CN221501290U

CN221501290U - Electroplating clamp and equipment

Info

Publication number: CN221501290U
Application number: CN202322898490.9U
Authority: CN
Inventors: 申义铭; 黄勇; 姚宇; 请求不公布姓名
Original assignee: Suzhou Taiyangjing New Energy Co ltd
Current assignee: Suzhou Taiyangjing New Energy Co ltd
Priority date: 2023-10-27
Filing date: 2023-10-27
Publication date: 2024-08-09
Anticipated expiration: 2033-10-27

Abstract

The application discloses an electroplating clamp and a device, wherein the electroplating clamp comprises: the anode assembly at least comprises an anode piece, and a plurality of anode assemblies are arranged along a preset direction; a cathode assembly configured to be electrically connected to a workpiece to be plated, the cathode assembly being provided in plurality along a preset direction, the anode assembly and the cathode assembly being alternately provided; the support assembly is configured to mount the anode assembly and the workpiece to be electroplated, the support assembly at least comprises a support frame and positioning blocks, the positioning blocks are sequentially arranged at intervals along the length direction of the support frame, every two adjacent positioning blocks form a positioning group, an anode interval for mounting the anode assembly is formed between two positioning blocks in the same positioning group, and a cathode interval for mounting the workpiece to be electroplated is formed between two adjacent positioning groups. According to the application, the anode component and the to-be-electroplated part are installed by utilizing the supporting component, and compared with the mode of respectively installing the anode component and the to-be-electroplated part on the two clamps, the application can improve the installation efficiency of the electroplating clamp and reduce the electroplating cost.

Description

Electroplating clamp and equipment

Technical Field

The application relates to the technical field of electroplating, in particular to an electroplating clamp and equipment.

Background

The electroplating process can be classified into horizontal electroplating and vertical electroplating according to the orientation of the workpiece to be electroplated during electroplating. In vertical electroplating, a piece to be electroplated is immersed in an electroplating solution in a vertical state, the piece to be electroplated is electrically connected with a negative electrode of a power supply to form a cathode, an anode piece is arranged in an electroplating tank and is electrically connected with a positive electrode of the power supply, and metal ions in the electroplating solution are released to the vicinity of the piece to be electroplated under the action of an electric field to form a plating layer on the piece to be electroplated.

In existing electroplating equipment, the part to be electroplated and the anode assembly are typically mounted on two electroplating clamps, respectively. However, with this structure, the two jigs need to be installed in sequence into the plating tank, and the member to be plated and the anode assembly are positioned during the installation process to ensure that the positions of the anode assembly and the member to be plated can be corresponded. As such, the installation time of the plating jig is excessively long, and the production cost of the plating apparatus increases.

Disclosure of Invention

The application aims to provide an electroplating clamp and equipment, wherein a support assembly is used for installing an anode assembly and a piece to be electroplated, and compared with a mode of installing the anode assembly and the piece to be electroplated on two clamps respectively, the electroplating clamp can improve the installation efficiency of the electroplating clamp and reduce the electroplating cost.

In order to achieve the above object, the present application provides an electroplating fixture, comprising an anode assembly, at least comprising an anode member, wherein a plurality of anode assemblies are arranged along a preset direction; a cathode assembly configured to be electrically connected to a workpiece to be plated, the cathode assembly being provided in plurality along a preset direction, the anode assembly and the cathode assembly being alternately provided; the support assembly is configured to mount the anode assembly and the workpiece to be electroplated, the support assembly at least comprises a support frame and positioning blocks, the positioning blocks are sequentially arranged at intervals along the length direction of the support frame, every two adjacent positioning blocks form a positioning group, an anode interval for mounting the anode assembly is formed between two positioning blocks in the same positioning group, and a cathode interval for mounting the workpiece to be electroplated is formed between two adjacent positioning groups.

As a further improvement of the above technical scheme: the cathode component is fixedly connected with the cathode conducting rod and is electrically connected with the anode conducting rod, and the anode component is fixedly connected with the anode conducting rod and is electrically connected with the cathode conducting rod; the cathode conducting rod is electrically connected with the negative electrode of the power supply, the anode conducting rod is electrically connected with the positive electrode of the power supply, the number of the anode conducting rod and the number of the cathode conducting rods are two, two current nodes are respectively formed between the anode conducting rod and the positive electrode of the power supply, two adjacent anode pieces are respectively electrically connected with the two anode conducting rods, and the two cathode conducting rods are respectively electrically connected with two sides of a piece to be electroplated.

As a further improvement of the above technical scheme: the support assembly further comprises two fixing plates, and two ends of the cathode conducting rod, the anode conducting rod and the support frame are respectively connected with the two fixing plates.

As a further improvement of the above technical scheme: the support frame includes first support body, second support body and third support body, first support body is located the bottom of anode assembly, second support body and third support body are located respectively the both ends of anode assembly.

As a further improvement of the above technical scheme: the anode assembly further includes an anode baffle for shielding an edge portion of the anode member.

As a further improvement of the above technical scheme: the anode assembly further includes a separator plate positioned between the two anode members when the anode assembly has two anode members.

As a further improvement of the above technical scheme: the anode part is provided with an anode lead-out part, one end of the anode lead-out part is connected with the anode part, the other end of the anode lead-out part extends in a direction far away from the anode part, and the anode lead-out part is electrically connected with the anode conducting rod.

As a further improvement of the above technical scheme: the cathode assembly comprises a cathode connecting rod, the cathode connecting rod is fixedly connected with the cathode conducting rod and electrically connected with the cathode conducting rod, and the cathode connecting rod is detachably connected with the to-be-electroplated part through a conductive adhesive tape and electrically connected with the to-be-electroplated part.

As a further improvement of the above technical scheme: the cathode connecting rod is provided with a sunken structure sinking towards the first frame body direction to form a first cathode conductive part and a second cathode conductive part with height difference, the first cathode conductive part is positioned above the second cathode conductive part, the first cathode conductive part is connected with the cathode conductive rod, and the second cathode conductive part and the to-be-electroplated piece are respectively connected with two ends of the conductive adhesive tape.

To achieve the above object, the present application provides an electroplating jig comprising: an anode assembly including at least an anode member; a cathode assembly configured to electrically connect to a part to be plated; a support assembly configured to mount the anode assembly and the part to be plated; the conductive assembly is connected with the supporting assembly and at least comprises a cathode conductive rod and an anode conductive rod, the cathode assembly is fixedly connected with the cathode conductive rod and is electrically connected with the anode conductive rod, and the anode member is fixedly connected with the anode conductive rod and is electrically connected with the anode conductive rod; the cathode assembly comprises a cathode connecting rod, the cathode connecting rod is fixedly connected with the cathode conducting rod and electrically connected with the cathode conducting rod, the cathode connecting rod is detachably connected with the to-be-electroplated part through a conductive adhesive tape and electrically connected with the to-be-electroplated part, the cathode connecting rod is provided with a concave structure to form a first cathode conducting part and a second cathode conducting part with height differences, the first cathode conducting part is positioned above the second cathode conducting part, the first cathode conducting part is connected with the cathode conducting rod, and the second cathode conducting part and the to-be-electroplated part are respectively connected with two ends of the conductive adhesive tape.

To achieve the above object, another aspect of the present application also provides an electroplating apparatus including the electroplating jig as described above, further comprising: an electroplating bath, wherein the electroplating clamp is arranged in the electroplating bath; during electroplating, electroplating liquid is contained in the electroplating tank, and the anode part and the to-be-electroplated area of the to-be-electroplated part are immersed in the electroplating liquid.

As a further improvement of the above technical scheme: the electroplating device comprises an electroplating tank and is characterized in that a mounting bracket is arranged in the electroplating tank, and a first mounting groove for placing a fixing plate of the electroplating clamp is arranged on the mounting bracket.

As a further improvement of the above technical scheme: the electroplating apparatus further includes: the liquid supply mechanism comprises a liquid supplementing assembly and a spraying assembly, wherein the liquid supplementing assembly is used for conveying electroplating liquid to the bottom of the electroplating clamp, and the spraying assembly is used for conveying the electroplating liquid to the side face of the electroplating clamp; the liquid circulation mechanism at least comprises a liquid storage barrel, a circulation pump and a circulation pipeline, wherein the circulation pipeline comprises a circulation liquid supply pipe and a circulation return pipe, the liquid supplementing assembly and the spraying assembly are communicated with the circulation return pipe, the circulation return pipe is connected with a return port of the liquid storage barrel through the circulation pump, one end of the circulation liquid supply pipe is communicated with the liquid storage barrel, and the other end of the circulation liquid supply pipe is communicated with the electroplating bath.

As a further improvement of the above technical scheme: an overflow pipe is arranged in the electroplating bath, one end of the overflow pipe penetrates through the bottom of the electroplating bath and is communicated with the circulating liquid supply pipe, and the horizontal plane of the pipe orifice of the other end of the overflow pipe is lower than the top surface of the electroplating bath and higher than the top surface of the anode part.

As a further improvement of the above technical scheme: and an ultrasonic generator is arranged on the mounting bracket.

To achieve the above object, another aspect of the present application also provides an electroplating apparatus including the electroplating jig as described above, further comprising: during electroplating, electroplating liquid is contained in the electroplating tank, and the anode part and the to-be-electroplated area of the to-be-electroplated part are immersed in the electroplating liquid; and the driving mechanism is configured to drive the electroplating clamp to move along the electroplating bath during electroplating.

Therefore, according to the electroplating clamp provided by the application, the to-be-electroplated part and the anode assembly are arranged on the electroplating clamp, so that the installation time of the electroplating clamp and the production cost of electroplating equipment are reduced; in addition, the conductive adhesive tape is used for detachably connecting the to-be-electroplated part and the cathode connecting rod, so that the conductive adhesive tape can be conveniently replaced, and the connection convenience of the to-be-electroplated part is improved; in addition, the cathode connecting rod is provided with the concave structure, so that the distance between a piece to be electroplated and the cathode connecting rod can be reduced, the length of the conductive adhesive tape is shortened, and the cost of the conductive adhesive tape is reduced.

The application also provides electroplating equipment comprising the electroplating clamp, wherein the area to be electroplated of the part to be electroplated and the anode part are immersed by electroplating liquid, so that metal ions electrolyzed by the anode part and metal ions in the electrolyte can flow onto the part to be electroplated through electroplating liquid and deposit to form a metal coating.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic perspective view of an electroplating clamp according to an embodiment of the present application;

FIG. 2 is a schematic perspective view of another view angle corresponding to the plating jig shown in FIG. 1 according to an embodiment of the present application;

FIG. 3 is a schematic plan view of a plating jig according to an embodiment of the present application;

FIG. 4 is a schematic perspective view of an electroplating fixture for removing a fixing plate according to an embodiment of the present application;

FIG. 5 is an enlarged partial view of area A of FIG. 4;

FIG. 6 is a schematic perspective view of another view corresponding to the plating jig for removing a fixing plate shown in FIG. 4 according to an embodiment of the present application;

FIG. 7 is a schematic plan view of an anode assembly and a member to be electroplated according to an embodiment of the present application in a second layout mode;

FIG. 8 is a schematic plan view illustrating another view angle of the anode assembly and the member to be electroplated shown in FIG. 7 according to an embodiment of the present application;

FIG. 9 is a schematic plan view of an anode assembly and a member to be electroplated according to an embodiment of the present application in a third layout mode;

FIG. 10 is a schematic plan view illustrating another view angle of the anode assembly and the member to be electroplated shown in FIG. 9 according to an embodiment of the present application;

FIG. 11 is a schematic diagram of a three-dimensional structure of an anode assembly and a member to be electroplated according to an embodiment of the present application in a second layout mode and a third layout mode, wherein the anode assembly has a structure with two anode members;

FIG. 12 is a schematic plan view of an anode assembly and a member to be electroplated according to an embodiment of the present application in a first arrangement;

FIG. 13 is a schematic plan view illustrating another view angle of the anode assembly and the member to be electroplated shown in FIG. 12 according to an embodiment of the present application;

FIG. 14 is a schematic perspective view of an anode assembly according to an embodiment of the present application, wherein the anode assembly has a structure with an anode member;

Fig. 15 is a schematic view of a partial structure of a first frame body provided with a latch according to an embodiment of the present application;

FIG. 16 is a schematic view showing a three-dimensional structure of an electroplating apparatus according to an embodiment of the present application;

FIG. 17 is a schematic diagram of a perspective structure of an additional liquid circulation mechanism and a controller of an electroplating apparatus according to an embodiment of the present application, wherein the electroplating tank is not shown;

FIG. 18 is an enlarged partial view of region B of FIG. 17;

FIG. 19 is a schematic perspective view of another view angle corresponding to the additional liquid circulation mechanism and the controller of the electroplating apparatus shown in FIG. 17, wherein the electroplating tank is not shown;

FIG. 20 is an enlarged partial view of region C of FIG. 19;

FIG. 21 is a schematic perspective view showing the positional relationship between the plating jig and the fluid replacement assembly according to the embodiment of the present application;

Fig. 22 is a schematic perspective view of a conductive component connected to a power source according to an embodiment of the present application;

FIG. 23 is a schematic view showing the flow of plating solution between the liquid circulation mechanism and the plating apparatus according to the embodiment of the present application;

FIG. 24 is a logic diagram of control between a controller and electroplating apparatus and temperature control components according to an embodiment of the present application.

Reference numerals:

10-electroplating clamp; a 101-anode assembly; 1011-a first anode member; 1012-a second anode member; 1013-anode baffles; 1014-separator; 1015-anode lead; 102-a cathode assembly; 1021-cathode linkage; 1022-conductive tape; 103-a support assembly; 1031-a fixing plate; 10311-a pull port; 1032-positioning blocks; 1033-a first frame; 1034-a second frame; 1035-a third frame; 104-a conductive component; 1041-a cathode conductive rod; 1042-a first anode conductive rod; 1043-a second anode conductive rod; 105-latch; 106-anode spacing; 107-cathode spacing.

20-A piece to be electroplated;

30-a power supply;

40-electroplating bath; 401-mounting a bracket; 4011-a first mount; 4012-a second mount; 4013-mounting platform; 402-spraying a bracket; 403-overflow pipe; 404-an ultrasonic generator;

50-a liquid circulation mechanism; 501-a liquid storage barrel; 502-a circulation pipeline; 5021-circulating liquid supply pipe; 5022-recirculating return line; 503-a circulation pump;

60-a liquid supply mechanism; 601-fluid replacement assembly; 6011-fluid replacement main pipe; 6012-fluid-supplementing branch pipes; 6013-liquid replenishing spray head; 6014-knockout; 6015-fluid replacement regulating valve; 602-a spray assembly; 6021-spraying main pipe; 6022-spray manifold; 6023-spray nozzle; 6024-spray regulating valve;

70-a controller; 71-a liquid level sensor; 72-flow sensor; 73-a temperature sensor;

80-a temperature control assembly; 801-a heat exchanger; 802-a liquid supply barrel; 803-first heat exchange tube; 804-a second heat exchange conduit; 805-a third heat exchange pipeline; 806-fourth heat exchange pipeline; 807-solenoid valve.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail with reference to the accompanying drawings. Terms such as "upper," "lower," "first end," "second end," "one end," "the other end," and the like used herein to refer to a spatially relative position are used for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Furthermore, the terms "mounted," "disposed," "provided," "connected," "slidingly connected," "secured," and "sleeved" are to be construed broadly. For example, "connected" may be in a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the background of the application, it is pointed out that existing electroplating equipment typically mounts the part to be electroplated and the anode assembly on two clamps, respectively. Specifically, in order to make the to-be-electroplated part always in a vertical state in the electroplating process, and simultaneously prevent the to-be-electroplated part from shaking under the impact of the electroplating liquid, so that the to-be-electroplated part cannot be uniformly electroplated, in the practical application of the electroplating equipment, the to-be-electroplated part needs to be clamped by using a clamp. Meanwhile, a common anode assembly generally includes at least one anode member, and during the electroplating process, it is required to ensure that the member to be electroplated is positioned as far as possible relative to the anode member, and therefore, the anode member is also clamped by a clamp. Under this structure, the anchor clamps of centre gripping anode assembly will install in the plating bath earlier, install the anchor clamps of centre gripping wait to electroplate the piece again, wherein, when waiting to electroplate a clamp installation, need make a plurality of wait to electroplate the distance between piece and the corresponding positive pole piece equal to wait to the electroplating area is relative with the position of positive pole piece. Thus, the installation and alignment of the jigs will consume a lot of production time, resulting in reduced productivity, and in addition, the processing of the two jigs will raise the cost of the plating equipment.

Based on this, the present application provides a plating jig, and a plating apparatus including the plating jig, two plating methods. This electroplating jig utilizes the supporting component that it had, can install anode assembly and wait to electroplate the piece simultaneously, so, before electroplating, only need will wait to electroplate the piece and install in wherein with anode member according to the structure of supporting component, can realize a plurality of homoenergetic correspondences of waiting between a plurality of electroplated pieces and a plurality of anode member, and when waiting to electroplate the piece in the change, also need not to wait repeatedly to electroplate the adjustment that piece and anode member carry out the position, so that the time of waiting to electroplate the piece in the installation electroplating jig and change can effectively reduce, thereby electroplating efficiency and productivity of electroplating equipment have been improved, and manufacturing cost can be reduced.

The technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. It should be apparent that the described embodiments of the application are only some, but not all, embodiments of the application. All other embodiments, based on the embodiments of the application, which a person skilled in the art would obtain without making any inventive effort, are within the scope of the application.

The plating jig 10 provided in the embodiment of the application is used for providing metal to be plated for plating equipment, installing the metal to be plated and the part to be plated 20, and conducting electricity for the metal to be plated and the part to be plated 20, wherein when the plating equipment is in a working state, metal ions are ionized by the metal to enter the plating solution and flow to the part to be plated 20, so that a metal film is attached to all or part of the surface of the part to be plated 20. Wherein, the to-be-electroplated part 20 can be a product needing to be endowed with a certain special physical property or decoration, such as a PCB board, a solar cell, a silicon chip, a chip and the like; for another example, the plating metal may be an insoluble anode, which is produced by coating a noble metal oxide coating having high electrochemical catalytic performance on a titanium substrate (mesh, plate, strip, tube, etc.), the coating containing a valve metal oxide of high stability, or the plating metal may be a soluble anode which itself dissolves into a metal ion into solution.

Referring to fig. 1-6, an electroplating fixture 10 includes at least an anode assembly 101, a cathode assembly 102, and a support assembly 103. Wherein the anode assembly 101 at least comprises an anode member, and the anode assembly 101 is provided with a plurality of anode members along a preset direction; the cathode assembly 102 is configured to be electrically connected to the to-be-plated pieces 20, the cathode assembly 102 is provided with a plurality of cathode assemblies 102 along a preset direction, and the anode assemblies 101 and the cathode assemblies 102 are alternately arranged, so that each to-be-plated piece 20 is provided with an anode piece corresponding to the to-be-plated piece, and positive ions ionized into the plating solution by the anode piece can be dissociated to the periphery of the to-be-plated piece 20 closest to the to-be-plated piece; the supporting component 103 is configured to mount the anode component 101 and the workpiece 20 to be electroplated, the supporting component 103 at least comprises a supporting frame and positioning blocks 1032, the positioning blocks 1032 are sequentially arranged at intervals along the length direction of the supporting frame, every two adjacent positioning blocks 1032 form a positioning group, an anode interval 106 for mounting the anode component 101 is formed between two positioning blocks 1032 in the same positioning group, and a cathode interval 107 for mounting the workpiece 20 to be electroplated is formed between two adjacent positioning groups. Because the thickness of the anode assembly 101 is different from the thickness of the to-be-electroplated part 20, the plurality of positioning blocks 1032 are grouped in pairs, and the distance between two positioning blocks 1032 in the positioning blocks is different from the distance between two adjacent positioning blocks, so that the mounting positions of the anode part and the to-be-electroplated part 20 are convenient to distinguish, when the anode part and the to-be-electroplated part 20 are mounted, the plurality of anode parts and the plurality of to-be-electroplated parts 20 can be directly mounted to corresponding positions according to the size of the mounting area, and under the condition that the positions of the mounting blocks 1032 are preset, the number and the positions of the anode parts and the to-be-electroplated parts 20 after the mounting are all corresponding, and the positions of the to-be-electroplated part 20 and the anode part do not need to be readjusted when the to-be-electroplated part 20 and the mounting electroplating clamp 10 are replaced, so that the mounting efficiency of the electroplating clamp 10 is improved.

In this embodiment, the plating jig 10 further includes a conductive assembly 104, the conductive assembly 104 is connected to the supporting assembly 103, the conductive assembly 104 includes at least a cathode conductive rod 1041 and an anode conductive rod, the cathode assembly 102 is fixedly connected to and electrically connected to the cathode conductive rod 1041, and the anode member is fixedly connected to and electrically connected to the anode conductive rod. Wherein, cathode conductive rod 1041 is electrically connected with the negative electrode of power supply 30, anode conductive rod is electrically connected with the positive electrode of power supply 30, the quantity of anode conductive rod and cathode conductive rod 1041 is two, form two current nodes respectively between two anode conductive rods and the positive electrode of power supply 30, two adjacent anode pieces are electrically connected with two anode conductive rods respectively, two cathode conductive rods 1041 are electrically connected with the two sides of to-be-electroplated part 20 respectively. In this way, the cathode conductive rod 1041 obtains the negative current and then transmits the negative current to the to-be-electroplated part 20, the anode conductive rod is electrically connected with the anode part through the anode conductive wire, and the anode conductive rod obtains the positive current and then transmits the positive current to the anode part, so that an electric field loop is formed between the anode part and the to-be-electroplated part 20. Because the anode assembly 101 and the cathode assembly 102 are alternately arranged, that is, the anode members and the members to be electroplated 20 are alternately arranged, under the condition that positioning blocks 1032 arranged at two ends of the support frame form positioning groups, the anode assemblies 101 are arranged at two ends of the support frame, at this time, the anode members are respectively arranged at two sides of each member to be electroplated 20, two adjacent anode members are respectively electrically connected with two anode conductive rods, that is, the anode members arranged at two sides of the same member to be electroplated 20 are electrically connected with two different anode conductive rods, meanwhile, two sides of the member to be electroplated 20 are respectively electrically connected with two cathode conductive rods 1041, thus, when the current intensities of the two anode conductive rods obtained from the positive electrode of the power supply are the same, the two surfaces to be electroplated of the member to be electroplated 20 can generate basically the same electroplating effect, and when the current intensities of the two anode conductive rods obtained from the positive electrode of the power supply are different, the two surfaces to be electroplated can generate different electroplating effects, thereby meeting different electroplating requirements of the member to be electroplated 20. For convenience of description, the two anode conductive bars are hereinafter referred to as a first anode conductive bar 1042 and a second anode conductive bar 1043, respectively, an anode member electrically connected to the first anode conductive bar 1042 is referred to as a first anode member 1011, an anode member electrically connected to the second anode conductive bar 1043 is referred to as a second anode member 1012, a surface to be plated of the member to be plated 20 corresponding to the first anode member 1011 is referred to as a first surface to be plated, and a surface to be plated of the member to be plated 20 corresponding to the second anode member 1012 is referred to as a second surface to be plated.

In one possible embodiment, the anode assembly 101 has one or two anode members, and when the anode assembly 101 has two anode members, the two anode members are electrically connected to two anode conductive rods, respectively. In this way, the number of anode members included in the anode assembly 101 can be changed as required, and the electrical connection mode of the anode members can be changed when the number of anode members is different, and the installation mode of the anode assembly 101 can be correspondingly adjusted, so that the anode assembly 101 can be stably installed on the support assembly 103 and is in an electrified state after the number of anode members is changed. In the same plating jig 10, when the anode assembly 101 has only one anode member, the required installation space will be smaller than that when the anode assembly 101 has two anode members, the number of installable parts will be larger than that when the anode assembly 101 has two anode members, and after the number of installable parts 101 is increased, the number of parts 20 to be plated that can be plated will also be increased, thereby improving the productivity of the plating apparatus.

When there are a plurality of the parts to be plated 20, in order to simultaneously plate the plurality of the parts to be plated 20, a corresponding number of the anode assemblies 101 should be provided such that at least one side of each part to be plated 20 is provided with the anode assembly 101 at the time of plating. When there are a plurality of the parts to be plated 20, in order to simultaneously plate the plurality of the parts to be plated 20, the number of the anode assemblies 101 is at least one more than that of the parts to be plated 20, so that both sides of each part to be plated 20 are provided with the anode assemblies 101 at the time of plating. Referring to fig. 7-11, assuming that the anode assembly 101 adopts a structure with two anode members, two anode members belonging to the same anode assembly 101 are respectively electrically connected with different anode conductive rods (if the anode assembly 101 is electrically connected with the same anode conductive rod, the anode assembly 101 can only have one anode member), under the structure, a plurality of anode members positioned on the same side of a plurality of to-be-plated members 20 are electrically connected with the same anode conductive rod, for example, the anode member positioned on the left side of the to-be-plated member 20 is electrically connected with the first anode member 1042, that is, the anode member positioned on the left side of the to-be-plated member 20 is a first anode member 1011, the anode member positioned on the right side of the to-be-plated member 20 is electrically connected with the second anode conductive rod 1043, that is, the anode members positioned on the right side of the to-be-plated member 20 are a second anode member 1012, that is, and the first anode member 1011 corresponds to the position of the to-be-plated member 20, so that the first anode member 1011 and the second anode member 20 correspond to the first surface to be-plated member 20 are electrically connected with the second surface to be-plated; if the current intensities obtained by the first anode conductive rod 1042 and the second anode conductive rod 1043 are different, the first surface to be plated and the second surface to be plated of the plurality of pieces to be plated 20 to be plated simultaneously will show different plating effects, that is, when the anode pieces are installed, the plurality of surfaces to be plated which need to achieve the same effect are arranged in the same direction, if the current intensities obtained by the first anode conductive rod 1042 and the second anode conductive rod 1043 are the same, the first surface to be plated and the second surface to be plated of the plurality of pieces to be plated 20 to be plated simultaneously will show the same plating effect, and in this case, the installation of the anode pieces does not need to consider the arrangement direction of the surfaces to be plated.

Referring to fig. 12 to 14, assuming that the anode assembly 101 adopts a structure having one anode member, the anode members connected to different anode conductive rods are alternately arranged, in this structure, two adjacent members to be plated 20 share the same anode member for plating, for example, when the anode member disposed between two adjacent members to be plated 20 is the first anode member 1011, two surfaces to be plated corresponding to the first anode member 1011 are the first surfaces to be plated of the members to be plated 20, and in the case that the first anode member 1011 and the second anode member 1012 are alternately arranged, the members to be plated 20 can realize double-sided plating in which two surfaces to be plated exhibit different plating effects, that is, when the anode members are installed, two anode members disposed on both sides of the same member to be plated 20 are electrically connected to the first anode conductive rod 1042 and the second anode conductive rod 1043, respectively. Of course, the structures of all the anode members may be the same (the structures of the first anode member 1011 and the second anode member 1012 are the same), so that adjacent anode members are connected with different anode conductive rods, and by passing currents of different intensities through the different anode conductive rods, two surfaces to be plated of the member 20 to be plated can also have different plating effects during plating. For example, the number of anode members is 101, all anode members are sequentially arranged, the anode members at the odd positions are first anode members 1011, the first anode members 1011 are electrically connected with the first anode conductive rods 1042, the anode members at the even positions are second anode members 1012, and the second anode members 1012 are electrically connected with the second anode conductive rods 1043; if the structures of the first anode member 1011 and the second anode member 1012 are different, different electroplating effects can be obtained on the two surfaces to be electroplated of the member 20 to be electroplated no matter whether the current intensities on the first anode conductive rod 1042 and the second anode conductive rod 1043 are the same; if the first anode member 1011 and the second anode member 1012 have the same structure, the current intensity on the first anode conductive rod 1042 and the second anode conductive rod 1043 are different, and the two surfaces to be plated of the member 20 to be plated can obtain different plating effects. Defining the interval between two adjacent anode members as the anode interval, wherein the number of the anode members is 101 in the example, 100 anode intervals can be formed, and 100 pieces to be electroplated 20 are placed in the 100 anode intervals, so that synchronous electroplating of the 100 pieces to be electroplated 20 can be realized.

The arrangement between the to-be-plated member 20 and the anode member is that the orthographic projection of the to-be-plated surface and the anode member on the same preset vertical plane is completely or partially overlapped, so that all areas or corresponding areas of the to-be-plated surface can be plated. Preferably, during electroplating, the to-be-electroplated part 20 and the anode part are arranged in parallel, and the center point of the to-be-electroplated part 20 and the center point of the anode part are positioned on the same horizontal line, namely, orthographic projections of the to-be-electroplated surface and the anode part on the same preset vertical plane are completely overlapped, so that the whole area of the to-be-electroplated surface can be electroplated. Further, the orthographic projections of the two anode members located at two sides of the to-be-plated member 20 on the same preset vertical plane are completely overlapped, and at the same time, the orthographic projections of the to-be-plated surfaces corresponding to the two anode members on the same preset vertical plane are completely overlapped, so that all the areas or the corresponding areas (all the areas if the two anode members are arranged in parallel with the to-be-plated member 20) of the two sides of the to-be-plated member 20 can be plated at the same time.

In one implementation, referring to fig. 1 to 6, the support assembly 103 further includes two fixing plates 1031, the fixing plates 1031 are respectively and fixedly connected with the two fixing plates 1031 at two ends of the support frame to form a frame structure, so that a space region for installing the anode assembly 101 is formed between the two fixing plates 1031, and two ends of the cathode conductive rod 1041 and the anode conductive rod are respectively fixed on the two fixing plates 1031. Wherein, the distance between two positioning blocks 1032 belonging to the same positioning group is greater than or equal to the thickness of the anode assembly 101, so as to mount the anode assembly 101 on the support frame. In this way, the anode assembly 101 is placed between two positioning blocks 1032 in the same positioning group, and the two sides of the anode assembly 101 are limited by the two positioning blocks 1032, so that the anode assembly 101 is mounted. When the distance between two adjacent positioning blocks 1032 is equal to the thickness of the anode assembly 101, the anode assembly 101 is mounted on the support frame by the pressure applied to the positioning blocks 1032 by the positioning blocks 1032, and when the distance between two adjacent positioning blocks 1032 is greater than the thickness of the anode assembly 101, the anode assembly 101 is mounted on the support frame by the clearance fit between the positioning blocks 1032 and the positioning blocks.

In order to enable the anode assembly 101 to be stably mounted on the support frame after the number of anode members is changed, the positioning block 1032 is detachably connected with the support frame. Specifically, when the anode assembly 101 adopts a structure having two anode members, and both sides of the anode assembly 101 correspond to surfaces to be plated, the thickness of the anode assembly 101 is the thickness of the two anode members plus the thickness of the two anode baffles 1013; when the anode assembly 101 adopts a structure having two anode members, and only one side of the anode assembly 101 corresponds to the surface to be plated, the thickness of the anode assembly 101 is the thickness of two anode members plus the thickness of one anode baffle 1013, or the thickness of one anode member plus the thickness of one anode baffle 1013; when the anode assembly 101 adopts a structure having one anode member, and both sides of the anode assembly 101 face to be electroplated, the thickness of the anode assembly 101 is the thickness of one anode member plus the thickness of two anode baffles 1013; when the anode assembly 101 adopts a structure having one anode member and only one side of the anode assembly 101 corresponds to the surface to be plated, the thickness of the anode assembly 101 is the thickness of one anode member plus the thickness of one anode baffle 1013. It will be appreciated that the thickness of the anode assembly 101, whether it has one anode member or two anode members, including at least the thickness of one anode member and the thickness of one anode baffle 1013, will be much greater than the thickness of the member to be electroplated 20, thereby facilitating the distinction between the mounting areas where the anode assembly 101 and the member to be electroplated 20 are mounted, due to the different thicknesses. In the case that the positioning blocks 1032 are in a detachable structure, the distance between two positioning blocks 1032 belonging to the same positioning group can be adjusted according to the thickness of the anode assembly 101, so that the structure of the anode assembly 101 can be replaced as required.

That is, the anode assembly 101 has at least three layout modes, referring to fig. 12-14, in which only the anode assembly 101 having one anode member is disposed in the plating jig 10, one anode member can simultaneously plate two surfaces to be plated, the surface to be plated 20 has two plating states, one plating state is that the first surface to be plated is located at the left side, the second surface to be plated is located at the right side, the other plating state is that the first surface to be plated is located at the right side, and the second surface to be plated is located at the left side, in which the surfaces to be plated 20 are alternately disposed in the two plating states, and adjacent surfaces to be plated 20 face the same anode member in different states, so that the first surface to be plated of each surface to be plated 20 presents the same plating effect, and the second surface to be plated of each surface to be plated 20 presents the same plating effect. Referring to fig. 7 to 8, the second arrangement is that only the anode assembly 101 having two anode members is disposed in the plating jig 10, in this arrangement, the members to be plated 20 are disposed in a single plating state, two sides of the anode members correspond to the surface to be plated and the partition 1014, respectively, only one anode member in the anode assemblies 101 located at both ends of the plating jig 10 is opposite to the member to be plated 20, most of the metal ions deposited on the surface to be plated come from the anode member closest thereto, and the metal ions electrolyzed by the remaining anode members are dissociated in the plating solution or deposited on the surface to be non-plated; referring to fig. 9-10, a third layout manner is that the plating jig 10 is provided with both an anode assembly 101 having one anode member and an anode assembly 101 having two anode members, wherein the anode assembly 101 having one anode member is provided with only two anode members and is respectively located at two ends of the plating jig 10, so that the situation that the anode members cannot provide metal ions for the to-be-plated member 20 in the anode assemblies 101 located at the ends can be avoided.

As can be seen from the above embodiments, among the three arrangement modes of the anode assemblies 101, the first arrangement mode uses only one anode member for the anode assemblies 101, so that the thickness is the smallest, the number of the anode assemblies 101 that can be arranged is the largest, the second arrangement mode uses two anode members for the anode assemblies 101, so that the thickness is the largest, the number of the anode assemblies 101 that can be arranged is the smallest, and the third arrangement mode uses two structures for the anode assemblies 101, so that the number of the anode assemblies 101 that can be arranged in the third arrangement mode is larger than that in the second arrangement mode and smaller than that in the first arrangement mode.

In this embodiment, referring to fig. 1-6, the support frame includes a first frame 1033, a second frame 1034 and a third frame 1035, where the first frame 1033 is located at the bottom of the anode assembly 101, and the second frame 1034 and the third frame 1035 are located at two ends of the anode assembly 101, respectively. In this way, by supporting the anode assembly 101 in a plurality of directions, the mounting stability of the anode assembly 101 can be further improved. Specifically, the second frame 1034 and the third frame 1035 have a distance therebetween, and the distance is greater than or equal to the width of the anode assembly 101, so that the anode assembly 101 can be placed between the second frame 1034 and the third frame 1035. When the distance between the two positioning blocks 1032 belonging to the same positioning group is equal to the thickness of the anode assembly 101, the anode assembly 101 is mounted on the support frame by the pressure applied to the positioning blocks 1032 by the positioning blocks, and when the distance between the two positioning blocks 1032 belonging to the same positioning group is greater than the thickness of the anode assembly 101, the anode assembly 101 is mounted on the support frame by the clearance fit between the positioning blocks 1032 and the positioning blocks. Thus, when the bottom of the anode assembly 101 is placed on the first frame 1033, the two positioning blocks 1032 belonging to the same positioning group on the first frame 1033 can limit the anode assembly 101 in the thickness direction thereof, at this time, two ends of the anode assembly 101 are respectively the second frame 1034 and the third frame 1035, and the anode assembly 101 can limit the anode assembly 101 in the width direction thereof through the second frame 1034 and the third frame 1035. In addition, positioning groups may be provided on both the second frame 1034 and the third frame 1035, and the anode assembly 101 may be further limited in the thickness direction thereof. When the first frame 1033, the second frame 1034, and the third frame 1035 are provided with the positioning blocks 1032, after the structure of the anode assembly 101 is determined, the positioning blocks 1032 on the first frame 1033, the second frame 1034, and the third frame 1035 need to be adjusted to make two positioning blocks 1032 be a group, so as to form a positioning group, and two positioning blocks 1032 in the same group are adjacent to each other and have a distance greater than or equal to the thickness of the anode assembly 101, thereby realizing the limitation of the anode assembly 101 in the thickness direction. It should be noted that, in order to ensure that the surface of the part 20 to be plated can be plated, the distance between the two positioning groups needs to be larger than the thickness of the part 20 to be plated.

In addition, when the anode assembly 101 is installed, the bottom of the anode assembly 101 needs to be placed on the first frame 1033, and in the placing process, the anode assembly 101 can be guided by limiting the anode assembly 101 in the width direction through the second frame 1034 and the third frame 1035, so that the anode assembly 101 is installed conveniently. Wherein, in order to limit the anode assembly 101 in the width direction, the width of the anode assembly 101 is the width of the anode baffle 1013, since the anode baffle 1013 needs to shield the edge portion of the anode member, the width of the anode baffle 1013 is necessarily larger than the width of the anode member, and when the width of the anode member is smaller than the width of the anode baffle 1013, the second frame 1034 and the third frame 1035 are respectively located at both sides of the anode baffle 1013 and limit the same in the width direction, and at this time, the anode member is limited only by the positioning block 1032 in the thickness direction; when the width of the anode member is equal to the width of the anode baffle 1013, the second frame 1034 and the third frame 1035 can simultaneously limit the anode member and the anode baffle 1013 in the width direction.

In practical applications, the number of the first frame 1033, the second frame 1034, and the third frame 1035 is more than one, so as to further improve the installation stability of the anode assembly 101. When the plurality of first frames 1033, the second frames 1034 and the third frames 1035 are installed, it is necessary to ensure that the plurality of first frames 1033, the plurality of second support bars and the plurality of third support bars are parallel to each other, wherein the plurality of first frames 1033 are horizontally arranged along the width direction of the anode assembly 101, and the plurality of second frames 1034 and the plurality of third frames 1035 are vertically arranged along the height direction of the anode assembly 101. Further, the number of the positioning blocks 1032 provided on the first frame 1033, the second support bar and the third support bar is the same, so as to limit the same number of anode assemblies 101. For example, the positioning blocks 1032 with the same number are disposed on the plurality of first frames 1033, the positioning blocks 1032 for fixing the same anode assembly 101 by the plurality of first frames 1033 are referred to as a positioning queue, the positioning queue includes two positioning blocks 1032 disposed on each first frame 1033 for fixing the same anode assembly 101, and the positioning queue can realize multi-point fixing and supporting of the anode assembly 101, so that the anode assembly 101 can be more stably mounted on the first frames 1033. For another example, the positioning blocks 1032 with the same number are disposed on the first frames 1033, the second frames 1034 and the third frames 1035, the positioning blocks 1032 with the same anode assembly 101 fixed by the first frames 1033, the second frames 1034 and the third frames 1035 are referred to as positioning modules, each positioning module includes two positioning blocks 1032 disposed on each first frame 1033, each second frame 1034 and each third frame 1035 for fixing the same anode assembly 101, and the positioning modules can realize multi-point fixing and supporting of the anode assembly 101, so that the anode assembly 101 can be more stably mounted on the first frames 1033, the second frames 1034 and the third frames 1035. Accordingly, in order to ensure that the surface of the workpiece 20 to be plated can be plated, the distance between the two positioning groups on the second frame 1034 and the third frame 1035 needs to be greater than the thickness of the workpiece 20 to be plated.

In one possible embodiment, referring to fig. 1 to 6, the anode assembly 101 further includes an anode baffle 1013, the anode baffle 1013 being configured to shield an edge portion of the anode member, and the anode baffle 1013 being positioned between the anode member and the member to be plated 20 during plating to reduce the electric field strength at the edge of the member to be plated 20. Because of the edge effect of the anode member itself (i.e., the electric lines of force tend to concentrate at the sharp corners and edges of the anode member so that the current density at the sharp corners and edges of the anode member is relatively high during electroplating), in order to prevent the electric lines of force flowing through the anode member to the edge portion of the member to be electroplated 20 from concentrating too much, a shielding member may be provided at the edge portion of the anode member so that the electric lines of force located in the edge region of the anode member need to bypass the anode baffle 1013 when flowing to the member to be electroplated 20 so that the electric lines of force located in the edge region of the anode member will have a greater path to the member to be electroplated 20 than the electric lines of force located in the center region of the anode member. Therefore, the distribution of the electric lines on the surface to be plated is uniform, and the influence of non-uniformity of the plating layer caused by the edge effect of the anode part is reduced. Wherein the edge portion of the anode member may be preset. Specifically, in the case that the anode baffle 1013 is not provided, the to-be-plated member 20 is directly plated, the to-be-plated member 20 after being plated is divided into N plating areas on average, and the plating thickness of each plating area is measured, so that the distribution of the power lines of the to-be-plated member 20 is reversely pushed, the edge portion of the to-be-plated member 20 is determined, the corresponding edge portion of the anode member is determined through the edge portion of the to-be-plated member 20, the edge portion of the anode member is shielded by the anode baffle 1013 to balance the distribution of the power lines of the to-be-plated member 20, and the uniformity of plating is effectively improved.

It is understood that the shape and size of the anode baffle 1013 can be adjusted according to the distribution of the edge portions. For example, when the thickness of the plating layer deposited on the upper edge portion of the member to be plated 20 is greater than that of the other portions, the anode baffle 1013 may be provided in a square shape or other structure having the same shape as the upper edge portion of the member to be plated 20, and the upper edge portion of the anode member is shielded by the anode baffle 1013 so that the thickness of the plating layer deposited on the upper edge portion of the member to be plated 20 is equal to that deposited on the other portions. In practice, the anode baffle 1013 is in a loop shape such that edge portions (including upper, lower, and side edges) of the anode baffle 1013 are all shielded, and only a center portion of the anode baffle 1013 is exposed.

In the present embodiment, the number of the anode baffles 1013 is equal to the number of the surfaces to be plated, so that the electric lines of force flowing through the anode member to the member to be plated 20 are blocked by the anode baffles 1013. When the anode assembly 101 adopts a structure having two anode members, the opposite sides of the two anode members, that is, the sides of each anode member corresponding to the surface to be electroplated are provided with anode baffles 1013, if the anode assembly 101 is located at the end of the electroplating fixture 10, only one anode member may be provided, or only one anode baffle 1013 may be provided. When the anode assembly 101 adopts a structure with one anode member, one side of the anode member corresponding to the surface to be electroplated is provided with the anode baffle 1013, and if the anode assembly 101 is positioned at the end of the electroplating fixture 10, only one side of the anode member corresponds to the surface to be electroplated, the other side does not need to be provided with the anode baffle 1013.

In one implementation, the plating jig 10 is further provided with a latch 105 for clamping the workpiece 20 to be plated, specifically, the latch 105 is provided on at least one of the first frame 1033, the second frame 1034, and the third frame 1035, and preferably, the latch 105 is provided on at least two of the first frame 1033, the second frame 1034, and the third frame 1035. The latch 105 is disposed in the cathode space 107, i.e. the latch 105 is disposed between two positioning groups. Preferably, the latch 105 is similar in structure to the teeth of a silicon wafer basket. Referring to fig. 15, the latch 105 has two protruding structures, and the distance between the two protruding structures is the thickness of the to-be-plated piece 20, so as to prevent the to-be-plated piece 20 from swaying under the fluid fluctuation of the plating solution when the distance between the two positioning groups is far greater than the thickness of the to-be-plated piece 20, so that a plating layer cannot be formed on the to-be-plated surface, or the uniformity of the plating layer is poor.

In one possible embodiment, referring to fig. 7-11, the anode assembly 101 further includes a separator plate 1014, where the anode assembly 101 has two anode members, the separator plate 1014 is located between the two anode members. As can be seen from the above embodiments, when the anode assembly 101 has two anode members, the anode conductive rods electrically connected to the two anode members are different, that is, the two anode members are the first anode member 1011 and the second anode member 1012, respectively, and in this structure, in order to avoid the mutual influence between the two anode members, a separator 1014 may be disposed between the two anode members. Accordingly, when the separator 1014 is disposed between two anode members, the thickness of the anode assembly 101 is equal to the thickness of two anode members plus the thickness of one separator 1014, plus the thickness of one or two anode baffles 1013, the distance between two adjacent positioning blocks 1032 on the support rod needs to be adjusted according to the thickness of the anode assembly 101 to achieve stable installation of the anode assembly 101. Wherein the size of the separator 1014 is larger than the size of the anode members, thereby better separating the effects between the two anode members. Preferably, the separator 1014, the anode member, the anode baffle 1013, and the member to be plated 20 are all aligned in the width direction so that the second frame 1034 and the third frame 1035 can simultaneously limit the anode member, the anode baffle 1013, the separator 1014, and the member to be plated 20 in the width direction.

Since the spacer 1014 is only disposed when the anode assembly 101 has two anode members, in this embodiment, the thickness of the anode assembly 101 will not be affected by the spacer 1014 when the anode assembly 101 is disposed in the first arrangement, the number of anode assemblies 101 that can be mounted in the plating jig 10 will be unchanged, the thickness of the anode assembly 101 will be increased by increasing the spacer 1014 when the anode assembly 101 is disposed in the second arrangement, the number of anode assemblies 101 that can be mounted in the plating jig 10 will be reduced (compared to when the anode assembly 101 is disposed without the spacer 1014), and the number of anode assemblies 101 that can be mounted in the plating jig 10 will be reduced when the anode assembly 101 is disposed in the third arrangement, wherein the number of anode assemblies 101 that can be mounted in the plating jig 10 is unchanged, and the number of anode assemblies 101 that can be mounted in only one anode member is still two is reduced compared to when the anode assembly 101 is disposed without the spacer 1014.

In one possible embodiment, referring to fig. 6, 11 and 14, an anode lead 1015 is provided on the anode member, one end of the anode lead 1015 is connected to the anode member, and the other end extends away from the anode member, and the anode lead 1015 is electrically connected to the anode conductive rod. In practical application, anode lead 1015 one end sets up in anode spare top, and the other end extends in vertical direction, because anode spare is in the operational state at electroplating equipment, needs submergence in plating solution, if anode spare is direct to be connected with the power positive pole, the circumstances such as power cord short circuit or electric leakage can take place, consequently, will be connected the power positive pole with power cord one end, the other end is connected to keeping away from anode spare to be located on the anode lead 1015 of anode spare top, can avoid the power cord to soak in liquid, in order to guarantee the power consumption safety on the anode spare.

In one possible embodiment, referring to fig. 1 to 6, the cathode assembly 102 includes a cathode link 1021, the cathode link 1021 being fixedly and electrically connected to a cathode conductive rod 1041, and the cathode link 1021 being detachably and electrically connected to the workpiece 20 to be plated by a conductive tape 1022 during plating. Wherein, the cathode connecting rod 1021, the cathode conductive rod 1041, the first anode conductive rod 1041 and the second anode conductive rod 1043 are all made of conductive materials, and the cathode connecting rod 1021 transmits the current obtained from the cathode conductive rod 1041 to the to-be-electroplated part 20.

Further, the cathode connecting rod 1021 has a concave structure sinking toward the first frame 1033, and forms a first cathode conductive portion and a second cathode conductive portion with a height difference, the first cathode conductive portion is located above the second cathode conductive portion, the first cathode conductive portion is connected with the cathode conductive rod 1041, and the second cathode conductive portion and the to-be-plated piece 20 are respectively connected with two ends of the conductive adhesive tape 1022. Preferably, the conductive adhesive tape 1022 is of a flexible structure, and during electroplating, the cathode connecting rod 1021 is adhered to and electrically connected with the to-be-electroplated part 20 through the conductive adhesive tape, and after electroplating, the conductive adhesive tape is torn off, so that the process of stripping the conductive adhesive tape 1022 or the connecting point of the carrier and the to-be-electroplated part 20 after electroplating is omitted, and the electroplating efficiency is improved.

There is also provided in one embodiment of the present disclosure an electroplating apparatus including the electroplating jig 10 of the foregoing embodiment. The plating apparatus is used for plating the member to be plated 20 so that a metal film is attached to all or a part of the surface of the member to be plated 20. Wherein the electroplating apparatus may be a vertical electroplating apparatus.

In this embodiment, referring to fig. 16-21, the electroplating apparatus further includes an electroplating tank 40, the electroplating fixture 10 is installed in the electroplating tank 40, during electroplating, the electroplating tank 40 contains electroplating solution, and the charged plating area of the to-be-electroplated part 20 and the anode assembly 101 are immersed in the electroplating solution, so that metal ions electrolyzed by the anode member and metal ions in the electrolyte can flow onto the charged plating area of the to-be-electroplated part 20 through the electroplating solution, and deposit to form a metal plating layer.

In one possible embodiment, referring to fig. 17 to 20, a mounting bracket 401 is provided in the plating tank 40, and a first mounting groove in which the fixing plate 1031 of the plating jig 10 is placed is provided on the mounting bracket 401. The plating jig 10 is detachably mounted in the plating tank 40, so that the plating jig 10 can be replaced and maintained, and in this embodiment, the plating jig 10 is mounted in a plugging manner. Specifically, the end of the mounting bracket 401 is connected to the inner wall of the plating tank 40, at least two first mounting grooves are provided on the mounting bracket 401, a distance is provided between the two first mounting grooves, the distance is adapted to the distance between the two fixing plates 1031 of the plating jig 10, and the fixing plates 1031 enable the two fixing plates 1031 of the plating jig 10 to be mounted in the first mounting grooves, thereby mounting the plating jig 10 to the mounting bracket 401. To ensure that the anode assembly 101 and the workpiece 20 to be plated are always immersed in the plating solution during plating, the plating vessel 10 needs to be positioned in the plating vessel 40, that is, the mounting bracket 401 is disposed in the plating vessel 40, and the distance between the bottom of the first mounting vessel and the top of the plating vessel 40 needs to be greater than or equal to the height of the plating vessel 10. Specifically, in the case where the distance between the bottom of the first installation groove and the top of the plating vessel 40 is equal to the height of the plating jig 10, the height of the anode member is smaller than the height of the fixing plate 1031, and the level at the top of the anode member is located below the level at the top of the fixing plate 1031, since the position of the member to be plated 20 corresponds to the position of the anode member, the level at the top of the member to be plated 20 is also correspondingly located below the level at the top of the fixing plate 1031, so that the liquid level can be lower than or equal to the level at the top of the plating vessel 40 after the anode member and the member to be plated 20 are immersed by the plating liquid, thereby avoiding overflow of the plating liquid into the plating vessel 40; when the distance between the bottom of the first installation vessel and the top of the plating vessel 40 is greater than the height of the plating jig 10, the height of the anode member is smaller than the height of the fixing plate 1031, and the horizontal plane at the top of the anode member is located below the horizontal plane at the top of the plating vessel 40.

Further, the fixing plate 1031 is provided with a lifting opening 10311, so that a manual or automatic device can control the electroplating clamp 10 to move integrally through the lifting opening 10311. If the level of the pulling-up opening 10311 is above the level of the top of the plating tank 40, the level of the top of the anode member is below the level of the top of the plating tank 40, so that the plating solution can still submerge the anode member and the member to be plated 20.

It should be noted that, when the plating apparatus is provided with the mounting bracket 401 in the plating tank 40, it is indicated that the plating apparatus performs plating on the workpiece 20 to be plated in a static plating manner, and at this time, the workpiece 20 to be plated is allowed to rest in the plating tank 40 by the plating jig 10. When the plating apparatus performs the plating on the workpiece 20 by using the dynamic plating method, the mounting bracket 401 is not required to be disposed in the plating tank 40, so that the plating tank 40 has enough space for the workpiece 20 to move. Specifically, a driving mechanism may be disposed in the electroplating apparatus, and the to-be-electroplated part 20 is moved in the electroplating tank 40 by the driving mechanism, so that the to-be-electroplated part 20 is electroplated in the moving process, where the driving mechanism may select a mechanical transmission part, such as a chain transmission structure, a belt transmission structure, etc., capable of driving the to-be-electroplated part 20 to move horizontally, which is not limited in the present application.

In practical applications, the driving mechanism may directly contact the plating jig 10, and drive the plating jig 10 to drive the workpiece 20 to be plated to move horizontally in the plating tank 40. If the driving mechanism of the conductive tape is directly used to drive the electroplating fixture 10, the structure of the electroplating fixture 10 is the same as that of the electroplating fixture 10 when the electroplating equipment is static electroplating, and the electroplating tank 40 needs to increase its internal space to horizontally move the electroplating fixture 10 in the electroplating tank 40, under this structure, the cathode conductive rod 1041 and the anode conductive rod can be connected with a power supply through power lines, the power lines move along with the power supply fixture during the movement of the electroplating fixture 10, or the anode conductive strips and the cathode conductive strips are arranged at two sides of the electroplating tank 40, the anode conducting bar and the cathode conducting bar are made of conducting materials, the anode conducting bar is electrically connected with the positive electrode of a power supply through a power line, the cathode conducting bar is electrically connected with the negative electrode of the power supply through a power line, the cathode conducting bar 1041 and the anode conducting bar are respectively contacted with the cathode conducting bar and the anode conducting bar, so that the cathode conducting bar 1041 can continuously contact with the cathode conducting bar to obtain negative current and convey the current to a piece to be electroplated 20 in the horizontal moving process of the electroplating fixture 10, and the anode conducting bar can continuously contact with the anode conducting bar to obtain positive current and convey the current to the anode piece; wherein the parts 20 to be plated need to be replaced by manual or automated equipment.

In one possible embodiment, the electroplating apparatus further comprises a liquid circulation mechanism 50 and a liquid supply mechanism 60. Wherein the liquid circulation mechanism 50 is configured to drive the plating liquid to circulate so as to form a liquid loop, and the cation concentration of the plating liquid in the plating tank 40 is maintained by circulating the plating liquid; the liquid supply mechanism 60 is connected to the liquid circulation mechanism 50, and supplies the plating liquid to the plating jig 10, so that the plating liquid with high cation concentration can flow directly to the plating jig 10 after flowing into the plating tank 40 through the liquid supply mechanism 60, thereby enabling the metal ions to be more rapidly enriched to the surface of the workpiece 20 to be plated. Specifically, referring to fig. 17-22, the fluid supply mechanism 60 includes at least a fluid replacement assembly 601, the fluid replacement assembly 601 including a fluid replacement main 6011, a fluid replacement branch 6012, and a fluid replacement nozzle 6013. Wherein, the fluid replacement main pipe 6011 is communicated with the fluid circulation mechanism 50, the fluid replacement branch pipe 6012 is communicated with the fluid replacement main pipe 6011, and the fluid replacement branch pipe 6012 is positioned below the plating jig 10, and the fluid replacement nozzle 6013 is arranged on the fluid replacement branch pipe 6012 with the nozzle facing the plating jig 10. Specifically, the fluid compensating branch pipe 6012 and the fluid compensating spray head 6013 may be provided in plurality, so that when the electroplating apparatus performs electroplating on the plurality of to-be-electroplated components 20, the fluid compensating branch pipe 6012 can timely convey a sufficient amount of electroplating solution to the anode assembly 101 and the bottom of the to-be-electroplated component 20, so as to increase the cation concentration between the to-be-electroplated component 20 and the anode component. In practical applications, in order to enable the plating solution to be uniformly delivered between the anode assembly 101 and the workpiece 20 to be plated, the number of the fluid-replenishing branch pipes 6012 is matched with the number of the first frame bodies 1033, and is at least one more than the number of the fluid-replenishing branch pipes 6012, so that the fluid-replenishing nozzle 6013 can replenish the anode assembly 101 and the workpiece 20 to be plated from both sides of the anode assembly 101 and between two adjacent first frame bodies 1033. wherein, the plurality of fluid-supplementing branch pipes 6012 are arranged in parallel with each other, one end is connected with the fluid-supplementing main pipe 6011, and the other end extends along the length direction of the first frame 1033 until the length of the first frame 1033 is equal to or greater than the length of the first frame 1033, so that the fluid-supplementing spray heads 6013 can be arranged along the length of the first frame 1033, and can be correspondingly arranged and adjusted according to the number of the anode assemblies 101, each fluid-supplementing branch pipe 6012 is provided with a plurality of fluid-supplementing spray heads 6013, the fluid-supplementing spray heads 6013 on two adjacent fluid-supplementing branch pipes 6012 can be staggered or arranged in parallel, when adopting a staggered structure, Every two staggered fluid replacement nozzles 6013 correspond to one anode assembly 101, and the nozzles of the two fluid replacement nozzles 6013 face two sides of the anode assembly 101 respectively, so that the replenished electroplating liquid can directly flow between the surface to be electroplated and the anode member, and when a parallel arrangement structure is adopted, the nozzles of the fluid replacement nozzles 6013 can face between the surface to be electroplated and the anode member, and because the electroplating liquid flowing out through the fluid replacement nozzles 6013 will flow between the surface to be electroplated and the anode member, the number of the fluid replacement nozzles 6013 and/or the fluid replacement branch pipes 6012 can be reduced under the structure that the fluid replacement nozzles 6013 adopt parallel arrangement.

Further, the fluid replacement main pipe 6011 is connected to the fluid replacement branch pipe 6012 via a separator 6014. If the fluid-filling branch pipe 6012 is only provided with one, the fluid-filling branch pipe 6012 may be directly connected to the fluid-filling main pipe 6011, if the fluid-filling branch pipe 6012 is provided with a plurality of fluid-filling branch pipes 6012, the plating solution in the fluid-filling main pipe 6011 needs to be uniformly distributed into the plurality of fluid-filling branch pipes 6012 by the fluid-separator 6014, in order to ensure that the plating solution can uniformly flow to the plurality of fluid-filling branch pipes 6012, the fluid-filling main pipe 6011 is connected to the middle position of the fluid-separator 6014 in the length direction, the two ends are equidistantly extended in the direction away from the center point, when the fluid-filling main pipe 6011 conveys the plating solution into the fluid-separator 6014, the plating solution enters from the middle of the fluid-separator 6014 and firstly diffuses into the two ends of the fluid-separator 6014, because the end of the fluid-separator 6014 is in a closed state, that is uniformly lifted after flowing to the end of the fluid-separator 6014, that is simultaneously introduced into the plurality of fluid-filling branch pipes 6012 by the fluid-filling branch pipe 6012.

In order to enable the plating solution flowing out through the fluid replacement nozzle 6013 to flow directly between the surface to be plated and the anode member, the fluid replacement nozzle 6013 and the fluid replacement branch pipe 6012 are positioned below the plating jig 10, and therefore, the fluid replacement branch pipe 6012, the fluid separator 6014 and the fluid replacement main pipe 6011 should have a certain height after being connected in order. In practical application, the fluid replacement branch pipe 6012 is linear, the fluid replacement main pipe 6011 is L-shaped, one end of the L-shaped horizontal portion of the fluid replacement main pipe 6011 is connected to the fluid circulation mechanism 50, the other end of the L-shaped horizontal portion passes through the side wall of the plating tank 40 to enter the plating tank 40, one end of the L-shaped vertical portion of the fluid replacement main pipe 6011 is connected to the horizontal portion, and the other end of the L-shaped vertical portion is communicated to the fluid separator 6014.

In one implementation, a second mounting groove is further provided on the mounting bracket 401 for placement of the fluid replacement manifold 6012. After the plating solution enters the fluid-supplementing branch pipe 6012 through the fluid separator 6014, the fluid flow will cause the vibration of the fluid-supplementing branch pipe 6012, if the fluid-supplementing branch pipe 6012 is only dependent on the fluid separator 6014 and the fluid-supplementing main pipe 6011 to be at a certain height, after long-term use, the joint of the fluid-supplementing branch pipe 6012 and the fluid separator 6014 is easily separated due to frequent vibration. Therefore, by placing the fluid replacement branch pipe 6012 on the mounting bracket 401, the mounting bracket 401 is utilized to provide a supporting force to the fluid replacement branch pipe 6012 to improve stability during use of the fluid replacement branch pipe 6012. Accordingly, the number of the second installation grooves is equal to the number of the fluid-supplementing branch pipes 6012, and the groove width of the second installation grooves is matched with the diameter of the fluid-supplementing branch pipes 6012, so that the fluid-supplementing branch pipes 6012 can be stably placed in the second installation grooves.

To ensure that the replenishment liquid injector 6013 is located below the plating jig 10, bottom replenishment is performed on the plating jig 10, and the second mounting groove is located below the first mounting groove. In practical application, the mounting bracket 401 has a first mounting portion 4011 and a second mounting portion 4012, a plurality of second mounting grooves are disposed on the second mounting portion 4012 in parallel, an upper surface of the second mounting portion 4012 protrudes upward to form the first mounting portion 4011, the first mounting grooves are disposed on the first mounting portion 4011, and according to the above embodiment, the first mounting grooves have two and support the two fixing plates 1031, respectively, and therefore, the first mounting portion 4011 and the second mounting portion 4012 are also correspondingly provided with two. Further, the distance between the bottom of the first mounting groove and the bottom of the second mounting groove is positively correlated with the distance between the fluid replacement branch pipe 6012 and the plating jig 10, i.e., the height of the first mounting portion 4011 increases, and accordingly, the distance between the fluid replacement branch pipe 6012 and the plating jig 10 increases, and the distance between the top of the fluid replacement branch pipe 6012 and the bottom of the plating jig 10 is greater than or equal to the length of the fluid replacement spray head 6013, so that the fluid replacement spray head 6013 can be mounted on the fluid replacement branch pipe 6012.

In one achievable embodiment, referring to fig. 17-20, the liquid supply mechanism 60 further comprises a spray assembly 602, the spray assembly 602 comprising a spray header 6021, a spray manifold 6022, and a spray header 6023; the shower main pipe 6021 is communicated with the liquid circulation mechanism 50, the shower branch pipe 6022 is communicated with the shower main pipe 6021, and the shower branch pipe 6022 is provided on the side wall of the plating tank 40, the shower head 6023 is provided on the shower branch pipe 6022, and the nozzle faces the plating jig 10. Unlike the manner in which the plating solution is supplied from the plating solution replenishing assembly 601 to the bottom of the plating jig 10, the shower head 6023 of the shower assembly 602 is disposed on the sidewall of the plating tank 40 to supply the plating solution from the side of the plating jig 10 between the surface to be plated and the anode member. Specifically, when the number of the spraying main pipes 6021 is two, the two spraying main pipes 6021 are respectively located at two sides of the electroplating tank 40 and are arranged along the length of the tank body of the electroplating tank 40, in order to enable electroplating liquid conveyed by the spraying nozzle 6023 to flow to the electroplating fixture 10 more quickly, the spraying main pipes 6021 are arranged at the top of the electroplating tank 40, in practical application, the number of the spraying branch pipes 6022 is multiple, and the spraying branch pipes 6022 are perpendicular to the spraying main pipes 6021 and are distributed and arranged along the length direction of the spraying main pipes 6021, the spraying branch pipes 6022 can be correspondingly arranged and adjusted according to the number of the anode assemblies 101, one end of the spraying main pipe 6021 is communicated with the liquid circulation mechanism 50, the other end of the spraying main pipe 6021 is in a closed state, after the electroplating liquid is conveyed into the spraying main pipe 6021 through the liquid circulation mechanism 50, one end of the spraying branch pipes 6022 is connected with the spraying main pipe 6021, and the other end of the spraying branch pipes extend downwards along the height of the electroplating tank 40, as the electroplating liquid easily causes vibration of the spraying branch pipes 6022 when flowing, the spraying branch pipes 6022 have a certain length, the spraying branch pipes 6022 can be arranged on the inner walls 6022 of the spraying branch pipes 6022, and the spraying branch pipes 6022 are not arranged along the length direction of the spraying branch pipes 6023, and the spraying branch pipes 6022 are arranged along the length direction, and the spraying branch pipes 6022 are not arranged.

The number of the spraying branch pipes 6022 may be equal to the number of the surfaces to be electroplated, that is, one workpiece 20 to be electroplated corresponds to two spraying branch pipes 6022, and the number of the spraying branch pipes 6022 may be smaller than the number of the surfaces to be electroplated because the electroplating solution flowing out through the spraying branch pipes 6023 can flow to other areas, as the spraying spray heads 6023 arranged on the spraying branch pipes 6022 face between the anode assembly 101 and the workpiece 20 to be electroplated.

Further, a shower bracket 402 on which a shower main 6021 is placed is provided on the plating tank 40. Specifically, the spray bracket 402 is disposed at the top of the electroplating bath 40, and a spray groove is disposed on the spray bracket 402, and the groove width of the spray groove is adapted to the diameter of the spray main 6021, so that the spray main 6021 can be stably placed in the spray groove. Further, at least two spraying grooves are provided, each spraying groove corresponds to support one spraying main pipe 6021, when four spraying grooves are provided, each two spraying grooves corresponds to one spraying main pipe 6021 and the two spraying grooves respectively support two ends of the spraying main pipe 6021. In practical application, spray support 402 can adopt bar structure or cubic structure, when spray support 402 adopts bar structure, spray support 402 extends along plating bath 40 length direction and sets up, can set up two on the both ends of a spray support 402 and spray the recess, when spray support 402 adopts cubic structure, spray support 402's quantity is four to four spray support 402 install in plating bath 40 four corners respectively, adopt the cubic structure spray support 402 to compare in bar spray support 402, the application mode is more nimble, spray support 402 when needing maintenance or change, can dismantle the installation alone.

In one embodiment, referring to fig. 17 and 19, an overflow pipe 403 is disposed in the electroplating tank 40, one end of the overflow pipe 403 penetrates through the bottom of the electroplating tank 40 to communicate with the liquid circulation mechanism 50, and the other end of the overflow pipe is located at a level lower than the top surface of the electroplating tank 40 and higher than the top surface of the anode member. Since the liquid supply mechanism 60 continuously supplies the plating solution to the plating tank 40, in order to circulate the plating solution and avoid overflow of the solution, the plating solution in the plating tank 40 needs to be discharged at regular time or continuously, and in the case that the anode member and the workpiece 20 need to be immersed in the plating solution, the excessive plating solution can be discharged by arranging the overflow pipe 403 or the overflow port, that is, the pipe orifice or the overflow port of the overflow pipe 403 needs to be arranged above the anode member, and since the position of the workpiece 20 corresponds to the position of the anode member, the horizontal plane of the top of the workpiece 20 is correspondingly located below the pipe orifice or the overflow port of the overflow pipe 403, so that the liquid level can be lower than or equal to the horizontal plane of the top of the plating tank 40 after the anode member and the region to be plated of the workpiece 20 are immersed by the plating solution.

Specifically, the highest electroplating liquid level point and the lowest electroplating liquid level point may be preset, where the lowest electroplating liquid level point and the top surface of the anode member are located at the same horizontal plane, or are higher than the horizontal plane where the top surface of the anode member is located, and the highest electroplating liquid level point is lower than the horizontal plane where the top surface of the plating tank 40 is located, or are located at the same horizontal plane as the top surface of the plating tank 40, so that a set section of the pipe orifice or the overflow port of the overflow pipe 403, that is, between the highest electroplating liquid level point and the lowest electroplating liquid level point, may exist when the pipe orifice or the overflow port of the overflow pipe 403 reaches the pipe orifice or the overflow port of the overflow pipe 403, the discharge is not timely caused to overflow the plating liquid from the plating tank 40, and when the pipe orifice or the overflow port of the overflow pipe 403 reaches the pipe orifice or the overflow port of the overflow pipe, the discharge speed is too fast to cause the plating liquid to be unable to submerge the anode member and the member 20 to be plated. When the overflow pipe 403 is arranged, the pipe orifice of the overflow pipe 403 is located in the arrangement region, and when the overflow port is arranged, the overflow port is arranged on the side wall of the electroplating tank 40 and is located in the arrangement region.

Further, a plurality of overflow pipes 403 may be disposed in the plating tank 40, and the plurality of overflow pipes 403 are uniformly distributed in the plating tank 40 to control the plating liquid levels at a plurality of positions in the plating tank 40 and discharge the liquid, which may easily result in a failure to timely discharge the plating liquid away from the overflow pipe 403 in the plating tank 40 if only one overflow pipe 403 is disposed.

In one possible embodiment, referring to fig. 17-20, an ultrasonic generator 404 is provided on the mounting bracket 401. By additionally arranging the ultrasonic generator 404 in the electroplating tank 40, ultrasonic waves act on the electroplating solution and the to-be-electroplated part 20, and high-intensity ultrasonic energy generated by the ultrasonic generator 404 can crack air in gaps on the surface of the to-be-electroplated part 20 or separate from the surface of the to-be-electroplated part 20, so that the electroplating solution can flow into the gaps on the surface of the to-be-electroplated part 20, the dispersion capacity and the deep plating capacity of the electroplating solution are improved, uniform metal plating layers can be deposited on the surface of the to-be-electroplated part 20 and in the gaps, the thickness difference between the surface of the to-be-electroplated part 20 and the plating layers in the gaps is reduced, the uniformity of the plating layers is further improved, and correspondingly, the production yield of the to-be-electroplated part 20 is also improved.

Specifically, the mounting bracket 401 further has a mounting platform 4013, the second mounting portion 4012 is disposed on the mounting platform 4013, and since the first mounting groove supporting the fixing plate 1031 is disposed on the second mounting portion 4012, a distance between the two second mounting portions 4012 is equal to a length of the plating jig 10, and when the plating apparatus employs static plating, a volume of the plating apparatus can be reduced to accommodate only the plating jig 10 and the liquid supply mechanism 60, so that a production cost and a floor area of the plating apparatus can be reduced. That is, an accommodating space for accommodating the ultrasonic generator 404 is formed among the mounting platform 4013, the second mounting portion 4012 and the fluid compensating branch pipe 6012, so that the space occupied by the ultrasonic generator 404 is reduced, and the volume of the plating tank 40 and the plating equipment is reduced.

Further, a connection block may be provided between the second mounting portion 4012 and the mounting platform 4014 to improve connection stability between the second mounting portion 4012 and the mounting platform 4014.

In one possible embodiment, referring to fig. 16, 23, and 24, the liquid circulation mechanism 50 includes at least a liquid storage tank 501, a circulation pump 503, and a circulation pipe 502. Specifically, the circulation pipeline 502 includes a circulation liquid supply pipe 5021 and a circulation return pipe 5022, the liquid replenishing main pipe 6011 and the spraying main pipe 6021 are both communicated with the circulation liquid supply pipe 5021, and the circulation return pipe 5022 is connected with a return port of the liquid storage barrel 501 through a circulation pump 503; one end of the circulation return pipe 5022 is communicated with the liquid storage tank 501, and the other end is communicated with the overflow pipe 403. In practical applications, the plating solution flows into the plating tank 40 through the circulation return pipe 5022, and when the plating solution level in the plating tank 40 rises to the position of the nozzle of the overflow pipe 403, the plating solution above the nozzle flows into the overflow pipe 403 and flows into the circulation return pipe 5022 and the liquid storage tank 501 through the overflow pipe 403. Thus, one cycle of the plating solution can be completed.

Further, the number of the circulation pumps 503 may be two, namely a circulation first pump and a circulation second pump, the circulation first pump is disposed on the circulation return pipe 5022, the inlet of the circulation second pump is connected with the circulation return pipe 5022, the outlet of the circulation second pump is connected with the liquid storage tank 501, and when the amount of the plating solution in the plating tank 40 is too large, the plating solution in the plating tank 40 can flow into the overflow pipe 403 with an acceleration under the suction force of the circulation second pump, so as to avoid the excessive plating solution overflowing into the plating tank 40.

In this embodiment, the plating solution may enter the plating tank 40 through the fluid replacement main 6011 and/or the shower main 6021, and thus, the flow direction of the plating solution may be controlled by providing a three-way valve or an adjusting valve. When setting up three-way valve, three-way valve's inlet is connected with circulation feed pipe 5021, and three-way valve's first liquid outlet is connected with fluid replacement is responsible for 6011, and the second liquid outlet is connected with spraying and is responsible for 6021, when spraying and being responsible for 6021 and having two, can set up a spraying distribution pipe again between second liquid outlet and spraying and being responsible for 6021, set up two on the spraying distribution pipe and connect respectively and spray and be responsible for 6021 and spray the shunt tube for can input electroplating solution simultaneously in two spraying are responsible for 6021. In the starting or running process of the electroplating equipment, the flow direction of the electroplating liquid can be regulated through the three-way valve, when the electroplating liquid is conveyed into the electroplating tank 40 only by the liquid supplementing component 601, the first liquid outlet can be opened, the second liquid outlet is closed, the circulating liquid supply pipe 5021 is communicated with the liquid supplementing main pipe 6011, the electroplating liquid flows into the liquid distributor 6014 through the liquid supplementing main pipe 6011 and is conveyed into the plurality of liquid supplementing branch pipes 6012 at the same time, the electroplating liquid in the liquid supplementing branch pipes 6012 flows between the surface to be electroplated and the anode part through the liquid supplementing spray heads 6013, when the electroplating liquid is conveyed into the electroplating tank 40 only by the spraying component 602, the second liquid outlet can be opened, the first liquid outlet is closed, the circulating liquid supply pipe 5021 is communicated with the spraying main pipe 6021 or the spraying distribution pipe, and the electroplating liquid enters the spraying spray heads 6023 through the spray branch pipes 6022 so as to flow between the surface to be electroplated and the anode part.

Because the three-way valve can only make one of the two liquid outlets be in an open state, in order to realize that the electroplating liquid flows into the electroplating bath 40 through the liquid supplementing main pipe 6011 and the spraying main pipe 6021 at the same time, a mode of setting adjusting valves on the liquid supplementing main pipe 6011 and the spraying main pipe 6021 at the same time can also be adopted. Specifically, one end of the circulation liquid supply pipe 5021 is connected with the liquid outlet of the liquid storage barrel 501, the other end of the circulation liquid supply pipe 5021 is provided with a three-way joint, the other two interfaces of the three-way joint are respectively connected with the liquid supplementing main pipe 6011 and the spraying main pipe 6021, when the electroplating liquid amount in the electroplating bath 40 is sufficient, any one of the regulating valves can be selectively opened, so that the electroplating liquid in the liquid storage barrel 501 flows into the electroplating bath 40 through the liquid supplementing main pipe 6011 or the spraying main pipe 6021, and when the electroplating liquid amount in the electroplating bath 40 is insufficient, the anode part and the part to be electroplated 20 can not be immersed, the two regulating valves can be selectively opened simultaneously, so that a large amount of liquid supplementing is carried out on the electroplating bath 40.

In one possible embodiment, referring to fig. 24, a level sensor 71 is provided within plating cell 40 to monitor the amount of plating solution within plating cell 40. Wherein, the liquid level sensors 71 are two, and the two liquid level sensors 71 are respectively arranged at the highest point and the lowest point of the electroplating liquid level. Specifically, the electroplating apparatus further includes a controller 70, and a communication line (wired or wireless communication line) exists between the liquid level sensor 71 and the controller 70, where the controller 70 may receive a signal sent by the liquid level sensor 71, so as to obtain a real-time liquid level in the electroplating tank 40. When the plating level in plating tank 40 is at the highest plating level or the lowest plating level, level sensor 71 may feed back to controller 70 via the communication lines described above, and then be alerted by controller 70 in the form of an acousto-optic. In addition, the controller 70 is electrically connected to the circulation pump 503 and the adjusting valve, so that the controller 70 can control the opening of the outlet valve of the circulation pump 503 and/or adjust the opening and closing of the valve when the plating liquid level in the plating tank 40 is at the highest plating liquid level or the lowest plating liquid level. For convenience of description, the two liquid level sensors 71 are hereinafter referred to as a high liquid level sensor and a low liquid level sensor, respectively, and the two regulating valves are hereinafter referred to as a makeup regulating valve 6015 and a shower regulating valve 6024, respectively.

For example, assuming that the distance between the high level sensor and the bottom of the plating tank 40 is H1, the distance between the low level sensor and the bottom of the plating tank 40 is H2, the current plating liquid level of the plating tank 40 is H3, and the units of H1, H2, and H3 are all cm, when h3=h2, it is indicated that the plating liquid level in the plating tank 40 is too small, the reason for this may be that the plating liquid level in the plating tank 40 is too small through the liquid supply mechanism 60, after receiving the signal sent by the low level sensor, the controller 70 determines the opening and closing states of the liquid supply adjusting valve 6015 and the spray adjusting valve 6024 at this time, if both the liquid supply adjusting valve 6015 and the spray adjusting valve 6024 are in the opened states, the plating liquid can be directly added into the plating tank 40 through manual or automatic equipment, if only the liquid supply adjusting valve 6015 or the spray adjusting valve 6024 is in the opened state, and then the other adjusting valve can be correspondingly opened, so that the plating liquid level in the plating tank 40 is still to be increased through the anode; when h3=h1, it indicates that the amount of plating solution in the plating tank 40 is too large, which may be caused by too large amount of plating solution being supplied into the plating tank 40 by the solution supply mechanism 60 or too small amount of plating solution being discharged through the overflow pipe 403, after receiving the signals from the high level sensor, the controller 70 determines the opening and closing states of the solution replenishment adjusting valve 6015 and the spray adjusting valve 6024 and the opening of the circulation pump 503 at this time, if the solution replenishment adjusting valve 6015 and the spray adjusting valve 6024 are both in an open state, either one of the adjusting valves may be closed, so that the amount of plating solution supplied into the plating tank 40 by the solution supply mechanism 60 is reduced, and simultaneously, the opening of the circulation pump 503 may be correspondingly adjusted to increase the opening, and if only the solution replenishment adjusting valve 6015 or the spray adjusting valve 6024 is in an open state, the opening of the circulation pump 503 may be increased, so that the suction force of the circulation pump 503 may be increased, and the solution in the plating tank 40 may flow out of the overflow pipe 403 at a faster speed. In addition, the overflow pipe 403, the circulation pipe 502 and the pipes in the liquid supply mechanism 60 need to be cleaned periodically to avoid the blockage of the inside of the pipes, so that the plating liquid cannot circulate.

Further, an optimal level sensor may be added to the plating tank 40, and the optimal level sensor is electrically connected to the controller 70, and the controller 70 may receive a signal sent by the optimal level sensor. Specifically, the controller 70 can determine the time at which the operation is stopped based on the signal transmitted from the optimal level sensor after the operation of reducing the liquid supply amount and increasing the liquid discharge amount of the plating tank 40 with an excessive amount of the plating liquid, and resume the supply amount and the discharge amount of the plating liquid in the normal state of the plating apparatus; accordingly, after the operation of increasing the supply amount and decreasing the discharge amount of the plating vessel 40 is performed by the controller 70 with an excessively small plating solution amount, the time for stopping the operation can be determined based on the signal from the optimum level sensor, and the supply amount and the discharge amount of the plating solution in the normal state of the plating apparatus can be restored.

Further, a width adjusting valve and a height adjusting valve may be provided on the liquid supplementing branch pipe 6012 and the shower branch pipe 6022, respectively. Since the length of the liquid replenishing branch pipe 6012 is equal to or greater than the length of the plating jig 10, when the number of anode assemblies 101 in the plating jig 10 is smaller than the number of positioning groups, the plating liquid can be caused to flow only through the portion of the plating jig 10 where the anode assemblies are mounted by the width adjusting valve, and accordingly, the length of the shower branch pipe 6022 is equal to or greater than the height of the plating jig 10, when the height of the anode member is changed or the height of the plating jig 10 is changed, the plating liquid can be caused to flow only through the height region where the anode member exists by the height adjusting valve. Wherein, width control valve and high governing valve all can set up a plurality of. The setting positions of the height adjustment valve and the width adjustment valve may be determined according to the commonly used sizes of the plurality of plating jigs 10 before the height adjustment valve and the width adjustment valve are set. For example, the height of the plurality of plating jigs 10 is A, B, C, the length of the shower branch 6022 is D, the units of A, B, C, D are cm, d=a > B > C, so two height adjusting valves may be disposed on the shower branch 6022, two positioning points B, C are marked on the shower branch 6022 correspondingly, that is, the distance from the end of the shower branch 6022 connected to the shower main 6021 to the point B is B, the distance from the end of the shower branch 6022 connected to the shower main 6021 to the point C is C, one of the height adjusting valves is located between the point B and the point a, and the other width adjusting valve is located between the point C and the point a, so that the circulated plating solution can directly flow between the anode member and the surface to be plated, and if the circulated plating solution flows to other positions in the plating tank 40, there is a possibility that the plating solution does not flow through the plating jigs 10 and enters the liquid loop again.

In one possible embodiment, referring to fig. 24, flow sensors 72 are provided on both the make-up main 6011 and the shower main 6021 for monitoring the flow of plating solution into the plating vessel 40 in real time. Specifically, the flow sensor 72 is electrically connected to the controller 70, and the controller 70 may receive the signal sent by the flow sensor 72, so as to obtain the real-time flow in the liquid replenishing main pipe 6011 and the spraying main pipe 6021. Before the electroplating apparatus is used, a flow threshold range of the flow sensor 72 may be preset to monitor in real time the amount of the electroplating solution flowing into the electroplating bath 40 through the fluid replenishment main pipe 6011 and the spray main pipe 6021, and the controller 70 may control the opening of the fluid replenishment adjusting valve 6015 and/or the spray adjusting valve 6024 according to the signal obtained by the flow sensor 72, so as to accurately control the flow rate of the electroplating solution in the fluid replenishment adjusting valve 6015 and/or the spray adjusting valve 6024.

In one embodiment, the liquid storage tank 501 contains a plating solution stock solution. Since the concentration of the cations in the plating solution in the plating tank 40 is reduced compared with that of the stock solution after the plating solution is used for a long time, the solution is returned to the liquid storage tank 501 to be mixed with the stock solution and precipitated, so that the concentration of the cations in the plating solution returned to the plating tank 40 through the liquid storage tank 501 is increased. To ensure that the concentration of cations in the plating solution re-flowing into the plating vessel 40 increases, the service personnel must periodically replenish the plating solution stock solution into the tank 501. If the plating solution flowing out of the solution supply mechanism 60 between the anode member and the surface to be plated is not mixed with the stock solution, but the plating solution in the plating tank 40 is recycled, the concentration of the cations reaching between the anode member and the surface to be plated may gradually decrease after a certain period of time, so that a plating layer with a sufficient thickness cannot be formed on the surface of the member to be plated 20.

Unlike the above-described method of containing the plating solution stock solution in the solution tank 501, the solution tank 501 may not contain the plating solution, but is only used to circulate the plating solution in the plating tank 40 without considering the decrease of the cation concentration in the plating solution, and after the plating solution is added to the plating tank 40 by manual or automatic equipment, the excessive plating solution in the plating tank 40 can flow into the solution tank 501 via the overflow pipe 403 to be stored, thereby avoiding overflow of the plating solution in the plating tank 40.

In one possible embodiment, referring to fig. 24, a temperature sensor 73 is provided within the plating vessel 40 to monitor the temperature of the plating solution within the plating vessel 40 in real time. Specifically, the temperature sensor 73 is electrically connected to the controller 70, and the controller 70 may receive a signal sent by the temperature sensor 73, so as to obtain a real-time temperature in the plating tank 40. In the electroplating production process, the temperature of the electroplating liquid is changed due to the heat generated during processing or the change of room temperature, however, when the temperature of the electroplating liquid does not meet the process requirement, the firmness, the uniformity, the flatness and the surface smoothness of the surface plating layer of the produced electroplating product are greatly influenced.

Thus, in one implementation, referring to FIG. 24, a temperature control assembly 80 is also included in the electroplating apparatus. Specifically, the temperature control assembly 80 includes a heat exchanger 801, a liquid supply barrel 802, a temperature control pump and a heat exchange pipeline, wherein a liquid outlet of the liquid supply barrel 802 is connected with a first heat exchange pipeline 803 and is communicated with a first liquid inlet of the heat exchanger 801 through the first heat exchange pipeline 803, a first liquid outlet of the heat exchanger 801 is connected with a second heat exchange pipeline 804 and is communicated with a liquid inlet of the liquid supply barrel 802 through the second heat exchange pipeline 804, so as to form a first loop formed by the first heat exchange pipeline 803, the second heat exchange pipeline 804, the liquid supply barrel 802 and the heat exchanger 801, and heat exchange liquid flows in the first loop; the heat exchange outlet of the liquid storage barrel 501 is connected with the third heat exchange pipeline 805 and is communicated with the second liquid inlet of the heat exchanger 801 through the third heat exchange pipeline 805, the second liquid outlet of the heat exchanger 801 is connected with the fourth heat exchange pipeline 806 and is communicated with the heat exchange inlet of the liquid storage barrel 501 through the fourth heat exchange pipeline 806, so as to form a second loop formed by the third heat exchange pipeline 805, the fourth heat exchange pipeline 806, the liquid storage barrel 501 and the heat exchanger 801, and the electroplating liquid flows in the second loop. The temperature control pumps are arranged on the first loop and the second loop respectively, so that the heat exchange liquid flowing out through the liquid supply barrel 802 circularly flows in the first loop, and the electroplating liquid circularly flows in the second loop. The electroplating solution in circulation exchanges heat with the heat exchange liquid through the heat exchanger 801, the electroplating solution after heat exchange flows into the liquid storage barrel 501, and then enters the electroplating bath 40 through the circulation liquid supply pipe, so that the regulation and control of the temperature of the electroplating solution in the electroplating bath 40 are completed.

In practical applications, the above solution uses a plate heat exchanger 801 for exchanging heat of the liquid. Specifically, the plating solution enters the flow channel of the plate heat exchanger 801 through the second loop, the heat exchange liquid enters the other flow channel of the plate heat exchanger 801 through the first loop, heat transfer is performed through the temperature difference between the two liquids, and the plating solution and the heat exchange liquid after heat exchange enter the second loop and the first loop respectively, so that the temperature of the plating solution flowing into the liquid storage barrel 501 through the plate heat exchanger 801 is lower than the temperature of the plating solution flowing out of the liquid storage barrel 501 or the temperature of the plating solution flowing into the liquid storage barrel 501 through the plate heat exchanger 801 is higher than the temperature of the plating solution flowing out of the liquid storage barrel 501.

In the present embodiment, referring to fig. 24, a solenoid valve 807 is provided on the third heat exchange pipe 805, and both the solenoid valve 807 and the temperature control pump are electrically connected to the controller 70, and the opening degrees of the solenoid valve 807 and the temperature control pump are controlled according to the acquired real-time temperature of the plating vessel 40, thereby adjusting the temperature of the plating solution in the plating vessel 40. For example, assuming that the preset temperature range of the plating solution in the plating tank 40 is T1-T2, when the heat generated by the plating is too high, or the temperature in the plating shop is too high, the actual temperature of the current plating solution obtained by the temperature sensor 73 is T3, and T3 is greater than the highest value T1 in the operating temperature range, in order to make the temperature of the plating solution in the plating tank 40 be in the preset temperature range, after the controller 70 receives the signal of the temperature sensor 73, the electromagnetic valve 807 and the temperature control pump are controlled to open, so that the plating solution in the liquid storage tank 501 enters the second loop to exchange heat with the heat exchange liquid, and is re-circulated to the liquid storage tank 501, at this time, the liquid contained in the liquid supply tank 802 is a cooling liquid, so that the temperature of the plating solution flowing into the liquid storage tank 501 is lower than the temperature of the plating solution flowing out of the liquid storage tank 501 after exchanging heat with the cooling liquid, after the cooling is continuously conveyed into the plating tank 40, the plating solution in the plating tank 40 can be reduced to T4, and T2 < T3 < T2 < T1 and the electromagnetic valve 807 is controlled to be closed; accordingly, when the temperature in the plating shop is too low, the actual temperature of the current plating solution obtained by the temperature sensor 73 is T5, and T5 is smaller than the minimum value T2 in the working temperature range, in order to make the temperature of the plating solution in the plating tank 40 be within the preset temperature range, after receiving the signal of the temperature sensor 73, the controller 70 controls the electromagnetic valve 807 and the temperature control pump to open, so that the plating solution in the liquid storage tank 501 enters the second loop, exchanges heat with the heat exchange liquid, and re-flows back into the liquid storage tank 501, in order to raise the temperature of the plating solution in the plating tank 40, at this time, the liquid contained in the liquid supply tank 802 is hot water with a temperature higher than the plating solution, so that the temperature of the plating solution flowing into the liquid storage tank 501 is higher than the plating solution flowing out of the liquid storage tank 501 after exchanging heat with the hot water, after the raised plating solution is continuously conveyed into the plating tank 40, the plating solution temperature in the plating tank 40 can be raised to T6, and T5 is less than T6 and less than T1, until T2 is less than T6 is less than T1, and the controller 70 and the temperature control pump 807 is controllable.

In order to avoid the influence of impurities generated during the electroplating process on the electroplating quality of the to-be-electroplated part 20, in an implementation manner, a filter screen is arranged at the connection part of the circulating liquid supply pipe 5021 and the liquid storage barrel 501, and the filter screen is arranged on the liquid loop so as to filter the recycled electroplating liquid. Specifically, during circulation, the plating solution flows through the overflow pipe 403, the circulation return pipe 5022, the liquid storage tank 501, the filter screen and the circulation liquid supply pipe 5021 in sequence, and finally enters the plating tank 40, and impurities in the plating solution are filtered and remain in the liquid storage tank 501, so that the plating solution conveyed into the plating tank 40 by the liquid storage tank 501 is free of impurities. Compared with the mode of arranging the filter screen on the overflow pipe 403, the filter screen is arranged at the joint of the circulating liquid supply pipe 5021 and the liquid storage barrel 501, so that impurities can be cleaned conveniently. Specifically, if the filter screen is disposed in the overflow pipe 403, impurities will be filtered and remain on the filter screen, and when the plating solution amount increases and the plating solution level rises, the impurities on the filter screen will be carried away from the filter screen by the flowing plating solution and enter the plating tank 40, so that the plating effect of the workpiece 20 to be plated is easily affected; if the filter screen is arranged at the connection part of the circulating liquid supply pipe 5021 and the liquid storage barrel 501, impurities are filtered and remain in the liquid storage barrel 501, the impurities can not enter the electroplating bath 40 to influence the electroplating effect of the to-be-electroplated part 20, and the residual impurities in the liquid storage barrel 501 can be removed by manually cleaning the liquid storage barrel 501 at regular time.

In one embodiment, in order to prevent the plating solution in the plating tank 40 from leaking, sealing rings are disposed at the connection between the plating tank 40 and the fluid replacement main pipe 6011, the connection between the fluid replacement main pipe 6011 and the circulation fluid supply pipe 5021, the connection between the circulation fluid supply pipe 5021 and the spray main pipe 6021, and the connection between the spray main pipe 6021 and the spray branch pipe 6022, and the sealing rings may be made of rubber, and seal the gaps between the connection by using elasticity of the sealing rings.

An example of a specific application of the plating jig is given below:

Providing a plurality of anode assemblies 101 arranged at intervals along a preset direction, so that a cathode interval 106 for installing the member to be electroplated 20 is formed between two adjacent anode assemblies 101;

dividing the two sides of the piece to be electroplated 20 into a first surface to be electroplated and a second surface to be electroplated according to the electroplating effect to be achieved;

Determining the current intensity and the electroplating effect corresponding to the current intensity which are respectively obtained by the two anode conducting rods, wherein the first surface to be electroplated corresponds to the first current intensity, and the second surface to be electroplated corresponds to the second current intensity;

the anode parts of two adjacent anode assemblies 101 are respectively and electrically connected with two anode conducting rods, the anode part for acquiring the first current intensity is a first anode part 1011, and the anode part for acquiring the second current intensity is a second anode part 1012;

the plurality of to-be-plated pieces 20 are placed in the cathode space 107 in a manner that the first to-be-plated surface corresponds to the first anode piece 1011 and the second to-be-plated surface corresponds to the second anode piece 1012, wherein the facing surfaces of two adjacent to-be-plated pieces 20 are both the first to-be-plated surface or both the second to-be-plated surfaces.

Under this electroplating method, the anode assembly 101 adopts a structure having only one anode member, and by alternately disposing the first anode member 1011 and the second anode member 1012, the surfaces to be electroplated on both sides of the first anode member 1011 will exhibit the electroplating effect of the first surface to be electroplated, and the surfaces to be electroplated on both sides of the second anode member 1012 will exhibit the electroplating effect of the second surface to be electroplated. Thus, the purpose that the two surfaces of the same piece 20 to be electroplated have different electroplating effects can be achieved.

If the anode assembly 101 is configured with two anode members, the electroplating method includes: placing a plurality of anode assemblies 101 in sequence into a plurality of anode spaces 106; dividing the two sides of the piece to be electroplated 20 into a first surface to be electroplated and a second surface to be electroplated according to the electroplating effect to be achieved; determining the current intensity and the electroplating effect corresponding to the current intensity which are respectively obtained by the two anode conducting rods, wherein the first surface to be electroplated corresponds to the first current intensity, and the second surface to be electroplated corresponds to the second current intensity; two anode pieces in the same anode assembly 101 are respectively and electrically connected with two anode conducting rods, the anode piece for obtaining the first current intensity is a first anode piece 1011, the anode piece for obtaining the second current intensity is a second anode piece 1012, and the connection modes of the two anode pieces in a plurality of anode assemblies 101 are the same; the plurality of members to be plated 20 are placed in the cathode space 107 in this order in the same configuration, wherein the first surface to be plated faces the first anode member 1011 and the second surface to be plated faces the second anode member 1012.

If the two surfaces of the to-be-plated member 20 need to have the same plating effect, the two surfaces of the to-be-plated member do not need to be distinguished, and at this time, the plating method includes: placing a plurality of anode assemblies 101 in sequence into a plurality of anode spaces 106; placing a plurality of parts to be plated 20 in sequence in a plurality of cathode spaces 107; the anode member in the anode assembly 101 may be connected to any one of the anode conductive rods; the current strengths of the two anode conductive rods obtained by the power supply 30 are equal.

It should be noted that, if the number of anode members included in the anode assembly 101 is changed during the front and rear electroplating in the same electroplating operation, the positions of the positioning blocks 1032 should be adjusted accordingly, so that the positioning blocks 1032 on the support frame can still be grouped in pairs, the distance between two positioning blocks 1032 belonging to the same positioning group is greater than the thickness of the anode assembly 101, and the distance between two positioning groups is greater than the thickness of the member to be electroplated 20.

An example of a specific application of the plating apparatus is given below:

Providing a cathode connecting rod 1021 for connecting the member to be plated 20 to the negative electrode of the power source 30;

Placing the piece to be plated 20 into the plating jig 10;

Acquiring the distance between the highest point of the piece 20 to be electroplated and the lowest point of the cathode connecting rod 1021, so as to determine the length of the conductive adhesive tape 1022;

connecting two ends of the conductive adhesive tape 1022 with the member to be electroplated 20 and the cathode connecting rod 1021 respectively;

Placing the plating jig 10 into the plating tank 40;

Starting a power supply 30 to electrify the electroplating equipment until all the parts to be electroplated 20 are electroplated;

the power supply 30 is turned off, the plating jig 10 is taken out, and both ends of the conductive tape 1022 are separated from the workpiece 20 to be plated and the cathode link 1021, respectively.

In this embodiment, the conductive tape 1022 is connected to the workpiece 20 to be plated by adhesion, and the conductive tape 1022 is connected to the cathode connecting rod 1021 by adhesion and/or clamping. Preferably, in order to improve connection stability, the conductive tape 1022 and the cathode connecting rod 1021 are connected by adopting a bonding and clamping connection mode, and in practical application, the clamping connection means that the connection part of the conductive tape 1022 and the cathode connecting rod 1021 is clamped and fixed by using a clamping member (for example, a clamp), that is, the bonding part of the conductive tape 1022 and the cathode connecting rod 1021 is clamped by the clamping member after the conductive tape 1022 is bonded. The conductive adhesive tape 1022 and the to-be-electroplated part 20 are adhered, so that the to-be-electroplated part 20 is prevented from being damaged due to the pressure applied to the clamping part when the clamping part clamps the to-be-electroplated part 20.

Through the connection mode, the cost of the conductive adhesive tape 1022 can be reduced, the replacement is convenient, the electroplating cost is effectively reduced, and the electroplating efficiency is improved. Specifically, after the plating of the workpiece 20 is completed, the plating jig 10 is directly taken out from the plating tank 40 by a manual or automatic device, one end of the conductive adhesive tape 1022 is torn off from the workpiece 20, the other end of the conductive adhesive tape 1022 is torn off from the cathode connecting rod 1021 after the clamping member is taken off, after a new batch of workpiece 20 to be plated and the conductive adhesive tape 1022 with a preset length are obtained by the manual or automatic device, one end of the conductive adhesive tape 1022 is bonded with the lowest point of the cathode connecting rod 1021, then the clamping member clamps the bonded position, and when a plurality of workpiece 20 to be plated are sequentially placed in the cathode intervals 107, the other end of the conductive adhesive tape 1022 is bonded with the highest point of the workpiece 20 to be plated. In this way, a round of replacement of the to-be-electroplated part 20 and the conductive adhesive tape 1022 can be completed, the conductive adhesive tape 1022 is conveniently connected without deplating, the electroplating efficiency can be improved, in addition, the two ends of the conductive adhesive tape 1022 are respectively connected with the highest point of the to-be-electroplated part 20 and the lowest point of the cathode connecting rod 1021, so that the required length is reduced as much as possible, and the use cost of the conductive adhesive tape 1022 is reduced.

Compared with the traditional mode of connecting the to-be-electroplated parts 20 by adopting the conductive adhesive tape or the conductive wire, the conductive adhesive tape 1022 can improve the electroplating efficiency and the electroplating cost of the electroplating equipment. Specifically, when the to-be-electroplated part 20 is connected by the conductive adhesive tape or the conductive wire, an additional fixing part is needed to position the to-be-electroplated part so as to avoid falling off in the electroplating process, and the conductive adhesive tape and the conductive wire are parts which are used for multiple times and are not needed to be replaced, so that after long-term use, the to-be-electroplated part is also provided with a coating, and the to-be-electroplated part is required to be subjected to deplating by using deplating equipment, thereby increasing the cost of electroplating work and reducing the efficiency of the electroplating work.

In one possible embodiment, the cathode link 1021 may be made to protrude downward, and the conductive tape 1022 may be connected with the protruding portion of the cathode link 1021 to shorten the length of the conductive tape 1022 connecting the cathode link 1021 and the member 20 to be plated, thereby reducing the cost of using the conductive tape 1022.

In one possible embodiment, the power supply 30 outputs a constant current when the electroplating apparatus is energized, or outputs a constant current for a preset time after the energization. If the power supply 30 of the electroplating apparatus outputs a constant current only in a preset time after being electrified, the state of the workpiece 20 to be electroplated can be stabilized under the constant current in the preset time, so that the bonding force between the plating layer and the substrate on the workpiece 20 to be electroplated is stronger after the workpiece 20 to be electroplated is electroplated.

In one possible embodiment, when the electroplating apparatus is energized, the power supply 30 simultaneously supplies current to both anode conductive bars, or supplies current to one of the anode conductive bars for a preset time after the energization, and then simultaneously supplies current to both anode conductive bars after the preset time has elapsed. If the power supply 30 of the electroplating apparatus supplies current to one of the anode conductive rods within a preset time after being energized, and supplies current to both anode conductive rods at the same time after the preset time is completed, the plating uniformity of the to-be-electroplated part 20 can be improved. Specifically, in the case that the two surfaces to be plated of the workpiece 20 are different in structure, if the two surfaces to be plated are plated for the same time, the plating layer of the surface to be plated having the deep concave structure is uneven, that is, the plating period is too short, so that the deep concave structure of the surface to be plated cannot be plated, or the thickness of the plating layer is insufficient. In this embodiment, the power supply 30 may perform electroplating on the surface to be electroplated with a complex structure within a preset time, that is, perform single-sided electroplating first, determine the anode conductive rod electrically connected to the surface to be electroplated with a complex structure, and then continuously perform energization on the anode conductive rod within the preset time, so that the surface to be electroplated of the part to be electroplated 20 is electroplated first, and after the preset time is over, the power supply 30 simultaneously transmits current to the two anode conductive rods, so that both surfaces to be electroplated of the part to be electroplated 20 start to be electroplated, and thus, the coating layer with the same thickness can still be provided when the depth structures of the two surfaces to be electroplated are different, so as to improve the coating uniformity of the part to be electroplated 20. It can be seen that, according to the electroplating fixture 10 provided by the application, the number of anode pieces in the anode assembly 101 can be changed, so that the installation space required by the anode assembly 101 is correspondingly changed, the installation space is unchanged under the condition that the specification of the electroplating fixture 10 is unchanged, when the number of anode pieces is reduced, the installation space required by the anode assembly 101 is reduced, and under the condition that the same installation space is adopted, the number of the anode assemblies 101 is increased, so that the number of pieces to be electroplated 20 which can be electroplated in the electroplating fixture 10 is correspondingly increased, thereby improving the electroplating efficiency and productivity of the electroplating equipment and reducing the production cost.

The present application also provides an electroplating apparatus including the electroplating jig 10, wherein the member to be electroplated 20 and the anode member are immersed by the electroplating solution, so that metal ions electrolyzed by the anode member, and metal ions contained in the electrolyte can flow onto the member to be electroplated 20 through the electroplating solution and deposit to form a metal coating, and the electroplating apparatus further has a liquid circulation mechanism 50 and a liquid supply mechanism 60, so that the electroplating solution can be recycled.

The application also provides an electroplating method using the electroplating clamp, wherein two sides of the same piece to be electroplated can show different electroplating effects by setting different current intensities, and in addition, one anode piece can simultaneously electroplate two surfaces to be electroplated with the same electroplating effect requirement on two pieces to be electroplated, so that two sides of a plurality of pieces to be electroplated can be simultaneously electroplated, and the productivity of electroplating equipment is improved.

The application also provides an electroplating method using the electroplating equipment, which can avoid the waste of the conductive adhesive tape by determining the length of the conductive adhesive tape after obtaining the shortest distance between the to-be-electroplated part and the cathode connecting rod; meanwhile, after the electroplating of a batch of to-be-electroplated parts is completed, the conductive adhesive tape can be replaced, the convenience of replacing the conductive adhesive tape can be effectively improved through the adhesive connection of the conductive adhesive tape, and the conductive adhesive tape is not required to be subjected to deplating treatment after being replaced, so that the electroplating efficiency is improved, and the electroplating cost is reduced.

It should be defined that the term "perpendicular" or "parallel" is not strictly perpendicular or parallel, for example, an angle of 92 degrees or 88 degrees may be considered perpendicular to both components, and an angle of 2 degrees may be considered parallel to both components, i.e. the two components remain "perpendicular" or "parallel" if the manufacturing tolerance permits or the functional requirements are met.

The foregoing is only illustrative of the present application and is not to be construed as limiting thereof, but rather as various modifications, equivalent arrangements, improvements, etc., within the spirit and principles of the present application.

Claims

1. An electroplating clamp, comprising:

the anode assembly at least comprises an anode piece, and a plurality of anode assemblies are arranged along a preset direction;

A cathode assembly configured to be electrically connected to a workpiece to be plated, the cathode assembly being provided in plurality along a preset direction, the anode assembly and the cathode assembly being alternately provided;

The support assembly is configured to mount the anode assembly and the workpiece to be electroplated, the support assembly at least comprises a support frame and positioning blocks, the positioning blocks are sequentially arranged at intervals along the length direction of the support frame, every two adjacent positioning blocks form a positioning group, an anode interval for mounting the anode assembly is formed between two positioning blocks in the same positioning group, and a cathode interval for mounting the workpiece to be electroplated is formed between two adjacent positioning groups.

2. The plating jig according to claim 1, wherein,

The cathode component is fixedly connected with the cathode conducting rod and is electrically connected with the anode conducting rod, and the anode component is fixedly connected with the anode conducting rod and is electrically connected with the cathode conducting rod;

The cathode conducting rod is electrically connected with the negative electrode of the power supply, the anode conducting rod is electrically connected with the positive electrode of the power supply, the number of the anode conducting rod and the number of the cathode conducting rods are two, two current nodes are respectively formed between the anode conducting rod and the positive electrode of the power supply, two adjacent anode pieces are respectively electrically connected with the two anode conducting rods, and the two cathode conducting rods are respectively electrically connected with two sides of a piece to be electroplated.

3. The plating jig according to claim 2, wherein the support assembly further comprises two fixing plates, and both ends of the cathode conductive rod, the anode conductive rod and the support frame are respectively connected to the two fixing plates.

4. The plating jig of claim 3, wherein the support frame comprises a first frame body, a second frame body and a third frame body, the first frame body is positioned at the bottom of the anode assembly, and the second frame body and the third frame body are respectively positioned at two ends of the anode assembly.

5. The plating jig according to any one of claims 1-4, wherein the anode assembly further comprises an anode baffle for shielding an edge portion of the anode member.

6. The plating jig of claim 5, wherein the anode assembly further comprises a separator plate, the separator plate being located between two of the anode members when the anode assembly has two of the anode members.

7. The plating jig according to claim 6, wherein an anode lead-out member is provided on the anode member, one end of the anode lead-out member is connected to the anode member, the other end extends in a direction away from the anode member, and the anode lead-out member is electrically connected to the anode conductive rod.

8. The plating jig according to claim 4, wherein the cathode assembly comprises a cathode connecting rod fixedly connected and electrically connected to the cathode conductive rod, and the cathode connecting rod is detachably connected and electrically connected to the member to be plated by a conductive tape.

9. The plating jig according to claim 8, wherein the cathode connecting rod has a recessed structure sunk toward the first frame body to form a first cathode conductive portion and a second cathode conductive portion having a height difference, the first cathode conductive portion being located above the second cathode conductive portion, the first cathode conductive portion being connected to the cathode conductive rod, the second cathode conductive portion and the member to be plated being connected to both ends of the conductive tape, respectively.

10. An electroplating clamp, comprising:

an anode assembly including at least an anode member;

A cathode assembly configured to electrically connect to a part to be plated;

a support assembly configured to mount the anode assembly and the part to be plated;

The conductive assembly is connected with the supporting assembly and at least comprises a cathode conductive rod and an anode conductive rod, the cathode assembly is fixedly connected with the cathode conductive rod and is electrically connected with the anode conductive rod, and the anode member is fixedly connected with the anode conductive rod and is electrically connected with the anode conductive rod;

The cathode assembly comprises a cathode connecting rod, the cathode connecting rod is fixedly connected with the cathode conducting rod and electrically connected with the cathode conducting rod, the cathode connecting rod is detachably connected with the to-be-electroplated part through a conductive adhesive tape and electrically connected with the to-be-electroplated part, the cathode connecting rod is provided with a concave structure to form a first cathode conducting part and a second cathode conducting part with height differences, the first cathode conducting part is positioned above the second cathode conducting part, the first cathode conducting part is connected with the cathode conducting rod, and the second cathode conducting part and the to-be-electroplated part are respectively connected with two ends of the conductive adhesive tape.

11. Electroplating apparatus employing the electroplating jig according to any one of claims 1 to 9, further comprising:

An electroplating bath, wherein the electroplating clamp is arranged in the electroplating bath; during electroplating, electroplating liquid is contained in the electroplating tank, and the anode part and the to-be-electroplated area of the to-be-electroplated part are immersed in the electroplating liquid.

12. The plating apparatus as recited in claim 11, wherein a mounting bracket is provided in said plating tank, and a first mounting groove in which a fixing plate of said plating jig is placed is provided on said mounting bracket.

13. The electroplating apparatus of claim 12, wherein the electroplating apparatus further comprises:

The liquid supply mechanism comprises a liquid supplementing assembly and a spraying assembly, wherein the liquid supplementing assembly is used for conveying electroplating liquid to the bottom of the electroplating clamp, and the spraying assembly is used for conveying the electroplating liquid to the side face of the electroplating clamp;

The liquid circulation mechanism at least comprises a liquid storage barrel, a circulation pump and a circulation pipeline, wherein the circulation pipeline comprises a circulation liquid supply pipe and a circulation return pipe, the liquid supplementing assembly and the spraying assembly are communicated with the circulation return pipe, the circulation return pipe is connected with a return port of the liquid storage barrel through the circulation pump, one end of the circulation liquid supply pipe is communicated with the liquid storage barrel, and the other end of the circulation liquid supply pipe is communicated with the electroplating bath.

14. The electroplating apparatus of claim 13, wherein an overflow pipe is disposed in the electroplating tank, one end of the overflow pipe penetrates through the bottom of the electroplating tank to be communicated with the circulating liquid supply pipe, and the other end of the overflow pipe is located at a level lower than the top surface of the electroplating tank and higher than the top surface of the anode element.

15. Electroplating apparatus according to claim 14, wherein the mounting bracket is provided with an ultrasonic generator.

16. Electroplating apparatus employing the electroplating jig according to any one of claims 1 to 9, further comprising:

During electroplating, electroplating liquid is contained in the electroplating tank, and the anode part and the to-be-electroplated area of the to-be-electroplated part are immersed in the electroplating liquid;

And the driving mechanism is configured to drive the electroplating clamp to move along the electroplating bath during electroplating.