CN105543940B - A kind of device and method of lifting VCP plating line electroplating evenness - Google Patents
A kind of device and method of lifting VCP plating line electroplating evenness Download PDFInfo
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- CN105543940B CN105543940B CN201510965086.6A CN201510965086A CN105543940B CN 105543940 B CN105543940 B CN 105543940B CN 201510965086 A CN201510965086 A CN 201510965086A CN 105543940 B CN105543940 B CN 105543940B
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- electroplating
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- bar
- kickboard
- circuit board
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of device of lifting VCP plating line electroplating evenness, including, electroplating bath, electroplating liquid medicine is filled with inside the electroplating bath, winged bar is provided with above the electroplating bath, the fixture for clamping circuit board is fixed with described winged bar, each winged bar is made of at least three fixture, each bar upper adjoining clips that fly are electrically connected with conducting wire, and adjacent winged bar is electrically connected with conducting wire.It is described fly bar, jig main body material be stainless steel, it is electrically conductive.Adjacent fixture, winged bar are electrically connected with conducting wire, resistance is reduced, improves electroplating efficiency, meanwhile, source current, which is averaged, is assigned to each fixture, effectively reduces the very poor of copper electroplating layer thickness, greatly improves the electroplating evenness of circuit board.A kind of method of lifting VCP plating line electroplating evenness is also disclosed, between fixture on the basis of mutual Electricity Federation, electroplating voltage, electric current is adjusted, further improves the electroplating evenness of circuit board.
Description
Technical field
The invention belongs to printed circuit board technology field, relates in particular to a kind of lifting VCP plating line electroplating evenness
Device and electro-plating method.
Background technology
The electronic production line of vertical continuous (Vertical Conveyor Plating, abbreviation VCP) is printed circuit board
Using injection copper-plating technique and the full plate of vertical continuous conveying device in (Printed Circuit Board, abbreviation PCB) production
(once) copper plating production line, compared with traditional vertical plating production line, its floor space is small, has stable plating efficiency；
In electroplating process, circuit board is held on fixture, and all workpiece mobile device driving under continuously from the one of electroplating bath
Sidesway is toward opposite side, and the working condition of every workpiece is identical, and circuit board is in electroplating cell body by the way of continuous moving
It is mobile, without departing from liquid, be not exposed in air, can upper and lower plate the degree of automation height automatically, and it is low in energy consumption, operate steadily.
The key of printed circuit board plating is to ensure that coating is uniform inside circuit board two sides and via hole, the uniformity of coating
Always it is the important indicator of evaluation plating efficiency, for conventional vertical continuously in electronic production line, circuit board clamp is connected to stainless steel
On crossbearer, conduction is connected by stainless steel crossbearer between fixture, but mutually Electricity Federation, this device are not asked there are following between fixture
Topic：(1) stainless steel crossbearer poorly conductive, current utilization rate is low, influences electroplating efficiency；(2) it is separately positioned between fixture, not mutually
Connection so that folder points disunity, current distribution is uneven on circuit board, it is larger to ultimately result in copper electroplating layer thickness difference, and plating is equal
Even property can not ensure, it is big to electroplate the probability of failure, and electroplating solution is of high cost.
The content of the invention
For this reason, the technical problems to be solved by the invention are in existing VCP plating lines, by not between circuit board clamp
Steel crossbearer connection of becoming rusty is conductive, mutual not Electricity Federation between fixture, and stainless steel crossbearer poorly conductive, current utilization rate are low, between fixture not
Interconnection causes current distribution is uneven on circuit board, and finally so that plating thickness is uneven, electroplating efficiency is low, so as to propose that one kind carries
Rise the device and method of VCP plating line electroplating evenness.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides a kind of device of lifting VCP plating line electroplating evenness, including electroplating bath, inside the electroplating bath
Electroplating liquid medicine is filled with, winged bar is provided with above the electroplating bath, the fixture for clamping circuit board is fixed with described winged bar,
Each it is made of at least three fixture for winged bar, each bar upper adjoining clips that fly are electrically connected with conducting wire, and adjacent winged bar is electrically connected with conducting wire
Connect.
Preferably, the conducting wire is encapsulated copper conductor, resistance is 5-8 between the adjoining clips after conducting wire connection
Milliohm.
Preferably, the kickboard that can be lifted along the electroplating bath short transverse, the kickboard are provided with the electroplating bath
Top is provided with two pieces of anode baffles.
Preferably, the kickboard is connected to kickboard elevating lever, the kickboard elevating lever is used for the height for adjusting the kickboard
Degree；The space of circuit board can be accommodated by being left between the anode baffle.
Preferably, it is provided with regulation scale at the top of the kickboard elevating lever.
It is described to fly bar to be fixed on the guide rail, on chain preferably, further include guide rail, chain, the guide rail and chain
Described winged bar is driven to do shuttling movement above the electroplating bath.
Preferably, fixed described winged bar of guide rail centre position and the anode of supply unit connect.
Fly bar and the main material of the fixture is stainless steel preferably, described.
The present invention also provides a kind of method of lifting VCP plating line electroplating evenness, include the following steps,
Circuit board to be electroplated, be held on the fixture by S1, flies bar to move circuit board described in the plating chain-driving
Into electroplating bath, the kickboard elevating lever according to the size adjusting of circuit board, and then adjust the height of kickboard and anode baffle；
S2, connect power supply and set electroplating voltage, electric current, starts to electroplate.
Preferably, in the step S2, electroplating voltage is not more than 1.54V, current density for the voltage at each fixture
For 3.0-3.5ASD.
The above technical solution of the present invention has the following advantages over the prior art：
(1) device of lifting VCP plating line electroplating evenness of the present invention, including electroplating bath, inside are filled with electricity
Plating liquid medicine, electroplating bath top set winged bar to be driven under guide rail, chain effect, are fixed with described winged bar and are used to clamp electricity
The fixture of road plate, each flies bar device and is made of at least three fixture, and each adjoining clips are electrically connected in winged bar device, adjacent folder
Have device to be electrically connected.Adjacent fixture, clamping device are electrically connected with conducting wire, reduce resistance, improves electroplating efficiency, together
When, source current, which is averaged, is assigned to each fixture, effectively reduces the very poor of copper electroplating layer thickness, greatly improves circuit board
Electroplating evenness.
(2) device of lifting VCP plating line electroplating evenness of the present invention, further includes what can be lifted along short transverse
Kickboard, is provided with two pieces of anode baffles in kickboard, circuit board to be electroplated is placed in the gap between two pieces of anode baffles, Ke Yitong
The height for overregulating kickboard and anode baffle handles various sizes of circuit board, without electroplating device is needed to change, reduces and is produced into
This, improves production efficiency.
(3) method of lifting VCP plating line electroplating evenness of the present invention, the basis of mutual Electricity Federation between fixture
On, electroplating voltage, electric current are adjusted, further improves the electroplating evenness of circuit board.
Brief description of the drawings
In order to make the content of the present invention more clearly understood, the specific embodiment below according to the present invention and combination
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is winged bar of structure diagram described in the embodiment of the present invention；
Fig. 2 is the structure diagram of the fixture described in the embodiment of the present invention；
Fig. 3 is the apparatus structure schematic diagram of the lifting electroplating evenness described in the embodiment of the present invention.
Reference numeral is expressed as in figure：1- electroplating baths；2- flies bar；3- fixtures；4- conducting wires；5- kickboards；6- anode baffles；7-
Kickboard elevating lever；8- regulation scales；9- jet pipes.
Embodiment
Embodiment
The present embodiment provides a kind of device of lifting VCP plating line electroplating evenness, as shown in Figs. 1-3, including electroplating bath
1, the electroplating bath 1 is square groove, and electroplating liquid medicine is filled with inside groove, and the top of electroplating bath 1 is provided with winged bar 2, and described winged bar 2 is consolidated
Due on guide rail and chain, shuttling movement is done above the electroplating bath 1 for winged bar 2 described in the guide rail and chain-driving, it is fixed
Fly bar 2 guide rail centre position and the anode of installation's power source connects, be fixedly installed on described winged bar 2 and be useful for clamping circuit board
Fixture 3, each winged bar device be made of at least three fixtures 3, it is described fly bars 2 and 3 main material of fixture be stainless steel, can lead
Electricity, it is each to fly bars 2 and be made of three fixtures 3 in the present embodiment, it is each fly bars 2 in adjoining clips 3 be electrically connected by conducting wire 4, together
Shi Xianglin is electrically connected between flying bars 2 also by conducting wire 4, and the conducting wire 4 is encapsulated copper conductor, the electricity after connection between adjoining clips 3
Hinder for 5-8 milliohms, in the present embodiment, the resistance is 6 milliohms；
The kickboard 5 that can be lifted along 1 short transverse of electroplating bath is additionally provided with electroplating bath 1, kickboard 5 is two pieces, respectively
It is connected on kickboard elevating lever 7, the kickboard elevating lever 7 can control kickboard 5 to be adjusted along the position in short transverse, be arranged at institute
The lifting distance of kickboard 5 can be measured by stating the regulation scale 8 at the top of kickboard elevating lever 7, be accurately positioned kickboard 5, described in every piece
Put in kickboard 5 and be provided with anode baffle 6, the gap that can accommodate circuit board is left between anode baffle 6.Can be by adjusting kickboard
5 and the height of anode baffle 6 handle various sizes of circuit board, without electroplating device is needed to change, reduce production cost, improve
Production efficiency.
The present embodiment also provides a kind of method of lifting VCP plating line electroplating evenness, it includes the following steps,
Circuit board to be electroplated, be held on the fixture 3 by S1, and fixture 3, which is fixed on, flies bars 2, guide rail and chain-driving institute
State winged bar 2 and circuit board is moved into 1 position of electroplating bath, and adjust kickboard elevating lever 7, and then adjust the height of kickboard 5 and anode baffle 6
Degree is to suitable position, the gap for making circuit board be placed between the anode baffle 6；
S2, connection power supply, the cathode of power supply are connected with the anode in electroplating bath, and the anode of power supply passes through winged bar and fixture
With circuit board communication, circuit board is become anode, electroplating voltage, electric current be set, the jet pipe 9 in electroplating bath 1 is sprayed to circuit board
Electroplate liquid, starts to electroplate, and the voltage that magnitude of voltage is arranged at each fixture is not more than 1.54V, current density 3.0-3.5ASD,
It is 3.2ASD in the present embodiment.
Fixture 3 on each winged bar 2, adjacent winged bar 2 are electrically connected by the present embodiment with conducting wire 4, between reduction fixture 3 and are flown
Resistance between bars 2, improves electroplating efficiency, source current, which is averaged, is assigned to each fixture 3, while adjusts the electricity in electroplating work procedure
Current voltage parameter, effectively reduces the very poor of copper electroplating layer thickness, greatly improves the electroplating evenness of circuit board.
Obviously, the above embodiments are merely examples for clarifying the description, and the restriction not to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (4)
1. a kind of device of lifting VCP plating line electroplating evenness, including electroplating bath, plating medicine is filled with inside the electroplating bath
Water, it is characterised in that winged bar is provided with above the electroplating bath；The fixture for clamping circuit board is fixed with described winged bar,
Each it is made of at least three fixture for winged bar, each bar upper adjoining clips that fly are electrically connected with conducting wire, and adjacent winged bar is electrically connected with conducting wire
Connect；The kickboard that can be lifted along the electroplating bath short transverse is provided with the electroplating bath, two pieces are provided with above the kickboard
Anode baffle, the kickboard are connected to kickboard elevating lever, and the kickboard elevating lever is used for the height for adjusting the kickboard；The sun
The space of circuit board can be accommodated by being left between the baffle of pole；The conducting wire is encapsulated copper conductor, the phase after conducting wire connection
Resistance is 5-8 milliohms between adjacent fixture；Regulation scale is provided with the top of the kickboard elevating lever；Among fixed described winged bar of guide rail
The anode of position and supply unit connects.
2. the device of lifting VCP plating line electroplating evenness according to claim 1, it is characterised in that further include guide rail,
Chain, it is described to fly bar to be fixed on the guide rail, on chain, fly described in the guide rail and chain-driving bar above the electroplating bath
Do shuttling movement.
3. the device of lifting VCP plating line electroplating evenness according to claim 2, it is characterised in that it is described fly bar and
The main material of the fixture is stainless steel.
4. a kind of method using such as claim 1-3 any one of them device lifting VCP plating line electroplating evenness, it is special
Sign is, includes the following steps,
Circuit board to be electroplated, be held on the fixture by S1, flies bar circuit board to be moved to electricity described in the plating chain-driving
In coating bath, the kickboard elevating lever according to the size adjusting of circuit board, and then adjust the height of kickboard and anode baffle；
S2, connect power supply and set electroplating voltage, electric current, starts to electroplate；
In the step S2, electroplating voltage is not more than 1.54V, current density 3.0-3.5ASD for the voltage at each fixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510965086.6A CN105543940B (en) | 2015-12-21 | 2015-12-21 | A kind of device and method of lifting VCP plating line electroplating evenness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510965086.6A CN105543940B (en) | 2015-12-21 | 2015-12-21 | A kind of device and method of lifting VCP plating line electroplating evenness |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105543940A CN105543940A (en) | 2016-05-04 |
| CN105543940B true CN105543940B (en) | 2018-04-27 |
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| CN201510965086.6A Active CN105543940B (en) | 2015-12-21 | 2015-12-21 | A kind of device and method of lifting VCP plating line electroplating evenness |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109972188A (en) * | 2017-12-28 | 2019-07-05 | 亚硕企业股份有限公司 | The movable protective mechanism of electroplating device |
| CN110724987A (en) * | 2019-11-07 | 2020-01-24 | 珠海市凯诺微电子有限公司 | VCP copper plating method |
| CN110760917B (en) * | 2019-11-29 | 2024-05-24 | 无锡星亿智能环保装备股份有限公司 | Elastic conductive device for electroplating line |
| CN115928180A (en) * | 2022-12-31 | 2023-04-07 | 广东兴达鸿业电子有限公司 | Device and method for improving electroplated layer uniformity of vertical electroplating line of printed circuit board |
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| JPS5989799A (en) * | 1982-11-15 | 1984-05-24 | Hitachi Ltd | Plating jig |
| CN2579913Y (en) * | 2002-11-25 | 2003-10-15 | 瑞盈机电有限公司 | Floating type anode cover plate |
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| CN105543940A (en) | 2016-05-04 |
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