KR20140028858A - Plating equipment - Google Patents

Abstract

The present invention relates to a plating apparatus, and a plating apparatus according to an embodiment of the present invention, a hanger portion for fixing a plated object, the hanger portion is coupled, a guide rail for guiding the movement of the hanger, and opposing the guide rail. It is formed to include a bus bar that is supplied with a current and the current collector is in contact with the bus bar to transfer the current to the hanger.

Description

Plating Equipment {PLATING EQUIPMENT}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus, and more particularly, to a plating apparatus for supplying a constant current to a plating target to form a plating film having a uniform thickness over the entire plating target.

In general, the plating process is a technique of forming a plating film of a desired thickness and material on a predetermined plating object.

As an example, a plating process is included in a manufacturing process of a circuit board such as a printed circuit board (PCB).

The printed circuit board (PCB) serves to easily connect various electronic devices according to a predetermined frame, and is widely used in all electronic products from home appliances to high-tech communication devices. It is also classified into PCB for package and PCB for package.

The printed circuit board is formed by forming a metal film on an insulating plate such as a phenolic resin insulating plate or an epoxy resin insulating plate and then etching it according to the wiring pattern of the circuit to form a necessary circuit and forming a hole for attaching components. The substrates are classified into single-sided boards, double-sided boards, and multilayer boards according to the number of surfaces on which wiring patterns are formed.

The plating process is performed to form a metal film for forming a wiring pattern of the printed circuit board or a conductive via for electrically connecting the wiring patterns formed on a plurality of surfaces.

Here, the printed circuit board is plated by a known electroplating apparatus, and the plating is performed using a vertically continuous plating apparatus as equipment for efficiently plating the printed circuit board.

This allows the printed circuit board to be immersed in the plating solution filled in the plating bath for a desired time by continuously passing the plating bath while the printed circuit board is upright.

In this case, the printed circuit board needs to be supplied with a constant current for electrochemical action while moving in the plating bath, and means for moving the printed circuit board is required.

In the conventional plating apparatus for supplying current by connecting a cathode to a printed circuit board, a hanger for holding and transporting a printed circuit board is in contact with a rail-shaped busbar connected to the cathode feeder, and a current is supplied. The current is fed along the busbar, and the current supplied to the hanger is plated by supplying a current to the printed circuit board through a clamp that fixes the printed circuit board.

In the conventional plating apparatus, a non-contact portion in which the hanger and the rail fall due to vibration or shock generated between the hanger and the rail during the movement of the hanger is generated, causing a difference in current supply for each hanger, and an irregular current with time on the hanger itself. There is a problem that plating is caused between the printed circuit board fixed to each hanger caused by the supply.

1. Korean Patent Publication (KR 2008-0111205) 2. Korean Patent Publication (KR 2010-0034318)

The present invention proposed to solve the above problems is an object of the present invention to provide a plating apparatus capable of supplying a uniform current to the vibration or shock during the movement of the hanger.

It is also an object of the present invention to provide a plating apparatus capable of detecting a hanger in which an electrical problem occurs during a transporting hanger.

Plating apparatus according to an embodiment of the present invention for achieving the above object is a hanger portion for fixing the plated object, the hanger portion is coupled, a guide rail for guiding the movement of the hanger, and formed to face the guide rail And a current collector for supplying current to the hanger by contacting the bus bar and the bus bar.

Here, the current collector may include a current collector plate that contacts the busbar to receive current and a cable connected to the current collector plate to transfer current to the hanger.

In this case, the current collector may be formed of a conductive material.

The current collector may further include an elastic member formed between the current collector plate and the hanger.

In this case, the elastic member may be formed such that the current collector plate presses the busbar at a constant pressure.

In addition, the cable may be formed of a braided cable.

The hanger may be formed at a distal end thereof, and a plurality of clamps may be formed to mount one end of the object to be processed.

Here, the hanger may be mounted in the vertical direction to the workpiece.

In addition, the hanger may be formed of a conductive material.

On the other hand, the bus bar is a plating apparatus is formed spaced apart from the guide rail at a predetermined interval on the guide rail.

Here, the bus bar is a plating apparatus used as a power input means of the auxiliary device installed in the hanger.

In addition, a conductive grease may be formed between the current collector and the busbar.

Plating apparatus according to another embodiment of the present invention for achieving the above object is formed to face the guide rail, the guide rail for guiding the movement of the hanger, the guide rail, the feed coil And a bus bar which is wound and generates an induction current, and an induction current collector which supplies current to the hanger by electromagnetic induction by the induction current generated in the bus bar.

Here, the bus bar may further include a plurality of feed protrusions protruding.

In addition, the induction collector may include a current collector electrode protruding in the busbar direction and a current collector coil wound around the current collector pole.

At this time, the current supplied from the bus bar by the magnetic induction method may be used as a power input means of the auxiliary device installed in the hanger.

As described above, the plating apparatus according to the embodiment of the present invention further installs a busbar for supplying current to the hanger in addition to the guide rail for guiding the movement of the hanger, thereby eliminating unstable current supply due to contact failure of the hanger. Since the plating film can be formed to a uniform thickness by minimizing the occurrence of stable current supply of the hanger and current supply for each hanger, there is an effect of improving the quality and reliability of the product.

1 is a side cross-sectional view showing a plating apparatus according to an embodiment of the present invention.
2 is a perspective view showing a plating apparatus according to an embodiment of the present invention.
3 is a front view showing a plating apparatus according to an embodiment of the present invention.
Figure 4 is a front view showing a plating apparatus according to another embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is merely an example and the present invention is not limited thereto.

In the following description, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intentions or customs of the user, the operator, and the like. Therefore, the definition should be based on the contents throughout this specification.

The technical idea of the present invention is determined by the claims, and the following embodiments are merely a means for effectively explaining the technical idea of the present invention to a person having ordinary skill in the art to which the present invention belongs.

Hereinafter, an embodiment of a plating apparatus according to the present invention will be described in detail with reference to the accompanying drawings of FIGS. 1 to 3.

1 is a side cross-sectional view showing a plating apparatus according to an embodiment of the present invention, Figure 2 is a perspective view showing a plating apparatus according to an embodiment of the present invention, Figure 3 is a front view showing a plating apparatus according to an embodiment of the present invention. to be.

As shown in Figures 1 to 3, the plating apparatus according to an embodiment of the present invention is a device for performing a predetermined plating process on the plated object by applying a current to the electrolyte.

As an example, the plated object may be a printed circuit board (PCB), and at the same time, a plating process for a plurality of printed circuit boards (B) may be continuously performed.

Such a plating apparatus includes a hanger part 10 for fixing and moving a printed circuit board B, a hanger part 10 coupled thereto, and a guide rail 20 for guiding the movement of the hanger part 10; And a current collector 40 which is formed to face the guide rail 20 to receive a current, and a current collector 40 that contacts the busbar 30 to transmit current to the hanger 10. Can be.

In addition, the plating apparatus is provided with a plating bath 2 filled with the electrolyte solution 1 so that the printed circuit board (B) is immersed.

Here, the plating tank (2) is a tank structure for a tank having a filling space so that the upper surface is open and the electrolyte (1) in which the metal is dissolved therein, the electrolyte (1) is filled to a certain height, the printing is immersed The insoluble positive electrode plates 3 to which positive currents are applied to both sides of the circuit board B may be disposed to face each other.

In addition, the plating tank 2 is formed with a circulation pipe, an electrolyte circulation member (not shown) consisting of a pump and a filter to filter foreign matters of the electrolyte solution 1, and the electrolyte solution 1 in the plating bath 2. ) Can be supplied circularly.

The hanger 10 may be formed to move along the guide rail 20 in a state where the printed circuit board B is mounted, and may be formed of a conductive material to transfer current to the printed circuit board B. FIG. have.

In this case, a plurality of hangers 10 moving along the guide rail 20 may be formed, and the number of hangers 10 may be selected according to a designer's design.

In addition, the hanger 10 may be formed to be movable upright in the vertical direction of the printed circuit board (B).

To this end, the hanger 10 is formed on the hanger body 11 and the other end of the hanger body 11 and the hanger body 11 is formed on one end of the hanger body 11 to mount the printed circuit board (B) The hanger body 11 may be composed of a conveying member 13 is coupled to be moved along the guide rail (20).

Here, the clamp 12 may be formed in the transverse direction at one end of the hanger body 11, it may be formed to clamp the upper end of the printed circuit board (B).

At this time, the clamp 12 is formed in a tong shape to facilitate the removal of the printed circuit board (B).

In addition, the transfer member 13 is to be coupled to the guide rail 20 so as to be movable, it may be formed in a shape bent to contact the guide rail 20 may be seated on the top of the guide rail (20).

That is, the hanger 10 is formed to be detachable to the guide rail 20, it is possible to add or remove the hanger 10 according to the design of the designer.

In addition, a plurality of roll members 14 may be formed in the transfer member 13 so as to face each other with the guide rail 20 therebetween.

Here, the roll member 14 is rotated in contact with the side of the guide rail 20, the hanger 10 can be moved smoothly along the guide rail (20).

On the other hand, the auxiliary device 15 may be configured on one side of the hanger 10.

Here, the auxiliary device 15 may be a current measuring device or the like, and the current measuring device may measure an amount of current applied to the hanger 10 from the busbar 30 to be described later.

At this time, the current measuring unit can measure the current flowing through the hanger 10 to check whether the current supply is smooth, there is an effect that can reduce the defective rate of the printed circuit board produced.

The guide rail 20 is coupled to the hanger 10 to guide the movement of the hanger 10, may be configured in a closed curve shape, it may be formed along the plating bath (2).

The bus bar 30 is a current is fed, it may be connected to a feeding device (not shown) for the current feeding, it may be formed of a conductive material.

Here, the bus bar 30 and the guide rail 20 may be formed so that the upper side and the lower side are opposed to each other vertically arranged, is formed in a closed curve like the guide rail 20, which will be described later It is possible to supply a current to the hanger 10 moving along the guide rail 20 through the whole (40).

In other words, the bus bar 30 is formed on the guide rail 20 to be spaced apart from the guide rail 20 by a predetermined interval, and the electric current is fed to the hanger 10 through the current collector 40 to be described later. The current is supplied, and the current supplied to the hanger unit 10 through the busbar 30 may be supplied to the printed circuit board B to be used for plating the printed circuit board B.

In addition, the bus bar 30 may be used as an input power source of the auxiliary device 15 such as a current measuring device.

However, when a current is supplied to the guide rail 20 as well as the busbar 30, the current supplied to the guide rail 20 is transferred to the printed circuit board B through the hanger 10 to be printed. Used in the plating process of the circuit board (B), the current supplied to the current collector 40 through the busbar 30 is used as a power input means of the auxiliary device 15, respectively, resulting in a short due to two power inputs. Can be prevented.

In addition, when the auxiliary device 15 is not used, the current supplied to the guide rails 20 and the busbars 30 is transferred to the printed circuit board B so that the plating process of the printed circuit board B may be performed. By using this, since the occurrence of variation in the current supplied to the printed circuit board B can be minimized to form a plating film having a uniform thickness, there is an effect of improving the high quality of the product and the reliability of the product.

The current collector 40 contacts the bottom surface of the busbar 30 to transfer current supplied to the busbar 30 to the hanger 10, and includes a current collector 41 and a cable 42. Can be.

Here, the current collector plate 41 may be formed in a plate shape to contact the bottom surface of the bus bar 30.

In addition, the current collector plate 41 may be formed of a conductive material to be in contact with the bus bar 30 to receive a current supplied to the bus bar 30, and may be formed of a material having low contact resistance. Do.

In addition, a conductive grease (not shown) may be formed between the current collector plate 41 and the bus bar 30 to smoothly move the hanger 10 and to make electrical contact.

In addition, the cable 42 is formed to electrically connect the current collector plate 41 and the hanger 10 between the current collector plate 41 and the hanger 10, and receives current through the current collector plate 41. Can be delivered to the hanger (10).

In this case, the cable 42 may be formed of a braided cable, and may be formed in any configuration as long as it is for transmitting current.

Meanwhile, an elastic member 43 may be formed between the current collector plate 41 and the hanger part 10.

At this time, the elastic member 43 is preferably formed to surround the cable 42.

Here, the elastic member 43 is formed to elastically support the lower portion of the current collector plate 41 to press the bus bar 30 at a constant pressure, so that the hanger part 10 guides the guide rail 20. Since it is possible to prevent the non-contact between the current collector plate 41 and the busbar 30 that may occur due to the vibration caused by the friction between the hanger 10 and the guide rail 20 or the impact applied from the outside when moving along, Through the hanger 10, there is an effect of stably transmitting the current transmitted to the printed circuit board B.

As described above, in the plating apparatus according to an embodiment of the present invention, the printed circuit board (B) is erected in the vertical direction and clamped a part of the upper end to the clamp 12 of the hanger part 10 after the plating bath ( Immerse in 2).

Here, the hanger 10 is seated on the upper portion of the guide rail 20 to be movable along the guide rail 20, the bus bar 30, the current is fed to the upper portion of the guide rail 20 Is formed, and a current collector 40 is formed to deliver a current supplied to the busbar 30 to the hanger 10.

At this time, the current collector plate 41 of the current collector portion 40 is in contact with the busbar 30 by the elastic member 43.

Accordingly, in the plating apparatus according to the present invention, in addition to the guide rail 20 for the transfer of the hanger 10, a bus bar 30 for supplying current to the hanger 10 is additionally provided, thereby providing a hanger part ( 10) by eliminating contact disturbances that may occur due to vibration or external shocks, and thereby, unstable current supply, thereby minimizing the occurrence of stable current supply of the hanger unit 10 and deviation of current supply for each hanger unit 10. Since the plating film can be formed on the printed circuit board B with a uniform thickness, there is an effect of improving the quality and reliability of the product.

4 is a front view showing a plating apparatus according to another embodiment of the present invention.

As shown in FIG. 4, the plating apparatus according to another embodiment of the present invention includes a hanger part 100 for fixing the plated object B and a guide rail 120 for guiding the movement of the hanger part 100. And, formed to face the guide rail 120, the feed coil 132 is wound, the electromagnetic induction by the bus bar 130 and the induced current generated in the bus bar 130 to generate an induced current It includes an induction collector 140 for supplying a current to the hanger 100.

Here, the rest of the configuration except for the busbar 130 and the induction collector 140 is the same as the configuration of the above-described embodiment will be omitted.

The bus bar 130 may be formed to be spaced apart from each other by a predetermined interval to face the guide rail 120, and the feed coil 132 may be wound along an outer circumferential surface thereof.

Here, the bus bar 130 may be formed of a conductive material, and a current may be supplied to the feed coil 132 that is wound. At this time, the current supplied to the feed coil 132 is preferably supplied with an alternating current of high frequency.

On the other hand, the bus bar 130 may be formed with a plurality of feed protrusions 131 protruding spaced apart at regular intervals in the lower portion.

The induction collector 140 is formed on the hanger 100 and is formed between the hanger 100 and the busbars 130 so as to receive current from the busbars 130 in a magnetic induction manner. Can be.

Here, the induction collector 140 is a plurality of current collector poles 141 protruding to correspond to the power supply pole 131 of the busbar 130 and the current collector coil 142 wound around the current collector protrusion 141. It may include.

That is, the induction current generated in the bus bar 130 is supplied to the current collector coil 142 by magnetic induction when the feeder electrode 131 and the current collector electrode 141 are close to each other. Through the electrode 141, there is an advantage that the current supply by magnetic induction can be more smoothly.

In addition, since the plurality of current collector coils 142 are formed, at least one of the current collector coils 131 spaced at regular intervals may be close to each other, and thus, a constant current may be supplied without interruption.

In addition, the current supplied to the current collector coil 142 may be transmitted to the hanger 100 and used as a power input means of the auxiliary device 150 requiring power installed in the hanger 100.

That is, when the current is supplied only to the busbar 130, the current supplied to the current collector coil 142 by magnetic induction is additionally installed in the plating apparatus, such as a current measuring device for measuring the amount of current. It can be used as a power input means of the device 150.

Therefore, the plating apparatus according to another embodiment of the present invention is further provided with a bus bar 130 for supplying a guide rail 120 current for guiding the movement of the hanger 100, in a non-contact magnetic induction method By supplying the current from the busbar 130 to the hanger 100, a constant current is continuously supplied to the auxiliary device 150 additionally installed in the plating apparatus, such as a current measuring device for measuring the amount of current. Can be used as a power input means.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. I will understand.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the scope of the appended claims, as well as the appended claims.

1: electrolyte
2: plating bath
3: bipolar plate
10, 100: hanger
11: hanger body
12: Clamp
13 transfer member
14 roll member
15, 150: Auxiliary device
20, 120: guide rail
30, 130: Busbar
40, 140: current collector
41: current collector
42: Cable
43: elastic member

Claims (16)

A hanger part to fix the plated object;
A guide rail for guiding the movement of the hanger;
A bus bar which is formed to face the guide rail and is supplied with electric current; And
A current collector which contacts the bus bar and transfers current to the hanger;
.
The method of claim 1,
The current collector
A current collector plate in contact with the busbar to receive a current; And
A cable connected to the current collector plate to transfer current to the hanger;
Plating device comprising a.
3. The method of claim 2,
The current collector plate
Plating device formed of conductive material.
3. The method of claim 2,
The current collector
Plating apparatus further comprises an elastic member formed between the current collector plate and the hanger.
5. The method of claim 4,
The elastic member
Plating apparatus wherein the current collector plate is formed to press the bus bar at a constant pressure.
3. The method of claim 2,
The cable is
Plating device formed of braided cable.
The method of claim 1,
The hanger part
A plating apparatus, wherein a plurality of clamps are formed at the leading end to mount one end of the workpiece.
The method of claim 1,
The hanger part
Plating apparatus for mounting the workpiece in the vertical direction.
The method of claim 1,
The hanger part
Plating device formed of a conductive material.
The method of claim 1,
The bus bar is a plating apparatus formed on the guide rail spaced apart from the guide rail by a predetermined interval.
The method of claim 1,
The busbar is
Plating apparatus used as a power input means of the auxiliary device provided in the hanger.
The method of claim 1,
A plating apparatus in which conductive grease is formed between the current collector and the busbar.
A hanger part to fix the plated object;
A guide rail for guiding the movement of the hanger;
A bus bar formed to face the guide rail and having a feeding coil supplied with a current; And
An induction collector receiving current from the busbars in a magnetic induction manner;
.
14. The method of claim 13,
The busbar is
Plating apparatus further comprising a plurality of protruding feed electrode.
14. The method of claim 13,
The induction collector is
A current collector electrode protruding in the busbar direction; And
A current collecting coil wound around the current collecting protrusion;
Plating device comprising a.
14. The method of claim 13,
Plating apparatus, the current supplied from the bus bar by the magnetic induction method is used as a power input means of the auxiliary device installed in the hanger.

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