating tank movably, it is characterized in that: this PCB plating tank also comprises motor, described motor drives and connects described movable cathode frame.
3. a kind of negative electrode according to claim 1 PCB plating tank movably, it is characterized in that: described broad side walls is provided with several perpendicular to the hydrojet passage of bottom land direction, described hydrojet passage is provided with several equally distributed nozzles, and described anode slot is arranged between adjacent two hydrojet passages.
4. a kind of PCB plating tank according to claim 1, it is characterized in that: described negative electrode retaining plate is provided with the negative plate slot.
5. a kind of negative electrode according to claim 1 PCB plating tank movably, it is characterized in that: described bottom land is provided with the heating zone.
6. a kind of negative electrode according to claim 1 PCB plating tank movably, it is characterized in that: described long sidewall is provided with thermowell.
7. a kind of negative electrode according to claim 3 PCB plating tank movably, it is characterized in that: this PCB plating tank comprises recycle pump, described bottom land is provided with the circulation fluid outlet, and the water inlet of described recycle pump is communicated with described circulation fluid outlet, and the water outlet of described recycle pump is communicated with described hydrojet passage.
8. a kind of PCB plating tank according to claim 1, it is characterized in that: described bottom land is provided with waste liquid outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220649045 CN203007458U (en) | 2012-11-30 | 2012-11-30 | PCB (Printed Circuit Board) electroplating bath with movable cathode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220649045 CN203007458U (en) | 2012-11-30 | 2012-11-30 | PCB (Printed Circuit Board) electroplating bath with movable cathode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203007458U true CN203007458U (en) | 2013-06-19 |
Family
ID=48599070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220649045 Expired - Fee Related CN203007458U (en) | 2012-11-30 | 2012-11-30 | PCB (Printed Circuit Board) electroplating bath with movable cathode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203007458U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105862097A (en) * | 2016-06-06 | 2016-08-17 | 浙江振有电子股份有限公司 | HDI plate through-hole copper filling system based on pulse technology |
| CN106119921A (en) * | 2016-08-22 | 2016-11-16 | 竞陆电子(昆山)有限公司 | Pcb plating line |
| CN112609235A (en) * | 2020-12-16 | 2021-04-06 | 江苏江洲环保科技有限公司 | Homogenization automatic electroplating device |
-
2012
- 2012-11-30 CN CN 201220649045 patent/CN203007458U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105862097A (en) * | 2016-06-06 | 2016-08-17 | 浙江振有电子股份有限公司 | HDI plate through-hole copper filling system based on pulse technology |
| CN106119921A (en) * | 2016-08-22 | 2016-11-16 | 竞陆电子(昆山)有限公司 | Pcb plating line |
| CN112609235A (en) * | 2020-12-16 | 2021-04-06 | 江苏江洲环保科技有限公司 | Homogenization automatic electroplating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20141130 |
|
| EXPY | Termination of patent right or utility model |