CN110760918A - A coating controllable electroplating system - Google Patents
A coating controllable electroplating system Download PDFInfo
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- CN110760918A CN110760918A CN201911205672.5A CN201911205672A CN110760918A CN 110760918 A CN110760918 A CN 110760918A CN 201911205672 A CN201911205672 A CN 201911205672A CN 110760918 A CN110760918 A CN 110760918A
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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Abstract
Description
技术领域technical field
本发明涉及电镀工艺领域,更进一步涉及一种镀层可控电镀系统。The invention relates to the field of electroplating technology, and further relates to a controllable electroplating system for a coating layer.
背景技术Background technique
在传统的电镀工艺中,所有阳极(阳极钛篮或不溶性阳极)都放置在电镀槽的两旁,作为阴极的工件在两旁阳极的中间走过,当电镀电流由阳极经电镀液流向阴极的时候,镀层就会在工件的表面形成。然而,在这种形式的电镀工艺中,由于整个电镀活动的规模存在于所有的工件和所有阳极之间,因此不同工件的镀层分布和厚度都会有一定程度的分别,亦即是有所参差。In the traditional electroplating process, all anodes (anode titanium baskets or insoluble anodes) are placed on both sides of the electroplating tank, and the workpiece as the cathode passes between the anodes on both sides. When the electroplating current flows from the anode to the cathode through the electroplating solution, A coating is formed on the surface of the workpiece. However, in this form of electroplating process, since the scale of the entire electroplating activity exists between all workpieces and all anodes, the coating distribution and thickness of different workpieces will vary to some extent, that is, uneven.
另一方面,不同型号尺寸的工件都会有不同的电镀面积,因此需要不同的电镀电流,由于电镀电流由大功率电镀整流器的正输出往电镀槽两旁的阳极流出,而所有工件的电流回路都是接在一起,接回大功率电镀整流器的负输出的,所以电镀电流都会流向电镀槽中的每个工件,因此用户只能控制整体所有工件的总电镀电流,而不能独立控制每个工件所接收的电镀电流。所以在传统的连续电镀生产线中,一般都会设定阳极去输出经过计算的特定总电镀电流值,然后电镀槽中间的阴极则需要是一模一样型号以及指定数量的工件在进行电镀,因此生产的灵活性就非常低。On the other hand, workpieces of different sizes will have different plating areas, so different plating currents are required. Since the plating current flows from the positive output of the high-power plating rectifier to the anodes on both sides of the plating tank, and the current loops of all workpieces are Connected together and connected to the negative output of the high-power electroplating rectifier, so the electroplating current will flow to each workpiece in the electroplating tank, so the user can only control the total electroplating current of all the workpieces as a whole, but cannot independently control the received by each workpiece. electroplating current. Therefore, in the traditional continuous electroplating production line, the anode is generally set to output the calculated specific total electroplating current value, and then the cathode in the middle of the electroplating tank needs to be the same model and the specified number of workpieces are electroplating, so the flexibility of production very low.
对于本领域的技术人员来说,如何提升工件镀层的一致性,并提升电镀生产灵活性,是目前需要解决的技术问题。For those skilled in the art, how to improve the consistency of the coating of the workpiece and improve the flexibility of electroplating production is a technical problem that needs to be solved at present.
发明内容SUMMARY OF THE INVENTION
本发明提供一种镀层可控电镀系统,通过设置独立的工件组合提升工件镀层的一致性,具有更高的电镀生产灵活性。The invention provides a coating controllable electroplating system, which improves the consistency of the coating of the workpiece by setting an independent workpiece combination, and has higher electroplating production flexibility.
一种镀层可控电镀系统,包括:A coating controllable electroplating system, comprising:
支承绝缘板,其上分别设置用于夹持阳极的阳极夹具和用于夹持阴极的阴极夹具;a supporting insulating plate, on which an anode clamp for clamping the anode and a cathode clamp for clamping the cathode are respectively arranged;
承载导轨,呈横向设置,用于支撑横向排布的多个所述支承绝缘板;The bearing guide rail is arranged horizontally and is used for supporting a plurality of the support insulating plates arranged horizontally;
电源子机,每个所述支承绝缘板上设置至少一个所述电源子机,阳极导电连接所述电源子机输出端的正极,阴极导电连接所述电源子机输出端的负极;a power supply sub-machine, at least one of the power supply sub-machines is arranged on each of the supporting insulating plates, the anode is conductively connected to the positive electrode of the output end of the power supply sub-machine, and the cathode is conductively connected to the negative electrode of the output end of the power supply sub-machine;
镀槽,用于盛放电解溶液。The plating tank is used to hold the electrolytic solution.
可选地,所述承载导轨的两侧分别设置能够导电的导电轨,两根所述导电轨分别连接于电源母机的正极与负极;Optionally, two sides of the carrying guide rail are respectively provided with conductive rails capable of conducting electricity, and the two conductive rails are respectively connected to the positive pole and the negative pole of the main power source;
各个所述电源子机的输入端分别与两根所述导电轨导电连接。The input ends of each of the power supply sub-machines are respectively electrically connected to the two conductive rails.
可选地,所述支承绝缘板上设置两排滑动金属轮,两排所述滑动金属轮分别与两根所述导电轨导电接触,并沿所述导电轨滚动;Optionally, two rows of sliding metal wheels are arranged on the supporting insulating plate, and the two rows of the sliding metal wheels are respectively in conductive contact with the two conductive rails and roll along the conductive rails;
所述电源子机的输入端分别连接两侧的所述滑动金属轮。The input ends of the power sub-machine are respectively connected to the sliding metal wheels on both sides.
可选地,还包括设置在所述支承绝缘板上的推压轮,所述推压轮位于所述承载导轨的下表面,与所述滑动金属轮配合夹持所述承载导轨。Optionally, it also includes a pushing wheel disposed on the supporting insulating plate, the pushing wheel is located on the lower surface of the bearing guide rail, and cooperates with the sliding metal wheel to clamp the bearing guide rail.
可选地,所述推压轮与所述滑动金属轮交错设置。Optionally, the pushing wheels and the sliding metal wheels are staggered.
可选地,所述承载导轨的两侧呈阶梯下陷,所述导电轨设置在下层台阶面上。Optionally, both sides of the carrying guide rail are recessed in steps, and the conductive rail is arranged on the lower step surface.
可选地,所述导电轨与所述承载导轨之间设置绝缘层。Optionally, an insulating layer is provided between the conductive rail and the carrying rail.
可选地,所述阳极夹具和所述阴极夹具均为导电金属,所述电源子机的输出端分别连接于所述阳极夹具和所述阴极夹具。Optionally, both the anode clamp and the cathode clamp are conductive metals, and the output ends of the power supply sub-machine are respectively connected to the anode clamp and the cathode clamp.
本发明提供一种镀层可控电镀系统,支承绝缘板上分别设置用于夹持阳极的阳极夹具和用于夹持阴极的阴极夹具,它们对应形成一个工件组合;在承载导轨上横向排布的多个支承绝缘板;每个支承绝缘板上设置至少一个电源子机,阳极导电连接所述电源子机输出端的正极,阴极导电连接电源子机输出端的负极,并且阳极与阴极分别伸入镀槽内盛放的电解溶液,每组阳极与阴极分别形成一个独立的回路;电镀时,电镀电流就只需要在独立工件组合中由阳极流向阴极工件,这个电场的规模比传统的缩小了很多,因此受到干扰的变化会非常少,阴极工件表面镀层的均匀度则能有所提升;另外由于每个工件都有自己的独立工件组合,因此工件之间不会互相影响,只要控制到每个独立工件组合有一致的设定参数,包括电镀电流值、电镀时间、工件和阳极之间的距离,阳极的形状和数量等等,则能够使到所有工件在电镀后有更趋于一致的镀层。The invention provides a coating controllable electroplating system. An anode clamp for clamping the anode and a cathode clamp for clamping the cathode are respectively arranged on the support insulating plate, and they form a workpiece combination correspondingly; A plurality of supporting insulating plates; each supporting insulating plate is provided with at least one power supply sub-machine, the anode is conductively connected to the positive electrode of the output end of the power supply sub-machine, the cathode is conductively connected to the negative electrode of the output end of the power supply sub-machine, and the anode and the cathode respectively extend into the plating tank The electrolytic solution contained inside, each group of anode and cathode respectively form an independent loop; during electroplating, the electroplating current only needs to flow from the anode to the cathode workpiece in the independent workpiece combination, the scale of this electric field is much smaller than the traditional one, so The changes affected by the interference will be very small, and the uniformity of the coating on the surface of the cathode workpiece can be improved; in addition, since each workpiece has its own independent workpiece combination, the workpieces will not affect each other, as long as each independent workpiece is controlled Combining consistent setting parameters, including plating current value, plating time, distance between workpiece and anode, shape and number of anodes, etc., can make all workpieces have a more consistent coating after plating.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.
图1A为本发明提供的镀层可控电镀系统的正视图FIG. 1A is a front view of the coating controllable electroplating system provided by the present invention
图1B为图1A的局部放大图;Fig. 1B is a partial enlarged view of Fig. 1A;
图2A为本发明提供的镀层可控电镀系统的侧视图;2A is a side view of a coating controllable electroplating system provided by the present invention;
图2B为图2A的局部放大图。FIG. 2B is a partial enlarged view of FIG. 2A .
图中包括:The figure includes:
支承绝缘板1、阳极夹具11、阴极夹具12、滑动金属轮13、推压轮14、绝缘层15、承载导轨2、导电轨21、电源子机3、镀槽4、电源母机5。
具体实施方式Detailed ways
本发明的核心在于提供一种镀层可控电镀系统,通过设置独立的工件组合提升工件镀层的一致性,具有更高的电镀生产灵活性。The core of the present invention is to provide a coating controllable electroplating system, which improves the consistency of the coating of the workpiece by setting independent workpiece combinations, and has higher electroplating production flexibility.
为了使本领域的技术人员更好地理解本发明的技术方案,下面将结合附图和具体的实施例,对本发明的技术方案进行详细的介绍说明。In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
本发明提供一种镀层可控电镀系统,包括支承绝缘板1、承载导轨2、电源子机3、镀槽4等结构,如图1A和图2A所示,分别为本发明提供的镀层可控电镀系统的正视图和侧视图;图1B为图1A的局部放大图,图2B为图2A的局部放大图,图中A表示阳极,B表示阴极;其中支承绝缘板1采用绝缘材料制成,起到绝缘效果和支撑作用,因此支承绝缘板1的开关并不仅限于平板状;在支承绝缘板1上分别设置用于夹持阳极的阳极夹具11和用于夹持阴极工件的阴极夹具12,阳极通过阳极夹具11与支承绝缘板1相对固定,阴极通过阴极夹具12与支承绝缘板1相对固定。The present invention provides a coating controllable electroplating system, including a supporting
工件作为阴极,对于两面均需要镀层的工件来说,阳极夹具11应设置在工件两边,每个阳极夹具11夹持一个阳极,每个阴极夹具12夹持一个阴极工件,阴极工件位于两边阳极之间,使两面均可快速形成镀层,但若只需要在一面形成镀层,可仅设置一边的阳极夹具。The workpiece is used as the cathode. For the workpiece that needs to be coated on both sides, the
承载导轨2呈横向设置,承载导轨2的长度远大于支承绝缘板1的长度,承载导轨2用于支撑横向排布的多个支承绝缘板1,也即多个不同的支承绝缘板1均由同一个承载导轨2支撑。承载导轨2可采用绝缘材料制成。The
电源子机3用于控制电镀阴极工件所需的电流和电压,每个支承绝缘板1上设置一个或多个电源子机3,阳极导电连接电源子机3输出端的正极,阴极导电连接电源子机3输出端的负极,每个支承绝缘板1上的阳极与阴极形成一个独立的工件组合,每个独立的工件组合内部形成导电回路,在阴极工件上形成镀层。需要注意的是,每个独立工件组合并不一定只有一个电源子机3,可以设置两个或以上数量的电源子机3接连多个阳极,工件两边的阳极可以分别由一个电源子机独立控制电镀电流;而当工件的电镀面积很大的时候,即使在工件的单边都可以有复数个阳极,同样也可设置复数个电源子机;而工件只有一个。镀槽4内用于盛放电解溶液,阴极与阳极插入到镀槽4之内。The
本发明的镀层可控电镀系统将每个支承绝缘板1相对固定的阳极与阴极形成一个独立的工件组合,每个独立工件组合在镀槽中独立运行。由于阳极不再是安装在镀槽的两旁,而是通过支承绝缘板1固定,再用连接了电源子机3正输出端的阳极夹具11夹住;阴极工件也是通过支承绝缘板1固定,再用连接了电源子机3负输出端的阴极夹具12夹住;所以电镀时,电镀电流就只需要在独立工件组合中由阳极流向阴极工件;这个电场的规模比传统共阴和共阳结构缩小了很多,因此受到干扰的变化会非常少,工件表面镀层的均匀度则能有所提升;另外由于每个阴极工件都通过独立的工件组合实现电镀,因此工件之间不会互相影响,只要控制到每个独立工件组合有一致的设定参数,包括电镀电流值、电镀时间、工件和阳极之间的距离,阳极的形状和数量等等,则能够使所有工件在电镀后有更趋于一致的镀层。The coating controllable electroplating system of the present invention forms an independent workpiece combination with the relatively fixed anode and cathode of each supporting insulating
由于每一个独立工件组合都是独立的,因此每一个工件组合可以配置不同的工件,然后通过无线电控制方式,控制不同独立工件组合的电源子机输出匹配的电镀电流,精确地进行电镀;在电源子机中安装无线电通信的组件和天线,把单片机(MCU)的内容通过无线电的接口方式收发。这样就有别于传统的连续电镀生产线需要电镀同型号和指定数量的工件。这为生产制程提供了非常大的灵活性,大幅提升用户的产能。Since each independent workpiece combination is independent, each workpiece combination can be configured with different workpieces, and then through radio control, the power supply sub-machines of different independent workpiece combinations are controlled to output matching electroplating currents, and electroplating is performed accurately; The components and antennas of radio communication are installed in the sub-machine, and the content of the single-chip microcomputer (MCU) is sent and received through the radio interface. This is different from the traditional continuous electroplating production line that needs to electroplate the same type and specified number of workpieces. This provides great flexibility for the production process and greatly increases the productivity of users.
由于采用独立工件组合的设计,阳极与阴极工件的距离可缩短,因而电镀的电压可以降低,电镀效率会比较高,达到节能的效果。Due to the design of independent workpiece combination, the distance between the anode and the cathode workpiece can be shortened, so the electroplating voltage can be reduced, the electroplating efficiency will be relatively high, and the effect of energy saving can be achieved.
在上述方案的基础上,本发明中承载导轨2的两侧分别设置能够导电的导电轨21,两根导电轨21分别连接于电源母机5的正极与负极,电源母机5连接电源,用于输出电流,两根导电轨21分别连接于电源母机5的不同输出。各个电源子机3的输入端分别与两根导电轨21导电连接,也即各个电源子机3经过导电轨21与电源母机5导电连接,电源母机5对各个电源子机3统一供电,再由各个电源子机3独立调节各自的输出参数,从而控制镀层的厚度。On the basis of the above solution, in the present invention,
整个电镀系统的供电分为二组,第一组为电源母机5,电源母机是一个交流转直流的电源(AC-DC Converter),把220V或380V的交流输配电转换为24V、36V或48V等等的低压直流电。第二组是电源子机3,电源子机是一个可调节输出的直流转直流电源(DC-DCConverter),把电源母机所输出的低压直流电转换为电镀所需要的输出。The power supply of the entire electroplating system is divided into two groups. The first group is the power supply main machine 5. The power supply main machine is an AC-DC converter, which converts the 220V or 380V AC power transmission and distribution into 24V, 36V or 48V. and so on low-voltage direct current. The second group is the
电源子机内部有单片机(MCU),通过不同的通信的方式,例如是无线电、RS485、RS232,就可以把用户要求的电流电压输出参数提供给单片机;单片机就会按照用户的要求参数和当前检测到的输出电流电压作瞬时的控制和调节,最后把输出电流或电压调节至用户所要求的数值。There is a single-chip microcomputer (MCU) inside the power supply sub-machine. Through different communication methods, such as radio, RS485, and RS232, the current and voltage output parameters required by the user can be provided to the single-chip microcomputer; The obtained output current and voltage are controlled and adjusted instantaneously, and finally the output current or voltage is adjusted to the value required by the user.
具体地,本发明在支承绝缘板1上设置两排滑动金属轮13,滑动金属轮13可相对于支承绝缘板1转动;两排滑动金属轮13分别与两根导电轨21导电接触,并沿导电轨21滚动,使支承绝缘板1相对于承载导轨2横向移动。支承绝缘板1一边从导电轨中获取电力,为电源子机提供来自电源母机的低压直流电,一边被推着连续向前行走直至跑完整个电镀过程。Specifically, in the present invention, two rows of sliding
整个电镀流程中,独立工件组合在承载导轨2上滑行,因为当中的工件自身有独立电源子机供应电镀电流,因此不会因电镀电流在各工件分配不平均或大规模电场不稳定的原因,导致电流跳动和闪停,影响电镀的质量。In the whole electroplating process, the independent workpieces are combined to slide on the
电源子机3的输入端分别连接两侧的滑动金属轮13,无论滑动金属轮13移动到任意位置,电源子机3的输入端均与导电轨21导电连通,使电源子机3始终与电源母机5导电连接。滑动金属轮13自身可不设置驱动的动力,依靠后方不段置入新的独立工件组合,被从后而来的工件组合推动向前,后方的支承绝缘板对前方的支承绝缘板接触推动其向前移动。The input ends of the
更进一步,本发明还包括设置在支承绝缘板1上的推压轮14,推压轮14可相对于支承绝缘板1转动,且推压轮14与滑动金属轮13的转轴均为横向;推压轮14位于承载导轨2的下表面,滑动金属轮13位于承载导轨2的上表面,推压轮14和滑动金属轮13通过侧方的连接杆相对连接,形成“匚”字形结构,卡接在承载导轨2的侧边;推压轮14与滑动金属轮13配合夹持承载导轨2,使支承绝缘板1在承载导轨2上的移动更平稳。Further, the present invention also includes a pushing
如图1A所示,推压轮14与滑动金属轮13交错设置,也即推压轮14与滑动金属轮13在水平面上的竖向投影不相重合,从而进一步提升支承绝缘板1横向移动的平顺度。As shown in FIG. 1A , the pushing
如图2B所示,承载导轨2的两侧呈阶梯下陷,承载导轨2的截面呈中间高两侧低的阶梯形状,导电轨21设置在下层台阶面上,承载导轨2的上表面与滑动金属轮13大致齐平。As shown in FIG. 2B , both sides of the carrying
在导电轨21与承载导轨2之间设置绝缘层15,从而进一步避免两个导电轨21之间发生短路。The insulating
具体地,本发明中阳极夹具11和阴极夹具12均为导电金属,阳极夹具11和阴极夹具12固定在支承绝缘板1在下方,电源子机3的输出端分别连接于阳极夹具11和阴极夹具12,通过阳极夹具11与阳极导电连接,通过阴极夹具12与阴极工件导电连接。Specifically, in the present invention, the
对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理,可以在不脱离本发明的精神或范围的情况下,在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
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Effective date of registration: 20250429 Address after: Room 509, Building 2, No. 15 Keji 4th Road, Songshan Lake Park, Dongguan City, Guangdong Province 523000 Patentee after: Yilibai Electric Energy Technology (Dongguan) Co.,Ltd. Country or region after: China Address before: Unit C, 9th Floor, Phase III, Kwun Tong Industrial Centre, 448-458 Kwun Tong Road, Kwun Tong, Kowloon, Hong Kong, China Patentee before: ELECPOWER LTD. Country or region before: Hong-Kong |