CN208857379U - Conductive structure and electroplating device - Google Patents
Conductive structure and electroplating device Download PDFInfo
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- CN208857379U CN208857379U CN201821163900.8U CN201821163900U CN208857379U CN 208857379 U CN208857379 U CN 208857379U CN 201821163900 U CN201821163900 U CN 201821163900U CN 208857379 U CN208857379 U CN 208857379U
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- conduct piece
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Abstract
The utility model provides a kind of conductive structure and electroplating device, wherein, conductive structure is used for board transmission electric signal, conductive structure includes the conductive component that conduction rack and multiple groups made of conductive material are installed on that on conduction rack and distance is arranged, each conductive component includes being movably installed on conduction rack and being electrically connected the first conduct piece with conduction rack, with the setting of conduction rack spacing and the sliding part made of conductive material, with elastic restoring force and its elastic restoring force act on the first conduct piece so that the first conduct piece and sliding part press fit elastic component, the sliding surface that sliding part has the first conduct piece of direction and is slidably matched with the first conduct piece, first conduct piece has the mating surface being slidably matched with sliding surface, sliding surface and mating surface are plane, sliding part is connect with circuit board.The technical issues of conductive structure of the utility model can be easy to produce poor contact to avoid conductive structure.
Description
Technical field
The utility model belongs to plating equipment technical field more particularly to a kind of conductive structure and electroplating device.
Background technique
Plating is exactly that the surface of metal or other materials product is made to adhere to layer of metal film using electrolysis, in circuit board
Production field, it usually needs the processing such as heavy copper are carried out to circuit board using electroplating technology.Electroplating device is generally comprised for conduction
Conductive structure, existing conductive structure is easy to produce poor contact problem.
Utility model content
The purpose of this utility model is to provide a kind of conductive structures, it is intended to solve conductive structure in the prior art and be easy to produce
The technical issues of raw poor contact.
The utility model is realized in this way a kind of conductive structure, is used for board transmission electric signal, conductive structure packet
It includes conduction rack and multiple groups made of conductive material and is installed on the conductive component that on conduction rack and distance is arranged, each conduction
Component include be movably installed on conduction rack and with conduction rack be electrically connected the first conduct piece, with conduction rack spacing setting and by
Sliding part made of conductive material there is elastic restoring force and its elastic restoring force to act on the first conduct piece so that first is conductive
The elastic component of part and sliding part press fit, the cunning that sliding part has the first conduct piece of direction and is slidably matched with the first conduct piece
Dynamic face, the first conduct piece have the mating surface being slidably matched with sliding surface, and sliding surface and mating surface are plane, sliding part and electricity
The connection of road plate.
Further, sliding part is formed with sliding slot of the notch towards the first conduct piece, and sliding surface is set to the slot bottom of sliding slot,
Sliding part further includes the accommodating structure being fixedly connected with the end of slot bottom, and the level height of accommodating structure is high lower than the level of slot bottom
Degree.
Further, accommodating structure include one with slot bottom flat part disposed in parallel and be connected to flat part and slot bottom end
Between interconnecting piece, the level height of flat part is lower than the level height of slot bottom.
Further, the lower section of sliding part adjacent thereto is protruded into flat part.
Further, the slot bottom in each conductive component is respectively positioned on same plane, and the flat part in each conductive component is respectively positioned on
In same plane, the interconnecting piece in each conductive component is arranged in parallel.
Further, conductive component further includes the mounting rack for being fixed on conduction rack and being used to install the first conduct piece, the
In on mounting rack, elastic component is installed on mounting rack and cooperates with the first conduct piece elastic compression joint the rotational installation of one conduct piece.
Further, mounting rack includes the fixed company of mounting plate and mounting plate two sides for being fixedly connected with conduction rack
Two first mounting ears of sliding part are connect and stretch to, the first mounting ear is arranged in pairs, and conductive component further includes one for rotating
The pin shaft of first conduct piece is installed, pin shaft passes through the first conduct piece and connect with two first mounting ears.
Further, mounting rack further includes two second installations that sliding part is fixedly connected with and stretched to mounting plate two sides
Ear, the second mounting ear and the first mounting ear correspond and spacing is arranged, and the second mounting ear is arranged in pairs, and conductive component is also
Including one and first the setting of conduct piece spacing the second conduct piece and one for being rotatablely installed the pin shaft of the second conduct piece, pin shaft
It is connect across the second conduct piece and with two second mounting ears.
Further, the rear end of the first conduct piece and the second conduct piece is formed with a bevel structure.
The utility model additionally provides a kind of electroplating device, the installation part that is all connected with including connecting plate, with each connecting plate, more
A to be installed on installation part with the fixture of clamping circuit board and above-mentioned conductive structure, installation part and fixture are by conductive material system
At connecting plate and sliding part are corresponded and installed.
The utility model compared with the existing technology have the technical effect that sliding part has towards the first conduct piece and with first
The sliding surface that conduct piece is slidably matched, the first conduct piece have the mating surface being slidably matched with sliding surface, sliding surface and mating surface
It is plane, in sliding part sliding process, sliding part and the first conduct piece are plane-plane contact, and contact area is big, be can avoid
Poor contact can guarantee that electric signal is stablized and be conducted from the first conduct piece to sliding part, when to circuit board batch processing (at this batch
Reason is simultaneously to multiple circuit boards progress electroplating processes), it is ensured that the energization that each circuit board can be stable, and then improve every
The electroplating effect of one circuit board and improve consistency with batch circuit board electroplating effect；The elastic restoring force that elastic component generates
The first conduct piece is acted on so that the first conduct piece and sliding part press fit, make the first conduction in the sliding process of sliding part
Part is always with sliding part press fit, i.e., in sliding process, sliding part and the first conduct piece remain plane-plane contact, avoids
Sliding part due to being caused to swing by other influences such as mechanical oscillation, than avoid sliding part swing caused by the
One conduct piece and the reduction of sliding part contact area and poor contact, therefore, the conductive structure of the utility model embodiment can be protected
Demonstrate,prove the contact stable with sliding part of the first conduct piece, can avoid poor contact, so improve the electroplating quality of single circuit board with
And it improves with batch electroplating effect consistency of the secondary circuit plate of plating.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the utility model embodiment, below will to the utility model embodiment or
Attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, drawings described below is only
Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the perspective view of conductive structure provided by the embodiment of the utility model.
Fig. 2 is the stereogram exploded view of conductive structure provided by the embodiment of the utility model.
Fig. 3 is the stereogram exploded view of conductive component provided by the embodiment of the utility model
Description of symbols:
| 100 | Conductive structure | 28 | Interconnecting piece | |
| 11 | Conduction rack | 29 | Mounting rack | |
| 20 | Conductive component | 31 | Mounting plate | |
| 21 | First conduct piece | 32 | First mounting ear | |
| 22 | Second conduct piece | 33 | Second mounting ear | |
| 23 | Sliding part | 34 | Pin shaft | |
| 24 | Sliding slot | 35 | Elastic component | |
| 25 | Sliding surface | 36 | First conductor wire | |
| 26 | Accommodating structure | 37 | Second conductor wire | |
| 27 | Flat part |
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and should not be understood as to the utility model
Limitation.
In the description of the present invention, it should be noted that when to be referred to as " being fixed on " or " being set to " another for element
A element, it can be directly on the other element or indirectly on another element.When an element is known as " even
It is connected to " another element, it can be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
For the ordinary skill in the art, above-mentioned term can be understood in the utility model as the case may be
In concrete meaning.
It should also be noted that, being defined in the utility model embodiment according to the XYZ rectangular coordinate system established in Fig. 3:
It is defined as front positioned at the side of X-axis positive direction, the side positioned at X-axis negative direction is defined as rear；Positioned at the one of Y-axis positive direction
Side is defined as right, and the side positioned at Y-axis negative direction is defined as left；It is defined as top positioned at the side of Z axis positive direction, is located at
The side of Z axis negative direction is defined as lower section.
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.
As shown in Figure 1 to Figure 3, the utility model embodiment provides a kind of conductive structure 100, for electric to board transmission
Signal, as shown in Figure 1 to Figure 3, conductive structure 100 include that conduction rack 11 and multiple groups made of conductive material are installed on conduction rack
On 11 and distance setting conductive component 20, each conductive component 20 include be movably installed on conduction rack 11 and with lead
Electric frame 11 is electrically connected the first conduct piece 21, is arranged with 11 spacing of conduction rack and the sliding part 23 made of conductive material, has
Elastic restoring force and its elastic restoring force act on the first conduct piece 21 so that the first conduct piece 21 and 23 press fit of sliding part
Elastic component 35, sliding part 23 has towards the first conduct piece 21 and the sliding surface 25 that is slidably matched with the first conduct piece 21, the
One conduct piece 21 has the mating surface (not shown) being slidably matched with sliding surface 25, and sliding surface 25 and mating surface are plane, sliding
Moving part 23 is connect with circuit board.
In this embodiment, conductive structure 100 includes that conduction rack 11 and multiple groups made of conductive material are installed on conduction
On frame 11 and distance setting conductive component 20, each conductive component 20 include be movably installed on conduction rack 11 and with
Conduction rack 11 is electrically connected the first conduct piece 21, is arranged with 11 spacing of conduction rack and the sliding part 23 made of conductive material, cunning
Moving part 23 is connect with circuit board, and the driving effect that sliding part 23 is driven power is slided along the direction V relative to the first conduct piece 21, sliding
Moving part 23 drive circuit board motion simultaneously circuit board is delivered to plating station, in this process, electric signal by conduction rack 11 successively
To the first conduct piece 21, the conduction of sliding part 23 until by the electric signal conduct on circuit board so that circuit board is electroplated.
In this embodiment, the cunning that sliding part 23 has the first conduct piece 21 of direction and is slidably matched with the first conduct piece 21
Dynamic face 25, the first conduct piece 21 have the mating surface being slidably matched with sliding surface 25, and sliding surface 25 and mating surface are plane,
In 23 sliding process of sliding part, sliding part 23 and the first conduct piece 21 are plane-plane contact, and contact area is big, can avoid contact not
It is good, it can guarantee that electric signal is steadily conducted from the first conduct piece 21 to sliding part 23, when to circuit board batch processing (at this batch
Reason is simultaneously to multiple circuit boards progress electroplating processes), it is ensured that the energization that each circuit board can be stable, and then improve every
The electroplating effect of one circuit board and improve consistency with batch circuit board electroplating effect.
In this embodiment, the elastic restoring force that elastic component 35 generates acts on the first conduct piece 21 so that the first conduct piece
21 with 23 press fit of sliding part, in the sliding process of sliding part 23 first conduct piece 21 is crimped with sliding part 23 always and matches
Close, i.e., in sliding process, sliding part 23 and the first conduct piece 21 remain plane-plane contact, avoid sliding part 23 due to by
The influence of the other factors such as mechanical oscillation causes to swing, than avoid sliding part 23 swing caused by it is first conductive
Part 21 and the reduction of 23 contact area of sliding part and poor contact, therefore, the conductive structure 100 of the utility model embodiment can be protected
The contact stable with sliding part 23 of the first conduct piece 21 is demonstrate,proved, can avoid poor contact, and then improve the plating matter of single circuit board
Amount and the consistency for improving the electroplating effect with the secondary circuit plate for criticizing plating.
Further, as shown in Fig. 2, adjacent two sliding part 23 is intervally installed, the first conduct piece 21 is in the length in the direction V
Degree is greater than the gap of adjacent two sliding part 23, in 23 sliding process of sliding part, each 23 synchronous slide of sliding part, and each sliding part
23 sliding speed is all the same, and when gap one first conduct piece 21 of face of adjacent two sliding part 23, the first conduct piece 21 is in V
The length in direction is greater than the gap of adjacent two sliding part 23, it is ensured that the first conduct piece 21 is able to maintain surely always with sliding part 23
Fixed contact, and then guarantee the conduction that electric signal can be stable in the electroplating process of circuit board, so that circuit board can be improved
Electroplating effect.
Further, sliding part 23 is formed with sliding slot 24 of the notch towards the first conduct piece 21, and sliding surface 25 is set to cunning
The slot bottom of slot 24, sliding part 23 further include the accommodating structure 26 being fixedly connected with the end of slot bottom, and the level of accommodating structure 26 is high
Degree is lower than the level height of slot bottom.
In this embodiment, the elastic restoring force that elastic component 35 generates acts on the first conduct piece 21 so that the first conduct piece
21 with 23 press fit of sliding part, sliding part 23 slide during, the first conduct piece 21 always it is opposite with slot bottom sliding, cunning
First conduct piece 21 can be limited in sliding slot 24 by cell wall and elastic component 35 cooperation of slot 24, avoid the first conduct piece 21 by sliding slot
It is gone out to the left or to the right in 24, if the first conduct piece 21 is gone out out of sliding slot 24 will cause the first conduct piece 21 and sliding part 23
Contact area reduces, and then will cause the first conduct piece 21 and 23 poor contact of sliding part, in other words, the cell wall of sliding slot 24 with
First conduct piece 21 is limited in sliding slot 24 by the cooperation of elastic component 35, can be improved electric between the first conduct piece 21 and sliding part 23
The stability of conduction, and then the electroplating effect of circuit board is improved, the one of same batch circuit board electroplating effect further can be improved
Cause property.
In this embodiment, sliding part 23 is slided relative to the first conduct piece 21, due to sliding part 23 and the first conduct piece
There is friction between 21, therefore, powder can be generated, since sliding part 23 and the first conduct piece 21 are made of conductive material, therefore,
The powder is also conductive powder, if the powder falls to circuit board, will affect the electroplating quality of circuit board, in sliding part 23
In sliding process, which is fallen down by the gap location of adjacent two sliding part 23, since sliding part 23 further includes the end with slot bottom
The accommodating structure 26 being fixedly connected, the level height of accommodating structure 26 are lower than the level height of slot bottom, which can connect
Firmly powder avoids powder from falling to circuit board, and then improves electroplating quality.
Further, accommodating structure 26 include one with slot bottom flat part 27 disposed in parallel and be connected to flat part 27 and slot
Interconnecting piece 28 between bottom end, the level height of flat part 27 are lower than the level height of slot bottom.
In this embodiment, accommodating structure 26 include one with slot bottom flat part 27 disposed in parallel and be connected to flat part 27
Interconnecting piece 28 between slot bottom end, the level height of flat part 27 are lower than the level height of slot bottom, and powder is slided by adjacent two
The gap location of moving part 23 is fallen, and is dropped down on interconnecting piece 28, or is tumbled from interconnecting piece 28 to flat part 27.
Further, the lower section of sliding part 23 adjacent thereto is protruded into flat part 27, and flat part 27 can be improved and connect gear powder
Effect and reliability.
Further, the slot bottom in each conductive component 20 is respectively positioned on same plane, the flat part 27 in each conductive component 20
It is respectively positioned in same plane, the interconnecting piece 28 in each conductive component 20 is arranged in parallel.
Further, conductive component 20 further includes the installation be fixed on conduction rack 11 and be used to install the first conduct piece 21
Frame 29, the rotational installation of the first conduct piece 21 on mounting rack 29, elastic component 35 be installed on mounting rack 29 and with the first conduct piece
The cooperation of 21 elastic compression joints.In this embodiment, mounting rack 29 and conduction rack 11 are fixedly mounted, the rotational installation of the first conduct piece 21 in
On mounting rack 29, the first conduct piece 21 can be installed to conduction rack 11.
Further, as shown in figure 3, mounting rack 29 includes the mounting plate 31 and peace for being fixedly connected with conduction rack 11
31 two sides of loading board are fixedly connected and stretch to two first mounting ears 32 of sliding part 23, and the first mounting ear 32 is arranged in pairs,
Conductive component 20 further includes one for be rotatablely installed the pin shaft 34 of the first conduct piece 21, pin shaft 34 across the first conduct piece 21 and with
The connection of two first mounting ears 32.
Further, elastic component 35 be two-way torsional spring, elastic component 35 be sheathed on pin shaft 34 and with the first conduct piece 21
Top elastic compression joint.
Further, mounting rack 29 further includes two second that sliding part 23 is fixedly connected with and stretched to 31 two sides of mounting plate
Mounting ear 33, the second mounting ear 33 and the first mounting ear 32 correspond and spacing is arranged, and the second mounting ear 33 is set in pairs
Set, conductive component 20 further include one and the setting of 21 spacing of the first conduct piece the second conduct piece 22 and one for being rotatablely installed the
The pin shaft 34 of two conduct pieces 22, pin shaft 34 pass through the second conduct piece 22 and connect with two second mounting ears 33.
In this embodiment, the second conduct piece 22 is installed on two second mounting ears 33 by a pin shaft 34, and second is conductive
Part 22 and sliding part 23 are electrically connected, and can increase the stability of sliding part 23 and the conduction of 11 electric signal of conduction rack.
Further, each conductive component 20 include first conductor wire 36 being connect with the first conduct piece 21 and with
Second conductor wire 37 of the second conduct piece 22 connection, the first conductor wire 36 and the second conduction are connect with conduction rack 11, and first leads
Electric wire 36 is for being electrically connected the first conduct piece 21 and conduction rack 11, and the second conductor wire 37 is for being electrically connected the second conduct piece 22
With conduction rack 11.
Further, conductive component 20 further include set it is another be set to pin shaft 34 on and with 22 press fit of the second conduct piece
Elastic component 35.
Further, adjacent two sliding part 23 is intervally installed, and length of second conduct piece 22 in the direction V is greater than adjacent
The gap of two sliding parts 23, in 23 sliding process of sliding part, each 23 synchronous slide of sliding part, and the sliding speed of each sliding part 23
Spend all the same, when gap one second conduct piece 22 of face of adjacent two sliding part 23, the second conduct piece 22 is in the length in the direction V
Greater than the gap of adjacent two sliding part 23, it is ensured that the second conduct piece 22 is able to maintain stable contact with sliding part 23 always,
And then guarantee the conduction that electric signal can be stable in the electroplating process of circuit board, so that the electroplating effect of circuit board can be improved.
Further, the rear end of the first conduct piece 21 and the second conduct piece 22 is formed with a bevel structure.Cunning can be increased
Smoothness when moving part 23 slides avoids the rear end of the first conduct piece 21 and the second conduct piece 22 and the front end of sliding part 23 from occurring
Interference.
The utility model other embodiments also provide a kind of electroplating device, as shown in figure 3, electroplating device include connecting plate,
The installation part that is all connected with each connecting plate multiple is installed on installation part with the fixture of clamping circuit board and above-mentioned conductive structure
100, installation part and fixture are made of conductive material, and connecting plate and sliding part 23 are corresponded and installed.
In this embodiment, the structural member that installation part is integral, and installation part is made of conductive material, multiple circuit boards
It is installed on installation part by fixture, and fixture is made of conductive material, as long as one in multiple connecting plates and sliding part
23 normal power-ups, then installation part can electric signal conduct on circuit board for plating, electricity when improving circuit board electroplating operation
The reliability of signal transduction, and when electroplating activity, the electricity of installation to each circuit board on installation part is all the same, can be improved
With the consistency of batch circuit board electroplating effect.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. a kind of conductive structure is used for board transmission electric signal, which is characterized in that the conductive structure includes by conduction material
Conduction rack and multiple groups made of matter are installed on the conduction rack and the conductive component of distance setting, each conductive group
Part includes being movably installed on the conduction rack and being electrically connected between the first conduct piece and the conduction rack with the conduction rack
Away from setting and the sliding part made of conductive material, that there is elastic restoring force and its elastic restoring force to act on described first is conductive
Part so that first conduct piece and the sliding part press fit elastic component, the sliding part have is led towards described first
Electric part and the sliding surface being slidably matched with first conduct piece, first conduct piece has to be slidably matched with the sliding surface
Mating surface, the sliding surface and the mating surface are plane, and the sliding part is connect with the circuit board.
2. conductive structure as described in claim 1, which is characterized in that the sliding part is formed with notch and leads towards described first
The sliding slot of electric part, the sliding surface are set to the slot bottom of the sliding slot, and the sliding part further includes solid with the end of the slot bottom
Surely the accommodating structure connected, the level height of the accommodating structure are lower than the level height of the slot bottom.
3. conductive structure as claimed in claim 2, which is characterized in that the accommodating structure includes one parallel with the slot bottom setting
The flat part set and the interconnecting piece being connected between the flat part and the slot bottom end, the level height of the flat part are low
In the level height of the slot bottom.
4. conductive structure as claimed in claim 3, which is characterized in that the sliding part adjacent thereto is protruded into the flat part
Lower section.
5. conductive structure as claimed in claim 3, which is characterized in that the slot bottom in each conductive component is respectively positioned on together
One plane, the flat part in each conductive component are respectively positioned in same plane, the company in each conductive component
Socket part is arranged in parallel.
6. the conductive structure as described in any one of claim 1 to 5, which is characterized in that the conductive component further includes solid
Due to the mounting rack on the conduction rack and for installing first conduct piece, the first conduct piece rotational installation is in described
On mounting rack, the elastic component is installed on the mounting rack and cooperates with the first conduct piece elastic compression joint.
7. conductive structure as claimed in claim 6, which is characterized in that the mounting rack includes for fixing with the conduction rack
The mounting plate of connection, two first mounting ears for being fixedly connected with the mounting plate two sides and stretching to the sliding part, described
One mounting ear is arranged in pairs, and the conductive component further includes one for being rotatablely installed the pin shaft of first conduct piece, institute
Pin shaft is stated across the first conduct piece and is connect with two first mounting ears.
8. conductive structure as claimed in claim 7, which is characterized in that the mounting rack further includes and the mounting plate two sides
Two second mounting ears of the sliding part are fixedly connected with and stretch to, second mounting ear and first mounting ear correspond
And spacing is arranged, second mounting ear is arranged in pairs, and the conductive component further includes between one and first conduct piece
For the second conduct piece and one away from setting for being rotatablely installed the pin shaft of second conduct piece, it is conductive that the pin shaft passes through second
Part is simultaneously connect with two second mounting ears.
9. conductive structure as claimed in claim 8, which is characterized in that after first conduct piece and second conduct piece
End is formed with a bevel structure.
10. a kind of electroplating device, which is characterized in that including connecting plate, the installation part, the Duo Gean that are all connected with each connecting plate
Loaded on the fixture of circuit board described in clamping and as in one of claimed in any of claims 1 to 9 conductive knot on the installation part
Structure, the installation part and the fixture are made of conductive material, and the connecting plate and the sliding part are corresponded and installed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821163900.8U CN208857379U (en) | 2018-07-20 | 2018-07-20 | Conductive structure and electroplating device |
| TW108209376U TWM586722U (en) | 2018-07-20 | 2019-07-18 | Conductive structure and electroplating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821163900.8U CN208857379U (en) | 2018-07-20 | 2018-07-20 | Conductive structure and electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208857379U true CN208857379U (en) | 2019-05-14 |
Family
ID=66413060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821163900.8U Active CN208857379U (en) | 2018-07-20 | 2018-07-20 | Conductive structure and electroplating device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN208857379U (en) |
| TW (1) | TWM586722U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108796588A (en) * | 2018-07-20 | 2018-11-13 | 东莞宇宙电路板设备有限公司 | Conductive structure and electroplating device |
-
2018
- 2018-07-20 CN CN201821163900.8U patent/CN208857379U/en active Active
-
2019
- 2019-07-18 TW TW108209376U patent/TWM586722U/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108796588A (en) * | 2018-07-20 | 2018-11-13 | 东莞宇宙电路板设备有限公司 | Conductive structure and electroplating device |
| WO2020015673A1 (en) * | 2018-07-20 | 2020-01-23 | 东莞宇宙电路板设备有限公司 | Conductive structure and electric plating device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM586722U (en) | 2019-11-21 |
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