WO2020015673A1

WO2020015673A1 - Conductive structure and electric plating device

Info

Publication number: WO2020015673A1
Application number: PCT/CN2019/096334
Authority: WO
Inventors: 陈德和
Original assignee: 东莞宇宙电路板设备有限公司
Priority date: 2018-07-20
Filing date: 2019-07-17
Publication date: 2020-01-23
Also published as: CN108796588A

Abstract

Provided are a conductive structure and an electric plating device, wherein the conductive structure is configured to transmit an electric signal to a circuit board, and the conductive structure comprises a conductive frame made of a conductive material and a plurality of conductive assemblies installed on the conductive frame and arranged apart from each other; each conductive assembly comprises a first conductive element movably installed on the conductive frame and electrically connected to the conductive frame, a sliding element arranged apart from the conductive frame and made of a conductive material, and an elastic element having an elastic restoring force acting on the first conductive element to press-fit the first conductive element to the sliding element; the sliding element has a sliding face facing the first conductive element and in a slide fit with the first conductive element; the first conductive element has a fitting face in a slide fit with the sliding face; both the sliding face and the fitting face are planar; and the sliding element is connected to the circuit board.

Description

Conductive structures and plating equipment

This application claims priority from a Chinese patent application filed with the Chinese Patent Office on July 20, 2018 with application number 201810805519.5, the entire contents of which are incorporated herein by reference.

Technical field

The present application belongs to the technical field of electroplating equipment, for example, relates to a conductive structure and electroplating equipment.

Background technique

Electroplating is the use of electrolysis to make a metal film on the surface of a metal or other material. In the field of circuit board production, electroplating is usually used to process copper on the circuit board. The electroplating equipment generally includes a conductive structure for conducting electricity. The conductive structure in the related art is prone to poor contact problems.

Summary of the invention

The present application provides a conductive structure and electroplating equipment, which aims to solve the problem that conductive structures are prone to poor contact in the related art.

This application is implemented as follows. A conductive structure is configured to transmit electrical signals to a circuit board. The conductive structure includes a conductive frame made of a conductive material and a plurality of groups of conductive components mounted on the conductive frame and spaced from each other. The conductive component includes a first conductive member movably mounted on the conductive frame and electrically connected to the conductive frame, a sliding member made of a conductive material disposed at a distance from the conductive frame, having elastic restoring force, and the elastic restoring force acts on the first conductive member. An elastic member that press-fits the first conductive member with the sliding member, the sliding member has a sliding surface facing the first conductive member and slidingly cooperates with the first conductive member, and the first conductive member has a matching surface slidingly matched with the sliding surface The sliding surface and the mating surface are both flat, and the sliding member is configured to be connected to the circuit board.

The present application also provides a plating equipment, including a plurality of connection boards, a mounting member connected to the plurality of connection boards, a plurality of jigs mounted on the mounting members and configured to clamp the circuit board, and the above-mentioned conductive structure, and the conductive structure. It includes multiple sliders, the mounting members and clamps are made of conductive materials, and multiple connection plates are installed one-to-one corresponding to multiple sliders.

BRIEF DESCRIPTION OF THE DRAWINGS

1 is a perspective view of a conductive structure provided by an embodiment of the present application;

2 is an exploded perspective view of a conductive structure provided by an embodiment of the present application;

3 is an exploded perspective view of a conductive component according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a conductive component according to an embodiment of the present application.

Reference sign description:

100, conductive structure; 11, conductive frame; 20, conductive component; 21, first conductive member; 22, second conductive member; 23, sliding member; 24, chute; 25, sliding surface; 26, receiving structure; 27. Flat portion; 28. Connection portion; 29. Mounting frame; 31. Mounting plate; 32. First mounting ear; 33; Second mounting ear; 34; Pin; 35; Elastic member; 36; First conductive wire ; 37, the second conductive line; 40, the connection plate; 41, the mounting piece; 42, the fixture.

detailed description

Hereinafter, embodiments of the present application will be described in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary, and are intended to explain the present application, and should not be construed as limiting the present application.

In the description of this application, when an element is referred to as being "fixed to" or "disposed to" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

The terms "length", "width", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom" " The directions or positional relations indicated by “inside” and “outside” are based on the positional or positional relations shown in the drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific The orientation and construction and operation in a specific orientation cannot be understood as a limitation on this application.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality" is two or more, unless specifically defined otherwise.

For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In the embodiment of the present application, according to the XYZ rectangular coordinate system established in FIG. 3, the side located in the positive direction of the X axis is defined as the front, and the side located in the negative direction of the X axis is defined as the rear. The side is defined as the right side, the side located in the negative direction of the Y axis is defined as the left side; the side located in the positive direction of the Z axis is defined as the upper side, and the side located in the negative direction of the Z axis is defined as the lower side.

As shown in FIG. 1 to FIG. 3, an embodiment of the present application provides a conductive structure 100 configured to transmit an electrical signal to a circuit board. As shown in FIG. 1 to FIG. 3, the conductive structure 100 includes a conductive frame made of a conductive material. 11 and a plurality of groups of conductive components 20 installed on the conductive frame 11 and spaced apart from each other. Each group of conductive components 20 includes a first conductive member 21 movably mounted on the conductive frame 11 and electrically connected to the conductive frame 11, and a conductive frame. The sliders 23 are arranged at a distance of 11 and are made of conductive material. The elastic members 35 have elastic restoring force, and the elastic restoring force acts on the first conductive member 21 to make the first conductive member 21 and the slider 23 press-fit and slide. The member 23 has a sliding surface 25 facing the first conductive member 21 and slidingly mating with the first conductive member 21. The first conductive member 21 has a mating surface (not shown) that mates with the sliding surface 25, the sliding surface 25 and the mating surface. Both are flat, and the slider 23 is configured to be connected to a circuit board.

In this embodiment, the conductive structure 100 includes a conductive frame 11 made of a conductive material and a plurality of groups of conductive components 20 mounted on the conductive frame 11 and spaced apart from each other. Each group of the conductive components 20 includes movably mounted on the conductive frame 11. The first conductive member 21 is electrically connected to the conductive frame 11, and the sliding member 23 made of conductive material is arranged at a distance from the conductive frame 11 and is connected to the circuit board. The sliding member 23 is driven by the driving force along the V The direction slides relative to the first conductive member 21, and the slider 23 drives the circuit board to move and transport the circuit board to the plating station. In the process, the electrical signal is transmitted from the conductive frame 11 to the first conductive member 21 and the slider 23 in this order. Until the electric signal is transmitted to the circuit board, the circuit board is electroplated.

In this embodiment, the sliding member 23 has a sliding surface 25 facing the first conductive member 21 and slidingly mates with the first conductive member 21, and the first conductive member 21 has a mating surface slidingly mating with the sliding surface 25. The sliding surface 25 and The mating surfaces are all flat surfaces. During the sliding process of the sliding member 23, the sliding member 23 and the first conductive member 21 are in surface-to-surface contact. The contact area is large, which can avoid poor contact, and can ensure that the electrical signal is stably passed by the first conductive member 21. Conducted to the slider 23, and when the circuit board is batch-processed (the batch process is to plate multiple circuit boards at the same time), it can ensure that each circuit board can be stably energized, thereby improving the plating effect of each circuit board And improve the consistency of the plating effect of the same batch of circuit boards.

In this embodiment, the elastic restoring force generated by the elastic member 35 acts on the first conductive member 21 so that the first conductive member 21 and the sliding member 23 are press-fitted. During the sliding process of the sliding member 23, the first conductive member 21 is always It is press-fitted with the sliding member 23, that is, during the sliding process, the sliding member 23 and the first conductive member 21 are always in surface-to-surface contact to prevent the sliding member 23 from swinging left and right due to the influence of other factors such as mechanical vibration. The contact area between the first conductive member 21 and the sliding member 23 is reduced due to the left-right swing of 23 and the contact is poor. Therefore, the conductive structure 100 in the embodiment of the present application can ensure stable contact between the first conductive member 21 and the sliding member 23, which can be avoided. Poor contact, thereby improving the plating quality of a single circuit board and the consistency of the plating effect of secondary circuit boards plated in the same batch.

In an embodiment, as shown in FIG. 2, two adjacent sliding members 23 are spaced apart from each other. The length of the first conductive member 21 in the V direction is greater than the gap between the two adjacent sliding members 23. The multiple sliding members 23 slide synchronously, and the sliding speeds of the multiple sliding members 23 are the same. When the gap between two adjacent sliding members 23 is directly opposite to the first conductive member 21, the length of the first conductive member 21 in the V direction It is larger than the gap between two adjacent sliding members 23, which can ensure that the first conductive member 21 and the sliding member 23 can always maintain stable contact, thereby ensuring that the electrical signals can be stably conducted during the plating process of the circuit board, thereby improving the circuit board's Plating effect.

In one embodiment, the sliding member 23 is formed with a sliding groove 24 with a notch facing the first conductive member 21. The sliding surface 25 is provided at the groove bottom of the sliding groove 24. The sliding member 23 further includes a fixed connection to an end of the groove bottom. The accommodating structure 26 has a horizontal height lower than the horizontal height of the bottom of the groove.

In this embodiment, the elastic restoring force generated by the elastic member 35 acts on the first conductive member 21 to press-fit the first conductive member 21 and the sliding member 23. During the sliding movement of the sliding member 23, the first conductive member 21 Always slide relative to the bottom of the groove. The groove wall of the chute 24 cooperates with the elastic member 35 to confine the first conductive member 21 inside the chute 24 and prevent the first conductive member 21 from punching left or right out of the chute 24. If the first conductive member 21 is punched out of the chute 24, the contact area between the first conductive member 21 and the sliding member 23 will be reduced, and the first conductive member 21 and the sliding member 23 will have poor contact, in other words, The groove wall of the chute 24 cooperates with the elastic member 35 to limit the first conductive member 21 within the chute 24, which can improve the stability of the electrical conduction between the first conductive member 21 and the slider 23, and thereby improve the plating effect of the circuit board. , Can improve the consistency of the plating effect of circuit boards in the same batch.

In this embodiment, the sliding member 23 slides relative to the first conductive member 21. Due to the friction between the sliding member 23 and the first conductive member 21, powder is generated. Since both the sliding member 23 and the first conductive member 21 are frictional, It is made of conductive material, so this powder is also a conductive powder. If the powder falls on the circuit board, it will affect the plating quality of the circuit board. During the sliding process of the sliding member 23, the powder is formed by two adjacent sliding members 23 The sliding member 23 also includes an accommodating structure 26 fixedly connected to the end of the groove bottom. The horizontal height of the accommodating structure 26 is lower than the horizontal height of the bottom of the groove. The accommodating structure 26 can catch powder. , To avoid powder falling on the circuit board, thereby improving the quality of plating.

In one embodiment, the accommodating structure 26 includes a flat portion 27 disposed parallel to the bottom of the groove and a connecting portion 28 connected between the flat portion 27 and the end of the bottom of the groove. The level of the flat portion 27 is lower than the level of the bottom of the groove. height.

In this embodiment, the accommodating structure 26 includes a flat portion 27 disposed parallel to the groove bottom and a connecting portion 28 connected between the flat portion 27 and the end of the groove bottom. The horizontal height of the flat portion 27 is lower than that of the groove bottom. At a horizontal height, the powder falls from the gap between two adjacent sliding members 23 and falls on the connecting portion 28 or rolls from the connecting portion 28 onto the flat portion 27.

In one embodiment, the flat portion 27 projects below the slider 23 adjacent to the slider 23 to which the flat portion 27 belongs, so that the effect and reliability of the flat portion 27 receiving powder can be improved.

In one embodiment, the groove bottoms in the plurality of sets of conductive components 20 are located on the same plane, the flat portions 27 in the plurality of sets of conductive components 20 are located in the same plane, and the connection portions 28 in the plurality of sets of conductive components 20 are arranged in parallel with each other. .

In one embodiment, the conductive component 20 further includes a mounting bracket 29 fixed on the conductive frame 11. The mounting bracket 29 is configured to mount the first conductive member 21. The first conductive member 21 is rotatably mounted on the mounting bracket 29, and the elastic member 35 Mounted on the mounting bracket 29 and elastically press-fitted with the first conductive member 21. In this embodiment, the mounting frame 29 and the conductive frame 11 are fixedly mounted, the first conductive member 21 is rotatably mounted on the mounting frame 29, and the first conductive member 21 can be mounted on the conductive frame 11.

In an embodiment, as shown in FIG. 3, the mounting bracket 29 includes a mounting plate 31 for fixed connection with the conductive frame 11, and two first plates that are fixedly connected to both sides of the mounting plate 31 and extend toward the slider 23. The mounting ears 32 are provided in pairs. The conductive assembly 20 further includes a pin 34 for rotatingly mounting the first conductive member 21. The pin 34 passes through the first conductive member 21 and connects with the two first The mounting ear 32 is connected.

In one embodiment, the elastic member 35 is a two-way torsion spring, and the elastic member 35 is provided to be sleeved on the pin 34 and is elastically crimped to the top of the first conductive member 21.

In one embodiment, the mounting bracket 29 further includes two second mounting ears 33 that are fixedly connected to both sides of the mounting plate 31 and extend toward the slider 23. The two second mounting ears 33 and the two first mounting ears 32. The one-to-one correspondence and the spacing are set, the second mounting ears 33 are arranged in pairs, and the conductive component 20 further includes a second conductive member 22 spaced from the first conductive member 21 and a pin for rotating the second conductive member 22. 34. The pin 34 passes through the second conductive member 22 and is connected to the two second mounting ears 33.

In this embodiment, the second conductive member 22 is mounted on the two second mounting ears 33 through a pin 34, and the second conductive member 22 is electrically connected to the slider 23, which can increase the electrical connection between the slider 23 and the conductive frame 11. Signaling stability.

In one embodiment, each group of conductive components 20 includes a first conductive line 36 connected to the first conductive member 21 and a second conductive line 37 connected to the second conductive member 22. The first conductive line 36 and the second conductive member are both conductive. Connected to the conductive frame 11, the first conductive line 36 is configured to electrically connect the first conductive member 21 and the conductive frame 11, and the second conductive line 37 is configured to electrically connect the second conductive member 22 and the conductive frame 11.

In one embodiment, the elastic member 35 is further configured to be sleeved on the pin 34 and press-fitted with the second conductive member 22.

In one embodiment, two adjacent sliding members 23 are spaced apart from each other. The length of the second conductive member 22 in the V direction is greater than the gap between the two adjacent sliding members 23. During the sliding movement of the sliding members 23, the plurality of sliding members 23 are synchronized. Sliding, and the sliding speeds of the plurality of sliding members 23 are the same. When the gap between two adjacent sliding members 23 is opposite to the second conductive member 22, the length of the second conductive member 22 in the V direction is longer than that of the two adjacent sliding members 23. The gap can ensure that the second conductive member 22 and the sliding member 23 can always maintain stable contact, thereby ensuring that the electric signal can be stably conducted during the plating process of the circuit board, thereby improving the plating effect of the circuit board.

In an embodiment, referring to FIG. 3, the first end of the first conductive member 21 and the first end of the second conductive member 22 (that is, the rear end of the first conductive member 21 and the rear end of the second conductive member 22) are both A slope structure is formed. The sliding degree of the sliding member 23 can be increased to prevent interference between the rear ends of the first conductive member 21 and the second conductive member 22 and the front end of the sliding member 23.

An embodiment of the present application further provides a plating device. As shown in FIGS. 1 to 4, the plating device includes a plurality of connection plates 40, a mounting member 41 connected to each of the plurality of connection plates 40, and a plurality of mounting members 41. The clamp 42 provided to clamp the circuit board and the above-mentioned conductive structure 100. The conductive structure 100 includes a plurality of sliders 23. The mounting member 41 and the clamp 42 are made of a conductive material. The plurality of connection plates 40 and the plurality of sliders 23 One-to-one installation.

In this embodiment, the mounting member 41 is an integral structural member, and the mounting member 41 is made of a conductive material. A plurality of circuit boards are mounted on the mounting member 41 through a clamp 42, and the clamp 42 is made of a conductive material. When one of the plurality of connection boards 40 is normally energized with the slider 23, the mounting member 41 can conduct electrical signals to the circuit board for power supply plating, which improves the reliability of electrical signal conduction during the circuit board plating operation, and during the plating operation, The electric quantity of each circuit board installed on the mounting member 41 is the same, which can improve the consistency of the plating effect of the circuit boards in the same batch.

Claims

A conductive structure includes a conductive frame (11) made of a conductive material and a plurality of groups of conductive components (20) installed on the conductive frame (11) and spaced from each other. Each group of conductive components (20) includes a movable A first conductive member (21) installed on the conductive frame (11) and electrically connected to the conductive frame (11), and a sliding member made of a conductive material and spaced from the conductive frame (11) (23) An elastic member having elastic restoring force and the elastic restoring force acting on the first conductive member (21) so that the first conductive member (21) and the sliding member (23) are press-fitted (35) The sliding member (23) has a sliding surface (25) facing the first conductive member (21) and sliding fit with the first conductive member (21), and the first conductive member (21) ) Has a mating surface slidingly mated with the sliding surface (25), the sliding surface (25) and the mating surface are both flat, and the sliding member (23) is configured to be connected to a circuit board.
The conductive structure according to claim 1, wherein the sliding member (23) is formed with a sliding groove (24) with a notch facing the first conductive member (21), and the sliding surface (25) is provided at the The groove bottom of the sliding groove (24), the sliding member (23) further includes a receiving structure (26) fixedly connected to an end of the groove bottom, and the horizontal height of the receiving structure (26) is lower than The horizontal height of the groove bottom.
The conductive structure according to claim 2, wherein the accommodating structure comprises a flat portion (27) provided in parallel with the groove bottom and connected between the flat portion (27) and an end portion of the groove bottom The horizontal portion of the connecting portion (28) of the flat portion (27) is lower than the horizontal height of the groove bottom.
The conductive structure according to claim 3, wherein the flat portion (27) projects below the slide (23) adjacent to the slide (23) to which the flat portion (27) belongs.
The conductive structure according to claim 3, wherein the groove bottoms in the plurality of sets of conductive components are all located in the same plane, and the flat portions (27) in the plurality of sets of conductive components are located in the same plane. The connection portions (28) in the plurality of sets of conductive components are all arranged in parallel with each other.
The conductive structure according to any one of claims 1 to 5, wherein the conductive component further comprises a mounting frame (29) fixed on the conductive frame (11), and the mounting frame (29) is provided as The first conductive member (21) is mounted, the first conductive member (21) is rotatably mounted on the mounting bracket (29), and the elastic member (35) is mounted on the mounting bracket (29) and It is elastically press-fitted with the first conductive member (21).
The conductive structure according to claim 6, wherein the mounting frame (29) comprises a mounting plate (31) for fixed connection with the conductive frame (11), and two sides of the mounting plate (31) respectively Two first mounting ears (32) fixedly connected to the side and extending to the sliding member (23), the first mounting ears (32) are arranged in pairs, and the conductive component (20) further includes a pin (34) The pin shaft (34) is configured to rotatably mount the first conductive member (21), and the pin shaft (34) passes through the first conductive member (21) and communicates with the two First mounting ears (32) are connected.
The conductive structure according to claim 7, wherein the mounting frame (29) further comprises two second fixedly connected to both sides of the mounting plate (31) and extending toward the sliding member (23). Mounting ears (33), the two second mounting ears (33) and the two first mounting ears (32) are in one-to-one correspondence and spaced, and the second mounting ears (33) are arranged in pairs The conductive assembly (20) further includes a second conductive member (22) spaced from the first conductive member (21) and the pin (34), and the pin (34) is also configured to rotate The second conductive member (22) is mounted, and the pin (34) passes through the second conductive member (22) and is connected to the two second mounting ears (33).
The conductive structure according to claim 8, wherein each of the first end of the first conductive member (21) and the first end of the second conductive member (22) has an inclined surface structure.
An electroplating equipment includes a plurality of connection plates (40), a mounting member (41) connected to each of the plurality of connection plates (40), and a plurality of mounting plates (41) installed as clamping circuits. A plate clamp (42) and a conductive structure (100) according to any one of claims 1 to 9, said conductive structure (100) comprising a plurality of sliding members (23), said mounting members (41) and The clamps (42) are all made of conductive materials, and the plurality of connection plates (40) and the plurality of sliding members (23) are installed one-to-one correspondingly.