CN110724987A - VCP copper plating method - Google Patents
VCP copper plating method Download PDFInfo
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- CN110724987A CN110724987A CN201911084585.9A CN201911084585A CN110724987A CN 110724987 A CN110724987 A CN 110724987A CN 201911084585 A CN201911084585 A CN 201911084585A CN 110724987 A CN110724987 A CN 110724987A
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- washing
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- copper plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a VCP copper plating method for producing an aluminum-based film-coated plate of a rigid-flex board, which comprises the steps of S1, removing oil; s2, primary spraying and washing; s3, acid washing; s4, secondary spraying and water washing, washing the washed board surface and the through holes, and removing residual pickling liquid medicine in the board surface and the through holes, wherein the pickling liquid medicine is known in the technical field; s5, copper plating, namely electrifying the plating piece, placing the plating piece in an electroplating solution, and electroplating copper on the plate surface and the through hole to form a copper plating layer, wherein the electroplating solution comprises 70-90g/L copper sulfate, 180-200g/L sulfuric acid, 180-200g/L chlorine ion, 5-15ml/L copper plating brightener and 1-3ml/L copper plating leveling agent; s6, carrying out spray washing for the third time; s7, microetching; s8, spraying and washing for four times; s9, antioxidation; s10, carrying out five times of spray water washing; and S11, drying. Effectively reduces the copper range of the copper plated hole and greatly improves the copper plating TP value and the uniformity of the electroplated copper.
Description
Technical Field
The invention belongs to the technical field of copper plating, and particularly relates to a VCP copper plating method.
Background
With the development of the FPC and the PCB, the single products of the FPC and the PCB can not meet the functional requirements of the products, so that a Rigid-Flex PCB (Rigid-Flex PCB) is produced. The rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board together according to process requirements in a fast pressing or combining manner. The rigid-flex circuit board has both flexible characteristics of the FPC and rigid characteristics of the PCB, so that the rigid-flex circuit board has both flexible regions and rigid regions. The rigid-flex board is widely applied to: aerospace, military equipment, computers, medical facilities, consumer electronics, and the like.
In the existing soft and hard combined board, the ratio of the hole copper thickness of the through hole to the surface copper thickness of the board surface is 1:1.1, the TP value is lower, in addition, the hole wall copper thickness of the through hole opening is 20um, the copper thickness of the middle position of the hole wall of the through hole is less than 15um, and the copper plating hole copper is extremely poor, so that the soft and hard combined board with a uniform copper plating layer is manufactured by the existing production process.
Disclosure of Invention
The invention mainly aims to provide a VCP copper plating method for producing a soft and hard combined board with a uniform copper plating layer.
In order to achieve the main object, the invention provides a VCP copper plating method, wherein a plated part is clamped by clamps of copper plating booms, each copper plating booms comprises at least three clamps, the plate part of each copper plating booms is made of brass, the clamps are made of 316 stainless steel and comprise S1, oil is removed, and surface grease and oxide of the plated part are removed; s2, carrying out primary spray washing, wherein the plated part comprises a plate surface and a through hole, and cleaning the plate surface and the through hole to remove residual degreasing agent in the plate surface and the through hole; s3, acid washing, and further removing copper surface oxides; s4, secondary spraying and water washing, washing the plate surface and the through hole after the pickling, and removing pickling liquid medicine remained in the plate surface and the through hole; s5, copper plating, namely electrifying the plating piece, placing the plating piece in an electroplating solution, and electroplating copper on the plate surface and the through hole to form a copper plating layer, wherein the electroplating solution comprises 70-90g/L copper sulfate, 180-200g/L sulfuric acid, 180-200g/L chlorine ion, 5-15ml/L copper plating brightener and 1-3ml/L copper plating leveling agent; s6, carrying out spray washing for three times, washing the plated copper board surface and the through holes, and removing the residual electroplating solution in the board surface and the through holes; s7, microetching, namely placing the plated part in acidic liquid medicine and an oxidizing agent; s8, carrying out spray washing for four times, washing the microetched board surface and the through holes, and removing residual acidic liquid medicine and oxidant in the board surface and the through holes; s9, antioxidation, namely placing the plated part in an organic protective agent; s10, carrying out spray washing for five times to wash the oxidized board surface and the through holes and remove the residual organic protective agent in the board surface and the through holes; and S11, drying, namely, sequentially carrying out air drying and high-temperature drying on the plated part.
According to the scheme, direct current is evenly distributed to each clamp and the plated part, the copper pole difference of the copper plated hole is effectively reduced, and the copper plating TP value and the uniformity of electroplated copper are greatly improved.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
FIG. 1 is a schematic flow chart of a VCP copper plating method according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the VCP copper plating method for producing an aluminum-based coated sheet for a rigid-flex circuit board according to the present embodiment includes clamping a plated article to a copper-plating flying bar clamp, each copper-plating flying bar clamp includes at least three clamps, a plate portion of the copper-plating flying bar clamp is made of brass, the clamp is made of 316 stainless steel, a conveying speed of the plated article is 1.5m/min, and the VCP copper plating method includes S1 removing oil and removing surface grease and oxides of the plated article; s2, performing primary spraying and washing, wherein the plated part comprises a plate surface and a through hole, washing the plate surface and the through hole, and removing residual degreasing agent in the plate surface and the through hole, wherein the degreasing agent is degreasing agent known in the technical field; s3, acid washing, and further removing copper surface oxides; s4, secondary spraying and water washing, washing the washed board surface and the through holes, and removing residual pickling liquid medicine in the board surface and the through holes, wherein the pickling liquid medicine is known in the technical field; s5, copper plating, namely electrifying the plating piece, placing the plating piece in an electroplating solution, and electroplating copper on the plate surface and the through hole to form a copper plating layer, wherein the electroplating solution comprises 70-90g/L copper sulfate, 180-200g/L sulfuric acid, 180-200g/L chlorine ion, 5-15ml/L copper plating brightener and 1-3ml/L copper plating leveling agent; s6, carrying out spray washing for three times, washing the plated copper board surface and the through holes, and removing the residual electroplating solution in the board surface and the through holes; s7, microetching, namely placing the plated part in an acidic liquid medicine and an oxidizing agent, wherein the acidic liquid medicine and the oxidizing agent are prepared by a formula known in the technical field; s8, carrying out spray washing for four times, washing the microetched board surface and the through holes, and removing residual acidic liquid medicine and oxidant in the board surface and the through holes; s9, antioxidation, namely placing the plated part in an organic protective agent, wherein the organic protective agent is a well-known organic protective agent in the technical field; s10, carrying out spray washing for five times to wash the oxidized board surface and the through holes and remove the residual organic protective agent in the board surface and the through holes; and S11, drying, namely, sequentially carrying out air drying and high-temperature drying on the plated part.
Step S2 includes:
step S21, spraying primary water for washing, and cleaning residual degreasing agent on the surface and in the holes after degreasing;
and step S22, spraying and washing for the second time to thoroughly clean the residual degreasing agent on the board surface and in the holes.
Step S4 includes:
step S41, secondary spraying and primary washing, and cleaning the residual pickling solution on the plate surface and in the holes after pickling;
and step S42, secondary spraying and secondary washing, and thoroughly washing the residual pickling liquid medicine on the board surface and in the holes.
Step S6 includes:
step S61, spraying primary water for three times, and cleaning the residual electroplating solution on the surface and in the holes after copper plating;
and step S62, spraying and washing for the second time for the third time to thoroughly clean the plating solution remained on the board surface and in the holes.
Step S8 includes:
step S81, spraying first-level water for four times, and cleaning residual acid liquid medicine and oxidant on the board surface and in the holes after micro etching;
and step S82, spraying secondary water for four times to thoroughly clean the residual acidic liquid medicine and oxidant on the board surface and in the holes.
Step S10 includes:
step S101, spraying primary water for five times, and cleaning organic protective agents remained on the surfaces and in the holes after oxidation resistance;
and S102, spraying secondary water washing for five times to thoroughly clean the organic protective agent remained on the board surface and in the holes.
Direct current is evenly distributed to each clamp and the plated part, so that the copper pole difference of the copper plated hole is effectively reduced, and the copper plating TP value and the uniformity of electroplated copper are greatly improved.
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only the preferred embodiments of the invention have been described above, and the present invention is not limited to the above-described embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A VCP copper plating process wherein a plated item is clamped to a copper-plated femto clamp, each of said copper-plated femto clamp comprising at least three of said clamps, a plate portion of said copper-plated femto clamp being formed of brass and said clamps being formed of 316 stainless steel, said VCP copper plating process comprising:
s1, removing oil, and removing surface grease and oxides of the plated part;
s2, carrying out primary spraying and water washing, wherein the plated part comprises a plate surface and a through hole, and cleaning the plate surface and the through hole to remove residual degreasing agent in the plate surface and the through hole;
s3, acid washing, and further removing copper surface oxides;
s4, secondary spraying and washing, namely, washing the pickled plate surface and the through hole, and removing pickling liquid medicine remained in the plate surface and the through hole;
s5, copper plating, namely electrifying the plating piece, placing the plating piece in an electroplating solution, and electroplating copper on the plate surface and the through hole to form a copper plating layer, wherein the electroplating solution comprises 70-90g/L copper sulfate, 180-200g/L sulfuric acid, 180-200g/L chlorine ion, 5-15ml/L copper plating brightener and 1-3ml/L copper plating leveling agent;
s6, carrying out spray washing for three times, washing the plated copper board surface and the through holes, and removing the residual electroplating solution in the board surface and the through holes;
s7, microetching, namely placing the plated part in acidic liquid medicine and an oxidizing agent;
s8, carrying out spray washing for four times, washing the microetched board surface and the through holes, and removing the residual acidic liquid medicine and the oxidant in the board surface and the through holes;
s9, antioxidation, namely placing the plated part in an organic protective agent;
s10, carrying out spray water washing for five times, washing the plate surface and the through holes after the oxidation resistance, and removing the organic protective agent remained in the plate surface and the through holes;
and S11, drying, namely, sequentially carrying out air drying and high-temperature drying on the plated part.
2. The method of claim 1, further comprising the step of:
the step S2 includes:
step S21, primary spraying and primary washing;
and step S22, spraying and washing for the second time.
3. The method of claim 2, further comprising:
the step S4 includes:
step S41, secondary spraying and primary washing;
and step S42, secondary spraying and secondary washing.
4. A VCP copper plating process according to claim 3, wherein:
the step S6 includes:
step S61, spraying water for the first level for the third time;
and step S62, spraying for the third time and washing for the second time.
5. The method of claim 4, wherein the copper plating process comprises:
the step S8 includes:
step S81, four times of spraying and first-level washing;
and step S82, spraying secondary water washing for four times.
6. The method of claim 5, wherein:
the step S10 includes:
step S101, five times of spraying and primary water washing;
and step S102, five times of secondary water spraying washing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911084585.9A CN110724987A (en) | 2019-11-07 | 2019-11-07 | VCP copper plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911084585.9A CN110724987A (en) | 2019-11-07 | 2019-11-07 | VCP copper plating method |
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| Publication Number | Publication Date |
|---|---|
| CN110724987A true CN110724987A (en) | 2020-01-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911084585.9A Pending CN110724987A (en) | 2019-11-07 | 2019-11-07 | VCP copper plating method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112680755A (en) * | 2020-12-15 | 2021-04-20 | 深圳市瀚鼎电路电子有限公司 | In-hole copper plating method for circuit board hole plugging |
| CN113416991A (en) * | 2021-06-29 | 2021-09-21 | 奥士康精密电路（惠州）有限公司 | Method for preventing VCP electroplated panel from being oxidized |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205000002U (en) * | 2015-07-31 | 2016-01-27 | 东莞市威力固电路板设备有限公司 | Perpendicular continuous electroplating equipment of moduleization |
| CN105543940A (en) * | 2015-12-21 | 2016-05-04 | 深圳崇达多层线路板有限公司 | Device and method for promoting electroplating uniformity of VCP electroplating wire |
| CN110318079A (en) * | 2018-03-28 | 2019-10-11 | 东莞市斯坦得电子材料有限公司 | A kind of VCP copper-plating technique for flexible printed circuit board |
-
2019
- 2019-11-07 CN CN201911084585.9A patent/CN110724987A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205000002U (en) * | 2015-07-31 | 2016-01-27 | 东莞市威力固电路板设备有限公司 | Perpendicular continuous electroplating equipment of moduleization |
| CN105543940A (en) * | 2015-12-21 | 2016-05-04 | 深圳崇达多层线路板有限公司 | Device and method for promoting electroplating uniformity of VCP electroplating wire |
| CN110318079A (en) * | 2018-03-28 | 2019-10-11 | 东莞市斯坦得电子材料有限公司 | A kind of VCP copper-plating technique for flexible printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 张允诚等: "《电镀手册第4版》", 31 December 2011, 国防工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112680755A (en) * | 2020-12-15 | 2021-04-20 | 深圳市瀚鼎电路电子有限公司 | In-hole copper plating method for circuit board hole plugging |
| CN113416991A (en) * | 2021-06-29 | 2021-09-21 | 奥士康精密电路（惠州）有限公司 | Method for preventing VCP electroplated panel from being oxidized |
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Application publication date: 20200124 |
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