CN205529122U - Electroplating system - Google Patents

Electroplating system Download PDF

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Publication number
CN205529122U
CN205529122U CN201620197956.XU CN201620197956U CN205529122U CN 205529122 U CN205529122 U CN 205529122U CN 201620197956 U CN201620197956 U CN 201620197956U CN 205529122 U CN205529122 U CN 205529122U
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CN
China
Prior art keywords
anode
electroplating
anode member
support body
electroplating system
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Expired - Fee Related
Application number
CN201620197956.XU
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Chinese (zh)
Inventor
郑文锋
萧舜昌
罗焕星
许吉昌
孙尚培
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Boardtek Electronics Corp
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Boardtek Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201620197956.XU priority Critical patent/CN205529122U/en
Application granted granted Critical
Publication of CN205529122U publication Critical patent/CN205529122U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses an electroplating system disposes a cathode terminal in a plating bath to an and at least anode tap, its at least anode tap is equipped with a plurality of positive pole spares that are mutual state of insulation configuration, other have a plurality of electrically conductive pieces respectively with each positive pole spare electrical connection for in order to see through the mode to the circular telegram of arbitrary or arbitrary several positive pole spare, produce different power line distributions in the plating bath, especially, must not change original anode tap equipment, can increase with more positive, reliable means and electroplate the quality to can produce good benefit.

Description

Electroplating system
Technical field
The relevant a kind of electroplating system of this utility model, particularly relates to one and can hang configuration kenel difference according to product design or product, coordinate the electroplating system adjusting electrical distribution state.
Background technology
It is known that, " electroplating " is a kind of method utilizing electroreduction reaction to plate a tunic on object, its machinery equipment used, the difference because of the difference of electroplated product, regardless of whether use the machinery equipment of which kind of form, all be designed with in electroplating region quantity not wait electrode bar as anode so that producing the dissociation of metal ion in electroplate liquid, workpiece to be plated is typically designed to negative electrode.
In time carrying out electroplating activity, the most respectively at anode and negative electrode input voltage, make electroplate liquid because of cell reaction precipitating metal ion, and those metal ions can depositing in cathode terminal, and after cathodic reduction, formed and plate in the coat of metal on workpiece to be plated surface;The electroplating system being currently known, then can divide into dissolubility anodization system and insoluble anodization system according to plated metal presentation mode.
In insoluble anode electroplating system, when electric current flow to bottom anode from anode top, its magnitude of current can successively decrease because of resistance, in other words, at anode top, due to bigger by electric current herein, the most more metal ion is decomposed release, and the electric current passed through by lower portion is few compared with by the electric current of position above, the most less metal ion is decomposed and discharges, and then produces electric force lines distribution the phenomenon of uneven (i.e. the Density Distribution of electric current is uneven) in electroplating bath.
It is thick at the local coating that electric current density is big that this phenomenon will result in product position, otherwise product position is thin at the place then coating that electric current density is little;Not only can have a strong impact on the quality (the most sub-product) of product because the uneven coating of product surface is even, in some cases, it is burned black that electric current density excessive (electric lines of force is overstocked) also easily causes product;Therefore, how to provide one can hang configuration kenel difference according to product design or product, coordinate the electroplating system adjusting electrical distribution state, the most always problem of the desired most ardently solution of industrial circle.
Utility model content
This utility model is solved the technical problem that i.e. is providing one can hang configuration kenel difference according to product design or product, coordinates the plating system adjusting electrical distribution state, for its main purpose person.
The technological means that this utility model is used is as described below.
In order to achieve the above object, electroplating system of the present utility model, in an electroplating bath, it is configured with a cathode terminal, and at least one anode tap;Wherein: this at least one anode tap is provided with a plurality of anode member configured in mutually insulated state, plural conductive part is separately had to be electrically connected with respectively this anode member respectively.
Utilize said structure feature, electroplating system of the present utility model, can pass through the mode to the energising of arbitrary or any several anode member, in electroplating bath, produce different electric force lines distribution state;Especially, when the product shape to be electroplated or hanging configuration kenel change, only need to be through the simple mode switching electric current supply loop, produce corresponding electric force lines distribution state, it is not necessary to change original anode tap equipment, i.e. means the most positive, reliable can increase electroplating quality, and good benefit can be produced.
According to said structure feature, this at least one anode tap described, it is provided with a support body, respectively this anode member is that the state of mutually insulated is located on this support body.
According to said structure feature, this at least one anode tap described, it is provided with a support body, respectively this anode member is that the state of mutually insulated is located on this support body;Respectively this electric-conductor is fixedly arranged on this support body.
According to said structure feature, this electroplating system described, farther include one for connecting the distributor cap of external power source, this distributor cap for and electric-conductor electrical connection set by respectively this anode member, this distributor cap is provided with plural number for controlling the circuit turn-on whether on-off circuit of respectively this anode member respectively.
According to said structure feature, this electroplating system described, farther include one for connecting the distributor cap of external power source, this distributor cap for and electric-conductor electrical connection set by respectively this anode member, this distributor cap is provided with plural number for controlling the circuit turn-on whether on-off circuit of respectively this anode member respectively;This at least one anode tap, is provided with a support body, and respectively this anode member is that the state of mutually insulated is located on this support body;Respectively this electric-conductor is fixedly arranged on this support body;This distributor cap is provided with plural number for the wire being electrically connected with respectively this electric-conductor respectively.
According to said structure feature, described respectively this anode member is provided with plural number mesh.
The described respectively external form profile that this anode member is rectangle.
The external form profile that described respectively this anode member is rounded.
The external form profile that described respectively this anode member is square.
The external form profile of described respectively this anode member ovalize.
The external form profile that described respectively this anode member is triangular in shape.
The external form profile that described respectively this anode member is trapezoidal.
The external form profile that described respectively this anode member is L-shaped.
This at least one anode tap described is provided with the anode member of at least two difference external form profile.
According to said structure feature, this electroplating system described, this anode strip connects a pendulous device.
According to said structure feature, this electroplating system described, this anode tap connects a pendulous device.
According to said structure feature, this electroplating system described, this cathode terminal connects a pendulous device.
According to said structure feature, this electroplating system described, this support body connects a pendulous device.
Produced by this utility model, technique effect is as follows.
Electroplating system disclosed by this utility model, main utilization has plural number and is available for the anode member design that whether control circuit turns on respectively so that in the way of through to the energising of arbitrary or any several anode member, the different electric force lines distribution state of generation in electroplating bath;Especially, when the product shape to be electroplated or hanging configuration kenel change, only need to be through the simple mode switching electric current supply loop, produce corresponding electric force lines distribution state, it is not necessary to change original anode tap equipment, i.e. means the most positive, reliable can increase electroplating quality, and good benefit can be produced.
Accompanying drawing explanation
Fig. 1 is electroplating system of the present utility model basic structure composed figure.
Fig. 2 is the anode tap stereoscopic figure of this utility model first embodiment.
Fig. 3 is the anode tap structural representation of this utility model the second embodiment.
Fig. 4 is the anode tap structural representation of this utility model the 3rd embodiment.
Fig. 5 is the anode tap structural representation of this utility model the 4th embodiment.
Fig. 6 is that the anode tap of this utility model the 5th embodiment uses view.
Fig. 7 is that the anode tap of this utility model sixth embodiment uses view.
Figure number illustrates:
10 electroplating baths
20 cathode terminals
30 anode taps
31 support bodys
32 anode member
321 mesh
33 electric-conductors
40 distributor caps
41 wires
50 anode strips
70 pendulous devices.
Detailed description of the invention
It is different that this utility model mainly provides one can hang configuration kenel according to product design or product, coordinate the electroplating system adjusting electrical distribution state, as it is shown in figure 1, electroplating system of the present utility model, in an electroplating bath 10, substantially it is configured with a cathode terminal 20, and at least one anode tap 30;Wherein: this at least one anode tap 30 is provided with a plurality of anode member 32 configured in mutually insulated state, separately has plural conductive part 33 to be electrically connected with respectively this anode member 32 respectively;In time implementing, this at least one anode tap 30 described, a support body 31 can be further provided with, respectively this anode member 32 state in mutually insulated is located on this support body 31.
In principle, electroplating system of the present utility model, when actual operation, paired anode tap 30 can be respectively placed in the internal both sides relative to cathode terminal 20 of electroplating bath 10, and the product carrying out electroplating it is intended in cathode terminal 20 hanging, make, respectively when anode tap 30 is with cathode terminal 20 input current, to make the electroplate liquid in electroplating bath 10 separate out depositing because of cell reaction in the metal ion of cathode terminal, after metal ion is in cathodic reduction, is formed and plate the coat of metal in product surface.
Due to, electroplating system of the present utility model, plural number is set and is available for the anode member 32 that whether control circuit turns on respectively, therefore can pass through the mode to the energising of arbitrary or any several anode member 32, in electroplating bath, produce different electric force lines distribution state;Especially, when the product shape to be electroplated or hanging configuration kenel change, only need to be through the simple mode switching electric current supply loop, produce corresponding electric force lines distribution state, it is not necessary to change original anode tap equipment, i.e. means the most positive, reliable can increase electroplating quality, and good benefit can be produced.
As shown in Figure 2, at this at least one anode tap 30 described, it is provided with a support body 31, and respectively this anode member 32 state in mutually insulated is located under the structure kenel on this support body 31, respectively this electric-conductor 33 also can be fixedly arranged on this support body 31, and one end and this support body 31 length set in advance of relative extension of each this electric-conductor 33 are preferred, the most advantageous installation in overall anode tap 30 sets up, and more more convenient electric-conductor 33 is electrically connected with external power source.
As shown in Figure 3, electroplating system of the present utility model, one can be farther included for connecting the distributor cap 40 of external power source, this distributor cap 40 is for being electrically connected with the electric-conductor 33 set by respectively this anode member 32, and this distributor cap 40 is provided with plural number for controlling the circuit turn-on whether on-off circuit of respectively this anode member 32 respectively.
Electroplating system of the present utility model, again to farther include one for connecting the distributor cap 40 of external power source, this distributor cap 40 is for being electrically connected with the electric-conductor 33 set by respectively this anode member 32, and this distributor cap 40 is provided with plural number for controlling the circuit turn-on whether on-off circuit of respectively this anode member 32 respectively;This at least one anode tap 30, it is provided with a support body 31, respectively this anode member 32 state in mutually insulated is located on this support body 31, and respectively this electric-conductor 33 is fixedly arranged on this support body 31, and this distributor cap 40 is provided with plural number and supplies the structure kenel of the wire 41 being electrically connected with respectively this electric-conductor 33 to be respectively rendered as good.
Plating system of the present utility model, take off under the various structure kenel that may implement upper, described respectively this anode member 32 is provided with plural number mesh 321, that is this anode member 32 described can in net, the structure kenel of basket presents so that it is the metal ion in electroplating bath is obtained preferably mobility.
And, in the upper embodiment taken off shown in Fig. 2, the described external form profile that respectively this anode member 32 is rectangle;In time implementing, described respectively this anode member 32 also can be in external form profile circular as shown in Figure 3, or in the most foursquare external form profile, it might even be possible to respectively in Fig. 5 when as shown in oval external form profile, the external form profile of triangle, trapezoidal external form profile and the external form profile of L-shaped;If desired, this at least one anode tap 30 described, also can be provided with the anode member 32 of at least two difference external form profile.Furthermore, also can as shown in Figure 6, in time implementing, described respectively this anode tap 30 can be further disposed upon between anode strip 50 and cathode terminal 20, it is ensured that electroplating quality;Or can be as it is shown in fig. 7, in time implementing, this anode tap 30 may be disposed at the anode strip 50 opposite side relative to cathode terminal 20;Further, cathode terminal 20, anode tap 30 and anode strip 50 can connect a pendulous device 70 according to its demand, reach coating effect evenly.
Specifically, electroplating system disclosed by this utility model, main utilization has plural number and is available for the anode member design that whether control circuit turns on respectively so that in the way of through to the energising of arbitrary or any several anode member, the different electric force lines distribution state of generation in electroplating bath;Especially, when the product shape to be electroplated or hanging configuration kenel change, only need to be through the simple mode switching electric current supply loop, produce corresponding electric force lines distribution state, it is not necessary to change original anode tap equipment, i.e. means the most positive, reliable can increase electroplating quality, and good benefit can be produced.

Claims (24)

1. an electroplating system, is configured with a cathode terminal (20), and at least one anode tap (30) in an electroplating bath (10);It is characterized in that: this at least one anode tap (30) is provided with a plurality of anode member (32) configured in mutually insulated state separately having plural conductive part (33) to be electrically connected with respectively this anode member (32) respectively.
2. electroplating system as claimed in claim 1, it is characterised in that this at least one anode tap (30), is provided with a support body (31), and respectively this anode member (32) state in mutually insulated is located on this support body (31).
3. electroplating system as claimed in claim 1, it is characterised in that this at least one anode tap (30), is provided with a support body (31), and respectively this anode member (32) state in mutually insulated is located on this support body (31);Respectively this electric-conductor (33) is fixedly arranged on this support body (31).
4. electroplating system as claimed in claim 1, it is characterized in that, this electroplating system, including one for connecting the distributor cap (40) of external power source, this distributor cap (40) for and electric-conductor (33) electrical connection set by respectively this anode member (32), this distributor cap (40) is provided with plural number for controlling the circuit turn-on whether on-off circuit of respectively this anode member (32) respectively.
5. electroplating system as claimed in claim 1, it is characterized in that, this electroplating system, including one for connecting the distributor cap (40) of external power source, this distributor cap (40) for and electric-conductor (33) electrical connection set by respectively this anode member (32), this distributor cap (40) is provided with plural number for controlling the circuit turn-on whether on-off circuit of respectively this anode member (32) respectively;This at least one anode tap (30), is provided with a support body (31), and respectively this anode member (32) state in mutually insulated is located on this support body (31);Respectively this electric-conductor (33) is fixedly arranged on this support body (31);This distributor cap (40) be provided with plural number for respectively with the wire (41) that respectively this electric-conductor (33) is electrically connected.
6. electroplating system as claimed in claim 1, it is characterised in that respectively this anode member (32) is provided with plural number mesh (321).
7. the electroplating system as described in claim 1 to 6 any of which, it is characterised in that the external form profile that respectively this anode member (32) is rectangle.
8. the electroplating system as described in claim 1 to 6 any of which, it is characterised in that the external form profile that respectively this anode member (32) is rounded.
9. the electroplating system as described in claim 1 to 6 any of which, it is characterised in that the external form profile that respectively this anode member (32) is square.
10. the electroplating system as described in claim 1 to 6 any of which, it is characterised in that the respectively external form profile of this anode member (32) ovalize.
11. electroplating systems as described in claim 1 to 6 any of which, it is characterised in that the external form profile that respectively this anode member (32) is triangular in shape.
12. electroplating systems as described in claim 1 to 6 any of which, it is characterised in that the external form profile that respectively this anode member (32) is trapezoidal.
13. electroplating systems as described in claim 1 to 6 any of which, it is characterised in that the external form profile that respectively this anode member (32) is L-shaped.
14. electroplating systems as described in claim 1 to 6 any of which, it is characterised in that this at least one anode tap (30) is provided with the anode member (32) of at least two difference external form profile.
15. electroplating systems as claimed in claim 1, it is characterised in that this electroplating system is provided with at least one anode strip (50).
16. electroplating systems as claimed in claim 9, it is characterised in that this anode tap (30) is arranged between anode strip (50) and cathode terminal (20).
17. electroplating systems as claimed in claim 9, it is characterised in that this anode tap (30) is arranged at the anode strip (50) opposite side relative to cathode terminal (20).
18. electroplating systems as claimed in claim 9, it is characterised in that this anode strip (50) connects a pendulous device (70).
19. electroplating systems as claimed in claim 10, it is characterised in that this anode strip (50) connects a pendulous device (70).
20. electroplating systems as claimed in claim 11, it is characterised in that this anode strip (50) connects a pendulous device (70).
21. electroplating systems as described in claim 1 to 6 any of which, it is characterised in that this anode tap (30) connects a pendulous device (70).
22. electroplating systems as described in claim 1 to 6 any of which, it is characterised in that this anode tap (30) and cathode terminal (20) connect a pendulous device (70).
23. electroplating systems as described in claim 1 to 6 any of which, it is characterised in that this cathode terminal (20) connects a pendulous device (70).
24. electroplating systems as described in claim 2,5 any of which, it is characterised in that this support body (31) connects a pendulous device (70).
CN201620197956.XU 2016-03-15 2016-03-15 Electroplating system Expired - Fee Related CN205529122U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620197956.XU CN205529122U (en) 2016-03-15 2016-03-15 Electroplating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620197956.XU CN205529122U (en) 2016-03-15 2016-03-15 Electroplating system

Publications (1)

Publication Number Publication Date
CN205529122U true CN205529122U (en) 2016-08-31

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107190306A (en) * 2016-03-15 2017-09-22 先丰通讯股份有限公司 Electroplating system
CN109518244A (en) * 2018-12-27 2019-03-26 中国电子科技集团公司第二研究所 The wafer copper-plating technique of coating edge effect can be weakened
WO2020099947A1 (en) * 2018-08-22 2020-05-22 盛青永致半导体设备(苏州)有限公司 Electroplating device and electroplating method
WO2021227853A1 (en) * 2020-05-09 2021-11-18 京东方科技集团股份有限公司 Electrode structure, and electrochemical deposition device and electrochemical deposition method therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107190306A (en) * 2016-03-15 2017-09-22 先丰通讯股份有限公司 Electroplating system
WO2020099947A1 (en) * 2018-08-22 2020-05-22 盛青永致半导体设备(苏州)有限公司 Electroplating device and electroplating method
CN109518244A (en) * 2018-12-27 2019-03-26 中国电子科技集团公司第二研究所 The wafer copper-plating technique of coating edge effect can be weakened
WO2021227853A1 (en) * 2020-05-09 2021-11-18 京东方科技集团股份有限公司 Electrode structure, and electrochemical deposition device and electrochemical deposition method therefor

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20160831