CN105543940A - Device and method for promoting electroplating uniformity of VCP electroplating wire - Google Patents
Device and method for promoting electroplating uniformity of VCP electroplating wire Download PDFInfo
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- CN105543940A CN105543940A CN201510965086.6A CN201510965086A CN105543940A CN 105543940 A CN105543940 A CN 105543940A CN 201510965086 A CN201510965086 A CN 201510965086A CN 105543940 A CN105543940 A CN 105543940A
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- electroplating
- kickboard
- vcp
- lifting
- plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
Abstract
The invention discloses a device for promoting electroplating uniformity of a VCP electroplating wire. The device comprises an electroplating tank; electroplating medicine water is filled in the electroplating tank; flight plates are arranged above the electroplating tank, and are fixed with fixtures for clamping a circuit board; each flight plate consists of at least three fixtures; adjacent fixtures on every flight plate are electrically connected by leads; and adjacent flight plates are electrically connected by leads. The flight plates and the fixtures adopt main materials of stainless steel, and can conduct electricity. The adjacent fixtures and flight plates are electrically connected by the leads, so that the resistance is reduced, and the electroplating efficiency is improved; and meanwhile, the power supply current is averagely distributed to each fixture, so that the thickness range of an electroplating copper layer is effectively reduced, and the electroplating uniformity of the circuit board is largely enhanced. The invention further discloses a method for promoting electroplating uniformity of the VCP electroplating wire; and based on mutual electric connection of the fixtures, the electroplating voltage and current are adjusted, so that the electroplating uniformity of the circuit board is further promoted.
Description
Technical field
The invention belongs to printed circuit board technology field, relate in particular to a kind of device and the electro-plating method that promote VCP plating line electroplating evenness.
Background technology
Electronic production line (the VerticalConveyorPlating of vertical continuous, be called for short VCP) be printed circuit board (PrintedCircuitBoard, be called for short PCB) produce in adopt full plate (once) copper plating production line spraying copper-plating technique and vertical continuous e Foerderanlage, compared with traditional vertical plating production line, its floor space is little, have stable plating usefulness; In electroplating process, circuit card is held on fixture, and the side migration opposite side of all workpiece all continuously from plating tank under running gear drives, the working condition of every sheet workpiece is identical, circuit card adopts the mode of continuous moving to move in electroplating cell body, do not leave liquid, be not exposed in air, can automatic upper and lower plate level of automation high, and low in energy consumption, operate steadily.
The key of printed circuit board plating is that the inner coating of guarantee circuit card two sides and via is even, the homogeneity of coating is always evaluate the important indicator of plating usefulness, in the continuous electronic production line of conventional vertical, circuit board clamp is connected on stainless steel crossbearer, conduction is connected by stainless steel crossbearer between fixture, but mutual not Electricity Federation between fixture, and there is following problem in this device: (1) stainless steel crossbearer poorly conductive, current utilization rate is low, affects electroplating efficiency; (2) be separated setting between fixture, not interconnected, make that circuit card presss from both sides disunity of counting, distribution of current is uneven, finally cause copper electroplating layer thickness difference comparatively large, electroplating evenness cannot ensure, electroplate failed probability large, and electroplating solution cost is high.
Summary of the invention
For this reason, technical problem to be solved by this invention is in existing VCP plating line, conduction is connected by stainless steel crossbearer between circuit board clamp, mutual not Electricity Federation between fixture, and stainless steel crossbearer poorly conductive, current utilization rate are low, do not interconnect between fixture and make distribution of current on circuit card uneven, finally make plating thickness uneven, electroplating efficiency is low, thus proposes a kind of device and method promoting VCP plating line electroplating evenness.
For solving the problems of the technologies described above, technical scheme of the present invention is:
The invention provides a kind of device promoting VCP plating line electroplating evenness, comprise plating tank, described plating tank inner filling has electroplating liquid medicine, be provided with above described plating tank and fly bar, described flying clings to the fixture be fixed with for clamping circuit board, each bar that flies is made up of at least 3 fixtures, eachly flies to cling to adjoining clips wire and is electrically connected, and the adjacent bar wire that flies is electrically connected.
As preferably, described wire is encapsulate copper conductor, and between the adjoining clips after described wire connects, resistance is 5-8 milliohm.
As preferably, be provided with in described plating tank and along the kickboard of described plating tank short transverse lifting, two pieces of anode baffle above described kickboard, can be provided with.
As preferably, described kickboard is connected to kickboard elevating lever, and described kickboard elevating lever is for regulating the height of described kickboard; Leaving between described anode baffle can the space of containment circuit board.
As preferably, described kickboard elevating lever top is provided with regulation scale.
As preferably, also comprise guide rail, chain, described in fly bar and be fixed on described guide rail, chain, fly bar described in described guide rail and chain-driving and do cyclic motion above described plating tank.
As preferably, the guide rail mid-way flying described in fixing to cling to is connected with the negative pole of supply unit.
As preferably, described in fly to cling to and the main material of described fixture is stainless steel.
The present invention also provides a kind of method promoting VCP plating line electroplating evenness, comprises the steps,
S1, electroplated circuit card is held on described fixture, flies bar described in described plating chain-driving and circuit card is moved in plating tank, kickboard elevating lever according to the size adjusting of circuit card, and then the height regulating kickboard and anode baffle;
S2, connect power supply electroplating voltage, electric current are set, start plating.
As preferably, in described step S2, electroplating voltage is that the voltage at each fixture place is not more than 1.54V, and current density is 3.0-3.5ASD.
Technique scheme of the present invention has the following advantages compared to existing technology:
(1) device of lifting VCP plating line electroplating evenness of the present invention, comprise plating tank, inner filling has electroplating liquid medicine, arrange above plating tank to fly to cling to and carry out transmission under guide rail, chain effect, described flying clings to the fixture be fixed with for clamping circuit board, each fly bar device be made up of at least 3 fixtures, each fly bar device in adjoining clips electrical connection, adjoining clips device be electrically connected.Adjacent fixture, clamping device wire are electrically connected, reduce resistance, improve electroplating efficiency, meanwhile, supply current is evenly distributed to each fixture, effectively reduces the extreme difference of copper electroplating layer thickness, significantly improves the electroplating evenness of circuit card.
(2) device of lifting VCP plating line electroplating evenness of the present invention, also comprising can along the kickboard of short transverse lifting, kickboard is provided with two pieces of anode baffle, electroplated circuit card is placed in the space between two pieces of anode baffle, can by regulating the circuit card of the height process different size of kickboard and anode baffle, without the need to changing electroplating device, reducing production cost, improve production efficiency.
(3) method of lifting VCP plating line electroplating evenness of the present invention, between fixture mutual Electricity Federation basis on, adjust electroplating voltage, electric current, improve the electroplating evenness of circuit card further.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation flying to cling to described in the embodiment of the present invention;
Fig. 2 is the structural representation of the fixture described in the embodiment of the present invention;
Fig. 3 is the apparatus structure schematic diagram of the lifting electroplating evenness described in the embodiment of the present invention.
In figure, Reference numeral is expressed as: 1-plating tank; 2-flies bar; 3-fixture; 4-wire; 5-kickboard; 6-anode baffle; 7-kickboard elevating lever; 8-regulation scale; 9-jet pipe.
Embodiment
Embodiment
The present embodiment provides a kind of device promoting VCP plating line electroplating evenness, as Figure 1-3, comprise plating tank 1, described plating tank 1 is square groove, groove inner filling has electroplating liquid medicine, be provided with above plating tank 1 and fly bar 2, the described bar 2 that flies is fixed on guide rail and chain, fly bar 2 described in described guide rail and chain-driving and do cyclic motion above described plating tank 1, the guide rail mid-way fixedly flying bar 2 is connected with the negative pole of installation's power source, described flying bar 2 is fixedly installed the fixture 3 for clamping circuit board, each bar device that flies is made up of at least three fixtures 3, describedly fly bar 2 and fixture 3 main material is stainless steel, can conduct electricity, in the present embodiment, each bar 2 that flies is made up of three fixtures 3, eachly fly adjoining clips 3 in bar 2 and be electrically connected by wire 4, adjacent flying also is electrically connected by wire 4 between bar 2 simultaneously, described wire 4 is encapsulate copper conductor, resistance after connecting between adjoining clips 3 is 5-8 milliohm, in the present embodiment, described resistance is 6 milliohms,
Also being provided with in plating tank 1 can along the kickboard 5 of described plating tank 1 short transverse lifting, kickboard 5 is two pieces, be connected on kickboard elevating lever 7, described kickboard elevating lever 7 can control kickboard 5 along the position adjustments in short transverse, the regulation scale 8 being arranged at described kickboard elevating lever 7 top can measure the lifting distance of kickboard 5, kickboard 5 is accurately located, kickboard 5 described in every block is put and is provided with anode baffle 6, leaving between anode baffle 6 can the space of containment circuit board.By regulating the circuit card of the height process different size of kickboard 5 and anode baffle 6, without the need to changing electroplating device, production cost can be reduced, improve production efficiency.
The present embodiment also provides a kind of method promoting VCP plating line electroplating evenness, and it comprises the steps,
S1, electroplated circuit card is held on described fixture 3, fixture 3 is fixed on and flies bar 2, fly bar 2 described in guide rail and chain-driving and circuit card is moved to plating tank 1 position, and regulate kickboard elevating lever 7, and then regulate the height of kickboard 5 and anode baffle 6 to suitable position, make circuit card be placed in space between described anode baffle 6;
S2, connection power supply, the positive pole of power supply is connected with the anode in plating tank, the negative pole of power supply is by flying bar and fixture and circuit board communication, make circuit card become negative pole, arrange electroplating voltage, electric current, the jet pipe 9 in plating tank 1 sprays electroplate liquid to circuit card, start plating, the voltage that magnitude of voltage is set to each fixture place is not more than 1.54V, and current density is 3.0-3.5ASD, is 3.2ASD in the present embodiment.
Each fixture 3 flown on bar 2, adjacent bar 2 wire 4 that flies are electrically connected by the present embodiment, reduce between fixture 3 and the resistance flown between bar 2, improve electroplating efficiency, supply current is evenly distributed to each fixture 3, adjust the voltage and current parameter in electroplating work procedure simultaneously, effectively reduce the extreme difference of copper electroplating layer thickness, significantly improve the electroplating evenness of circuit card.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.And thus the apparent change of extending out or variation be still among the protection domain of the invention.
Claims (10)
1. promote a device for VCP plating line electroplating evenness, comprise plating tank, described plating tank inner filling has electroplating liquid medicine, it is characterized in that, is provided with and flies bar above described plating tank; Described fly to cling to be fixed with fixture for clamping circuit board, each bar that flies is made up of at least 3 fixtures, eachly flies to cling to adjoining clips wire and is electrically connected, and the adjacent bar wire that flies is electrically connected.
2. the device of lifting VCP plating line electroplating evenness according to claim 1, it is characterized in that, described wire is encapsulate copper conductor, and between the adjoining clips after described wire connects, resistance is 5-8 milliohm.
3. the device of lifting VCP plating line electroplating evenness according to claim 1 and 2, is characterized in that, is provided with and along the kickboard of described plating tank short transverse lifting, can be provided with two pieces of anode baffle above described kickboard in described plating tank.
4. the device of lifting VCP plating line electroplating evenness according to claim 3, it is characterized in that, described kickboard is connected to kickboard elevating lever, and described kickboard elevating lever is for regulating the height of described kickboard; Leaving between described anode baffle can the space of containment circuit board.
5. the device of lifting VCP plating line electroplating evenness according to claim 4, it is characterized in that, described kickboard elevating lever top is provided with regulation scale.
6. the device of lifting VCP plating line electroplating evenness according to claim 5, it is characterized in that, also comprise guide rail, chain, described in fly bar and be fixed on described guide rail, chain, fly bar described in described guide rail and chain-driving and do cyclic motion above described plating tank.
7. the device of lifting VCP plating line electroplating evenness according to claim 6, it is characterized in that, the guide rail mid-way flying described in fixing to cling to is connected with the negative pole of supply unit.
8. the device of lifting VCP plating line electroplating evenness according to claim 7, is characterized in that, described in fly to cling to and the main material of described fixture is stainless steel.
9. promote a method for VCP plating line electroplating evenness, it is characterized in that, comprise the steps,
S1, electroplated circuit card is held on described fixture, flies bar described in described plating chain-driving and circuit card is moved in plating tank, kickboard elevating lever according to the size adjusting of circuit card, and then the height regulating kickboard and anode baffle;
S2, connect power supply electroplating voltage, electric current are set, start plating.
10. the method for lifting VCP plating line electroplating evenness according to claim 9, it is characterized in that, in described step S2, electroplating voltage is that the voltage at each fixture place is not more than 1.54V, and current density is 3.0-3.5ASD.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510965086.6A CN105543940B (en) | 2015-12-21 | 2015-12-21 | A kind of device and method of lifting VCP plating line electroplating evenness |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510965086.6A CN105543940B (en) | 2015-12-21 | 2015-12-21 | A kind of device and method of lifting VCP plating line electroplating evenness |
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| Publication Number | Publication Date |
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| CN105543940A true CN105543940A (en) | 2016-05-04 |
| CN105543940B CN105543940B (en) | 2018-04-27 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109972188A (en) * | 2017-12-28 | 2019-07-05 | 亚硕企业股份有限公司 | The movable protective mechanism of electroplating device |
| CN110724987A (en) * | 2019-11-07 | 2020-01-24 | 珠海市凯诺微电子有限公司 | VCP copper plating method |
| CN110760917A (en) * | 2019-11-29 | 2020-02-07 | 无锡星亿智能环保装备股份有限公司 | Elastic conductive device for electroplating line |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5989799A (en) * | 1982-11-15 | 1984-05-24 | Hitachi Ltd | Plating jig |
| CN2579913Y (en) * | 2002-11-25 | 2003-10-15 | 瑞盈机电有限公司 | Floating type anode cover plate |
| CN201525899U (en) * | 2009-11-13 | 2010-07-14 | 北大方正集团有限公司 | Clamping plate tool for electroplating a circuit board |
| CN201809473U (en) * | 2010-07-27 | 2011-04-27 | 广州明毅电子机械有限公司 | Movable substrate clamping mechanism for electroplating of substrates |
| CN202175732U (en) * | 2011-07-18 | 2012-03-28 | 上达电子(深圳)有限公司 | Gold plating hanging tool |
| CN202272979U (en) * | 2011-01-20 | 2012-06-13 | 俊杰机械(深圳)有限公司 | Electroplating hanger provided with injection molding hanger head and injection molding coated chuck |
| CN102605414A (en) * | 2012-03-31 | 2012-07-25 | 深圳崇达多层线路板有限公司 | Device and method for improving uniformity of plating layer of PCB (printed circuit board) vertical plating line |
| CN202898583U (en) * | 2012-11-01 | 2013-04-24 | 北大方正集团有限公司 | Electroplating board feeding rack and equipment |
| CN203096217U (en) * | 2013-01-25 | 2013-07-31 | 昆山博通机械设备有限公司 | Novel electroplated conductive plate |
| CN104302815A (en) * | 2014-08-11 | 2015-01-21 | 深圳崇达多层线路板有限公司 | Plating slot and plating device |
| CN104878424A (en) * | 2015-04-29 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Method for improving electroplating layer uniformity of PCB (printed circuit board) vertical electroplating line |
| CN204752883U (en) * | 2015-06-30 | 2015-11-11 | 深圳市翔宇电路有限公司 | Electroplate frid and plate homogeneity improvement device |
-
2015
- 2015-12-21 CN CN201510965086.6A patent/CN105543940B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5989799A (en) * | 1982-11-15 | 1984-05-24 | Hitachi Ltd | Plating jig |
| CN2579913Y (en) * | 2002-11-25 | 2003-10-15 | 瑞盈机电有限公司 | Floating type anode cover plate |
| CN201525899U (en) * | 2009-11-13 | 2010-07-14 | 北大方正集团有限公司 | Clamping plate tool for electroplating a circuit board |
| CN201809473U (en) * | 2010-07-27 | 2011-04-27 | 广州明毅电子机械有限公司 | Movable substrate clamping mechanism for electroplating of substrates |
| CN202272979U (en) * | 2011-01-20 | 2012-06-13 | 俊杰机械(深圳)有限公司 | Electroplating hanger provided with injection molding hanger head and injection molding coated chuck |
| CN202175732U (en) * | 2011-07-18 | 2012-03-28 | 上达电子(深圳)有限公司 | Gold plating hanging tool |
| CN102605414A (en) * | 2012-03-31 | 2012-07-25 | 深圳崇达多层线路板有限公司 | Device and method for improving uniformity of plating layer of PCB (printed circuit board) vertical plating line |
| CN202898583U (en) * | 2012-11-01 | 2013-04-24 | 北大方正集团有限公司 | Electroplating board feeding rack and equipment |
| CN203096217U (en) * | 2013-01-25 | 2013-07-31 | 昆山博通机械设备有限公司 | Novel electroplated conductive plate |
| CN104302815A (en) * | 2014-08-11 | 2015-01-21 | 深圳崇达多层线路板有限公司 | Plating slot and plating device |
| CN104878424A (en) * | 2015-04-29 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Method for improving electroplating layer uniformity of PCB (printed circuit board) vertical electroplating line |
| CN204752883U (en) * | 2015-06-30 | 2015-11-11 | 深圳市翔宇电路有限公司 | Electroplate frid and plate homogeneity improvement device |
Non-Patent Citations (1)
| Title |
|---|
| 曾华梁 等编: "《电镀工程手册》", 31 January 2010, 机械工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109972188A (en) * | 2017-12-28 | 2019-07-05 | 亚硕企业股份有限公司 | The movable protective mechanism of electroplating device |
| CN110724987A (en) * | 2019-11-07 | 2020-01-24 | 珠海市凯诺微电子有限公司 | VCP copper plating method |
| CN110760917A (en) * | 2019-11-29 | 2020-02-07 | 无锡星亿智能环保装备股份有限公司 | Elastic conductive device for electroplating line |
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| Publication number | Publication date |
|---|---|
| CN105543940B (en) | 2018-04-27 |
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