CN107190307A - Electroplating anode device - Google Patents
Electroplating anode device Download PDFInfo
- Publication number
- CN107190307A CN107190307A CN201610146571.5A CN201610146571A CN107190307A CN 107190307 A CN107190307 A CN 107190307A CN 201610146571 A CN201610146571 A CN 201610146571A CN 107190307 A CN107190307 A CN 107190307A
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- CN
- China
- Prior art keywords
- anode
- electroplating
- anode member
- anode device
- electroplating anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
Abstract
The electroplating anode device of the present invention, mainly is available for controlling circuit turn-on whether anode member to design respectively in setting plural number on a support body so that in the way of through to any or any several anode members energizations, different electric force lines distribution states are produced in electroplating bath；Especially, when the product shape or hanging configuration kenel to be electroplated is changed, the mode of simple switching electric current supply loop need to be only passed through, corresponding electric force lines distribution state is produced, so as to ensure product electroplating quality with relatively more positive, reliable means.
Description
Technical field
The present invention is relevant with electroplating system, and the main electroplating system one kind that provides can be different according to product design or product hanging configuration kenel, coordinate the electroplating anode device of adjustment electrical distribution state.
Background technology
It is well-known, " plating " is a kind of method that a tunic is plated in utilization electroreduction reaction on object, its used machinery equipment, the difference because of the difference of electroplated product, regardless of whether using the machinery equipment of which kind of form, in being all designed with electrode bar that quantity do not wait in electroplating region as anode, so as to produce the dissociation of metal ion in electroplate liquid, workpiece to be plated is typically designed to negative electrode.
When electroplating activity is carried out, then respectively in anode and negative electrode input voltage, make electroplate liquid because of cell reaction precipitating metal ion, and those metal ions can depositing in cathode terminal, and after cathodic reduction, formed and plated in the coat of metal on workpiece to be plated surface；The electroplating system being currently known, then can divide into dissolubility anodization system and insoluble anodization system according to plating metal presentation mode.
In insoluble anode electroplating system, when electric current flow to anode bottom from anode top, its magnitude of current can successively decrease because of resistance, in other words, at anode top, due to larger by electric current herein, therefore more metal ion is decomposed release, and it is few compared with the electric current by top position by the electric current that lower portion passed through, therefore less metal ion, which is decomposed, discharges, and then generation electric force lines distribution and the phenomenon of uneven (i.e. the Density Distribution of electric current is uneven) in electroplating bath.
This phenomenon will cause product position in the big place plating thickness of current density, and in the small place of current density, then coating is thin for product position on the contrary；Not only can because of product surface uneven coating it is even and have a strong impact on the quality of product (especially sub- product), in some cases, it is burned black that current density excessive (power line is overstocked) also easily causes product；Therefore, how to provide electroplating system one kind can be different according to product design or product hanging configuration kenel, coordinate the electroplating anode device of adjustment electrical distribution state, always industrial circle desires most ardently the problem of solution for a long time.
The content of the invention
In view of this, the present invention i.e. can be different according to product design or product hanging configuration kenel in offer electroplating system one kind, coordinate the electroplating anode device for adjusting electrical distribution state.
In order to achieve the above object, electroplating anode device of the invention, with a support body, and a plurality of anode members；Wherein, respectively the anode member is located on the support body in the state of mutually insulated, separately has plural conductive part to be electrically connected respectively with the respectively anode member.
Using said structure feature, electroplating anode device of the invention can pass through the mode being powered to any or any several anode members, different electric force lines distribution states produced in electroplating bath；Especially, when the product shape or hanging configuration kenel to be electroplated is changed, the mode of simple switching electric current supply loop need to be only passed through, corresponding electric force lines distribution state is produced, product electroplating quality is ensured with relatively more positive, reliable means.
According to said structure feature, described respectively electric-conductor is fixedly arranged on the support body.
According to said structure feature, the described electroplating anode device further includes a distributor cap for supplying connection external power source, the distributor cap supplies to be electrically connected with the electric-conductor set by the respectively anode member, and the distributor cap supplies the circuit turn-on whether on-off circuit of the respectively anode member controlled respectively provided with plural number.
According to said structure feature, the described electroplating anode device further includes a distributor cap for supplying connection external power source, the distributor cap supplies to be electrically connected with the electric-conductor set by the respectively anode member, and the distributor cap supplies the circuit turn-on whether on-off circuit of the respectively anode member controlled respectively provided with plural number；Respectively the electric-conductor is fixedly arranged on the support body；The index dial is provided with plural number for wire respectively with the electrical connection of the respectively electric-conductor.
According to said structure feature, described respectively anode member is provided with plural mesh.
The external form profile that described respectively anode member is rectangle.
The rounded external form profile of described respectively anode member.
The square external form profile of described respectively anode member.
The oval external form profile of described respectively anode member.
Described respectively anode member external form profile triangular in shape.
The trapezoidal external form profile of described respectively anode member.
The L-shaped external form profile of described respectively anode member.
Described electroplating anode device, in anode member of the support body provided with least two different external form profiles.
Disclosed herein electroplating anode device, it is main to control circuit turn-on whether anode member to design respectively using having plural number to be available for so that in the way of through being powered to any or any several anode members, different electric force lines distribution states are produced in electroplating bath；Especially, when the product shape or hanging configuration kenel to be electroplated is changed, the mode of simple switching electric current supply loop need to be only passed through, corresponding electric force lines distribution state is produced, so as to ensure product electroplating quality with relatively more positive, reliable means.
Brief description of the drawings
Fig. 1 is the electroplating anode device stereoscopic figure of first embodiment of the invention.
Fig. 2 is the electroplating anode device structural representation of second embodiment of the invention.
Fig. 3 is the electroplating anode device structural representation of third embodiment of the invention.
Fig. 4 is the electroplating anode device structural representation of fourth embodiment of the invention.
Fig. 5 is electroplating anode device structure operation schematic diagram of the invention.
Figure number explanation：
10 support bodys
20 anode members
21 mesh
30 electric-conductors
40 distributor caps
41 wires
50 workpiece
60 pendulous devices.
Embodiment
Can be different according to product design or product hanging configuration kenel present invention generally provides unified plant of plating, coordinate the electroplating anode device for adjusting electrical distribution state, as shown in figure 1, the electroplating anode device of the present invention, with a support body 10, and a plurality of anode members 20；Wherein, respectively the anode member 20 is located on the support body 10 in the state of mutually insulated, separately has plural conductive part 30 to be electrically connected respectively with the respectively anode member 20.
In principle, the electroplating anode device of the present invention, when practical application, paired electroplating anode device can be respectively placed in inside electroplating bath relative to negative electrode both sides, and the product for being intended to be electroplated in cathode hanger, make respectively in the state of anode tap and cathode terminal input current, to make the electroplate liquid in electroplating bath separate out depositing because of cell reaction in the metal ion of cathode terminal, after metal ion in after cathodic reduction, the coat of metal plated in product surface is formed.
Because electroplating anode device of the invention is available for circuit turn-on whether anode member 20 controlled respectively in setting plural number on a support body 10, therefore can pass through the mode being powered to any or any several anode members 20, and different electric force lines distribution states are produced in electroplating bath；Especially, when the product shape or hanging configuration kenel to be electroplated is changed, the mode of simple switching electric current supply loop need to be only passed through, corresponding electric force lines distribution state is produced, product electroplating quality is ensured with relatively more positive, reliable means.
The electroplating anode device of the present invention, when implementing, described respectively electric-conductor 30 can be fixedly arranged on the support body 10, each one end of the electric-conductor 30 and relative extension length set in advance of support body 10 is preferred, not only the advantageous installation in overall electroplating anode device is set up, and more more convenient electric-conductor 30 is electrically connected with external power source.
Please coordinate simultaneously shown in reference picture 2, the electroplating anode device of the present invention, a distributor cap 40 for supplying connection external power source can further be included, the distributor cap 40 with the electric-conductor 30 set by the respectively anode member 20 for being electrically connected, and the distributor cap 40 supplies the circuit turn-on whether on-off circuit of the respectively anode member 20 controlled respectively provided with plural number.
The electroplating anode device of the present invention, supply to connect the distributor cap 40 of external power source further to include one again, the distributor cap 40 with the electric-conductor 30 set by the respectively anode member 20 for being electrically connected, the distributor cap 40 supplies the circuit turn-on whether on-off circuit of the respectively anode member 20 controlled respectively provided with plural number, respectively the electric-conductor 30 can be fixedly arranged on the support body 10, respectively one end of the electric-conductor 30 and the relative extension length set in advance of support body 10, and wire 41 of the distributor cap 40 provided with plural number for being electrically connected respectively with the respectively electric-conductor 30 structure kenel be rendered as it is good.
The electroplating anode device of the present invention, taken off upper under the various structure kenels that may implement, described respectively anode member 20 is provided with plural mesh 21, that is, the described anode member 20 can be presented in the structure kenel of net, basket, the metal ion in its electroplating bath is obtained preferably mobility.
And, in the upper embodiment taken off shown in Fig. 1, the external form profile that respectively anode member 20 is rectangle；When implementing, described respectively anode member 20 also can be in external form profile circular as shown in Figure 2, or in square external form profile as shown in Figure 3, it might even be possible to respectively in the external form profile such as external form profile oval as shown in Fig. 4, the external form profile of triangle, trapezoidal external form profile and L-shaped；If necessary, described electroplating anode device, also can be in anode member 20 of the support body 10 provided with least two different external form profiles；As shown in figure 5, the anode member 20 may be disposed at the both sides of workpiece 50, the effect of homogeneous coating is reached, pendulous device 60 further also can be set and connects with anode member 20 and workpiece 50, using linear reciprocally swinging mode, enables coating more uniform.
Specifically, disclosed herein electroplating anode device, it is main to be available for controlling circuit turn-on whether anode member to design respectively using with plural so that in the way of through to any or any several anode members energizations, different electric force lines distribution states are produced in electroplating bath；Especially, when the product shape or hanging configuration kenel to be electroplated is changed, the mode of simple switching electric current supply loop need to be only passed through, corresponding electric force lines distribution state is produced, so as to ensure product electroplating quality with relatively more positive, reliable means.
Claims (14)
1. a kind of electroplating anode device, with a support body (10), and a plurality of anode members (20)；Characterized in that, respectively the anode member (20) is located on the support body (10) in the state of mutually insulated, separately there is plural conductive part (30) to be electrically connected respectively with the respectively anode member (20).
2. electroplating anode device as claimed in claim 1, it is characterised in that respectively the electric-conductor (30) is fixedly arranged on the support body (10).
3. electroplating anode device as claimed in claim 1, it is characterized in that, the electroplating anode device includes a distributor cap (40) for supplying connection external power source, the distributor cap (40) with the electric-conductor (30) set by the respectively anode member (20) for being electrically connected, and the distributor cap (40) supplies the circuit turn-on whether on-off circuit of the respectively anode member (20) controlled respectively provided with plural number.
4. electroplating anode device as claimed in claim 1, it is characterized in that, the electroplating anode device includes a distributor cap (40) for supplying connection external power source, the distributor cap (40) with the electric-conductor (30) set by the respectively anode member (20) for being electrically connected, and the distributor cap (40) supplies the circuit turn-on whether on-off circuit of the respectively anode member (20) controlled respectively provided with plural number；Respectively the electric-conductor (30) is fixedly arranged on the support body (10)；The index dial (40) is provided with plural number for wire (41) respectively with the electrical connection of the respectively electric-conductor (20).
5. electroplating anode device as claimed in claim 1, it is characterised in that respectively the anode member (20) is provided with plural mesh (21).
6. the electroplating anode device as described in claim 1 to 5 any of which, it is characterised in that the external form profile that respectively anode member (20) is rectangle.
7. the electroplating anode device as described in claim 1 to 5 any of which, it is characterised in that each rounded external form profile of the anode member (20).
8. the electroplating anode device as described in claim 1 to 5 any of which, it is characterised in that each oval external form profile of the anode member (20).
9. the electroplating anode device as described in claim 1 to 5 any of which, it is characterised in that each anode member (20) external form profile triangular in shape.
10. the electroplating anode device as described in claim 1 to 5 any of which, it is characterised in that each trapezoidal external form profile of the anode member (20).
11. the electroplating anode device as described in claim 1 to 5 any of which, it is characterised in that each L-shaped external form profile of the anode member (20).
12. the electroplating anode device as described in claim 1 to 5 any of which, it is characterised in that the electroplating anode device, in anode member (20) of the support body (10) provided with least two different external form profiles.
13. the electroplating anode device as described in claim 1 to 5 any of which, it is characterised in that the electroplating anode device, the anode member (20) is connected with pendulous device (60).
14. electroplating anode device as claimed in claim 13, it is characterised in that the pendulous device (60) connection workpiece (50).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610146571.5A CN107190307A (en) | 2016-03-15 | 2016-03-15 | Electroplating anode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610146571.5A CN107190307A (en) | 2016-03-15 | 2016-03-15 | Electroplating anode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107190307A true CN107190307A (en) | 2017-09-22 |
Family
ID=59870645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610146571.5A Pending CN107190307A (en) | 2016-03-15 | 2016-03-15 | Electroplating anode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107190307A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110438538A (en) * | 2018-08-22 | 2019-11-12 | 盛青永致半导体设备(苏州)有限公司 | A kind of electroplanting device and electro-plating method |
| CN113549982A (en) * | 2021-07-26 | 2021-10-26 | 成都飞机工业（集团）有限责任公司 | Cylindrical part electroplating device and electroplating method |
| WO2021227853A1 (en) * | 2020-05-09 | 2021-11-18 | 京东方科技集团股份有限公司 | Electrode structure, and electrochemical deposition device and electrochemical deposition method therefor |
Citations (5)
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| JPS5594491A (en) * | 1979-01-10 | 1980-07-17 | Nec Corp | Forming method for thick minute metal pattern |
| CN202284230U (en) * | 2011-09-07 | 2012-06-27 | 万亿股份有限公司 | Plating bath |
| CN203021667U (en) * | 2012-12-06 | 2013-06-26 | 先丰通讯股份有限公司 | Electrochemical processing device |
| CN105369337A (en) * | 2014-08-11 | 2016-03-02 | 亚智科技股份有限公司 | Multi-anode control device and electroplating equipment having the same |
| CN205529121U (en) * | 2016-03-15 | 2016-08-31 | 先丰通讯股份有限公司 | Electroplated anode device |
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2016
- 2016-03-15 CN CN201610146571.5A patent/CN107190307A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5594491A (en) * | 1979-01-10 | 1980-07-17 | Nec Corp | Forming method for thick minute metal pattern |
| CN202284230U (en) * | 2011-09-07 | 2012-06-27 | 万亿股份有限公司 | Plating bath |
| CN203021667U (en) * | 2012-12-06 | 2013-06-26 | 先丰通讯股份有限公司 | Electrochemical processing device |
| CN105369337A (en) * | 2014-08-11 | 2016-03-02 | 亚智科技股份有限公司 | Multi-anode control device and electroplating equipment having the same |
| CN205529121U (en) * | 2016-03-15 | 2016-08-31 | 先丰通讯股份有限公司 | Electroplated anode device |
Non-Patent Citations (1)
| Title |
|---|
| 刘仁志: "《印制板电镀》", 30 September 2008, 国防工业出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110438538A (en) * | 2018-08-22 | 2019-11-12 | 盛青永致半导体设备(苏州)有限公司 | A kind of electroplanting device and electro-plating method |
| WO2020099947A1 (en) * | 2018-08-22 | 2020-05-22 | 盛青永致半导体设备(苏州)有限公司 | Electroplating device and electroplating method |
| WO2021227853A1 (en) * | 2020-05-09 | 2021-11-18 | 京东方科技集团股份有限公司 | Electrode structure, and electrochemical deposition device and electrochemical deposition method therefor |
| CN113549982A (en) * | 2021-07-26 | 2021-10-26 | 成都飞机工业（集团）有限责任公司 | Cylindrical part electroplating device and electroplating method |
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Application publication date: 20170922 |
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