CN220952133U - Electroplating equipment - Google Patents

Abstract

The application discloses electroplating equipment which comprises an electroplating tank, an electroplating solution tank and a conductive mechanism. Wherein, the plating bath is used for electroplating the film. The conductive mechanism is used for conducting electricity to the two ends of the film. The plating solution tank is arranged at two sides of the plating bath and used for plating solution of the metal attached on the conductive mechanism, and the conductive mechanism is arranged in the plating solution tank. The electroplating equipment solves the problem that the metal deposited on the surface of the conductive mechanism in the prior art can influence the product quality of the conductive film.

Description

Electroplating equipment

Technical Field

The application relates to the technical field of water electroplating, in particular to electroplating equipment.

Background

Electroplating refers to a process of plating a layer of metal or alloy on the surface of metal by utilizing the electrolysis principle, and electroplating is generally used for thickening a copper layer in the preparation process of the composite copper foil. In the electroplating process of the composite copper foil, titanium blue with copper balls is used as an anode, a conductive roller is used for conducting electricity to the film, the film is used as a cathode, and copper is electroplated on the conductive film.

In the process of film electroplating, the surface of the film is provided with a certain plating solution, when the film bypasses the conductive roller to be electroplated, the film is in contact with the conductive roller, and the plating solution is also in contact with the conductive roller, so that the plating solution and the conductive roller are subjected to electroplating reaction, large-area copper is deposited on the surface of the conductive roller, and the deposited copper can cause relatively large influence on the production of the film. One way to solve this problem is to replace the conductive roller with a plurality of conductive wheels. The plurality of conductive wheels are electrified at two ends of the film to prevent the conductive wheels from contacting the film in a large area, so that the deposited copper film on the conductive wheels is influenced.

Although the method has improved the poor quality of coating film that causes that adopts the conductive roller coating film to a certain extent, nevertheless the continuous deposition copper on the conductive wheel still can have an influence on the coating film quality of film, for example when the copper thickness on the conductive wheel is different, the current that receives on the film coating film is inhomogeneous to make the thickness of film on everywhere different problem.

Disclosure of utility model

The application aims to provide electroplating equipment, which at least solves the problem that copper deposited on the surface of a conductive wheel in the prior art can affect the product quality of a conductive film.

According to an aspect of the present application, there is provided an electroplating apparatus comprising:

The electroplating bath is used for electroplating the film;

The conductive mechanism is used for conducting electricity to the two ends of the film;

the plating stripping tanks are arranged at two sides of the plating bath and are used for carrying out plating stripping on the metal attached to the conductive mechanism;

the conductive mechanism is arranged in the plating stripping tank.

Further, an anode part is arranged in the plating bath;

An auxiliary cathode part is arranged in the deplating tank;

a first power supply and a second power supply are arranged outside the electroplating bath, the positive electrode of the first power supply is connected with the anode part, and the negative electrode of the first power supply is connected with the conductive mechanism;

The positive pole of the second power supply is connected with the conductive mechanism, and the negative pole of the second power supply is connected with the auxiliary cathode part.

Further, the plating stripping tank is provided with a first film channel for the film to pass through, the anode parts comprise two anode parts, and the two anode parts are sequentially arranged on the upper side and the lower side of the first film channel along the height direction of the plating stripping tank.

Further, the anode portion includes an anode plate including a plurality of anode sub-plates, and each of the plurality of anode sub-plates is connected to an anode of a first power source of the power source.

Further, be provided with the first film passageway that supplies the film to pass between electrolysis trough and the solution tank, electrically conductive mechanism includes:

a first conductive component;

A second conductive component;

The first conductive component and the second conductive component are sequentially arranged side by side along the height direction of the plating stripping groove, a gap for a film to pass through is formed between the first conductive component and the second conductive component, and the gap is communicated with the first film channel.

Further, the first conductive component and the second conductive component each comprise a plurality of conductive parts, the plurality of conductive parts are arranged in the plating solution tank at intervals along the direction parallel to the first film channel, the plurality of conductive parts of the first conductive component and the second conductive component are arranged in a one-to-one correspondence manner, and a gap is reserved between the two corresponding conductive parts.

Further, the conductive parts include conductive wheels, the corresponding conductive wheels are a first conductive wheel and a second conductive wheel respectively, the electroplating device further includes a driving component, the corresponding two conductive parts are driven by the same driving component, and the driving component includes:

The first synchronous gear is arranged outside the plating bath and is connected with the first conductive wheel through the first rotating shaft;

The second synchronous gear is arranged outside the plating stripping tank and connected with the second conductive wheel through a second rotating shaft, and the second synchronous gear is meshed with the first synchronous gear;

The driving motor is arranged outside the plating solution tank and is in driving connection with the first synchronous gear and/or the second synchronous gear.

Further, an overflow groove is arranged on one side of the plating solution tank far away from the plating bath, and an overflow channel is arranged at the bottom of one side of the plating solution tank close to the overflow groove.

Further, the bottom of the overflow tank is communicated with the bottom of the electroplating tank through a backflow channel, and a control component for controlling the on-off of the backflow channel is arranged on the backflow channel.

Further, along the working direction of electroplating equipment, both sides of electroplating bath all are provided with the transition groove, are provided with the second film passageway that supplies the film to pass on the transition groove, and second film passageway and first film passageway intercommunication, and be provided with the transmission subassembly that is used for carrying out the transmission to the film in the transition groove.

Compared with the prior art, the technical scheme of the application has at least the following technical effects: the film is electroplated with a metal layer under the action of the electroplating liquid, and the conductive mechanism is also affected by the electroplating liquid, so that the conductive mechanism is electroplated with metal. However, the solution in the solution plating tank can cause the metal electroplated on the conductive mechanism to be subjected to solution plating, so that the influence of the metal deposited on the conductive mechanism on the film plating quality of the film is avoided to a certain extent.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

FIG. 1 is a schematic view of a structure of an electroplating apparatus according to the present disclosure;

FIG. 2 is a schematic view showing a part of the structure of the plating apparatus disclosed in the present application;

FIG. 3 is a cross-sectional view of the electroplating apparatus of the present disclosure;

FIG. 4 is a cross-sectional view of a plating cell and a transition cell of the plating apparatus of the present disclosure;

FIG. 5 is a cross-sectional view of an isopipe and transition trough of the disclosed electroplating apparatus;

fig. 6 is a cross-sectional view of a transition tank of the electroplating apparatus of the present disclosure.

Wherein the above figures include the following reference numerals:

10. Plating bath; 11. an anode portion; 12. a first film channel; 13. a total liquid inlet; 14. a plating solution outlet; 15. a shunt port; 20. a deplating tank; 21. an auxiliary cathode portion; 30. a conductive mechanism; 31. a first conductive wheel; 32. a second conductive wheel; 40. an overflow trough; 41. an overflow channel; 42. a solution outlet; 50. a transition groove; 51. a second film channel; 52. a transmission assembly; 61. a first rotating shaft; 62. a second rotating shaft; 71. a first synchronizing gear; 72. and a second synchronizing gear.

Detailed Description

It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the authorization specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

In order to solve the problem that copper deposited on the surface of a conductive wheel in the electroplating process of the conventional electroplating equipment can affect the product quality of a conductive film, according to the embodiment of the application, the electroplating equipment is provided. As shown in fig. 1, the plating apparatus includes a plating tank 10, a plating solution tank 20, and a conductive mechanism 30.

Wherein the plating tank 10 is used for plating a thin film. The conductive mechanism 30 is used to conduct electricity to both ends of the film. The plating solution tank 20 is disposed at both sides of the plating tank 10, and is used for plating the metal adhering to the conductive mechanism 30, and the conductive mechanism 30 is disposed in the plating solution tank 20.

Specifically, the film is electroplated with a metal layer by the electroplating solution in the electroplating tank 10, and the conductive mechanism 30 is also affected by the electroplating solution, so that the conductive mechanism 30 is also electroplated with metal. However, the plating solution in the plating bath 20 can cause the metal plated on the conductive mechanism 30 to be plated, thereby avoiding the influence of the metal deposited on the conductive mechanism 30 on the quality of the film plating.

In one embodiment of the present embodiment, the plating solution stored in the plating bath 20 can plate the metal attached to the conductive mechanism 30. Specifically, the thin film is a conductive thin film, and the plating solution is a liquid that flows into the plating solution tank 20 after the plating of the plating solution. In operation of the plating apparatus of the present embodiment, the thin film is immersed in the plating solution and electrically connected to the anode in the plating tank 10, and the conductive mechanism 30 is in contact with the thin film as the cathode, so that the metal ions in the plating solution are reduced to metal and deposited on the thin film, thereby forming a metal layer. Meanwhile, in this embodiment, there are two plating solution tanks 20, the conductive mechanisms 30 are respectively disposed in the two plating solution tanks 20, the conductive mechanisms 30 conduct electricity to the two ends of the thin film, and the conductive mechanisms 30 are immersed in the plating solution. When the thin film is electroplated, the conductive mechanism 30 is also used as a cathode of the electroplating tank 10 under the action of the stripping solution, so that the conductive mechanism 30 is attached with metal. However, since the conductive mechanism 30 serves as an anode in the plating bath 20, the metal deposited on the conductive mechanism 30 is re-plated into ions, thereby avoiding the deposition of metal on the conductive mechanism 30 to some extent to affect the film plating quality.

Further, an anode portion 11 is provided in the plating vessel 10. The plating bath 20 is provided with an auxiliary cathode portion 21. The plating tank 10 is provided with a first power source (not shown) and a second power source (not shown), and the anode of the first power source is connected to the anode portion 11 and the cathode of the first power source is connected to the conductive mechanism 30. The positive electrode of the second power supply is connected to the conductive mechanism 30, and the negative electrode of the second power supply is connected to the auxiliary cathode portion 21.

Specifically, in the plating tank 10, the conductive mechanism 30 serves as a cathode, so that the conductive mechanism 30 is plated with metal, and in the electroless plating tank 20, the conductive mechanism 30 serves as an anode, so that the metal deposited on the conductive mechanism 30 is subjected to electroless plating. Meanwhile, the relative speed of electroplating and deplating on the conductive mechanism 30 can be changed by controlling the current of the first power supply and the second power supply, so that metal can hardly be deposited on the conductive mechanism 30.

Further, referring to fig. 2, a first thin film passage 12 through which a thin film passes is provided between the plating tank 10 and the plating tank 20, two anode portions 11 are included in this embodiment, and the two anode portions 11 are disposed on the upper side and the lower side of the first thin film passage 12 in order in the height direction of the plating tank 20. This indicates that both sides of the film can be plated with a metal layer during film plating. The first film passage 12 in this embodiment allows the film edge to pass through the plating tank 10 and enter the stripping tank 20, so that the conductive mechanism 30 can supply power to the edges of the two ends of the film, and the first film passage 12 can also supply the electrolyte in the plating tank 10 to enter the stripping tank 20.

Further, the anode portion 11 includes an anode plate including a plurality of anode sub-plates, and the plurality of anode sub-plates are connected to the positive electrode of the first power supply.

Specifically, the anode plate is a structural member formed by splicing a plurality of anode sub-plates on the same horizontal plane, and the anode sub-plates are connected with the positive electrode of the power supply, so that the current density distribution of the film is more uniform at all positions when the film is coated. In one embodiment, the anode plate is a titanium plate. When the titanium plate is used as an electroplating anode, the titanium plate is insoluble in electrolyte, and the service life is long. In this embodiment, the auxiliary cathode portion 21 is also a titanium plate, and the titanium plate is stable in chemical properties when used as a cathode, and therefore can be used for a long period of time. It should be noted that, since the auxiliary cathode portion 21 is continuously electroplated with metal, the stripping effect of the conductive mechanism 30 in the stripping tank 20 is affected, and therefore the auxiliary cathode portion 21 needs to be replaced after a certain period of use when the electroplating apparatus is actually operated. Meanwhile, in the present embodiment, the metal ions may be provided by an electrolyte, for example, a copper sulfate solution may be used as the plating solution in the case of plating the copper layer. Alternatively, in the present embodiment, the titanium plate of the anode portion 11 may be replaced with titanium blue and a metal ball.

As shown in fig. 1, in the present embodiment, the conductive mechanism 30 includes a first conductive member and a second conductive member. The first conductive component and the second conductive component are sequentially arranged side by side along the height direction of the plating solution tank 20, and a gap for the thin film to pass through is formed between the first conductive component and the second conductive component, and the gap is communicated with the first thin film channel 12. This means that the first and second conductive members can supply power to both sides of the film, respectively, during electroplating, and that the first and second conductive members can also provide a clamping action on the edges of the ends of the film, preventing the film from coming into contact with the conductive mechanism 30 during operation of the electroplating apparatus. In addition, the first film passage 12 penetrates the plating tank 10 along the film conveying direction, and the edges of the two ends of the film can penetrate the first film passage 12 into the plating stripping tank 20 and be clamped in the gap between the first conductive component and the second conductive component.

Further, the first conductive component and the second conductive component each include a plurality of conductive portions, the plurality of conductive portions are disposed in the plating solution tank 20 at intervals along a direction parallel to the first film channel 12, the plurality of conductive portions of the first conductive component and the second conductive component are disposed in one-to-one correspondence, and a gap is formed between the two corresponding conductive portions. On the one hand, the plurality of conductive parts can enable the current in all directions of the film to be more uniform, and the coating quality is improved. On the other hand, the plurality of conductive parts can also play a supporting role on the film surface everywhere, so that the film coating areas of the film are positioned on the same horizontal plane, and the film coating quality is improved. Second, the plurality of conductive portions also have a transmission effect on the film. Of course, in the present embodiment, the conductive portions of the first conductive element and the second conductive element in the plating solution tank 20 may be at least one, for example, the conductive portions of the first conductive element and the second conductive element each include only one conductive roller, or the plating solution tank 20 has only one conductive portion, and the conductive portions are conductive clips.

In addition, the electroplating device also comprises a driving component, and the two corresponding conductive parts are driven by the same driving component. Specifically, the conductive portion can not only supply current to the film but also transmit the current to the film so that the plating can act on the plating region of the film. The conductive portions are driven by the driving member, and in the present embodiment, the corresponding two conductive portions are driven by the same driving portion. This means that only one driving member is required between the conductive portions of the first conductive member and the second conductive member arranged side by side in the height direction of the plating apparatus to drive both conductive portions. Compared with the prior art that one conductive part needs one driving part for driving, the structure reduces the production cost of electroplating equipment to a certain extent.

Further, as shown in fig. 3 and 5, the conductive part includes conductive wheels, and the corresponding conductive wheels are a first conductive wheel 31 and a second conductive wheel 32, respectively, and the driving part includes: a first synchronizing gear 71, a second synchronizing gear 72, and a driving motor (not shown in the drawing). Wherein the first synchronizing gear 71 is disposed outside the plating bath 20 and connected to the first conductive wheel 31 through the first shaft 61. The second synchronizing gear 72 is disposed outside the plating bath 20 and connected to the second conductive wheel 32 through the second rotating shaft 62, and the second synchronizing gear 72 is engaged with the first synchronizing gear 71. The drive motor is arranged outside the plating tank 20 and is in driving connection with the first and/or second synchronization gear 71, 72.

It should be noted that "the driving motor is in driving connection with the first synchronous gear 71 and/or the second synchronous gear 72" means one of three cases that the driving motor is in driving connection with the first synchronous gear 71, the driving motor is in driving connection with the second synchronous gear 72, and the driving motor is in driving connection with the first synchronous gear 71 and the second synchronous gear 72. In a specific embodiment, the driving motor is in driving connection with the first synchronous gear 71, and the corresponding first synchronous gear 71 and the second synchronous gear 72 are meshed, and the second synchronous gear 72 rotates along with the first synchronous gear 71, so that the second conductive wheel 32 rotates synchronously with the first conductive wheel 31. Further, the driving motor is arranged outside the plating solution removing tank 20, so that the plating solution is prevented from contacting with the driving motor, and the driving motor is prevented from being damaged. In addition, the first and second synchronous gears 71 and 72 are disposed outside the plating solution tank 20 to prevent the first and second synchronous gears 71 and 72 from contacting the plating solution, and to prevent the first and second synchronous gears 71 and 72 from being plated with metal, thereby causing the first and second synchronous gears 71 and 72 to be stuck.

As shown in fig. 5, an overflow tank 40 is provided on the side of the plating tank 20 away from the plating tank 10, and an overflow passage 41 is provided at the bottom of the side of the plating tank 20 close to the overflow tank 40. Specifically, the plating solution in the plating bath 20 can flow into the overflow vessel 40 through the overflow channel 41 and out of the plating apparatus in the overflow vessel 40, avoiding excessive plating solution in the plating bath 20. In the present embodiment, a mounting passage is provided on the side wall between the overflow tank 40 and the plating tank 20 for mounting the auxiliary cathode portion 21, and the mounting passage is provided between the driving member and the overflow passage 41. Further, in order to prevent the driving member from coming into contact with the deplating solution, the driving member is provided in the overflow vessel 40 with a predetermined distance from the bottom surface of the overflow vessel 40 in the height direction of the plating apparatus. It should be noted that the predetermined distance in this embodiment is a distance higher than the highest level of the plating solution in the overflow trough. In addition, the overflow path 41 is provided at the bottom of the side of the plating bath 20 near the overflow bath 40, preventing the plating bath from overflowing from the upper end of the side wall of the plating bath 20, thereby affecting the driving part.

Further, the bottom of the overflow tank 40 is communicated with the bottom of the plating tank 10 through a return passage (not shown), and a control member (not shown) for controlling the on-off of the return passage is provided on the return passage.

Specifically, the solution outlet 42 of the overflow tank 40 is communicated with the return channel, the total inlet 13 of the plating tank 10 is communicated with the return channel, and as shown in fig. 2 and fig. 4, a plurality of shunt ports 15 extending along a direction perpendicular to the film conveying direction are further provided in the plating tank 10 at intervals, and the shunt ports 15 are communicated with the total inlet 13, so that the plating solution entering the plating tank 10 is uniformly mixed throughout the plating tank 10. Meanwhile, a plating solution outlet 14 is formed in the bottom of the plating tank 10 for controlling the level of the plating solution in the plating tank 10. Still further, in operation of the plating apparatus of the present application, the plating solution is continuously replenished from the total solution inlet 13 at the bottom of the plating tank 10, and the replenished plating solution moves upward from the bottom of the plating tank 10 and is fully mixed with the plating solution in the plating tank 10, and when reaching the position of the thin film passage, plating with the thin film occurs, and then part of the plating solution overflows into the plating solution tank 20 through the first thin film passage 12. At this time, the concentration of the liquid in the plating tank 20 is lower than that in the plating tank 10, which is more advantageous for the plating stripping of the conductive mechanism 30. When the conductive mechanism 30 is deplating, part of the deplating solution flows into the overflow groove 40 through the overflow channel 41, finally flows into the reflux channel through the deplating solution outlet 42 and is refluxed into the electroplating tank 10 under the control of the control component, thereby realizing the circulation of the plating solution and reducing the consumption of the plating solution.

Further, as shown in fig. 6, along the working direction of the electroplating apparatus, both sides of the electroplating tank 10 are provided with a transition tank 50, a second film channel 51 for passing a film is provided on the transition tank 50, the second film channel 51 is communicated with the first film channel 12, and a transmission assembly 52 for transmitting the film is provided in the transition tank 50. Specifically, the film enters one transition tank 50 through the second film passage 51, is transferred into the plating tank 10 for plating under the action of the transfer assembly 52 of the transition tank 50, and then enters the transition tank 50 at the other end after the plating is completed, and leaves the plating apparatus through the second film passage 51 under the action of the transfer assembly. Wherein the working direction refers to the transport direction of the film. The transport assemblies 52 on both sides of the transition tank 50 serve to transport and support the film in the operating direction of the plating apparatus. Meanwhile, the transfer assembly 52 may be provided as a tension roller for adjusting the tension of the film. Similarly, a tension detecting device may be further disposed in the transition groove 50 to detect the tension of the film so as to adjust the tension of the film. Alternatively, the conveyor assembly may be a idler.

On the other hand, a plurality of electroplating devices of the embodiment can be connected in series for electroplating, and metal layers with different thicknesses can be electroplated on the film according to different numbers of electroplating devices.

Spatially relative terms, such as "above … …," "above … …," "upper surface on … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present application.

The above is only a preferred embodiment of the present application, and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. An electroplating apparatus, comprising:

A plating tank (10), wherein the plating tank (10) is used for plating a film;

A conductive mechanism (30), wherein the conductive mechanism (30) is used for conducting electricity to two ends of the film;

a stripping tank (20), wherein the stripping tank (20) is arranged at two sides of the plating tank (10) and is used for stripping the metal attached on the conductive mechanism (30);

the conductive mechanism (30) is arranged in the plating solution tank (20).

2. Electroplating apparatus according to claim 1, wherein an anode portion (11) is provided in the electroplating bath (10);

an auxiliary cathode part (21) is arranged in the plating stripping tank (20);

A first power supply and a second power supply are arranged outside the electroplating bath (10), the positive electrode of the first power supply is connected with the anode part (11), and the negative electrode of the second power supply is connected with the conductive mechanism (30);

The positive electrode of the second power supply is connected with the conductive mechanism (30), and the negative electrode of the second power supply is connected with the auxiliary cathode part (21).

3. Electroplating apparatus according to claim 2, wherein a first film passage (12) through which the film passes is provided between the electroplating bath (10) and the deplating bath (20), the anode parts (11) comprise two, and the two anode parts (11) are disposed in order on the upper side and the lower side of the first film passage (12) in the height direction of the deplating bath (20).

4. A plating apparatus according to claim 3, wherein said anode portion comprises an anode plate, said anode plate comprises a plurality of anode sub-plates, and a plurality of said anode sub-plates are each connected to a positive electrode of said first power source.

5. Electroplating apparatus according to claim 1, wherein a first film passage (12) is provided between the electroplating tank (10) and the de-plating tank (20) through which the film passes, the electrically conductive mechanism (30) comprising:

a first conductive component;

A second conductive component;

the first conductive components and the second conductive components are sequentially arranged side by side along the height direction of the plating stripping groove (20), a gap for the thin film to pass through is formed between the first conductive components and the second conductive components, and the gap is communicated with the first thin film channel (12).

6. The plating apparatus according to claim 5, wherein each of said first conductive member and said second conductive member includes a plurality of conductive portions, a plurality of said conductive portions being disposed in said plating solution tank (20) at intervals in a direction parallel to said first thin film passage (12), a plurality of said conductive portions of said first conductive member and said second conductive member being disposed in one-to-one correspondence with said gap therebetween.

7. Electroplating apparatus according to claim 6, wherein the conductive portions comprise conductive wheels, corresponding conductive wheels being a first conductive wheel (31) and a second conductive wheel (32), respectively, the electroplating apparatus further comprising a drive member by which the corresponding two conductive portions are driven, the drive member comprising:

A first synchronous gear (71), wherein the first synchronous gear (71) is arranged outside the Jie Ducao (20) and is connected with the first conductive wheel (31) through a first rotating shaft (61);

A second synchronous gear (72), wherein the second synchronous gear (72) is arranged outside the Jie Ducao (20) and is connected with the second conductive wheel (32) through a second rotating shaft (62), and the second synchronous gear (72) is meshed with the first synchronous gear (71);

The driving motor is arranged outside the Jie Ducao (20), and is in driving connection with the first synchronous gear (71) and/or the second synchronous gear (72).

8. Electroplating apparatus according to claim 1, wherein an overflow tank (40) is provided on the side of the de-plating tank (20) remote from the electroplating tank (10), and an overflow channel (41) is provided at the bottom of the side of the de-plating tank (20) close to the overflow tank (40).

9. Electroplating apparatus according to claim 8, wherein the bottom of the overflow tank (40) is in communication with the bottom of the electroplating tank (10) via a return channel, and the return channel is provided with a control member for controlling the on-off of the return channel.

10. Electroplating apparatus according to any one of claims 3 to 7, wherein a transition trough (50) is provided on both sides of the electroplating bath (10) in the working direction of the electroplating apparatus, a second film passage (51) through which the film passes is provided on the transition trough (50), the second film passage (51) is in communication with the first film passage (12), and a transport assembly (52) for transporting the film is provided in the transition trough (50).