CN207079293U - A kind of electroplating device - Google Patents
A kind of electroplating device Download PDFInfo
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- CN207079293U CN207079293U CN201720706993.3U CN201720706993U CN207079293U CN 207079293 U CN207079293 U CN 207079293U CN 201720706993 U CN201720706993 U CN 201720706993U CN 207079293 U CN207079293 U CN 207079293U
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Abstract
The utility model discloses a kind of electroplating device, electroplating bath, hanger mechanism and some plating modules including being equipped with electroplate liquid, the hanger mechanism is located at the top of the electroplating bath, the plating module includes power supply module, anode assemblies and cathode assembly, the input of power supply module is connected with external power source, and the electric current of cathode output end and cathode output end is controlled by the control assembly of inside；Anode assemblies electrically connect with the cathode output end of the power supply module；Cathode assembly electrically connects with the cathode output end of the power supply module, and lower end electrically connects with workpiece；The anode assemblies and the cathode assembly are connected with the hanger mechanism respectively.The electroplating process that each plating module can be directed to the workpiece each connected is controlled, the limitation of the specification and quantity of workpiece is no longer influenced by during plating, using flexible, the corresponding plating module of workpiece that can also be directly to scrapping are adjusted, and avoid batch workpiece from scrapping.
Description
Technical field
It the utility model is related to the technical field of plating, more particularly to a kind of electroplating device.
Background technology
Current electroplating device generally comprises electroplating bath, frame and the overhead traveling crane run along frame in plating stage, on overhead traveling crane
Hanger is set, and workpiece to be electroplated is moved by hanger.Electroplate liquid and anode are equipped with electroplating bath, in plating, hanger meeting
Connected with the negative pole of power supply by connecting line, then connected with workpiece so that workpiece turns into negative electrode.Such a electroplating device needs to hang
By defined spacing workpiece placed side by side on tool, and three workpiece are one group, and the specification of the workpiece of same batch processing will be kept
Unanimously, with influence of the edge effect to electroplating effect when reducing workpiece plating.In addition, for the equipment of batch plating,
The workpiece of plating could start to electroplate when having to reach certain quantity, during electroplating current density with design load difference too
Greatly, electroplating effect is influenceed.Therefore, such a electroplating device can only electroplate same rule in batches after piece count reaches certain amount
The workpiece of lattice, single workpiece can not be adjusted, very flexible, and larger batch workpiece be present and scrap hidden danger.
Utility model content
The purpose of this utility model is to propose a kind of electroplating device, the electroplating process of each workpiece individually can be controlled
System, is not limited, and avoid batch workpiece from scrapping by the specification and number of workpiece.
To use following technical scheme up to this purpose, the utility model：
A kind of electroplating device, including it is equipped with the electroplating bath of electroplate liquid, hanger mechanism and some plating modules, the hanger
Mechanism is located at the top of the electroplating bath, and the plating module includes：Power supply module, anode assemblies and cathode assembly, power supply group
The input of part is connected with external power source, and the electric current of cathode output end and cathode output end is controlled by the control assembly of inside；
Anode assemblies electrically connect with the cathode output end of the power supply module；The cathode output end electricity of cathode assembly and the power supply module
Connection, lower end electrically connects with workpiece；The anode assemblies and the cathode assembly are connected with the hanger mechanism respectively.
Wherein, the quantity of the cathode assembly is one, and the quantity of the anode assemblies is two, and respectively positioned at described
The both sides of cathode assembly.
Wherein, power supply module includes two cathode output ends and a cathode output end, the output of each cathode output end
Electric current independent control, and an anode assemblies are connected respectively.
Wherein, the hanger mechanism includes rack rail, travel mechanism and lifting parts, and the rack rail is located at the electricity
The top of coating bath, the top of the lifting parts are connected with the rack rail by travel mechanism and moved along the rack rail
It is dynamic, anode lifting mechanism and negative electrode hoisting mechanism, the anode lifting mechanism and the anode unit are provided with the lifting parts
Part is connected, and the negative electrode hoisting mechanism is connected with the cathode assembly.
Wherein, the electric connection line connected with external power source, the input of the power supply module are disposed with along the rack rail
End is connected by conduction brush with the electric connection line.
Wherein, the control assembly of the power supply module includes microprocessor and the rectification mould being connected with the microprocessor
Group, the input of the rectification module are connected with the conduction brush, and the microprocessor is also dynamic with the travel mechanism respectively
The power part electrical connection of power part, the power part of the anode lifting mechanism and the negative electrode hoisting mechanism.
Wherein, the power supply module also includes wireless communication module, the wireless communication module and microprocessor electricity
Connection.
Wherein, the bottom of the lifting parts is fixed with fender bracket, and the fender bracket surround what is be connected with the cathode assembly
Workpiece setting.
Beneficial effect：The utility model provides a kind of electroplating device, including is equipped with the electroplating bath of electroplate liquid, hanger machine
Structure and some plating modules, the hanger mechanism are located at the top of the electroplating bath, and the plating module includes：Power supply module,
Anode assemblies and cathode assembly, the input of power supply module are connected with external power source, and positive pole is controlled by the control assembly of inside
The electric current of output end and cathode output end；Anode assemblies electrically connect with the cathode output end of the power supply module；Cathode assembly with
The cathode output end electrical connection of the power supply module, lower end electrically connects with workpiece；The anode assemblies and the cathode assembly point
It is not connected with the hanger mechanism.Electroplating device be integrated with electroplating process by electroplating module required for power supply module, anode
Component and cathode assembly, and each plating module connects a workpiece to be electroplated.In plating, by hanger mechanism by anode
The bottom of component and the workpiece being connected with cathode assembly are put into the electroplate liquid of electroplating bath, and each module of electroplating can be directly against
The electroplating process of the workpiece each connected is controlled, mainly the size of control electric current, according to each workpiece to electroplating
Journey is adjusted.When needing high-volume to electroplate, electroplating device can be arranged as required to some plating modules, to each workpiece
It can individually be precisely controlled, be no longer rely on the spacing of each workpiece to ensure the uniformity of electric current.It therefore, there is no need to be kept for same batch
The specification of the workpiece of amount must be consistent, it is not required that three workpiece form one group, it is not required that the quantity of workpiece meets will
Ask to ensure current density.That is, plating when be no longer influenced by workpiece specification and quantity limitation, using flexible, can also directly
The corresponding plating module of workpiece to scrapping is adjusted, and avoids batch workpiece from scrapping.
Brief description of the drawings
Fig. 1 is the structural representation of electroplating device provided by the utility model.
Wherein：
1- electroplating baths, 2- hangers mechanism, 21- rack rails, 22- travel mechanisms, 23- lifting parts, 231- anode hoisters
Structure, 232- negative electrode hoisting mechanisms, 3- plating modules, 31- power supply modules, 311- conduction brush, 32- anode assemblies, 33- cathode sets
Part, 4- workpiece.
Embodiment
It is clearer for the technical scheme and the technique effect that reaches that make technical problem that the utility model solves, use,
Further illustrate the technical solution of the utility model below in conjunction with the accompanying drawings and by embodiment.
As shown in figure 1, the utility model provides a kind of electroplating device, including it is equipped with electroplating bath 1, the hanger of electroplate liquid
Mechanism 2 and some plating modules 3.Hanger mechanism 2 is located at the top of electroplating bath 1, and plating module 3 includes power supply module 31, anode
Component 32 and cathode assembly 33.The input of power supply module 31 connects with external power source, and is controlled by the control assembly of inside
The electric current of cathode output end and cathode output end.Anode assemblies 32 electrically connect with the cathode output end of power supply module.Cathode assembly
33 electrically connect with the cathode output end of power supply module, and lower end electrically connects with workpiece 4.Anode assemblies 32 and cathode assembly 33 respectively with
Hanger mechanism 2 connects.Specifically, cathode assembly 33 can be electrically connected by certain fixture or hanger etc. with workpiece 4, and
Workpiece 4 is fixed.
Electroplating device of the present utility model be integrated with electroplating process by electroplating module 3 required for power supply module 31, sun
Pole component 32 and cathode assembly 33, cathode assembly 33 connect workpiece 4 to be electroplated.In plating, by hanger mechanism 2 by anode
The bottom of component 32 and the workpiece 4 being connected with cathode assembly 33 are put into the electroplate liquid of electroplating bath 1, and each module 3 of electroplating can be with
It is controlled directly against the electroplating process of each connected workpiece 4, mainly the size of control electric current, according to each workpiece
4 pairs of electroplating process are adjusted.When needing high-volume to electroplate, electroplating device can be arranged as required to some plating modules 3,
Each workpiece 4 can be individually precisely controlled, be no longer rely on the spacing of each workpiece 4 to ensure the uniformity of electric current.Therefore, no
Need to keep the specification of the workpiece 4 of same batch to be consistent, it is not required that three workpiece 4 form one group, it is not required that work
The quantity of part 4 meets to require to ensure current density.That is, plating when be no longer influenced by workpiece specification and quantity limitation, use
Flexibly, the corresponding plating module 3 of workpiece 4 that can also be directly to scrapping is adjusted, and avoids the batch of workpiece 4 from scrapping.
The quantity of cathode assembly 33 of the present utility model can be one, and the quantity of anode assemblies 32 can be two, and
Two anode assemblies 32 are located at the both sides of cathode assembly 33 respectively.Specifically, the obverse and reverse of workpiece 4 corresponds to one respectively
Anode assemblies 32.Such a structure is advantageous to the stabilization of the obverse and reverse electroplating current of workpiece 4, especially when electroplating device is set
When multiple plating modules 3 respectively electroplates to respective workpiece 4, other influences for electroplating modules to workpiece 4 can be avoided.It is right
For two anode assemblies 32, two cathode output ends, the output of each cathode output end can be set in power supply module 31
Electric current independent control, and an anode assemblies 32 are connected respectively.Two anode assemblies 32 of electric current independent control can be adjusted respectively
The plating conditions of the both sides of whole workpiece 4, are further precisely controlled, and obtain more preferable electroplating effect.
Hanger mechanism 2 of the present utility model includes rack rail 21, travel mechanism 22 and lifting parts 23, rack rail 21
In the top of electroplating bath 1, the top of lifting parts 23 is connected with rack rail 21 by travel mechanism 22 and moved along rack rail 21
It is dynamic, anode lifting mechanism 231 and negative electrode hoisting mechanism 232, anode lifting mechanism 231 and anode assemblies are provided with lifting parts 23
32 connections, negative electrode hoisting mechanism 232 are connected with cathode assembly 33.By travel mechanism 22 can with the position in movable lifting portion 23,
Anode assemblies 32 and negative electrode can be controlled respectively by the anode lifting mechanism 231 in lifting parts 23 and negative electrode hoisting mechanism 232
The height of component 33, therefore, pass through whole hanger mechanism 2, it is possible to achieve the movement and lifting of anode assemblies 32 and workpiece 4, it is complete
Into in electroplating process to the carrying of workpiece 4.
Electric energy during in order to introduce plating and required for porter's workpiece 4, electroplating device along rack rail 21 be disposed with
The electric connection line of external power source connection, the input of power supply module 31 is connected by conduction brush 311 with electric connection line, to ensure
When being moved to different positions, it can obtain electric energy and complete corresponding plating or handling process.
The control assembly of power supply module 31 of the present utility model includes microprocessor and the rectification mould being connected with microprocessor
Group, the input of rectification module are connected with conduction brush 311, the microprocessor also power part with travel mechanism 22, anode respectively
The power part electrical connection of the power part and negative electrode hoisting mechanism 232 of hoisting mechanism 231.By microprocessor individually to workpiece
When the handling process of 4 electroplating process sum is controlled, it can be adjusted for different workpiece 4.Spread along rack rail 21
If the resistance of electric connection line in different positions and differ, and power supply module 31 and workpiece 4 are kept individually controlling, jointly
When mobile, the resistance between power supply module 31 and workpiece 4 keeps constant, can avoid the resistance variations of electric connection line to plating electricity
The influence of stream, translational speed during plating can be improved.
Power supply module of the present utility model can also set wireless communication module, and wireless communication module is electrically connected with microprocessor
Connect, then one control centre is set in electroplating workshop, pass through wireless communication module and the radio communication mold on each plating module
Block is connected, and then the electro-plating situation of each workpiece 4 is controlled by each microprocessor.
In order to improve the protection to workpiece 4, inwall when avoiding the workpiece 4 from being moved with cathode assembly 33 with electroplating bath 1 scrapes,
Fender bracket can be fixed in the bottom of lifting parts 23, fender bracket is set around the workpiece 4 being connected with cathode assembly 33, fender bracket 23
Follow plating module and workpiece 4 to move, avoid workpiece 4 from being scraped by collision.
Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality
With new thought, there will be changes, this specification content should not be construed as in specific embodiments and applications
To limitation of the present utility model.
Claims (8)
1. a kind of electroplating device, it is characterised in that electroplating bath (1), hanger mechanism (2) and some electricity including being equipped with electroplate liquid
Module (3) is plated, the hanger mechanism (2) is located at the top of the electroplating bath (1), and the plating module (3) includes：
Power supply module (31), its input connect with external power source, control cathode output end by the control assembly of inside and bear
The electric current of pole output end；
Anode assemblies (32), electrically connected with the cathode output end of the power supply module (31)；
Cathode assembly (33), electrically connected with the cathode output end of the power supply module (31), lower end electrically connects with workpiece (4)；Institute
Anode assemblies (32) and the cathode assembly (33) is stated to be connected with the hanger mechanism (2) respectively.
2. electroplating device as claimed in claim 1, it is characterised in that the quantity of the cathode assembly (33) is one, described
The quantity of anode assemblies (32) is two, and is located at the both sides of the cathode assembly (33) respectively.
3. electroplating device as claimed in claim 2, it is characterised in that it is defeated that the power supply module (31) includes two positive poles
Go out end, the output current independent control of each cathode output end, and connect an anode assemblies (32) respectively.
4. the electroplating device as described in claim any one of 1-3, it is characterised in that the hanger mechanism (2) includes frame rail
Road (21), travel mechanism (22) and lifting parts (23), the rack rail (21) is located at the top of the electroplating bath (1), described
The top of lifting parts (23) is connected with the rack rail (21) by travel mechanism (22) and moved along the rack rail (21)
It is dynamic, it is provided with anode lifting mechanism (231) and negative electrode hoisting mechanism (232), the anode hoister in the lifting parts (23)
Structure (231) is connected with the anode assemblies (32), and the negative electrode hoisting mechanism (232) is connected with the cathode assembly (33).
5. electroplating device as claimed in claim 4, it is characterised in that be disposed with along the rack rail (21) and external power source
The electric connection line of connection, the input of the power supply module (31) are connected by conduction brush (311) with the electric connection line.
6. electroplating device as claimed in claim 5, it is characterised in that the control assembly of the power supply module (31) includes micro- place
Reason device and the rectification module being connected with the microprocessor, the input of the rectification module are connected with the conduction brush (311),
The microprocessor also power part with the travel mechanism (22), the power part of the anode lifting mechanism (231) respectively
The power part of part and the negative electrode hoisting mechanism (232) electrically connects.
7. electroplating device as claimed in claim 6, it is characterised in that the power supply module (31) also includes radio communication mold
Block, the wireless communication module electrically connect with the microprocessor.
8. electroplating device as claimed in claim 7, it is characterised in that the bottom of the lifting parts (23) is fixed with fender bracket,
The fender bracket is set around the workpiece (4) being connected with the cathode assembly (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720706993.3U CN207079293U (en) | 2017-06-16 | 2017-06-16 | A kind of electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720706993.3U CN207079293U (en) | 2017-06-16 | 2017-06-16 | A kind of electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207079293U true CN207079293U (en) | 2018-03-09 |
Family
ID=61425404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720706993.3U Active CN207079293U (en) | 2017-06-16 | 2017-06-16 | A kind of electroplating device |
Country Status (1)
| Country | Link |
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| CN (1) | CN207079293U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107119308A (en) * | 2017-06-16 | 2017-09-01 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
| CN110760918A (en) * | 2019-11-29 | 2020-02-07 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
-
2017
- 2017-06-16 CN CN201720706993.3U patent/CN207079293U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107119308A (en) * | 2017-06-16 | 2017-09-01 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
| CN110760918A (en) * | 2019-11-29 | 2020-02-07 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
| CN110760918B (en) * | 2019-11-29 | 2022-02-18 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
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