KR20090132090A - Jig for printed circuit board plating - Google Patents

Abstract

PURPOSE: A jig for plating a PCB is provided to remove plating deviation according to current deviation in plating as first and second transfer arms guide current deviation to a rotating bar and the center point of a vertical frame. CONSTITUTION: A jig(100) for plating a PCB comprises a main body, a pair of rotating bars(120), a clamping unit(130), and a current supplying unit(140). The main body has a lattice form consisting of a pair of horizontal frames(112a) and a pair of vertical frames(112b). The plated substrate panel is mounted on the front side of the main body. A pair of rotating bars are vertically arranged on the both sides of the main body. The rotating bar presses the substrate panel mounted on the main body. The clamping unit fixes each rotating bar on the main body. A plurality of fixed contact points(114) are mounted on the vertical frame at constant intervals. A plurality of rotating contact points(122) are arranged on each rotating bar on the same line with the fixed contact point. The current supplying unit supplies the uniform current to the substrate panel mounted on the main body.

Description

JIG FOR PRINTED CIRCUIT BOARD PLATING}

The present invention relates to a jig for plating a printed circuit board, and more particularly, by providing a jig capable of supplying an equal current by minimizing a current deviation in the entire printed circuit board, which is a plated object immersed in a plating bath for electroplating. , The present invention relates to a jig for plating a printed circuit board which can increase the reliability of the product by removing the plating deviation caused by the current deviation during plating.

In general, a printed circuit board (PCB) serves to easily connect various electronic devices according to a predetermined frame, and is widely used in all electronic products from home appliances to advanced communication devices. It is classified into general PCB, module PCB, and package PCB.

A printed circuit board is formed by attaching a thin plate such as copper to one side of a phenolic resin insulating plate or an epoxy resin insulating plate, and then etching it according to the wiring pattern of the circuit to form a necessary circuit and forming holes by attaching parts. According to the number of wiring circuits, it is classified into single-sided board, double-sided board, multi-layer board and so on. The more layers, the more excellent the mounting ability of the parts is used for high-precision products. It is used.

The printed circuit board is plated by a well-known electroplating apparatus, and the plating apparatus is configured to metal-plat the printed circuit board to be plated by supplying electricity through an energizing unit after injecting metal to be plated into the electrolytic solution of the electrolytic cell. .

Conventional electroplating apparatus is a three-step process, first, a pre-treatment step of cleaning and rinsing the substrate to be plated, a plating step of plating the substrate after the pre-treatment step, and a post-treatment of the plated substrate consist of. At this stage, a carrier for suspending the substrate to be plated to move along the guide rail of the plating equipment is installed, and the carrier is provided with a jig having a rectangular frame shape for clamping the substrate to be plated.

The general process of electroplating through the above-described plating jig proceeds in the order of dehydration, polishing, degreasing, dipping, electroplating, post-treatment, and drying. The electroplating process is fixed through a printed circuit board, which is a plated object on the jig. Then, the plated object is plated by applying a current to the jig under the state of being immersed in the plating bath in which the plating liquid is contained.

However, the conventional plating jig has a problem that a current deviation occurs between the top and bottom of the plated object fixed to the jig because the current is supplied from the top of the jig for electroplating. As a result, there is another problem in that the reliability of the product is deteriorated because the uniform plating is not performed because the current does not flow evenly over the entire surface of the plated object.

The present invention has been made to solve the conventional problems as described above, the object of the present invention is to supply an equal current by minimizing the current deviation to the entire printed circuit board to be plated material immersed in the plating bath for electroplating. The present invention provides a jig for plating a printed circuit board which can increase the reliability of a product by removing a plating deviation caused by current deviation during plating, thereby providing uniform plating.

In order to achieve the object of the present invention as described above, the present invention,

It has a lattice shape consisting of a pair of horizontal frames and a pair of vertical frames, and a pair of rotations for pressing a substrate panel mounted on both sides of the main body and a substrate panel mounted on both sides of the main body mounted on the front surface. Bar and a conventional clamping means for fixing each pivoting bar for pressing the substrate panel to the main body, and each of the vertical frames is provided with a plurality of fixed contact points at equal intervals, and each pivoting bar has a fixed contact and the same line In the jig for plating a printed circuit board mounted with a plurality of rotational contacts arranged,

The jig for plating a printed circuit board further includes a current supply means for supplying an equal current to the substrate panel mounted on the main body.

The current supply means;

A current supply unit for supplying current to the substrate panel side while connecting the main body on which the substrate panel to be plated is mounted to a current guide bar to which current is supplied by being connected to a general power supply device; And

A current distribution unit electrically connected to the current supply unit to supply current to each vertical frame and the center point of each rotating bar to distribute current equally to each fixed contact point and each rotating contact point; Provide jig for plating.

Current supply unit,

A pair of support rods extending vertically from the upper both sides of the main body to the upper outer side of the main body;

The upper part is connected to the current guide bar and the current is applied, and the lower part is a pair of vertical current applying bars spaced apart from the upper part of each support bar; And

It is provided with an insulator coupling connecting one of the supporting rods spaced up and down and one of the current applying rods adjacent to each other.

Preferably, each of the current applying rods are formed integrally with a fixed bracket having a shape of a "" "shape so as to span the current guide rods, and the current applying rods and the fixing brackets are made of a conductive metal material. An upper portion of the support rod is screwed to the lower side of the ring, and a lower portion of the current applying rod is screwed to the upper side of the coupling.

Current distribution unit,

A pair of first transfer arms extending from an upper portion of each pivoting bar to a central point of the pivoting bar; And

And a pair of second transfer arms extending from the top of the rear surface of each vertical frame to a central point of the vertical frame and connected to each other.

An upper portion of each first transfer arm is electrically connected to an adjacent current applying rod by a first wire, and an upper portion of each second transfer arm is electrically connected to an adjacent current applying rod by a second wire.

Preferably, each pivot bar is equipped with two pivoting contacts, respectively, on the top and the bottom of the first transmission arm connected to the pivot bar, and on each vertical frame, the top and the bottom of the second transmission arm connected to the vertical frame. Two fixed contacts are mounted on the bottom.

As described above, according to the present invention, a printed circuit immersed in the plating bath for electroplating because the first transfer arm and the second transfer arm connected to the current applying rod guides the current to the center of the pivoting bar and the vertical frame Since it is possible to supply an even current by minimizing the current deviation in the entire substrate, it is possible to eliminate the plating deviation due to the current deviation during plating, thereby increasing the reliability of the product by enabling uniform plating.

Hereinafter, a printed circuit board plating jig according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a perspective view showing a jig for plating a printed circuit board according to the present invention, and FIG. 2 is a perspective view showing a state of use of the jig for plating a printed circuit board shown in FIG.

1 and 2, the jig 100 for plating a printed circuit board according to the present invention is a pre-treatment step for cleaning and rinsing the substrate panel (P) to be plated, and plated the substrate panel (P) after the pretreatment step It is used in the plating step and the usual plating process consisting of the step of post-processing the substrate panel P after the plating is completed.

The printed circuit board plating jig 100 according to the present invention has a lattice shape consisting of a pair of horizontal frames 112a and a pair of vertical frames 112b, and the substrate panel P to be plated is mounted on the front surface thereof. The main body 110, a pair of rotating bar 120 is disposed perpendicular to both sides of the main body 110 and pressurized the substrate panel (P) mounted on the main body 110, and pressurizing the substrate panel (P) It consists of a conventional clamping means 130 for fixing each rotating bar 120 to the main body 110.

As anyone can see, each of the plurality of fixed contacts 114 are equidistantly mounted on each vertical frame (112b), each of the rotating bar 120 is a plurality of rotating contacts disposed in the same line with the fixed contact 114 A fixing pin 116 is mounted on the front surface of the main body 110 so that the fixed contact 114 and the rotating contact 122 exactly contact the ground plane (not shown) of the substrate panel P. Is fitted.

The plating jig 100 according to the present invention formed as described above further includes a current supply means 140 capable of supplying an equal current to the substrate panel P mounted on the main body 110.

The current supply unit 140 includes a current supply unit 142 for supplying current to the substrate panel P while connecting the main body 110 on which the substrate panel P to be plated is mounted to the current guide bar B, and a current. It is electrically connected to the supply unit 142 to supply current to the center of each of the vertical frame 112b and each rotating bar 120 to equalize to each of the fixed contact 114 and each of the rotating contact 122 And a current distribution unit 152 for distributing current.

As anyone can see, the current guide bar (B) is electrically connected to a conventional power supply (not shown) to receive the current.

First, the current supply unit 142 is a pair of support bars 144 extending from the upper side of the upper body of the main body 110 to the upper outer side of the main body 110, the upper portion is connected to the current guide bar (B) to the current Is applied, and the lower portion is a pair of vertical current applying rods 146 spaced apart from the upper portion of each supporting rod 144, and any current adjacent to any one supporting rod 144 spaced up and down. A coupling 150 of insulator connecting the rods 146.

The upper portion of each current applying rod 146 is formed integrally with a fixed bracket 148 having a substantially "" "shape so as to span the current guide bar (B), the current applying rod 146 and the current applying rod The fixing bracket 148 formed at 146 is made of an electrically conductive metal material.

The coupling 150 is made of an insulator so that the current applied to each current applying rod 146 is not guided to the support rod 114. An upper portion of the support rod 144 is screwed to the lower side of the coupling 150, and a lower portion of the current applying rod 146 is screwed to the upper side of the coupling 150.

On the other hand, the current distribution unit 152 is a pair of first transfer arm 154 extending from the top of each rotating bar 120 to the central point of the rotating bar 120 and connected to each vertical frame 112b It has a pair of second transfer arm (156) is connected to extend from the top of the back of the back to the center of the vertical frame (112b).

An upper portion of each first transfer arm 154 is electrically connected to an adjacent current applying rod 146 by a first wire 158, and an upper portion of each second transfer arm 156 is connected to a second wire 160. Is electrically connected to an adjacent current applying rod 146 by

On the other hand, each pivoting bar 120 is equipped with two pivoting contacts 122 at the top and bottom, respectively, based on the first transfer arm 154 connected to the pivoting bar 120, and each vertical frame 122b. Two fixed contacts 114 are respectively mounted on the upper and lower sides of the second transmission arm 156 connected to the vertical frame 122b. That is, four pivot contacts 122 are mounted on the pivoting bar 120, and four stationary contacts 114 are mounted on the vertical frame 122b.

Hereinafter, the state of use of the printed circuit board plating jig 100 formed as described above will be briefly described.

First, by loosening the clamping means 130, each rotating bar 120 is rotated to the front side of the main body 110. When the rotation bar 120 is rotated, under the state in which the substrate panel P is fitted to the fixing pin 116 on the front surface of the main body 110, the rotation bar 120 is rotated back to the main body 110 and clamping means. Tighten the 130.

Under this condition, the substrate panel P and the main body 110 are put in a plating bath (not shown) for plating the substrate panel P, and then a current guide rod (not shown) is provided through a power supply device (not shown). When a current is applied to B), the current is guided along each of the current application rods 146 and the first wire 158 and the second wire 160, and again each of the first transfer arm arm 154 and Through each second transfer arm 156 is guided to the center point of each pivot bar 120 and each vertical frame 112b.

In this way, the current guided to the center point of each pivot bar 120 and each vertical frame 112b is guided to each pivot contact 122 and each fixed contact 114 while minimizing the current deviation. The substrate panel P is uniformly plated without plating deviation.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the invention described in the claims. You will understand.

1 is a perspective view showing a jig for plating a printed circuit board according to the present invention; and

2 is a perspective view showing a state of use of the jig for plating a printed circuit board shown in FIG.

Explanation of symbols on the main parts of the drawing

100: jig for plating a printed circuit board 110: main body

112a: horizontal frame 112b: vertical frame

114: fixed contact 116: fixed pin

120: rotation bar 122: rotation contact

130: clamping means 140: current supply means

142: current supply unit 144: support rod

146: current application rod 148: fixing bracket

150: coupling 152: current distribution

154: first delivery arm 156: second delivery arm

158: first wire 160: second wire

Claims (5)

A main body having a lattice shape consisting of a pair of horizontal frames and a pair of vertical frames, the substrate panel being plated on the front surface thereof, and a substrate disposed on both sides of the main body and pressing the substrate panel mounted on the main body. A pair of rotation bars and a conventional clamping means for fixing each of the rotation bars for pressing the substrate panel to the main body, and each of the vertical frames is provided with a plurality of fixed contacts at equal intervals, each of the rotations In the jig for plating a printed circuit board is equipped with a plurality of rotating contacts arranged in the same line as the fixed contact, The jig for plating the printed circuit board further includes current supply means for supplying an equal current to the substrate panel mounted on the main body. The current supply means; A current supply unit for supplying current to the substrate panel side while connecting the main body on which the substrate panel to be plated is mounted to a current guide bar to which current is supplied connected to a general power supply device; And A current distribution unit electrically connected to the current supply unit to supply a current to the center point of each of the vertical frame and each of the pivot bars to distribute current evenly to each of the fixed contacts and each of the pivot contacts; Printed circuit board plating jig characterized in that it comprises. The method of claim 1, wherein the current supply unit, A pair of support rods extending vertically from the upper both sides of the main body to the upper outer side of the main body; An upper portion connected to the current guide rod to receive current, and a lower portion of the pair of vertical current applying rods spaced apart from an upper portion of each of the supporting rods; And A jig for plating a printed circuit board, comprising: a coupling made of an insulator connecting one of the supporting rods and the adjacent one of the current applying rods 146 spaced apart up and down. According to claim 2, wherein each of the current applying rod is formed in the fixed bracket of the substantially "" "shape integrally formed so as to span the current guide rod, the current applying rod and the fixing bracket is a metal that can be energized The jig for plating a printed circuit board, wherein the upper side of the support rod is screwed to the lower side of the coupling, and the lower side of the current applying rod is screwed to the upper side of the coupling. The method of claim 2, wherein the current distribution unit, A pair of first transfer arms extending from an upper portion of each pivot bar to a central point of the pivot bar; And And a pair of second transfer arms extending from the top of the rear surface of each vertical frame to a center point of the vertical frame, An upper portion of each of the first transfer arms is electrically connected to the adjacent current applying rods by a first wire, and an upper portion of each second transfer arm is electrically connected to the adjacent current applying rods by a second wire. Printed circuit board plating jig, characterized in that the. 5. The rotary bar of claim 4, wherein each of the pivoting bars is provided with two pivoting contacts, respectively, on the top and the bottom of the first transmission arm connected to the pivoting bar, and each of the vertical frames is connected to the vertical frame. 2 jig for plating a printed circuit board, characterized in that two fixed contacts are mounted on the upper and lower sides of the transfer arm.

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