CN210163543U - Ceramic substrate is hanger for copper facing - Google Patents
Ceramic substrate is hanger for copper facing Download PDFInfo
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- CN210163543U CN210163543U CN201920991237.9U CN201920991237U CN210163543U CN 210163543 U CN210163543 U CN 210163543U CN 201920991237 U CN201920991237 U CN 201920991237U CN 210163543 U CN210163543 U CN 210163543U
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- rack
- main body
- hanger
- ceramic substrate
- copper
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Abstract
The utility model provides a ceramic substrate is hanger for copper facing relates to the electro-coppering field. The rack for copper plating of the ceramic substrate comprises a rack support and a rack main body, wherein the rack main body is rotatably connected to the rack support so as to turn over the rack main body; the hanger main body is provided with a plurality of mounting holes for mounting the ceramic substrate. In the copper electroplating process, the utility model discloses accessible upset hanger main part forms the copper coating that the homogeneity is good on ceramic substrate surface, does benefit to subsequent encapsulation operation and has prolonged off-the-shelf life.
Description
Technical Field
The utility model relates to an electrolytic copper plating field particularly, relates to a ceramic substrate hanger for copper facing.
Background
The ceramic substrate has excellent heat conductivity, reliable electric insulation, low dielectric constant and dielectric loss, and is an ideal heat dissipation packaging material for new generation large-scale integrated circuits, semiconductor module circuits and high-power devices. The method can be applied to the fields of high-power semiconductor modules, semiconductor refrigerators, electronic heaters, power control circuits, automotive electronics, solar panel assemblies, lasers and the like. The surface of the ceramic substrate is often subjected to a copper plating treatment.
The general ceramic substrate copper plating process comprises the following steps: the ceramic substrate is arranged in a hanger, the hanger is placed in a copper plating tank filled with electroplating solution, the ceramic substrate to be plated serves as a cathode, metal copper serving as an anode is oxidized into copper ions to enter the electroplating solution under the action of a power supply, the copper ions move to the cathode under the action of an electric field and are reduced and deposited on the surface of the ceramic substrate to form a copper plating layer.
However, in the actual copper electroplating process, the inventors of the present application found that the copper plating layer on the ceramic substrate was unevenly distributed, and after actual measurement, it was found that the copper plating layer formed on the ceramic substrate had a shape with a thick top and a thin bottom as shown in fig. 1a, which may be caused by uneven distribution of electric lines of force during the electroplating process. The uneven thickness of the copper plating on the ceramic substrate affects the subsequent packaging and the service life of the finished product.
SUMMERY OF THE UTILITY MODEL
The utility model provides a ceramic substrate is hanger for copper facing aims at improving the inhomogeneous problem of copper plate.
In order to solve the technical problem, the utility model provides a rack for copper plating of ceramic substrates, which comprises a rack bracket and a rack main body, wherein the rack main body is rotationally connected to the rack bracket so as to overturn the rack main body; the hanger main body is provided with a plurality of mounting holes for mounting the ceramic substrate.
As a further optimization, the hanger bracket is an H-shaped bracket and comprises two oppositely arranged side portions and a connecting portion for connecting the two side portions, and the middle portions of the two sides of the hanger main body are respectively and rotatably connected to the two side portions, so that the hanger main body can be turned over.
As further optimization, first through holes are formed in one ends, located below the two side portions in the vertical direction, second through holes matched with the first through holes are formed in the middle of the two sides of the hanger main body, and the first through holes are connected with the second through holes through rotating shafts.
As a further optimization, the hanger further comprises a clamping piece arranged on the side portion, the clamping piece comprises two clamping plates and an elastic piece arranged between the two clamping plates and connecting the two clamping plates, and the clamping piece is used for clamping or releasing the hanger main body.
As a further optimization, a limiting sliding groove is formed in the side portion, the elastic piece is arranged in the limiting sliding groove in a sliding mode, and the clamping piece is used for being close to or far away from the hanger main body through sliding in the limiting sliding groove.
As further optimization, one end of each of the two side parts, which is located above the side part in the vertical direction, is provided with a first hook.
Preferably, the peripheral wall of the mounting hole is provided with a second hook for mounting the ceramic substrate.
The utility model has the advantages that:
utility model obtains through the above-mentioned design ceramic substrate hanger for copper facing, during the use, ceramic substrate 1 is installed in the mounting hole of hanger main part. First, the first copper electroplating is performed in the state shown in fig. 2a, and after a first copper layer 2 having a thick upper portion and a thin lower portion is formed on the surface of the ceramic substrate 1, the hanger body is turned over by 180 ° (as shown in fig. 2 b), and then the second copper electroplating is performed, so that a second copper layer 3 having a thick upper portion and a thin lower portion is formed on the surface of the first copper layer 2 again. Because the main body of the hanger is overturned, the direction of the ceramic substrate 1 during the second copper electroplating is different from that during the first copper electroplating, so that the shapes of the first copper layer 2 and the second copper layer 3 formed on the surface of the main body are complementary, and finally a copper plating layer with good uniformity is formed (as shown in figure 1 b), the problem of uneven thickness of the copper plating layer is greatly improved, the subsequent packaging operation is facilitated, and the service life of a finished product is prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of a copper plating structure of a ceramic substrate; wherein, (a) is the structure diagram of the ceramic substrate with non-uniform copper layer in the background art; (b) the structure of the copper plating layer formed after the ceramic substrate copper plating hanger provided by the utility model is used is shown schematically;
fig. 2 is a schematic diagram of the hanger main body turning over provided by the present invention; wherein, (a) is a schematic structural diagram before the hanger main body is turned over; (b) is a schematic structural diagram after the hanger main body is overturned;
fig. 3 is a schematic structural view of a rack for copper plating of a ceramic substrate provided by the present invention at a first viewing angle;
fig. 4 is a schematic structural view of the rack for copper plating of the ceramic substrate provided by the present invention at a second viewing angle;
fig. 5 is a schematic structural view of a rack for copper plating of a ceramic substrate provided by the present invention at a third viewing angle;
FIG. 6 is an enlarged partial view at I shown in FIG. 3 (with the clamp removed);
fig. 7 is a side view of a clamp provided by the present invention;
fig. 8 is a partial enlarged view at II shown in fig. 3.
The labels in the figure are: 1-a ceramic substrate; 2-a first copper layer; 3-a second copper layer; 10-a hanger bracket; 11-side part; 12-a connecting part; 13-a first hook; 14-a rotating handle; 15-a first via; 16-a rotation axis; 17-a second via; 18-a nut; 19-a flexible card; 20-a hanger body; 21-mounting holes; 22-a second hook; 22 a-a first end; 22 b-a second end; 22 c-a circular arc hook; 30-a clamp; 31-a splint; 32-an elastic member; 33-limit sliding chute.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Examples
The invention will be described in further detail with reference to the following detailed description and accompanying drawings:
referring to fig. 3 to 4, the utility model provides a rack for copper plating of ceramic substrates, which comprises a rack support 10 and a rack main body 20, wherein the rack main body 20 is rotatably connected to the rack support 10, so that the rack main body 20 can be turned over; the hanger body 20 is provided with a plurality of mounting holes 21 for mounting the ceramic substrate 1.
Specifically, in the present embodiment, when the hanger is used for copper electroplating, the ceramic substrate 1 is first mounted in the mounting hole 21 of the hanger main body 20. Then, the first copper electroplating is performed in the state shown in fig. 2a to form a first copper layer 2 with a thick upper portion and a thin lower portion on the surface of the ceramic substrate 1, and then, the hanger body 20 is turned over by 180 ° (as shown in fig. 2 b) and the second copper electroplating is performed again to form a second copper layer 3 with a thick upper portion and a thin lower portion on the surface of the first copper layer 2. Because the hanger main body 20 is turned over, the direction of the ceramic substrate 1 during the second copper electroplating is different from the direction during the first copper electroplating, so that the shapes of the first copper layer 2 and the second copper layer 3 are complementary, and finally a copper plating layer with good uniformity is formed (as shown in fig. 1 b), so that the problem of uneven thickness of the copper plating layer is greatly improved, the subsequent packaging operation is facilitated, and the service life of a finished product is prolonged. It should be noted that the copper plating layer with good uniformity can be formed only when the components, temperature and plating time of the plating solution of the first copper electroplating and the second copper electroplating are consistent.
As a further optimization, the hanger bracket 10 is an H-shaped bracket, and includes two side portions 11 disposed opposite to each other and a connecting portion 12 connecting the two side portions 11, and the middle portions of the two sides of the hanger main body 20 are respectively rotatably connected to the two side portions 11, so that the hanger main body 20 is turned over.
More preferably, in a preferred embodiment of the present invention, as shown in fig. 6, two ends of the side portion 11 located below in the vertical direction are all provided with a first through hole 15, the middle portions of the two sides of the hanger main body 20 are all provided with a second through hole 17 matched with the first through hole 15, the first through hole 15 and the second through hole 17 are connected by a rotation shaft 16, and the hanger main body 20 rotates around the rotation shaft 16.
It should be noted that the turning effect can be achieved by rotating the hanger main body 20 around the rotating shaft 16, or as shown in fig. 6, the rotating shaft 16 rotates in the first through hole 15, and the rotating shaft 16 is fixedly connected with the hanger main body 20 through the second through hole 17 and the nut 18, and then the rotating handle 14 is disposed at one end of the rotating shaft 16 away from the hanger main body 20, so that the hanger main body 20 is turned over by rotating the rotating handle 14, and direct contact with the hanger main body 20 is avoided.
As a further optimization, the hanger bracket 10 and the hanger main body 20 are both made of stainless steel materials, so that the hanger bracket is ensured to have conductive performance, and meanwhile, due to the inert property of the stainless steel materials, the hanger bracket cannot react with electroplating solution, and the hanger is prevented from being damaged.
As a further optimization, the hanger for copper plating of the ceramic substrate 1 of the present embodiment further includes a clamping member 30, as shown in fig. 2 and 7, the clamping member 30 is disposed on the side portion 11, and includes two clamping plates 31 and an elastic member 32 disposed between the two clamping plates 31 and connecting the two clamping plates 31, and the clamping member 30 is used for clamping or releasing the hanger main body 20. In use, the two clamping plates 31 can be pressed to enable the ends of the two clamping plates 31 on the same side to approach or move away from each other so as to clamp or release the hanger main body 20. Since the hanger main body 20 of the present embodiment is rotatable, if the hanger main body 20 is not fixed during the plating process, the hanger may rotate due to factors such as the flow rate of the plating solution, thereby affecting the uniformity of the copper plating. Therefore, the clamp 30 arranged on the side part 11 is used for fixing the hanger main body 20 in the electroplating process, so that the hanger main body 20 is ensured not to rotate in the electroplating process, and the uniformity of a copper plating layer is improved.
As a further optimization, as shown in fig. 6, the side portion 11 is opened with a limiting sliding slot 33, the elastic member 32 is slidably disposed in the limiting sliding slot 33, and the clamping member 30 is configured to move closer to or away from the hanger main body 20 by sliding in the limiting sliding slot 33.
Further, in a preferred embodiment of the present invention, as shown in fig. 6, two long edges of the limiting sliding groove 33 are wave-shaped, and the wave-shaped long edges are back to back and are in one-to-one correspondence, so that a plurality of limiting cavities are formed in the limiting sliding groove 33, the limiting cavities are adapted to the shape of the elastic member 32, so as to ensure that the clamping member 30 cannot easily slide in the limiting sliding groove 33, and avoid the insufficient clamping force on the hanger main body 20. It should be noted that the elastic member 32 may be a spring plate or a rubber block, which is not limited herein.
As a further optimization, as shown in fig. 5, one end of each of the two side portions 11, which is located vertically above, is provided with a first hook 13. The couple is used for hanging the hanger on the cathode bar, is equipped with elasticity card 19 in first couple 13, and elasticity card 19 can be for example thin sheetmetal, makes things convenient for the hanger to hang and establishes, and is inseparabler with the contact of cathode bar, and is more firm.
As a further optimization, as shown in fig. 4, the peripheral wall of the mounting hole 21 is provided with a second hook 22 for mounting the ceramic substrate 1. As shown in fig. 8, the first end 22a of the second hook 22 is fixed to the peripheral wall of the mounting hole 21, and the second end 22b extends a distance away from the mounting hole 21, is bent toward the mounting hole 21, and then extends a distance again toward the mounting hole 21, thereby forming a second hook 22 having a "doglegged" shape. The second end 22b of the second hook 22 is further provided with an arc hook 22c, so that the ceramic substrate 1 can be mounted on the arc hook 22c, and the ceramic substrate is convenient to mount and dismount while ensuring firm mounting.
Further, in the preferred embodiment, the mounting holes 21 are arranged in a 4 × 4 array on the hanger body 20 to ensure the copper plating efficiency.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The rack for copper plating of the ceramic substrate is characterized by comprising a rack bracket and a rack main body, wherein the rack main body is rotatably connected to the rack bracket so as to turn over the rack main body; the hanger main body is provided with a plurality of mounting holes for mounting the ceramic substrate.
2. The hanger for copper plating of ceramic substrates as claimed in claim 1, wherein the hanger bracket is an H-shaped bracket comprising two oppositely disposed side portions and a connecting portion connecting the two side portions, and the middle portions of the two sides of the hanger main body are respectively rotatably connected to the two side portions so as to turn over the hanger main body.
3. The rack of claim 2, wherein a first through hole is formed in one end of each of the two side portions which are vertically located at the lower side, a second through hole matched with the first through hole is formed in the middle of each of the two sides of the rack body, and the first through hole and the second through hole are connected through a rotating shaft.
4. The rack for copper plating of ceramic substrates as claimed in claim 3, further comprising a clamping member disposed on the side portion, the clamping member comprising two clamping plates and an elastic member disposed between and connecting the two clamping plates, the clamping member being configured to clamp or release the rack body.
5. The rack of claim 4, wherein the side portion is provided with a limiting sliding groove, the elastic member is slidably disposed in the limiting sliding groove, and the clamping member is slidably disposed in the limiting sliding groove to approach or separate from the rack body.
6. The rack for copper plating of ceramic substrates as claimed in claim 2, wherein the first hooks are provided at the upper ends of the two side portions in the vertical direction.
7. The rack for copper plating of ceramic substrates as claimed in claim 2, wherein the peripheral wall of the mounting hole is provided with a second hook for mounting the ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920991237.9U CN210163543U (en) | 2019-06-27 | 2019-06-27 | Ceramic substrate is hanger for copper facing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920991237.9U CN210163543U (en) | 2019-06-27 | 2019-06-27 | Ceramic substrate is hanger for copper facing |
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| Publication Number | Publication Date |
|---|---|
| CN210163543U true CN210163543U (en) | 2020-03-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920991237.9U Active CN210163543U (en) | 2019-06-27 | 2019-06-27 | Ceramic substrate is hanger for copper facing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112725772A (en) * | 2020-12-24 | 2021-04-30 | 北京青云航空仪表有限公司 | Hanging tool and hanging method for chemical nickel plating of QFN independent chip |
| CN113249761A (en) * | 2020-02-12 | 2021-08-13 | 上海飞机制造有限公司 | Anodization stores pylon |
-
2019
- 2019-06-27 CN CN201920991237.9U patent/CN210163543U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113249761A (en) * | 2020-02-12 | 2021-08-13 | 上海飞机制造有限公司 | Anodization stores pylon |
| CN113249761B (en) * | 2020-02-12 | 2022-07-15 | 上海飞机制造有限公司 | Anodization stores pylon |
| CN112725772A (en) * | 2020-12-24 | 2021-04-30 | 北京青云航空仪表有限公司 | Hanging tool and hanging method for chemical nickel plating of QFN independent chip |
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