CN208857380U - Drive mechanism and electroplating device - Google Patents

Drive mechanism and electroplating device Download PDF

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Publication number
CN208857380U
CN208857380U CN201821163917.3U CN201821163917U CN208857380U CN 208857380 U CN208857380 U CN 208857380U CN 201821163917 U CN201821163917 U CN 201821163917U CN 208857380 U CN208857380 U CN 208857380U
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China
Prior art keywords
guide plate
idler wheel
drive mechanism
annular groove
sliding
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CN201821163917.3U
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Chinese (zh)
Inventor
陈德和
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Dongguan Universal Pcb Equipment Co Ltd
Universal PCB Equipment Co Ltd
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Dongguan Universal Pcb Equipment Co Ltd
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Priority to CN201821163917.3U priority Critical patent/CN208857380U/en
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Priority to TW108209377U priority patent/TWM586723U/en
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Abstract

The utility model provides a kind of drive mechanism and electroplating device, wherein, the driving effect that drive mechanism is used to be driven power drives circuit board to move along preset track, drive mechanism includes rectilinear orbit, the idler wheel for connecting for the installation part of mounting circuit boards and at least one with installation part and being rolled in rectilinear orbit, idler wheel offers the annular groove with rectilinear orbit cooperation, rectilinear orbit include between the upper and lower away from setting and level the first guide plate and the second guide plate, the plate thickness of first guide plate and the second guide plate matches setting with the groove width of annular groove, first guide plate is downwardly into annular groove above idler wheel, second guide plate is by being inserted upwardly into annular groove below idler wheel, the slot bottom of annular groove is contacted with the second guide plate.The drive mechanism of the utility model can deviate to avoid circuit board in motion process and expected motion profile.

Description

Drive mechanism and electroplating device
Technical field
The utility model belongs to plating equipment technical field more particularly to a drive mechanism and electroplating device.
Background technique
Plating is exactly that the surface of metal or other materials product is made to adhere to layer of metal film using electrolysis, in circuit board Production field, it usually needs the processing such as heavy copper are carried out to circuit board using electroplating technology.Electroplating device is generally comprised for conduction Drive mechanism, existing drive mechanism be easy so that circuit board deviates in motion process and expected motion profile.
Utility model content
The purpose of this utility model is to provide a kind of drive mechanisms, it is intended to solve circuit board in the prior art and be moved through The technical issues of journey and expected motion profile deviate.
The utility model is realized in this way a drive mechanism, the driving effect for being driven power drives circuit board edge The movement of preset track, drive mechanism include rectilinear orbit, for the installation part of mounting circuit boards and at least one and installation part Connection and the idler wheel rolled in rectilinear orbit, idler wheel offer the annular groove with rectilinear orbit cooperation, and rectilinear orbit includes up and down The first guide plate and the second guide plate of spacing setting and level, the plate thickness of the first guide plate and the second guide plate is and annular groove Groove width match setting, the first guide plate is downwardly into annular groove above idler wheel, the second guide plate by idler wheel lower direction Upper insertion annular groove, the slot bottom of annular groove are contacted with the second guide plate.
Further, drive mechanism includes multiple spaced idler wheels and the shaft that is arranged in a one-to-one correspondence with idler wheel, more A idler wheel extends along a horizontal line arranges, and shaft one end is fixed on installation part, and the other end of shaft passes through idler wheel and and idler wheel Rotational installation.
Further, drive mechanism further includes the two bearings being correspondingly arranged with shaft, is provided between shaft and idler wheel Two bearings.
Further, the notch of annular groove is arranged to loudspeaker opening, the width radially flaring of loudspeaker opening.
Further, linear guide further includes a supporting element, and the first guide plate interlocking on supporting element, lock by the second guide plate It is connected on supporting element.
The utility model additionally provides a kind of electroplating device, including above-mentioned drive mechanism.
Further, electroplating device further include it is multiple be fixedly installed on installation part with the fixture of clamping circuit board, it is each to press from both sides Tool is made of an electrically conducting material, and each fixture is electrically connected with installation part.
Further, fixture include the first clamping part for being fixedly connected and being powered with installation part, it is hinged with the first clamping part The second clamping part and elasticity of installation are connected between the first clamping part and the second clamping part to keep the first clamping part and the The elastic compression part of two clamping part clamped conditions.
Further, electroplating device further includes a conductive structure, and conductive structure includes the conduction rack made of conductive material It is installed on the conductive component that on conduction rack and distance is arranged with multiple groups, each conductive component includes being movably installed in conduction On frame and with conduction rack be electrically connected conduct piece, with conduction rack spacing setting and the sliding part made of conductive material, have bullet Property restoring force and its elastic restoring force act on conduct piece so that conduct piece and sliding part press fit elastic component, sliding part tool Have towards conduct piece and the sliding surface that is slidably matched with conduct piece, conduct piece has the mating surface being slidably matched with sliding surface, sliding Dynamic face and mating surface are plane, and sliding part is connect with circuit board.
Further, sliding part is formed with sliding slot of the notch towards conduct piece, and sliding surface is set to the slot bottom of sliding slot, sliding Part further includes the accommodating structure being fixedly connected with the end of slot bottom, and the level height of accommodating structure is lower than the level height of slot bottom.
The utility model compared with the existing technology have the technical effect that idler wheel roll when, the first guide plate and second guiding Plate cooperates with annular groove jointly, and the plate thickness of the first guide plate and the second guide plate matches setting with the groove width of annular groove, can be with It avoids idler wheel from shaking to two sides, further can avoid circuit board and deviate in motion process and expected motion profile, from And ensure that circuit board moves in same perpendicular always, and then the electroplating quality of each circuit board can be improved, meanwhile, also The consistency of same batch circuit board electroplating effect can be improved;The slot bottom of annular groove is contacted with the second guide plate, can be with It prevents idler wheel from installation part being driven to move downward, the downward play of circuit board is driven to avoid rolling, so that circuit board is always same The movement of one level height, and then the electroplating quality of each circuit board can be improved, at the same time it can also improve same batch circuit board The consistency of electroplating effect.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the utility model embodiment, below will to the utility model embodiment or Attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, drawings described below is only Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts, It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the perspective view of electroplanting device provided by the embodiment of the utility model.
Fig. 2 is the stereogram exploded view of electroplanting device provided by the embodiment of the utility model.
Fig. 3 is the stereogram exploded view of idler wheel provided by the embodiment of the utility model, bearing and shaft.
Description of symbols:
100 Electroplating device 17 Annular groove
11 Rectilinear orbit 18 Shaft
12 Supporting element 19 Bearing
13 First guide plate 31 Fixture
14 Second guide plate 32 First clamping part
15 Installation part 33 Second clamping part
16 Idler wheel 34 Elastic compression part
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and should not be understood as to the utility model Limitation.
In the description of the present invention, it should be noted that when to be referred to as " being fixed on " or " being set to " another for element A element, it can be directly on the other element or indirectly on another element.When an element is known as " even It is connected to " another element, it can be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed System, is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning are necessary It with specific orientation, is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention, More than, unless otherwise specifically defined.
For the ordinary skill in the art, above-mentioned term can be understood in the utility model as the case may be In concrete meaning.
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation Example, the present invention will be further described in detail.
As shown in Figure 1 to Figure 3, the utility model embodiment provides a kind of drive mechanism, and the driving for being driven power is made With driving circuit board to move along preset track, drive mechanism includes rectilinear orbit 11, the installation part 15 for mounting circuit boards And at least one connect with installation part 15 and in rectilinear orbit 11 roll idler wheel 16, idler wheel 16 is offered matches with rectilinear orbit 11 The annular groove 17 of conjunction, rectilinear orbit 11 include the first guide plate 13 and the second guide plate 14 between the upper and lower away from setting and level, the The plate thickness of one guide plate 13 and the second guide plate 14 matches setting with the groove width of annular groove 17, and the first guide plate 13 is in idler wheel 16 Top be downwardly into annular groove 17, the second guide plate 14 is inserted upwardly into annular groove 17 by the lower section of idler wheel 16, annular groove 17 Slot bottom is contacted with the second guide plate 14.
In this embodiment, rectilinear orbit 11 includes the first guide plate 13 and the second guiding between the upper and lower away from setting and level Plate 14, wherein the first guide plate 13 and 14 parallel spacing of the second guide plate are arranged, and idler wheel 16 can be enabled to be packed into straight line rail On road 11 (i.e. between the first guide plate 13 and the second guide plate 14), the first guide plate 13 and the second guide plate 14 are horizontally disposed can To guarantee that idler wheel 16 is moved along horizontal motion profile always.
In this embodiment, when idler wheel 16 rolls, the first guide plate 13 and the second guide plate 14 are matched with annular groove 17 jointly It closes, the plate thickness of the first guide plate 13 and the second guide plate 14 matches setting with the groove width of annular groove 17, can be to avoid idler wheel 16 It is shaken to two sides, further can avoid circuit board and deviate in motion process and expected motion profile, so that it is guaranteed that electric Road plate moves in same perpendicular always, and then the electroplating quality of each circuit board can be improved, at the same time it can also improve The consistency of same batch circuit board electroplating effect.
In this embodiment, the slot bottom of annular groove 17 is contacted with the second guide plate 14, can prevent idler wheel 16 from driving Installation part 15 moves downward, and the downward play of circuit board is driven to avoid rolling, so that circuit board is always in same level height Movement, and then the electroplating quality of each circuit board can be improved, at the same time it can also improve same batch circuit board electroplating effect Consistency.
Further, the slot bottom clearance fit of the first guide plate 13 and annular groove 17, can reduce the first guide plate 13 with Frictional force between idler wheel 16 increases the smoothness that idler wheel 16 rolls.
Further, drive mechanism includes multiple spaced idler wheels 16 and the shaft that is arranged in a one-to-one correspondence with idler wheel 16 18, multiple idler wheels 16 extend along a horizontal line arranges, and 18 one end of shaft is fixed on installation part 15, and the other end of shaft 18 passes through Idler wheel 16 is simultaneously rotatablely installed with idler wheel 16.In this embodiment, multiple idler wheels 16 extend along a horizontal line and arrange, and can save cloth Between emptying, reduce the size of drive mechanism in the vertical direction, the other end of shaft 18 passes through idler wheel 16 and rotates with idler wheel 16 Installation so that installation part 15 can be moved along rectilinear orbit 11, and then can make installation part 15 that circuit board be driven to transport along rectilinear orbit 11 It is dynamic.
Further, as shown in figure 3, drive mechanism further includes the two bearings 19 being correspondingly arranged with shaft 18, shaft 18 with Two bearings 19 are provided between idler wheel 16.
In this embodiment, two bearings 19 are provided between shaft 18 and idler wheel 16 can reduce shaft 18 and idler wheel 16 Between frictional force, improve mechanically operated efficiency, and reduce frictional dissipation.
Further, the notch of annular groove 17 is arranged to loudspeaker opening, the width radially flaring of loudspeaker opening.? In the embodiment, the width radially flaring of loudspeaker opening can increase the convenience that idler wheel 16 is transferred to rectilinear orbit 11, And the frictional force between the cell wall of annular groove 17 and the first guide plate 13 and the second guide plate 14 can also be reduced, and then can be with It improves idler wheel 16 and rolls smoothness.
Further, linear guide further includes a supporting element 12, and on supporting element 12, second leads 13 interlocking of the first guide plate To 14 interlocking of plate on supporting element 12.
In this embodiment, when needing replacing the idler wheel 16 of different size, and the idler wheel 16 of the different size has The annular groove 17 of different groove widths needs to select the first guide plate 13 and the second guiding of different-thickness according to the groove width of annular groove 17 Plate 14,13 interlocking of the first guide plate is on supporting element 12, and 14 interlocking of the second guide plate is on supporting element 12, and conveniently replaced first The replacement of guide plate 13 and the second guide plate 14.
Another embodiment of the utility model also provides a kind of electroplating device 100, including above-mentioned drive mechanism.
Further, electroplating device 100 further includes multiple is fixedly installed on installation part 15 with the fixture of clamping circuit board 31, each fixture 31 is made of an electrically conducting material, and each fixture 31 is electrically connected with installation part 15.
In this embodiment, when electroplating activity, driving force with drive installation part 15 move, installation part 15 drive fixture 31 with And it is clamped in the circuit board motion on fixture 31, fixture 31 drives circuit board that installation part 15 is followed to be transmitted to plating station for electricity Plate operation.
Further, fixture 31 includes the first clamping part 32 for being fixedly connected and being powered with installation part 15 and the first clamping The second clamping part 33 and elasticity that portion 32 is hingedly installed are connected between the first clamping part 32 and the second clamping part 33 to keep The elastic compression part 34 of 33 clamped condition of first clamping part 32 and the second clamping part.
In this embodiment, the second clamping and the first hingedly installation of clamping part 32, outer the second clamping part of power drive 33 are opposite Enable the spacing between the second clamping part 33 and the second clamping part 33 that circuit board is allowed to be put into the first clamping part 32 opening, bullet Property 34 elasticity of compression piece be connected between the first clamping part 32 and the second clamping part 33 to keep the first clamping part 32 to press from both sides with second Hold 33 clamped condition of portion, it is ensured that circuit board is clamped in fixture 31.
Further, electroplating device 100 further includes a conductive structure, and conductive structure includes the conduction made of conductive material Frame and multiple groups are installed on conduction rack and the conductive component of distance setting, and each conductive component includes being movably installed in lead Conduct piece and the setting of conduction rack spacing and the sliding part 44 made of conductive material, tool are electrically connected on electric frame and with conduction rack Flexible restoring force and its elastic restoring force act on conduct piece so that conduct piece and 44 press fit of sliding part elastic component, it is sliding Moving part 44 has towards conduct piece and the sliding surface that is slidably matched with conduct piece, and conduct piece has matches with what sliding surface was slidably matched Conjunction face, sliding surface and mating surface are plane, and sliding part 44 is connect with circuit board.
In this embodiment, conductive structure include conduction rack and multiple groups made of conductive material be installed on conduction rack and The conductive component of distance setting, each conductive component include being movably installed on conduction rack and being electrically connected with conduction rack Conduct piece, with conduction rack spacing setting and the sliding part 44 made of conductive material, sliding part 44 connect with circuit board, sliding part 44, which are driven the driving effects of power, slides along the direction V relative to conduct piece, and sliding part 44 drives circuit board motion and by circuit board It is delivered to plating station, in this process, electric signal is from conduction rack successively to conduct piece, the conduction of sliding part 44 until by the telecommunications Number conduction on circuit board so that circuit board is electroplated.
In this embodiment, sliding part 44 has towards conduct piece and the sliding surface that is slidably matched with conduct piece, conduct piece With the mating surface being slidably matched with sliding surface, sliding surface and mating surface are plane, in 44 sliding process of sliding part, sliding Part 44 and conduct piece are plane-plane contact, and contact area is big, can avoid poor contact, electric signal can be guaranteed steadily by conduction Part is conducted to sliding part 44, when to circuit board batch processing (batch processing is to carry out electroplating processes to multiple circuit boards simultaneously), It can guarantee the energization that each circuit board can be stable, and then improve the electroplating effect of each circuit board and improve with batch electricity The consistency of road plate electroplating effect.
In this embodiment, the elastic restoring force that elastic component generates acts on conduct piece so that conduct piece and sliding part 44 are pressed It connects cooperation, makes conduct piece always with 44 press fit of sliding part in the sliding process of sliding part 44, i.e., it is sliding in sliding process Moving part 44 and conduct piece remain plane-plane contact, avoid sliding part 44 due to being led by the influence of the other factors such as mechanical oscillation Cause swings, and reduces and contacts with 44 contact area of sliding part than the conduct piece for avoiding sliding part 44 from swinging caused Bad, therefore, the conductive structure of the utility model embodiment can guarantee the conduct piece contact stable with sliding part 44, can avoid Poor contact, and then the electroplating quality for improving single circuit board and raising are the same as the one of batch electroplating effect of the secondary circuit plate of plating Cause property.
Further, sliding part 44 is formed with sliding slot of the notch towards conduct piece, and sliding surface is set to the slot bottom of sliding slot, sliding Moving part 44 further includes the accommodating structure 47 being fixedly connected with the end of slot bottom, and the level height of accommodating structure 47 is lower than the water of slot bottom Flat height.
In this embodiment, sliding part 44 is slided relative to conduct piece, is rubbed due to existing between sliding part 44 and conduct piece It wipes, therefore, powder can be generated, since sliding part 44 and conduct piece are made of conductive material, therefore, which is also conductive Powder will affect the electroplating quality of circuit board if the powder falls to circuit board, in 44 sliding process of sliding part, the powder It is fallen down by the gap location of adjacent two sliding part 44, since sliding part 44 further includes the accommodating structure being fixedly connected with the end of slot bottom 47, the level height of accommodating structure 47 is lower than the level height of slot bottom, which can catch powder, avoid powder fall to On circuit board, and then improve electroplating quality.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model Protection scope within.

Claims (10)

1. a kind of drive mechanism, the driving effect for being driven power drives circuit board to move along preset track, and feature exists In the drive mechanism includes rectilinear orbit, the installation part for installing the circuit board and at least one and the installation part Connection and the idler wheel rolled in the rectilinear orbit, the idler wheel offers the annular groove with rectilinear orbit cooperation, described Rectilinear orbit includes the first guide plate and the second guide plate away from setting and level between the upper and lower, first guide plate and described the The plate thickness of two guide plates matches setting with the groove width of the annular groove, and first guide plate is downward in the top of the idler wheel Be inserted into the annular groove, second guide plate by being inserted upwardly into the annular groove below the idler wheel, the annular groove Slot bottom is contacted with second guide plate.
2. drive mechanism as described in claim 1, which is characterized in that the drive mechanism includes multiple spaced described Idler wheel and the shaft being arranged in a one-to-one correspondence with the idler wheel, multiple idler wheels extend along a horizontal line arranges, the shaft one End is fixed on the installation part, and the other end of the shaft passes through the idler wheel and is rotatablely installed with the idler wheel.
3. drive mechanism as claimed in claim 2, which is characterized in that the drive mechanism further includes sets corresponding with the shaft The two bearings set are provided with two bearings between the shaft and the idler wheel.
4. the drive mechanism as described in any one of claims 1 to 3, which is characterized in that the notch of the annular groove is arranged It is open at loudspeaker, the width of loudspeaker opening radially flaring.
5. the drive mechanism as described in any one of claims 1 to 3, which is characterized in that the linear guide further includes one Supporting element, the first guide plate interlocking is on the supporting element, and the second guide plate interlocking is on the supporting element.
6. a kind of electroplating device, including the drive mechanism as described in any one of claim 1 to 5.
7. electroplating device as claimed in claim 6, which is characterized in that the electroplating device further includes multiple being fixedly installed in institute It states with the fixture of circuit board described in clamping on installation part, each fixture is made of an electrically conducting material, and each fixture is and institute State installation part electrical connection.
8. electroplating device as claimed in claim 7, which is characterized in that the fixture include be fixedly connected with the installation part and The second clamping part and elasticity that the first clamping part being powered and first clamping part are hingedly installed are connected to first folder It holds between portion and second clamping part to keep the elasticity of first clamping part and the second clamping part clamped condition to press Contracting part.
9. electroplating device as claimed in claim 8, which is characterized in that the electroplating device further includes a conductive structure, described Conductive structure includes that conduction rack and multiple groups made of conductive material are installed on the conduction rack and distance setting is led Electrical component, each conductive component include being movably installed on the conduction rack and being electrically connected with the conduction rack conductive Part, with the conduction rack spacing setting and the sliding part made of conductive material, have elastic restoring force and its elastic restoring force Act on the conduct piece so that the conduct piece and the sliding part press fit elastic component, the sliding part have direction The conduct piece and the sliding surface being slidably matched with the conduct piece, the conduct piece, which has, to be slidably matched with the sliding surface Mating surface, the sliding surface and the mating surface are plane, and the sliding part is connect with the circuit board.
10. electroplating device as claimed in claim 9, which is characterized in that the sliding part is formed with notch towards the conduction The sliding slot of part, the sliding surface are set to the slot bottom of the sliding slot, and the sliding part further includes fixing with the end of the slot bottom The accommodating structure of connection, the level height of the accommodating structure are lower than the level height of the slot bottom.
CN201821163917.3U 2018-07-20 2018-07-20 Drive mechanism and electroplating device Active CN208857380U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201821163917.3U CN208857380U (en) 2018-07-20 2018-07-20 Drive mechanism and electroplating device
TW108209377U TWM586723U (en) 2018-07-20 2019-07-18 Transmission structure and electroplating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821163917.3U CN208857380U (en) 2018-07-20 2018-07-20 Drive mechanism and electroplating device

Publications (1)

Publication Number Publication Date
CN208857380U true CN208857380U (en) 2019-05-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821163917.3U Active CN208857380U (en) 2018-07-20 2018-07-20 Drive mechanism and electroplating device

Country Status (2)

Country Link
CN (1) CN208857380U (en)
TW (1) TWM586723U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020015674A1 (en) * 2018-07-20 2020-01-23 东莞宇宙电路板设备有限公司 Transmission structure and electroplating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020015674A1 (en) * 2018-07-20 2020-01-23 东莞宇宙电路板设备有限公司 Transmission structure and electroplating device

Also Published As

Publication number Publication date
TWM586723U (en) 2019-11-21

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