CN101760770B - Electroplating equipment for electrode of silicon solar cell slice - Google Patents
Electroplating equipment for electrode of silicon solar cell slice Download PDFInfo
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- CN101760770B CN101760770B CN 200910215298 CN200910215298A CN101760770B CN 101760770 B CN101760770 B CN 101760770B CN 200910215298 CN200910215298 CN 200910215298 CN 200910215298 A CN200910215298 A CN 200910215298A CN 101760770 B CN101760770 B CN 101760770B
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- guide groove
- electroplating
- hole
- spray cup
- silicon chip
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Abstract
The invention discloses electroplating equipment for an electrode of a silicon solar cell slice, solving the problems of small area ratio between polycrystalline silicon occupied area and impressed lead area and poor coating quality of a single solar cell slice in the prior art. The equipment comprises a plurality of groups of electroplate liquid troughs (38), electroplate liquid pumps and delivery lines (39) and electroplated rectifiers power supplies (43) which are arranged in a frame (37) and are mutually independent, a travelling crane guide rail (41) and a delivering trolley (42) are arranged on the inner top of a sealed cover body (40), a plurality of groups of the electroplating liquid troughs (38), spraying cups (36) and conductive needle fixation and regulation mechanisms (25) are arranged between a charging position and a discharging position, the lower cavity (23) of the spraying cup is fixedly provided with an electroplating anode fixing frame (26) and an electroplating anode net (27), and the outer cavity of the lower cavity (23) of the spraying cup is provided with an electroplating anode extraction column (35) and an electroplate liquid inlet, thus improving the quality of the single polycrystalline silicon slice.
Description
Technical field
The present invention relates to a kind of electroplating device, particularly a kind of electrode that is used for silicon solar cell carries out galvanized equipment.
Background technology
The production technique of solar battery sheet is earlier crystalline silicon to be cut into silicon chip, the silicon chip that cuts is printed out gate line electrode through adopting screen printing technique after the various art breading again with the silver slurry, because silver slurry printing technology requires can not be too little at the interval between the printing grid line on the silicon chip, require the width of silk screen printing grid line on the silicon chip can not be too narrow simultaneously, make that the lead of starching on the solar battery sheet that printing technology prints out with silver is big with the ratio of the area of silicon chip; Mixing in the silver slurry simultaneously has organism, and the electric conductivity of silicon chip is reduced, and these have caused the low shortcoming of solar energy converting rate of silicon chip.In addition, can't be solved, make the uneven coating of in conduction main line groove and conductive branch groove, electroplating out even, have influence on the quality of silicon solar cell owing to electroplate the coplanarity of silicon solar cell when jet electro-plating; Simultaneously because silver slurry, the cost height of manufacture of solar cells producer are used in silk screen printing in a large number.
Summary of the invention
The lead that spray cup for electrode plating of silicon solar cell provided by the invention has solved on the solar battery sheet that prior art exists is with the ratio of the area of silicon chip big, mix in the silver slurry simultaneously organism is arranged, the electric conductivity of silicon chip is reduced, caused the low shortcoming of solar energy converting rate of silicon chip, the inhomogeneous and high technical problem of production cost of electrolytic coating.
The present invention overcomes the above problems by following scheme:
Electroplating equipment for electrode of silicon solar cell slice, comprise frame, in frame, be provided with many groups electric bath grooves and electroplate liquid pump and transfer line and electroplating rectifier power supply independently separately, frame is provided with the cover body of sealing, be provided with the running rail of left and right horizontal direction at the cover body inner top of sealing, but the left and right horizontal direction that is provided with this running rail moves and the floor truck of vertical shifting up and down, the left end of frame working face be provided with silicon chip on material level, be provided with the following material level of silicon chip at the right-hand member of frame working face, between last material level and following material level, be provided with described many group electric bath grooves, in every group of electric bath groove, be provided with the spray cup, described spray cup is by the spray cup lower chamber of basin body shape, the spray cup upper cavity and the conductive pin fixed adjustment mechanisms that tip upside down on the basin body shape on the spray cup lower chamber are formed, be set with the galvanic anode anchor in the described spray cup lower chamber, on this galvanic anode anchor, be movably set with the galvanic anode net, the outer chamber of spray cup lower chamber is provided with galvanic anode and draws post and electroplating solution admission port, the electroplating solution admission port is communicated with plating liquid pump and transfer line, and galvanic anode is drawn post and is electrically connected with the electroplating rectifier power supply; Be to be movably arranged on the silicon chip that the quilt of position plates at the bottom of the basin at the bottom of the basin of the spray cup upper cavity of the basin body shape of described back-off, around the upper edge at the basin edge that sprays the cup upper cavity, be respectively arranged with the positive stop strip of zig-zag overflow groove and silicon chip, on the overflow eaves of spray cup upper cavity, be relatively set with the fixed leg of pair of conductive pin fixed adjustment mechanisms, the conductive pin fixed adjustment mechanisms is fixed on the fixed leg by permanent seat, the cavity wall that two groups of conductive supporting pins pass spray cup upper cavity respectively be arranged in the spray cup upper cavity and respectively with silicon chip on two conduction main line groove movable supporting contact, between spray cup lower chamber and spray glass upper cavity, be provided with sealed strip; Described conductive pin fixed adjustment mechanisms comprises: the guide groove spare of cuboid, the first square guide groove and the second square guide groove that on guide groove spare, are provided with respectively, a movable T shape regulating block that is provided with in the first square guide groove, movable the 2nd T shape regulating block that is provided with in the second square guide groove, the first conductive supporting pin and the second conductive supporting pin, two inboards are provided with a pair of supporting revolving shaft fixed orifices about in the described first square guide groove, base plate in first guide groove is provided with the fixing threaded hole of regulating bolt, the supporting revolving shaft that the sole piece of a described T shape regulating block is provided with the left and right horizontal direction passes through the hole, on the jacking block of a T shape regulating block, be respectively arranged with vertical direction up and down the adjusting bolt pass through the hole and up and down vertical direction first jackscrew pass through the hole, first group of conductive supporting cushion hand-hole of horizontal direction before and after being provided with between the front and back sides of the jacking block of a T shape regulating block, the supporting revolving shaft that supporting revolving shaft passes the left and right horizontal direction that is provided with on the sole piece of a T shape regulating block supports a T shape regulating block by the two inboard a pair of supporting revolving shaft fixed orificess that are provided with about in the hole and the first square guide groove and is arranged in the first square guide groove, regulate the screw bolt passes setting nut, passing through the hole and regulating the fixing threaded hole that is provided with on the base plate of stage clip in the first square guide groove on the jacking block of the one T shape regulating block is screwed onto, the first conductive supporting pin is movably arranged on first group and supports in the cushion hand-hole, the hole of passing through of first jackscrew is communicated with first group of conductive supporting cushion hand-hole, first jackscrew is movably arranged on this by in the hole, and guide groove spare is provided with electroplating cathode and draws post and be electrically connected with the electroplating rectifier power supply.
According to being respectively arranged with different electroplate liquids in every group of electric bath grooves of requirement in described many group electric bath grooves to the plating process of silicon chip electrode plating.
The present invention is simple and compact for structure, only need a kind of mould just can electroplate at the silicon chip of 125 * 125 and 156 * 156 two kinds of sizes, can adapt to different electroplating technology requirement to electrode of silicon solar cell slice, improve the solar energy converting rate of silicon chip and the quality of silicon solar cell greatly, reduced production cost.
Description of drawings:
Fig. 1 is the structural representation that the present invention overlooks direction
Fig. 2 is the structural representation of left apparent direction of the present invention
Fig. 3 is the structural representation of master's apparent direction of the present invention
Fig. 4 is that structure of the present invention is launched synoptic diagram
Fig. 5 is a structural representation of the present invention
Fig. 6 is a part sectioned view of the present invention
Fig. 7 is the deployed configuration synoptic diagram of conductive pin fixed adjustment mechanisms of the present invention
Fig. 8 is a conductive pin fixed adjustment mechanisms structural representation of the present invention
Embodiment
Electroplating equipment for electrode of silicon solar cell slice, comprise frame 37, in frame 37, be provided with many groups electric bath grooves 38 and electroplate liquid pump and transfer line 39 and electroplating rectifier power supply 43 independently separately, frame 37 is provided with the cover body 40 of sealing, be provided with the running rail 41 of left and right horizontal direction at cover body 40 inner tops of sealing, but the left and right horizontal direction that is provided with this running rail 41 moves and the floor truck 42 of vertical shifting up and down, the left end of frame working face be provided with silicon chip on material level 44, be provided with the following material level 45 of silicon chip at the right-hand member of frame working face, between last material level 44 and following material level 45, be provided with described many group electric bath grooves 38, in every group of electric bath groove 38, be provided with spray cup 36, described spray cup 36 spray cup lower chambers 23 by the basin body shape, the spray cup upper cavity 24 and the conductive pin fixed adjustment mechanisms 25 that tip upside down on the basin body shape on the spray cup lower chamber 23 are formed, be set with galvanic anode anchor 26 in the described spray cup lower chamber 23, on this galvanic anode anchor 26, be movably set with galvanic anode net 27, the outer chamber of spray cup lower chamber 23 is provided with galvanic anode and draws post 35 and electroplating solution admission port, the electroplating solution admission port is communicated with plating liquid pump and transfer line 39, and galvanic anode is drawn post 35 and is electrically connected with electroplating rectifier power supply 43; Be to be movably arranged on the silicon chip 20 that the quilt of position plates at the bottom of the basin at the bottom of the basin of the spray cup upper cavity 24 of the basin body shape of described back-off, around the upper edge at the basin edge that sprays cup upper cavity 24, be respectively arranged with the positive stop strip 30 of zig-zag overflow groove 29 and silicon chip, on the overflow eaves 28 of spray cup upper cavity 24, be relatively set with the fixed leg 31 of pair of conductive pin fixed adjustment mechanisms 25, conductive pin fixed adjustment mechanisms 25 is fixed on the fixed leg 31 by permanent seat 19, the cavity wall that two groups of conductive supporting pins pass spray cup upper cavity 24 respectively be arranged in the spray cup upper cavity 24 and respectively with silicon chip 20 on two conduction main line groove movable supporting contact, between spray cup lower chamber 23 and spray glass upper cavity 24, be provided with sealed strip 33; Described conductive pin fixed adjustment mechanisms 25 comprises: the guide groove spare of cuboid 1, the first square guide groove 2 and the second square guide groove 3 that on guide groove spare 1, are provided with respectively, a movable T shape regulating block 8 that is provided with in the first square guide groove 2, movable the 2nd T shape regulating block that is provided with in the second square guide groove 3, the first conductive supporting pin 17 and the second conductive supporting pin 18, two inboards are provided with a pair of supporting revolving shaft fixed orifices 5 about in the described first square guide groove 2, base plate in first guide groove 2 is provided with the fixing threaded hole 4 of regulating bolt 11, the sole piece of a described T shape regulating block 8 is provided with the supporting revolving shaft of left and right horizontal direction by hole 9, on the jacking block of a T shape regulating block 8, be respectively arranged with vertical direction up and down adjusting bolt 11 pass through hole 10 and up and down vertical direction first jackscrew 16 pass through the hole, first group of conductive supporting cushion hand-hole 14 of horizontal direction before and after being provided with between the front and back sides of the jacking block of a T shape regulating block 8, the supporting revolving shaft that supporting revolving shaft 6 passes the left and right horizontal direction that is provided with on the sole piece of a T shape regulating block 8 supports a T shape regulating block 8 by the two inboard a pair of supporting revolving shaft fixed orificess 5 that are provided with about in the hole 9 and the first square guide groove 2 and is arranged in the first square guide groove 2, regulate bolt 11 and pass setting nut 12 successively, passing through hole 10 and regulating the fixing threaded hole 4 that is provided with on the base plate of stage clip 7 in the first square guide groove 2 on the jacking block of the one T shape regulating block 8 is screwed onto, the first conductive supporting pin 17 is movably arranged on first group and supports in the cushion hand-hole 14, the hole of passing through of first jackscrew 16 is communicated with first group of conductive supporting cushion hand-hole 14, first jackscrew 16 is movably arranged on this by in the hole, and guide groove spare 1 is provided with electroplating cathode and draws post 34 and be electrically connected with electroplating rectifier power supply 43.
According to being respectively arranged with different electroplate liquids in every group of electric bath grooves of requirement in described many group electric bath grooves 38 to the plating process of silicon chip electrode plating.
Between the upper edge at the basin edge of described spray cup upper cavity 24 and silicon chip 20, be movably set with and connect fragment net 32, the broken silicon wafers that produces in the production can not be entered in the plating cavity, in order to avoid cause the running obstacle of equipment.
Electroplate liquid enters to electroplate upwards to spray the spray cup successively with galvanic anode net 27, four negative electrode conductive supporting pins from the electroplating solution admission port of spray cup lower chamber 23 and contacts the grid line that silicon chip laser is carved with silicon chip and finish plating, the zig-zag overflow groove 29 that the electroplate liquid that overflows from spray cup is provided with respectively around the upper edge at the basin edge of spray cup upper cavity 24 flows out, and is back to electroplate liquid through the overflow eaves 28 of spray cup upper cavity 24 and supplies with in the groove.
After frame 37 whole assemblings are finished, the cover body 40 of sealing is set on frame 37, the running rail 41 of left and right horizontal direction is set at cover body 40 inner tops of sealing, but the left and right horizontal direction that is provided with this running rail 41 moves and the floor truck 42 of vertical shifting up and down, the adsorption unit of silicon solar cell is set on floor truck 42, and this adsorption unit is material level 44 places absorption silicon solar cell on silicon chip.Successively that 4 electric bath grooves 38 are placed side by side according to technology station order, 8 spray cups 36 are positioned on the electric bath groove 38.The adsorption unit of silicon solar cell is fetched and delivered silicon chip on the support pin of the conductive supporting pin secured adjusted mechanism 25 on the spray cup 36 on each electric bath groove 38 successively according to the technology automatic control program, spray cup 36 is by circulation line and electric bath groove 38 UNICOMs, circulation line is got to the electroplating solution in the electric bath groove 38 in the spray cup device, electroplating solution contacts with silicon solar cell by conductive supporting pin secured adjusted mechanism, thereby finishes electroplating process.
Claims (2)
1. electroplating equipment for electrode of silicon solar cell slice, comprise frame (37), in frame (37), be provided with many groups independently electric bath groove (38) and plating liquid pump and transfer line (39) and electroplating rectifier power supplys (43) separately, frame (37) is provided with the cover body (40) of sealing, be provided with the running rail (41) of left and right horizontal direction at cover body (40) inner top of sealing, this running rail (41) but be provided with that the left and right horizontal direction moves and the floor truck of vertical shifting (42) up and down, the left end of frame working face be provided with silicon chip on material level (44), be provided with the following material level (45) of silicon chip at the right-hand member of frame working face, between last material level (44) and following material level (45), be provided with the described independently electric bath groove (38) of organizing separately more, independently be provided with spray cup (36) in the electric bath groove (38) separately at every group, it is characterized in that: described spray cup (36) is by the spray cup lower chamber (23) of basin body shape, the spray cup upper cavity (24) and the conductive pin fixed adjustment mechanisms (25) that tip upside down on the basin body shape on the spray cup lower chamber (23) are formed, be set with galvanic anode anchor (26) in the described spray cup lower chamber (23), on this galvanic anode anchor (26), be movably set with galvanic anode net (27), the outer chamber of spray cup lower chamber (23) is provided with galvanic anode and draws post (35) and electroplating solution admission port, the electroplating solution admission port is communicated with plating liquid pump and transfer line (39), and galvanic anode is drawn post (35) and is electrically connected with electroplating rectifier power supply (43); Be to be movably arranged on the silicon chip (20) that the quilt of position plates at the bottom of the basin at the bottom of the basin of the spray cup upper cavity (24) of the basin body shape of described back-off, around the upper edge at the basin edge that sprays cup upper cavity (24), be respectively arranged with the positive stop strip (30) of zig-zag overflow groove (29) and silicon chip, on the overflow eaves (28) of spray cup upper cavity (24), be relatively set with the fixed leg (31) of pair of conductive pin fixed adjustment mechanisms (25), conductive pin fixed adjustment mechanisms (25) is fixed on the fixed leg (31) by permanent seat (19), the cavity wall that two groups of conductive supporting pins pass spray cup upper cavity (24) respectively be arranged in the spray cup upper cavity (24) and respectively with silicon chip (20) on two conduction main line groove movable supporting contact, between spray cup lower chamber (23) and spray glass upper cavity (24), be provided with sealed strip (33); Described conductive pin fixed adjustment mechanisms (25) comprising: the guide groove spare of cuboid (1), the first square guide groove (2) and the second square guide groove (3) that on guide groove spare (1), are provided with respectively, a movable T shape regulating block (8) that is provided with in the first square guide groove (2), movable the 2nd T shape regulating block that is provided with in the second square guide groove (3), the first conductive supporting pin (17) and the second conductive supporting pin (18), two inboards are provided with a pair of supporting revolving shaft fixed orifices (5) about in the described first square guide groove (2), base plate in the first square guide groove (2) is provided with the fixing threaded hole (4) of regulating bolt (11), the sole piece of a described T shape regulating block (8) is provided with the supporting revolving shaft of left and right horizontal direction by hole (9), on the jacking block of a T shape regulating block (8), be respectively arranged with vertical direction up and down adjusting bolt (11) pass through hole (10) and up and down vertical direction first jackscrew (16) pass through the hole, first group of conductive supporting cushion hand-hole (14) of horizontal direction before and after being provided with between the front and back sides of the jacking block of a T shape regulating block (8), the supporting revolving shaft that supporting revolving shaft (6) passes the left and right horizontal direction that is provided with on the sole piece of a T shape regulating block (8) supports a T shape regulating block (8) by the two inboard a pair of supporting revolving shaft fixed orificess (5) that are provided with about in hole (9) and the first square guide groove (2) and is arranged in the first square guide groove (2), regulate bolt (11) and pass setting nut (12) successively, passing through hole (10) and regulate the fixing threaded hole (4) that stage clip (7) is provided with on the interior base plate of the first square guide groove (2) on the jacking block of the one T shape regulating block (8) is screwed onto, the first conductive supporting pin (17) is movably arranged on first group and supports in the cushion hand-hole (14), the hole of passing through of first jackscrew (16) is communicated with first group of conductive supporting cushion hand-hole (14), first jackscrew (16) is movably arranged on this by in the hole, and guide groove spare (1) is provided with electroplating cathode and draws post (34) and be electrically connected with electroplating rectifier power supply (43).
2. electroplating equipment for electrode of silicon solar cell slice according to claim 1 is characterized in that: according to the requirement of the plating process of silicon chip electrode plating independently is respectively arranged with different electroplating solutions in every group of electric bath groove in the electric bath groove (38) separately in described many groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910215298 CN101760770B (en) | 2009-12-30 | 2009-12-30 | Electroplating equipment for electrode of silicon solar cell slice |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910215298 CN101760770B (en) | 2009-12-30 | 2009-12-30 | Electroplating equipment for electrode of silicon solar cell slice |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101760770A CN101760770A (en) | 2010-06-30 |
| CN101760770B true CN101760770B (en) | 2011-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910215298 Expired - Fee Related CN101760770B (en) | 2009-12-30 | 2009-12-30 | Electroplating equipment for electrode of silicon solar cell slice |
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| CN (1) | CN101760770B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101567406B1 (en) * | 2014-06-30 | 2015-11-10 | 주식회사 호진플라텍 | Plating equipment for solar cell wafer using electroplating and light-induced plating jointly |
| CN108754585B (en) * | 2018-07-18 | 2023-09-19 | 苏州太阳井新能源有限公司 | Contact type upper electrode conductive device for horizontal electroplating equipment |
| CN114318471A (en) * | 2020-10-12 | 2022-04-12 | 福建钧石能源有限公司 | Horizontal coating device for preparing HIT crystalline silicon solar cell |
| CN112725867A (en) * | 2020-12-23 | 2021-04-30 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Working method of rotary shearing mechanism for stirring plating solution in horizontal film-coating spray cup of wafer |
| CN116103732B (en) * | 2023-03-22 | 2024-03-08 | 苏州太阳井新能源有限公司 | Vertical electroplating device, equipment and method |
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2009
- 2009-12-30 CN CN 200910215298 patent/CN101760770B/en not_active Expired - Fee Related
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| CN101760770A (en) | 2010-06-30 |
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Granted publication date: 20110615 Termination date: 20161230 |