CN203440489U - Improved structure of hole-filling electroplating line - Google Patents
Improved structure of hole-filling electroplating line Download PDFInfo
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- CN203440489U CN203440489U CN201320486970.8U CN201320486970U CN203440489U CN 203440489 U CN203440489 U CN 203440489U CN 201320486970 U CN201320486970 U CN 201320486970U CN 203440489 U CN203440489 U CN 203440489U
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- electrolyzer
- negative plate
- improved structure
- plating line
- filling perforation
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Abstract
The utility model discloses an improved structure of a hole-filling electroplating line. The improved structure comprises an electrolytic tank, a negative plate and a plurality of positive plates, wherein the electrolytic tank comprises a tank bottom and two pairs of vertical sidewalls which are correspondingly arranged around the periphery of the tank bottom; the positive plates are electrically connected to the positive electrode of a power supply, and are positioned on the inner surfaces of one pair of the correspondingly arranged vertical sidewalls of the electrolytic tank respectively; the negative plate is electrically connected to the negative electrode of the power supply, and is positioned and erected between the other pair of the correspondingly arranged vertical sidewalls of the electrolytic tank; an electroplating hanger for clamping a product to be electroplated is hung on the negative plate; a power device capable of driving the negative plate to move is also connected to the negative plate. Therefore, bubbles in a blind hole can be removed in a vibration way in an electroplating process of an HDI (high-definition interface) product, the quality exception problems of filling omission, hole-filling recesses and the like during the blind hole electroplating of the HDI product are effectively solved, and the yield of the HDI product is greatly improved.
Description
Technical field
The utility model relates to filling perforation electroplating technology field, and a kind of improved structure of filling perforation plating line is specifically provided.
Background technology
The miniaturization of electronic product has brought a series of challenge to components and parts manufacture and printed board processing industry, product is less, components and parts degree of integration is just larger, for components and parts manufacturer, terms of settlement is exactly the number of pins increasing considerably in unit surface, the encapsulation of IC components and parts is changed to BGA, CSP by QFP, TCP, simultaneously towards the more FC development of high-order.Adapt with it, HDI live width/spacing is also from 4mil/4mil(100 μ m/100 μ m) size becomes 3mil/3mil(75 μ m/75 μ m), and even 60 current μ m/60 μ m; Its internal structure and processing technology are also constantly changing to meet its thinner, closeer, less requirement.
HDI develops into the high-density arrangement that realizes surperficial BGA district BallArray, and then adopted the mode of lamination that surperficial cabling is introduced to internal layer, the processing in HDI hole is being experienced from simple blind buried via hole plate high-order filling perforation plate up till now, on processing small holes and treatment technology, the designs such as VOP, StaggerVia, StepVia, Skipvia, StackVia, ELIC have successively been produced, to arrange by the high-density that solves HDIZhong BGA district BallArray.
But in existing electroplating processing process, owing to having bubble in blind hole, when electroplating, can be easy to occur blind hole fails to fill in or blind hole in the phenomenon of not filling up, thereby cause HDI product surface depression, form defective products.
Summary of the invention
In order to overcome above-mentioned defect, the utility model provides a kind of improved structure of filling perforation plating line, and this structure can effectively solve the surface dimple phenomenon of HDI product when blind hole is electroplated, and has greatly improved the yield of HDI product.
The utility model for the technical scheme that solves its technical problem and adopt is: a kind of improved structure of filling perforation plating line, comprise electrolyzer, negative plate and a plurality of positive plate, described electrolyzer comprises bottom land and is located in the edge-on wall of the corresponding setting of two couples of bottom land periphery, described a plurality of positive plate be all electrically connected on the anodal of power supply and location is arranged at described electrolyzer respectively a pair of corresponding internal surface that edge-on wall is set on, described negative plate be electrically connected on the negative pole of power supply and spacer is located at described electrolyzer another between the edge-on wall of corresponding setting, and on described negative plate, be linked with the Electropolating hangers for clamping electroplated product, described negative plate is also connected with the power set that can drive its motion.
As further improvement of the utility model, described electrolyzer is rectangular structure, symmetrically on the internal surface of two long side walls of described electrolyzer offer a plurality of slots that extend along electrolyzer short transverse, the corresponding activity of described a plurality of positive plates is inserted in the plurality of slot.
As further improvement of the utility model, on the top of two broadside sidewalls of described electrolyzer, symmetry is installed with two permanent seats, the two ends activity of described negative plate wore this symmetrically arranged two permanent seats, and at the place, two ends of described negative plate, was installed with described power set respectively.
As further improvement of the utility model, described power set is vibrating motor, and described vibrating motor can drive described negative plate to move back and forth along the direction that is parallel to electrolyzer length direction.
As further improvement of the utility model, on two long side walls of described electrolyzer, also symmetry offers a plurality of hydrojet pipelines that extend along electrolyzer short transverse, on each hydrojet pipeline, all offer a plurality of nozzles that communicate with its inside, and the plurality of nozzle is all right against described negative plate.
As further improvement of the utility model, each slot is respectively fixedly installed between adjacent two hydrojet pipelines.
As further improvement of the utility model, on the bottom land of described electrolyzer, offer liquid outlet, separately this filling perforation plating line also includes recycle pump, and the water-in on described recycle pump and water outlet are corresponding to be respectively connected with described liquid outlet and hydrojet pipeline.
As further improvement of the utility model, also be provided with strainer, described strainer is provided with soiling solution entrance and scavenging solution outlet, and the soiling solution entrance on described strainer is communicated in the water outlet on described recycle pump, and the scavenging solution outlet on described strainer is communicated in described hydrojet pipeline.
As further improvement of the utility model, on the internal surface at the bottom of described electrolytic bath, be also provided with for the circulating cooling pipe and the heating tube that regulate electrolytic solution temperature, and one inflate circulation tube for what regulate electrolytic solution flow velocity.
The beneficial effects of the utility model are: by the two ends at negative plate, one vibrating motor is all installed, HDI product can be driven the bubble in blind hole out of by vibration in electroplating process like this, effectively solved that HDI product produces when blind hole is electroplated fail to fill in, the quality abnormal phenomenon such as filling perforation depression, greatly improved the yield of HDI product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
By reference to the accompanying drawings, make the following instructions:
1---electrolyzer 2---negative plate
3---vibrating motor 10---slot
11---hydrojet pipeline
Embodiment
With reference to the accompanying drawings the structure improved embodiment of a kind of filling perforation plating line of the present utility model is elaborated.
The improved structure of a kind of filling perforation plating line of the present utility model, comprise electrolyzer 1, negative plate 2 and a plurality of positive plate, described electrolyzer comprises bottom land and is located in the edge-on wall of the corresponding setting of two couples of bottom land periphery, described a plurality of positive plate be all electrically connected on the anodal of power supply and location is arranged at described electrolyzer 1 respectively a pair of corresponding internal surface that edge-on wall is set on, described negative plate 2 be electrically connected on the negative pole of power supply and spacer is located at described electrolyzer 1 another between the edge-on wall of corresponding setting, and on described negative plate 2, be linked with the Electropolating hangers for clamping electroplated product, described negative plate 2 is also connected with the power set that can drive its motion.
In the present embodiment, described electrolyzer 1 is rectangular structure, symmetrically on the internal surface of two long side walls of described electrolyzer offers a plurality of slots 10 that extend along electrolyzer short transverse, and the corresponding activity of described a plurality of positive plates is inserted in the plurality of slot.
On the top of two broadside sidewalls of described electrolyzer, symmetry is installed with two permanent seats, and the two ends activity of described negative plate 2 wore this symmetrically arranged two permanent seats, and at the place, two ends of described negative plate 2, is installed with described power set respectively.
In the present embodiment, described power set is that vibrating motor 3(also can adopt vibratory pump), and described vibrating motor can drive described negative plate to move back and forth along the direction that is parallel to electrolyzer length direction.HDI product can be driven the bubble in blind hole out of by vibration in electroplating process like this, effectively solved that HDI product produces when blind hole is electroplated fail to fill in, the quality abnormal phenomenon such as filling perforation depression, greatly improved the yield of HDI product.
In the present embodiment, on two long side walls of described electrolyzer, also symmetry offers a plurality of hydrojet pipelines 11 that extend along electrolyzer short transverse, on each hydrojet pipeline 11, all offer a plurality of nozzles that communicate with its inside, and the plurality of nozzle is all right against described negative plate 2.
Preferably, each slot 10 is respectively fixedly installed between adjacent two hydrojet pipelines 11.
In the present embodiment, on the bottom land of described electrolyzer, offer liquid outlet, separately this filling perforation plating line also includes recycle pump, and the water-in on described recycle pump and water outlet are corresponding to be respectively connected with described liquid outlet and hydrojet pipeline 11.
Also be provided with strainer, described strainer is provided with soiling solution entrance and scavenging solution outlet, and the soiling solution entrance on described strainer is communicated in the water outlet on described recycle pump, and the scavenging solution outlet on described strainer is communicated in described hydrojet pipeline 11.
In the present embodiment, on the internal surface at the bottom of described electrolytic bath, be also provided with for the circulating cooling pipe and the heating tube that regulate electrolytic solution temperature, and one inflate circulation tube for what regulate electrolytic solution flow velocity.
Claims (9)
1. the improved structure of a filling perforation plating line, comprise electrolyzer (1), negative plate (2) and a plurality of positive plate, described electrolyzer comprises bottom land and is located in the edge-on wall of the corresponding setting of two couples of bottom land periphery, described a plurality of positive plate be all electrically connected on the anodal of power supply and location is arranged at described electrolyzer (1) respectively a pair of corresponding internal surface that edge-on wall is set on, described negative plate (2) be electrically connected on the negative pole of power supply and spacer is located at described electrolyzer (1) another between the edge-on wall of corresponding setting, and on described negative plate (2), be linked with the Electropolating hangers for clamping electroplated product, it is characterized in that: described negative plate (2) is also connected with the power set that can drive its motion.
2. the improved structure of filling perforation plating line according to claim 1, it is characterized in that: described electrolyzer (1) is rectangular structure, symmetrically on the internal surface of two long side walls of described electrolyzer offer a plurality of slots (10) that extend along electrolyzer short transverse, the corresponding activity of described a plurality of positive plates is inserted in the plurality of slot.
3. the improved structure of filling perforation plating line according to claim 2, it is characterized in that: on the top of two broadside sidewalls of described electrolyzer, symmetry is installed with two permanent seats, the two ends activity of described negative plate (2) wore this symmetrically arranged two permanent seats, and at the place, two ends of described negative plate (2), was installed with described power set respectively.
4. the improved structure of filling perforation plating line according to claim 3, is characterized in that: described power set is vibrating motor (3), and described vibrating motor can drive described negative plate to move back and forth along the direction that is parallel to electrolyzer length direction.
5. the improved structure of filling perforation plating line according to claim 3, it is characterized in that: on two long side walls of described electrolyzer, also symmetry offers a plurality of hydrojet pipelines (11) that extend along electrolyzer short transverse, on each hydrojet pipeline (11), all offer a plurality of nozzles that communicate with its inside, and the plurality of nozzle is all right against described negative plate (2).
6. the improved structure of filling perforation plating line according to claim 5, is characterized in that: each slot (10) is respectively fixedly installed between adjacent two hydrojet pipelines (11).
7. the improved structure of filling perforation plating line according to claim 5, it is characterized in that: on the bottom land of described electrolyzer, offer liquid outlet, another this filling perforation plating line also includes recycle pump, and the water-in on described recycle pump and water outlet are corresponding to be respectively connected with described liquid outlet and hydrojet pipeline (11).
8. the improved structure of filling perforation plating line according to claim 7, it is characterized in that: be also provided with strainer, described strainer is provided with soiling solution entrance and scavenging solution outlet, soiling solution entrance on described strainer is communicated in the water outlet on described recycle pump, and the scavenging solution outlet on described strainer is communicated in described hydrojet pipeline (11).
9. the improved structure of filling perforation plating line according to claim 1, it is characterized in that: on the internal surface at the bottom of described electrolytic bath, be also provided with for the circulating cooling pipe and the heating tube that regulate electrolytic solution temperature, and one inflate circulation tube for what regulate electrolytic solution flow velocity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320486970.8U CN203440489U (en) | 2013-08-09 | 2013-08-09 | Improved structure of hole-filling electroplating line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320486970.8U CN203440489U (en) | 2013-08-09 | 2013-08-09 | Improved structure of hole-filling electroplating line |
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| Publication Number | Publication Date |
|---|---|
| CN203440489U true CN203440489U (en) | 2014-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320486970.8U Expired - Fee Related CN203440489U (en) | 2013-08-09 | 2013-08-09 | Improved structure of hole-filling electroplating line |
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| CN (1) | CN203440489U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103938242A (en) * | 2014-05-08 | 2014-07-23 | 天津普林电路股份有限公司 | High-density interconnection circuit board vertical continuous plating wire body and production method thereof |
| CN105862097A (en) * | 2016-06-06 | 2016-08-17 | 浙江振有电子股份有限公司 | HDI plate through-hole copper filling system based on pulse technology |
-
2013
- 2013-08-09 CN CN201320486970.8U patent/CN203440489U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103938242A (en) * | 2014-05-08 | 2014-07-23 | 天津普林电路股份有限公司 | High-density interconnection circuit board vertical continuous plating wire body and production method thereof |
| CN105862097A (en) * | 2016-06-06 | 2016-08-17 | 浙江振有电子股份有限公司 | HDI plate through-hole copper filling system based on pulse technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140219 Termination date: 20160809 |