CN108774746A - Drive mechanism and electroplating device - Google Patents
Drive mechanism and electroplating device Download PDFInfo
- Publication number
- CN108774746A CN108774746A CN201810805538.8A CN201810805538A CN108774746A CN 108774746 A CN108774746 A CN 108774746A CN 201810805538 A CN201810805538 A CN 201810805538A CN 108774746 A CN108774746 A CN 108774746A
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- CN
- China
- Prior art keywords
- guide plate
- idler wheel
- drive mechanism
- annular groove
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of drive mechanism and electroplating devices, wherein, driving effect of the drive mechanism for driven power drives circuit board to be moved along preset track, drive mechanism includes rectilinear orbit, the idler wheel for connecting with installation part and being rolled in rectilinear orbit for the installation part of mounting circuit boards and at least one, idler wheel offers the annular groove coordinated with rectilinear orbit, rectilinear orbit include between the upper and lower away from setting and level the first guide plate and the second guide plate, the plate thickness of first guide plate and the second guide plate matches setting with the groove width of annular groove, first guide plate is downwardly into annular groove above idler wheel, second guide plate below idler wheel by being inserted upwardly into annular groove, the slot bottom of annular groove is contacted with the second guide plate.The drive mechanism of the present invention can deviate to avoid circuit board in motion process and expected movement locus.
Description
Technical field
The invention belongs to equipment technical field more particularly to a drive mechanism and electroplating device is electroplated.
Background technology
Plating is exactly so that the surface of metal or other materials product is adhered to layer of metal film using electrolysis, in circuit board
Production field, it usually needs the processing such as heavy copper are carried out to circuit board using electroplating technology.Electroplating device is generally comprised for conduction
Drive mechanism, existing drive mechanism be easy so that circuit board deviate in motion process and expected movement locus.
Invention content
The purpose of the present invention is to provide a kind of drive mechanisms, it is intended to solve in the prior art circuit board motion process with
The technical issues of expected movement locus deviates.
The invention is realized in this way a drive mechanism, the driving effect for driven power drives circuit board along default
Track movement, drive mechanism includes rectilinear orbit, connect with installation part for the installation part of mounting circuit boards and at least one
And the idler wheel rolled in rectilinear orbit, idler wheel offer annular groove coordinate with rectilinear orbit, rectilinear orbit including between the upper and lower away from
Be arranged and horizontal the first guide plate and the second guide plate, the plate thickness of the first guide plate and the second guide plate with the slot of annular groove
Width matching setting, the first guide plate are downwardly into annular groove above idler wheel, and the second guide plate is inserted upwards by the lower section of idler wheel
Enter annular groove, the slot bottom of annular groove is contacted with the second guide plate.
Further, drive mechanism includes multiple spaced idler wheels and the shaft that is arranged in a one-to-one correspondence with idler wheel, more
A idler wheel extends along a horizontal line arranges, and shaft one end is fixed on installation part, and the other end of shaft passes through idler wheel and and idler wheel
Rotational installation.
Further, drive mechanism further includes the two bearings being correspondingly arranged with shaft, is both provided between shaft and idler wheel
Two bearings.
Further, the notch of annular groove is arranged to loudspeaker opening, the width radially flaring of loudspeaker opening.
Further, the linear guide further includes a support element, and the first guide plate interlocking on support element, lock by the second guide plate
It is connected on support element.
The present invention also provides a kind of electroplating devices, including above-mentioned drive mechanism.
Further, electroplating device further include it is multiple be fixedly installed on installation part with the fixture of clamping circuit board, it is each to press from both sides
Tool is made of an electrically conducting material, and each fixture is electrically connected with installation part.
Further, fixture includes the first clamping part for being fixedly connected and being powered with installation part, is hinged with the first clamping part
The second clamping part and elasticity of installation are connected between the first clamping part and the second clamping part to keep the first clamping part and the
The elastic compression part of two clamping part clamped conditions.
Further, electroplating device further includes a conductive structure, and conductive structure includes the conduction rack made of conductive material
It is installed on the conductive component that on conduction rack and distance is arranged with multigroup, each conductive component includes being movably installed in conduction
On frame and with conduction rack be electrically connected conduct piece, with conduction rack spacing setting and the sliding part made of conductive material, have bullet
Property restoring force and its elastic restoring force act on conduct piece so that conduct piece and sliding part press fit elastic component, sliding part tool
The sliding surface for having towards conduct piece and being slidably matched with conduct piece, conduct piece has the mating surface being slidably matched with sliding surface, sliding
Dynamic face and mating surface are plane, and sliding part is connect with circuit board.
Further, sliding part is formed with sliding slot of the notch towards conduct piece, and sliding surface is set to the slot bottom of sliding slot, sliding
Part further includes the accommodating structure being fixedly connected with the end of slot bottom, and the level height of accommodating structure is less than the level height of slot bottom.
The present invention having the technical effect that compared with the existing technology：When idler wheel rolls, the first guide plate and the second guide plate are total
Coordinate with annular groove, the plate thickness of the first guide plate and the second guide plate matches setting with the groove width of annular groove, can be to avoid
Idler wheel shakes to both sides, further can avoid circuit board and deviates in motion process and expected movement locus, to really
It protects circuit board to move in same perpendicular always, and then the electroplating quality of each circuit board can be improved, at the same time it can also
Improve the consistency of same batch circuit board electroplating effect；The slot bottom of annular groove is contacted with the second guide plate, can be prevented
Idler wheel drives installation part to move downward, and drives the downward play of circuit board to avoid rolling so that circuit board is always in same water
Flat high degree of motion, and then the electroplating quality of each circuit board can be improved, at the same time it can also improve same batch circuit board electroplating
The consistency of effect.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to the embodiment of the present invention or the prior art
Attached drawing needed in description is briefly described, it should be apparent that, drawings described below is only the present invention's
Some embodiments for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other attached drawings.
Fig. 1 is the stereogram of electroplanting device provided in an embodiment of the present invention.
Fig. 2 is the stereogram exploded view of electroplanting device provided in an embodiment of the present invention.
Fig. 3 is the stereogram exploded view of idler wheel provided in an embodiment of the present invention, bearing and shaft.
Reference sign：
| 100 | Electroplating device | 17 | Annular groove | |
| 11 | Rectilinear orbit | 18 | Shaft | |
| 12 | Support element | 19 | Bearing | |
| 13 | First guide plate | 31 | Fixture | |
| 14 | Second guide plate | 32 | First clamping part | |
| 15 | Installation part | 33 | Second clamping part | |
| 16 | Idler wheel | 34 | Elastic compression part |
Specific implementation mode
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it should be noted that when element is referred to as " being fixed on " or " being set to " another yuan
Part, it directly on another element or can be connected on another element.It is known as and " connects when an element
In " another element, it can be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on ... shown in the drawings or position are closed
System, is merely for convenience of description of the present invention and simplification of the description, not indicating or implying the indicated device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
For the ordinary skill in the art, it can understand above-mentioned term in the present invention as the case may be
Concrete meaning.
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.
As shown in Figure 1 to Figure 3, the embodiment of the present invention provides a kind of drive mechanism, is used for the driving effect band of driven power
Dynamic circuit board is moved along preset track, drive mechanism include rectilinear orbit 11, for mounting circuit boards installation part 15 and
At least one connect with installation part 15 and in the idler wheel 16 that rectilinear orbit 11 rolls, and idler wheel 16 is offered to be coordinated with rectilinear orbit 11
Annular groove 17, rectilinear orbit 11 include the first guide plate 13 and the second guide plate 14 between the upper and lower away from setting and level, and first leads
Setting is matched with the groove width of annular groove 17 to the plate thickness of plate 13 and the second guide plate 14, the first guide plate 13 is in the upper of idler wheel 16
Side is downwardly into annular groove 17, and the second guide plate 14 is inserted upwardly into annular groove 17, the slot bottom of annular groove 17 by the lower section of idler wheel 16
It is contacted with the second guide plate 14.
In this embodiment, rectilinear orbit 11 includes that the first guide plate 13 and second between the upper and lower away from setting and level is oriented to
Plate 14, wherein the first guide plate 13 and 14 parallel spacing of the second guide plate are arranged, and idler wheel 16 can be enable to be packed into straight line rail
On road 11 (i.e. between the first guide plate 13 and the second guide plate 14), the first guide plate 13 and the second guide plate 14 are horizontally disposed can
To ensure that idler wheel 16 is moved along horizontal movement locus always.
In this embodiment, when idler wheel 16 rolls, the first guide plate 13 and the second guide plate 14 are matched with annular groove 17 jointly
It closes, the plate thickness of the first guide plate 13 and the second guide plate 14 matches setting with the groove width of annular groove 17, can be to avoid idler wheel 16
It is shaken to both sides, further can avoid circuit board and deviate in motion process and expected movement locus, so that it is guaranteed that electric
Road plate moves in same perpendicular always, and then can improve the electroplating quality of each circuit board, at the same time it can also improve
The consistency of same batch circuit board electroplating effect.
In this embodiment, the slot bottom of annular groove 17 is contacted with the second guide plate 14, can prevent idler wheel 16 from driving
Installation part 15 moves downward, and drives the downward play of circuit board to avoid rolling so that circuit board is always in same level height
Movement, and then the electroplating quality of each circuit board can be improved, at the same time it can also improve same batch circuit board electroplating effect
Consistency.
Further, the slot bottom clearance fit of the first guide plate 13 and annular groove 17, can reduce the first guide plate 13 with
Frictional force between idler wheel 16 increases the smoothness that idler wheel 16 rolls.
Further, drive mechanism includes multiple spaced idler wheels 16 and the shaft that is arranged in a one-to-one correspondence with idler wheel 16
18, multiple idler wheels 16 extend along a horizontal line arranges, and 18 one end of shaft is fixed on installation part 15, and the other end of shaft 18 passes through
Idler wheel 16 is simultaneously rotatablely installed with idler wheel 16.In this embodiment, multiple idler wheels 16 extend along a horizontal line and arrange, and can save cloth
Between emptying, reduce the size of drive mechanism in the vertical direction, the other end of shaft 18 passes through idler wheel 16 and rotated with idler wheel 16
Installation so that installation part 15 can be moved along rectilinear orbit 11, and then can make installation part 15 that circuit board be driven to be transported along rectilinear orbit 11
It is dynamic.
Further, as shown in figure 3, drive mechanism further includes the two bearings 19 being correspondingly arranged with shaft 18, shaft 18 with
Two bearings 19 are both provided between idler wheel 16.
In this embodiment, shaft 18 and idler wheel 16 can be reduced by two bearings 19 being both provided between shaft 18 and idler wheel 16
Between frictional force, improve mechanically operated efficiency, and reduce frictional dissipation.
Further, the notch of annular groove 17 is arranged to loudspeaker opening, the width radially flaring of loudspeaker opening.?
In the embodiment, the width radially flaring of loudspeaker opening can increase the convenience that idler wheel 16 is transferred to rectilinear orbit 11,
And the frictional force between the cell wall of annular groove 17 and the first guide plate 13 and the second guide plate 14 can also be reduced, and then can be with
It improves idler wheel 16 and rolls smoothness.
Further, the linear guide further includes a support element 12, and on support element 12, second leads 13 interlocking of the first guide plate
To 14 interlocking of plate on support element 12.
In this embodiment, when needing replacing the idler wheel 16 of different size, and the idler wheel 16 of the different size has
The annular groove 17 of different groove widths needs to select the first guide plate 13 and second of different-thickness to be oriented to according to the groove width of annular groove 17
Plate 14,13 interlocking of the first guide plate is on support element 12, and 14 interlocking of the second guide plate is on support element 12, and conveniently replaced first
The replacement of guide plate 13 and the second guide plate 14.
Another embodiment of the present invention also provides a kind of electroplating device 100, including above-mentioned drive mechanism.
Further, electroplating device 100 further includes multiple is fixedly installed on installation part 15 with the fixture of clamping circuit board
31, each fixture 31 is made of an electrically conducting material, and each fixture 31 is electrically connected with installation part 15.
In this embodiment, when electroplating activity, driving force with drive installation part 15 move, installation part 15 drive fixture 31 with
And it is clamped in the circuit board motion on fixture 31, fixture 31 drives circuit board that installation part 15 is followed to be transmitted to plating station for electricity
Plate operation.
Further, fixture 31 includes the first clamping part 32 for being fixedly connected and being powered with installation part 15, is clamped with first
The second clamping part 33 and elasticity that portion 32 is hingedly installed are connected between the first clamping part 32 and the second clamping part 33 to keep
The elastic compression part 34 of 33 clamped condition of first clamping part 32 and the second clamping part.
In this embodiment, the second clamping and the first hingedly installation of clamping part 32, the second clamping part of outer power drive 33 are opposite
Enable the spacing between the second clamping part 33 and the second clamping part 33 that circuit board is allowed to be put into the first clamping part 32 opening, bullet
Property 34 elasticity of compression piece be connected between the first clamping part 32 and the second clamping part 33 with keep the first clamping part 32 and second press from both sides
Hold 33 clamped condition of portion, it is ensured that circuit board is clamped in fixture 31.
Further, electroplating device 100 further includes a conductive structure, and conductive structure includes conductive made of conductive material
It frame and multigroup is installed on conduction rack and the conductive component of distance setting, each conductive component include being movably installed in lead
It is electrically connected conduct piece and the setting of conduction rack spacing and the sliding part 44 made of conductive material, tool on electric frame and with conduction rack
Flexible restoring force and its elastic restoring force act on conduct piece so that conduct piece and 44 press fit of sliding part elastic component, it is sliding
The sliding surface that moving part 44 has towards conduct piece and is slidably matched with conduct piece, conduct piece has matches with what sliding surface was slidably matched
Conjunction face, sliding surface and mating surface are plane, and sliding part 44 is connect with circuit board.
In this embodiment, conductive structure include the conduction rack made of conductive material and it is multigroup be installed on conduction rack and
The conductive component of distance setting, each conductive component include being movably installed on conduction rack and being electrically connected with conduction rack
Conduct piece, with conduction rack spacing setting and the sliding part 44 made of conductive material, sliding part 44 connect with circuit board, sliding part
The driving effect of 44 driven power is slided along the directions V relative to conduct piece, and sliding part 44 drives circuit board motion and by circuit board
It is delivered to plating station, in this process, electric signal is from conduction rack successively to conduct piece, the conduction of sliding part 44 until by the telecommunications
Number conduction on circuit board so that circuit board is electroplated.
In this embodiment, the sliding surface that sliding part 44 has towards conduct piece and is slidably matched with conduct piece, conduct piece
With the mating surface being slidably matched with sliding surface, sliding surface and mating surface are plane, in 44 sliding process of sliding part, sliding
Part 44 is plane-plane contact with conduct piece, and contact area is big, can avoid poor contact, electric signal can be ensured steadily by conduction
Part is conducted to sliding part 44, when to circuit board batch processing (batch processing is to carry out electroplating processes to multiple circuit boards simultaneously),
It can ensure the energization that each circuit board can be stablized, and then improve the electroplating effect of each circuit board and improve with batch electricity
The consistency of road plate electroplating effect.
In this embodiment, the elastic restoring force that elastic component generates acts on conduct piece so that conduct piece is pressed with sliding part 44
It connects cooperation, makes conduct piece always with 44 press fit of sliding part in the sliding process of sliding part 44, i.e., it is sliding in sliding process
Moving part 44 remains plane-plane contact with conduct piece, avoids sliding part 44 due to being led by the influence of the other factors such as mechanical oscillation
Cause swings, than avoid sliding part 44 swing caused by the reduction of conduct piece and 44 contact area of sliding part and contact
Bad, therefore, the conductive structure of the embodiment of the present invention can ensure the contact that conduct piece is stablized with sliding part 44, can avoid contact
It is bad, and then improve the electroplating quality of single circuit board and improve with the consistent of batch electroplating effect of the secondary circuit plate of plating
Property.
Further, sliding part 44 is formed with sliding slot of the notch towards conduct piece, and sliding surface is set to the slot bottom of sliding slot, sliding
Moving part 44 further includes the accommodating structure 47 being fixedly connected with the end of slot bottom, and the level height of accommodating structure 47 is less than the water of slot bottom
Flat height.
In this embodiment, sliding part 44 is slided relative to conduct piece, is rubbed due to existing between sliding part 44 and conduct piece
It wipes, therefore, will produce powder, since sliding part 44 and conduct piece are made of conductive material, therefore, which is also conductive
Powder can influence the electroplating quality of circuit board if the powder falls to circuit board, in 44 sliding process of sliding part, the powder
It is fallen down by the gap location of adjacent two sliding part 44, since sliding part 44 further includes the accommodating structure being fixedly connected with the end of slot bottom
47, the level height of accommodating structure 47 is less than the level height of slot bottom, which can catch powder, avoid powder fall to
On circuit board, and then improve electroplating quality.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (10)
1. a kind of drive mechanism, the driving effect for driven power drives circuit board to be moved along preset track, and feature exists
In the drive mechanism includes rectilinear orbit, the installation part for installing the circuit board and at least one and the installation part
It connects and in the idler wheel that the rectilinear orbit rolls, the idler wheel offers the annular groove coordinated with the rectilinear orbit, described
Rectilinear orbit includes the first guide plate and the second guide plate away from setting and level between the upper and lower, first guide plate and described the
The plate thickness of two guide plates matches setting with the groove width of the annular groove, and first guide plate is downward in the top of the idler wheel
Be inserted into the annular groove, second guide plate by being inserted upwardly into the annular groove below the idler wheel, the annular groove
Slot bottom is contacted with second guide plate.
2. drive mechanism as described in claim 1, which is characterized in that the drive mechanism includes multiple spaced described
Idler wheel and the shaft being arranged in a one-to-one correspondence with the idler wheel, multiple idler wheels extend along a horizontal line arranges, the shaft one
End is fixed on the installation part, and the other end of the shaft passes through the idler wheel and is rotatablely installed with the idler wheel.
3. drive mechanism as claimed in claim 2, which is characterized in that the drive mechanism further includes sets corresponding with the shaft
The two bearings set are both provided with two bearings between the shaft and the idler wheel.
4. the drive mechanism as described in any one of claims 1 to 3, which is characterized in that the notch of the annular groove is arranged
It is open at loudspeaker, the width of loudspeaker opening radially flaring.
5. the drive mechanism as described in any one of claims 1 to 3, which is characterized in that the linear guide further includes one
Support element, the first guide plate interlocking is on the support element, and the second guide plate interlocking is on the support element.
6. a kind of electroplating device includes the drive mechanism as described in any one of claim 1 to 5.
7. electroplating device as claimed in claim 6, which is characterized in that the electroplating device further includes multiple being fixedly installed in institute
It states and is made of an electrically conducting material with the fixture of circuit board described in clamping, each fixture on installation part, each fixture is and institute
State installation part electrical connection.
8. electroplating device as claimed in claim 7, which is characterized in that the fixture include be fixedly connected with the installation part and
The second clamping part and elasticity that the first clamping part being powered and first clamping part are hingedly installed are connected to first folder
It holds between portion and second clamping part to keep first clamping part and the elasticity of the second clamping part clamped condition to press
Contracting part.
9. electroplating device as claimed in claim 8, which is characterized in that the electroplating device further includes a conductive structure, described
Conductive structure includes the conduction rack made of conductive material and multigroup is installed on the conduction rack and distance setting is led
Electrical component, each conductive component include being movably installed on the conduction rack and being electrically connected with the conduction rack conductive
Part, with the conduction rack spacing setting and the sliding part made of conductive material, have elastic restoring force and its elastic restoring force
Act on the conduct piece so that the conduct piece and the sliding part press fit elastic component, the sliding part have direction
The conduct piece and the sliding surface being slidably matched with the conduct piece, the conduct piece, which has, to be slidably matched with the sliding surface
Mating surface, the sliding surface and the mating surface are plane, and the sliding part is connect with the circuit board.
10. electroplating device as claimed in claim 9, which is characterized in that the sliding part is formed with notch towards the conduction
The sliding slot of part, the sliding surface are set to the slot bottom of the sliding slot, and the sliding part further includes being fixed with the end of the slot bottom
The accommodating structure of connection, the level height of the accommodating structure are less than the level height of the slot bottom.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810805538.8A CN108774746A (en) | 2018-07-20 | 2018-07-20 | Drive mechanism and electroplating device |
| PCT/CN2019/096335 WO2020015674A1 (en) | 2018-07-20 | 2019-07-17 | Transmission structure and electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810805538.8A CN108774746A (en) | 2018-07-20 | 2018-07-20 | Drive mechanism and electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108774746A true CN108774746A (en) | 2018-11-09 |
Family
ID=64031408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810805538.8A Pending CN108774746A (en) | 2018-07-20 | 2018-07-20 | Drive mechanism and electroplating device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108774746A (en) |
| WO (1) | WO2020015674A1 (en) |
Cited By (6)
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| WO2020015674A1 (en) * | 2018-07-20 | 2020-01-23 | 东莞宇宙电路板设备有限公司 | Transmission structure and electroplating device |
| CN110760918A (en) * | 2019-11-29 | 2020-02-07 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
| CN111334841A (en) * | 2020-04-14 | 2020-06-26 | 昆山东威科技股份有限公司 | Conductive structure and hanger |
| CN111441076A (en) * | 2020-04-14 | 2020-07-24 | 昆山东威科技股份有限公司 | Adjustable fixed plate and hanger |
| CN112144099A (en) * | 2020-09-17 | 2020-12-29 | 珠海松柏科技有限公司 | Horizontal electroplating production line and transmission mechanism thereof |
| CN115094501A (en) * | 2022-07-28 | 2022-09-23 | 深圳市宏讯制造技术有限公司 | Guide structure and electroplating device |
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| CN110760918A (en) * | 2019-11-29 | 2020-02-07 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
| CN110760918B (en) * | 2019-11-29 | 2022-02-18 | 依力柏电能有限公司 | Electroplating system with controllable plating layer |
| CN111334841A (en) * | 2020-04-14 | 2020-06-26 | 昆山东威科技股份有限公司 | Conductive structure and hanger |
| CN111441076A (en) * | 2020-04-14 | 2020-07-24 | 昆山东威科技股份有限公司 | Adjustable fixed plate and hanger |
| CN112144099A (en) * | 2020-09-17 | 2020-12-29 | 珠海松柏科技有限公司 | Horizontal electroplating production line and transmission mechanism thereof |
| CN112144099B (en) * | 2020-09-17 | 2021-12-21 | 珠海松柏科技有限公司 | Horizontal electroplating production line and transmission mechanism thereof |
| CN115094501A (en) * | 2022-07-28 | 2022-09-23 | 深圳市宏讯制造技术有限公司 | Guide structure and electroplating device |
| CN115094501B (en) * | 2022-07-28 | 2023-11-10 | 深圳市宏讯制造技术有限公司 | Guide structure and electroplating device |
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| Publication number | Publication date |
|---|---|
| WO2020015674A1 (en) | 2020-01-23 |
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