TWM586722U - Conductive structure and electroplating apparatus - Google Patents

Abstract

This creation is a conductive structure and electroplating equipment. The conductive structure is used to transmit electrical signals to the circuit board. The conductive structure includes a conductive frame made of conductive material and a plurality of groups of conductive elements mounted on the conductive frame and spaced from each other. Each conductive element includes a first conductive member movably mounted on the conductive frame and electrically connected to the conductive frame, a sliding member made of a conductive material spaced from the conductive frame, having elastic restoring force, and the elastic restoring force acting on The first conductive member is an elastic member that press-fits the first conductive member and the sliding member. The sliding member has a sliding surface facing the first conductive member and slidingly fits the first conductive member. The first conductive member has a sliding fit with the sliding surface. The mating surface, the sliding surface and the mating surface are all flat, and the slider is connected to the circuit board. The conductive structure of the present invention can avoid the technical problem that the conductive structure is prone to poor contact.

Description

Conductive structures and plating equipment

This creation is about the technical field of electroplating equipment, especially a conductive structure and electroplating equipment.

Electroplating is the use of electrolysis to make a metal film on the surface of a metal or other material. In the field of circuit board production, it is usually necessary to use electroplating to perform copper sinking on the circuit board. Electroplating equipment generally includes a conductive structure for conducting electricity, and existing conductive structures are prone to poor contact problems.

The main purpose of this creation is to provide a conductive structure, which aims to solve the technical problem that conductive structures are prone to poor contact in the prior art.

Therefore, in order to achieve the above purpose, the present invention is a conductive structure including: used to transmit electrical signals to a circuit board. The conductive structure includes a conductive frame made of a conductive material and a plurality of groups mounted on the conductive frame and spaced from each other. Conductive elements, each of which includes a first conductive member movably mounted on the conductive frame and electrically connected to the conductive frame, a sliding member made of a conductive material spaced from the conductive frame, having elastic restoring force, and elastic restoring A force acts on the first conductive member to make the first conductive member press-fit with the sliding member. The sliding member has a sliding surface facing the first conductive member and slidingly cooperates with the first conductive member. The sliding surface is a mating surface for sliding fit. The sliding surface and the mating surface are both flat, and the sliding part is connected to the circuit board.

According to the conductive structure described above, the sliding member is formed with a sliding slot with a notch facing the first conductive member, the sliding surface is provided at the bottom of the sliding slot, and the sliding member further includes an end portion corresponding to the bottom of the slot. The fixed height of the receiving structure is lower than the horizontal height of the bottom of the groove.

The conductive structure described above, wherein the accommodating structure includes a flat portion disposed parallel to the bottom of the groove and a connecting portion connected between the flat portion and the end of the bottom of the groove, and the flat portion has a low horizontal height. The horizontal height of the bottom of the groove.

The conductive structure described above, wherein the flat portion extends below the sliding member adjacent to the flat portion.

According to the conductive structure described above, the groove bottoms of the conductive components are located on the same plane, the flat portions of the conductive components are located on the same plane, and the connection portions of the conductive components are arranged in parallel.

The conductive structure described above, wherein the conductive components further include a mounting bracket fixed on the conductive frame and used to install the first conductive member, the first conductive member is rotatably mounted on the mounting frame, and the elasticity The component is mounted on the mounting frame and elastically press-fits with the first conductive component.

According to the above-mentioned conductive structure, the mounting frame includes a mounting plate for fixed connection with the conductive frame, two first mounting ears fixedly connected to both sides of the mounting plate, and extending to the sliding member. The first mounting ears are arranged in pairs, and the conductive components further include a pin for rotatably mounting the first conductive members. The pins pass through the first conductive members and are connected to the first mounting ears.

The conductive structure described above, wherein the mounting frame further includes a connection with the Both sides of the mounting plate are fixedly connected to the two second mounting ears of the sliding member, the second mounting ears and the first mounting ears correspond to each other and are spaced apart, and the second mounting ears are arranged in pairs. The conductive components further include a second conductive member spaced apart from the first conductive member and a pin for rotatably mounting the second conductive member. The pin passes through the second conductive member and communicates with the plurality of conductive members. The second mounting ear is connected.

According to the aforementioned conductive structure, a rear end of the first conductive member and the second conductive member is formed with an inclined surface structure.

This creation also provides a plating equipment, including a connection plate, a mounting piece connected to each connection plate, a plurality of jigs mounted on the mounting piece to clamp the circuit board, and the above-mentioned conductive structure, and the mounting piece and the jig are all conductive Made of material, the connecting plate and the sliding member are installed correspondingly to each other.

The technical effect of this creation relative to the prior art is that the sliding member has a sliding surface facing the first conductive member and slidingly cooperates with the first conductive member, and the first conductive member has a mating surface slidingly mating with the sliding surface, the sliding surface and the mating surface. Both are flat. During the sliding process of the sliding member, the sliding member is in surface-to-surface contact with the first conductive member, and the contact area is large, which can avoid poor contact, and can ensure that the electrical signal is stably transmitted from the first conductive member to the sliding member. When batch processing of circuit boards (the batch processing is to perform plating on multiple circuit boards at the same time), it can ensure that each circuit board can be stably energized, thereby improving the plating effect of each circuit board and improving the same batch of circuits. Consistency of plate plating effect; the elastic restoring force generated by the elastic member acts on the first conductive member to press-fit the first conductive member and the slider, so that the first conductive member is always crimped to the slider during the sliding process of the slider Cooperation, that is, during the sliding process, the sliding member and the first conductive member are always in surface-to-surface contact to prevent the sliding member from swinging left and right due to other influences such as mechanical vibration Than to prevent the first conductive member and the contact area of the sliding swing member about the slide member caused by contact failure and reduced, thus, the conductive structure of the present embodiment can ensure the creation of a first conductive member and the slide The stable contact of the moving parts can avoid poor contact, thereby improving the plating quality of a single circuit board and the consistency of the plating effect of the secondary circuit boards plated in the same batch.

To sum up, this case is not only innovative in terms of space type, but also can enhance the above-mentioned multiple effects over conventional items. It should have fully met the requirements of novel and progressive statutory new patents, and applied in accordance with law. This new type of patent application is inspired by creativity and is of great virtue.

100‧‧‧ conductive structure

11‧‧‧ conductive frame

20‧‧‧ conductive components

21‧‧‧The first conductive piece

22‧‧‧Second conductive member

23‧‧‧ Slide

24‧‧‧Chute

25‧‧‧ sliding surface

26‧‧‧Accommodation structure

27‧‧‧ flat

28‧‧‧Connecting Department

29‧‧‧Mounting frame

31‧‧‧Mounting plate

32‧‧‧First mounting ear

33‧‧‧Second mounting ear

34‧‧‧ pin

35‧‧‧elastic

36‧‧‧The first conductive wire

37‧‧‧Second Conductive Wire

Figure 1 is a perspective view of the conductive structure of the creation.

Figure 2 is a three-dimensional exploded view of the conductive structure of the creation.

Figure 3 is an exploded perspective view of the conductive elements of the conductive structure.

The following describes embodiments of the present invention based on FIGS. 1 to 3. This description is not intended to limit the implementation of this creation, but is a kind of embodiment of the creation. In the drawings and the embodiments, the same or similar drawing reference numerals in all drawings refer to the same, substantially the same, or Functionally equivalent parts and components. The drawings are a simplified form, and in all embodiments, the drawings are not drawn to exact dimensions.

At the same time, it should be noted that, in this creative embodiment, according to the XYZ rectangular coordinate system established in Figure 3, the side located in the positive direction of the X axis is defined as the front, and the side located in the negative direction of the X axis is defined as Rear; the side located in the positive direction of the Y axis is defined as the right side, the side located in the negative direction of the Y axis is defined as the left side; the side located in the positive direction of the Z axis is defined as the upper side, and the side located in the negative direction of the Z axis is defined as Below.

Please refer to FIG. 1 to FIG. 3. This creative embodiment provides a conductive structure 100 for transmitting electrical signals to a circuit board (not shown). As shown in FIGS. 1 to 3, the conductive structure 100 The conductive frame 11 comprises a conductive frame 11 made of a conductive material and a plurality of groups of conductive components 20 installed on the conductive frame 11 and spaced apart from each other. Each conductive component 20 includes a movable mount on the conductive frame 11 and is electrically connected to the conductive frame 11. The first conductive member 21, the sliding member 23, which is spaced apart from the conductive frame 11, and is made of a conductive material, has elastic restoring force and its elastic restoring force acts on the first conductive member 21 so that the first conductive member 21 and the sliding member 23 The compression-fitting elastic member 35, the sliding member 23 has a sliding surface 25 facing the first conductive member 21 and slidingly mates with the first conductive member 21, and the first conductive member 21 has a mating surface slidingly mating with the sliding surface 25 (not shown in the figure) (Shown), the sliding surface 25 and the mating surface are both flat, and the sliding member 23 is connected to the circuit board.

In this embodiment, the conductive structure 100 includes a conductive frame 11 made of a conductive material and a plurality of sets of conductive components 20 mounted on the conductive frame 11 and spaced from each other. Each conductive component 20 includes a movable mounting on the conductive frame 11. The first conductive member 21 is electrically connected to the conductive frame 11, and the sliding member 23 made of conductive material is arranged at a distance from the conductive frame 11 and is connected to the circuit board. The sliding member 23 is driven by the driving force. The V direction slides relative to the first conductive member 21, and the sliding member 23 drives the circuit board to move and transport the circuit board to the plating station. In this process, the electrical signal is sequentially transmitted from the conductive frame 11 to the first conductive member 21 and the sliding member 23. Conducted until the electrical signal is conducted to the circuit board to electroplate the circuit board.

In this embodiment, the sliding member 23 has a sliding surface 25 facing the first conductive member 21 and slidingly mates with the first conductive member 21, and the first conductive member 21 has a mating surface slidingly mating with the sliding surface 25. The sliding surface 25 and The mating surfaces are all flat surfaces. During the sliding process of the sliding member 23, the sliding member 23 and the first conductive member 21 are in surface-to-surface contact. The contact area is large, which can avoid poor contact, and can ensure that the electrical signal is stably passed by the first conductive member 21. Conducted to the slider 23 during batch processing of the circuit board (the batch The processing is to perform plating on multiple circuit boards at the same time), which can ensure that each circuit board can be stably energized, thereby improving the plating effect of each circuit board and improving the consistency of the plating effect of the same batch of circuit boards.

In this embodiment, the elastic restoring force generated by the elastic member 35 acts on the first conductive member 21 so that the first conductive member 21 and the sliding member 23 are press-fitted. During the sliding process of the sliding member 23, the first conductive member 21 is always Press-fit with the slider 23, that is, during the sliding process, the slider 23 and the first conductive member 21 always maintain surface-to-surface contact to avoid the slider 23 from swinging left and right due to the influence of other factors such as mechanical vibration, which can be compared to avoiding the slider The contact area between the first conductive member 21 and the slider 23 is reduced and the contact is poor due to the left-right swing of 23. Therefore, the conductive structure 100 of this creative embodiment can ensure stable contact between the first conductive member 21 and the slider 23, which can avoid Poor contact, thereby improving the plating quality of a single circuit board and the consistency of the plating effect of secondary circuit boards plated in the same batch.

Further, as shown in FIG. 2, the two adjacent sliding members 23 are spaced apart from each other, and the length of the first conductive member 21 in the V direction is greater than the gap between the two adjacent sliding members 23. The pieces 23 slide synchronously, and the sliding speed of each of the pieces 23 is the same. When the gap between two adjacent pieces 23 is directly opposite to the first conductive piece 21, the length of the first conductive piece 21 in the V direction is longer than that of the two adjacent pieces. The gap between the pieces 23 can ensure that the first conductive piece 21 and the sliding piece 23 can always maintain stable contact, thereby ensuring that the electrical signal can be stably conducted during the plating process of the circuit board, thereby improving the plating effect of the circuit board.

Further, the sliding member 23 is formed with a sliding groove 24 with a notch facing the first conductive member 21, the sliding surface 25 is provided at the groove bottom of the sliding groove 24, and the sliding member 23 further includes a receiving structure fixedly connected to the end of the groove bottom. 26. The horizontal height of the receiving structure 26 is lower than the horizontal height of the bottom of the tank.

In this embodiment, the elastic restoring force generated by the elastic member 35 acts on the first conductive member 21 to press-fit the first conductive member 21 and the sliding member 23. During the sliding movement of the sliding member 23, the first conductive member 21 Always slide relative to the bottom of the groove. The groove wall of the chute 24 cooperates with the elastic member 35 to confine the first conductive member 21 inside the chute 24 and prevent the first conductive member 21 from punching left or right out of the chute 24. If the first conductive member 21 is punched out of the chute 24, the contact area between the first conductive member 21 and the slider 23 will be reduced, which will further cause the poor contact between the first conductive member 21 and the slider 23, in other words, The groove wall of the chute 24 cooperates with the elastic member 35 to limit the first conductive member 21 within the chute 24, which can improve the stability of the electrical conduction between the first conductive member 21 and the slider 23, and thereby improve the plating effect of the circuit board. , Which can further improve the consistency of the plating effect of circuit boards in the same batch.

In this embodiment, the sliding member 23 slides relative to the first conductive member 21. Due to the friction between the sliding member 23 and the first conductive member 21, powder is generated. Since both the sliding member 23 and the first conductive member 21 are frictional, It is made of conductive material, so the powder is also a conductive powder. If the powder falls on the circuit board, it will affect the plating quality of the circuit board. During the sliding process of the sliding member 23, the powder is composed of two adjacent sliding members. The gap 23 is dropped. Since the sliding member 23 further includes a receiving structure 26 fixedly connected to the end of the groove bottom, the horizontal height of the receiving structure 26 is lower than the horizontal height of the groove bottom. The receiving structure 26 can catch Powder to prevent the powder from falling onto the circuit board, thereby improving the quality of plating.

Further, the accommodating structure 26 includes a flat portion 27 disposed in parallel with the groove bottom and a connecting portion 28 connected between the flat portion 27 and the end of the groove bottom. The horizontal height of the flat portion 27 is lower than the horizontal height of the groove bottom.

In this embodiment, the accommodating structure 26 includes a flat portion 27 disposed parallel to the groove bottom and a connecting portion 28 connected between the flat portion 27 and the end of the groove bottom. The horizontal height of the flat portion 27 is lower than that of the groove bottom. Horizontal height, powder consists of two adjacent The gap of the slider 23 falls, falls on the connecting portion 28, or rolls off from the connecting portion 28 onto the flat portion 27.

Further, the flat portion 27 protrudes below the sliding member 23 adjacent to the flat portion 27 to improve the effect and reliability of the flat portion 27 receiving the powder.

Further, the bottoms of the grooves in each conductive component 20 are located on the same plane, the flat portions 27 in each conductive component 20 are located in the same plane, and the connecting portions 28 in each conductive element 20 are arranged in parallel.

Further, the conductive component 20 further includes a mounting bracket 29 fixed on the conductive frame 11 and used for mounting the first conductive member 21. The first conductive member 21 is rotatably mounted on the mounting bracket 29, and the elastic member 35 is mounted on the mounting bracket 29. It is elastically press-fitted with the first conductive member 21. In this embodiment, the mounting frame 29 and the conductive frame 11 are fixedly mounted, the first conductive member 21 is rotatably mounted on the mounting frame 29, and the first conductive member 21 can be mounted on the conductive frame 11.

Further, as shown in FIG. 3, the mounting bracket 29 includes a mounting plate 31 for fixed connection with the conductive frame 11, and two first mounting ears 32 fixedly connected to both sides of the mounting plate 31 and extending toward the slider 23, The first mounting ears 32 are arranged in pairs. The conductive assembly 20 further includes a pin 34 for rotatingly mounting the first conductive member 21. The pin 34 passes through the first conductive member 21 and is connected to the two first mounting ears 32. .

Further, the elastic member 35 is a two-way torsion spring, and the elastic member 35 is sleeved on the pin 34 and is elastically pressed against the top of the first conductive member 21.

Further, the mounting bracket 29 further includes two second mounting ears 33 which are fixedly connected to both sides of the mounting plate 31 and extend toward the sliding member 23. The second mounting ears 33 and the first mounting ears 32 are corresponding to each other and spaced apart. The mounting ears 33 are arranged in pairs. The conductive assembly 20 further includes a second conductive member 22 spaced from the first conductive member 21 and a pin 34 for rotating the second conductive member 22. The pin 34 passes through The second conductive member 22 is connected to the two second mounting ears 33.

In this embodiment, the second conductive member 22 is mounted on the two second mounting ears 33 through a pin 34, and the second conductive member 22 is electrically connected to the slider 23, which can increase the electrical signal of the slider 23 and the conductive frame 11. Conduction stability.

Further, each conductive element 20 includes a first conductive wire 36 connected to the first conductive member 21 and a second conductive wire 37 connected to the second conductive member 22. The first conductive wire 36 and the second conductive member are both The conductive frame 11 is connected. The first conductive line 36 is used to electrically connect the first conductive member 21 and the conductive frame 11, and the second conductive line 37 is used to electrically connect the second conductive member 22 and the conductive frame 11.

Further, the conductive element 20 further includes another elastic member 35 provided on the pin 34 and press-fitted with the second conductive member 22.

Further, two adjacent sliding members 23 are spaced apart from each other, and the length of the second conductive member 22 in the V direction is longer than the gap between the adjacent two sliding members 23. During the sliding of the sliding members 23, each sliding member 23 slides synchronously, and each The sliding speed of the sliding members 23 are the same. When the gap between two adjacent sliding members 23 is directly opposite to a second conductive member 22, the length of the second conductive member 22 in the V direction is greater than the gap between the two adjacent sliding members 23, which can ensure that The second conductive member 22 and the sliding member 23 can always maintain stable contact, thereby ensuring that the electric signal can be stably conducted during the plating process of the circuit board, thereby improving the plating effect of the circuit board.

Further, the rear ends of the first conductive members 21 and the second conductive members 22 are formed with an inclined surface structure (not shown). The sliding degree of the sliding member 23 can be increased to prevent interference between the rear ends of the first conductive member 21 and the second conductive member 22 and the front end of the sliding member 23.

Another embodiment of the present invention also provides a plating equipment. As shown in FIG. 3, the plating equipment includes a connection plate, a mounting member connected to each connection plate, A plurality of clamps mounted on the mounting member to clamp the circuit board and the above-mentioned conductive structure 100 are made of conductive material, and the connection plate and the sliding member 23 are installed correspondingly to each other.

In this embodiment, the mounting member is an integral structural member, and the mounting member is made of a conductive material. A plurality of circuit boards are mounted on the mounting member by a clamp, and the clamp is made of a conductive material. One of them is normally energized with the sliding member 23, the mounting member can conduct electrical signals to the circuit board for power plating, which improves the reliability of the electrical signal transmission during the circuit board plating operation, and during the plating operation, each The power of one circuit board is the same, which can improve the consistency of the plating effect of the same batch of circuit boards.

In summary, this is only a preferred and feasible embodiment of this creation, and it does not limit the scope of the patent for this creation. Any equivalent structural changes made by using this description and the contents of the drawings are equally included in this creation. Within the scope, joint Chen Ming.

Claims (10)

A conductive structure for transmitting electrical signals to a circuit board is characterized in that the conductive structure includes a conductive frame made of a conductive material and a plurality of conductive components mounted on the conductive frame and spaced apart from each other. The components each include a first conductive member movably mounted on the conductive frame and electrically connected to the conductive frame, a sliding member which is arranged at a distance from the conductive frame and is made of a conductive material, and has an elastic restoring force and its elasticity. A restoring force acts on the first conductive member to make the first conductive member press-fit with the sliding member, and the sliding member has a sliding surface facing the first conductive member and slidingly mating with the first conductive member. The first conductive member has a mating surface slidingly mated with the sliding surface, the sliding surface and the mating surface are both flat, and the sliding member is connected to the circuit board. The conductive structure according to item 1 of the scope of the patent application, wherein the sliding member is formed with a sliding groove with a notch facing the first conductive member, the sliding surface is provided at the bottom of the sliding groove, and the sliding member further includes a and The receiving structure at the bottom end of the groove is fixedly connected, and the horizontal height of the receiving structure is lower than the horizontal height of the groove bottom. The conductive structure according to item 2 of the patent application scope, wherein the accommodating structure includes a flat portion disposed in parallel with the bottom of the groove and a connecting portion connected between the flat portion and an end of the bottom of the groove, the flat portion The horizontal height of the part is lower than the horizontal height of the bottom of the groove. The conductive structure according to item 3 of the scope of patent application, wherein the flat portion protrudes below the sliding member adjacent to the flat portion. According to the conductive structure described in item 3 of the patent application scope, wherein the groove bottoms of the conductive components are located on the same plane, the flat portions of the conductive components are located on the same plane, and the connection portions of the conductive components are all Set in parallel. The conductive structure according to any one of claims 1 to 5, wherein the conductive components further include a mounting bracket fixed on the conductive frame and used for installing the first conductive member, the first conductive The member is rotatably mounted on the mounting bracket, and the elastic member is mounted on the mounting bracket and is elastically press-fitted with the first conductive member. The conductive structure according to item 6 of the scope of patent application, wherein the mounting bracket includes a mounting plate for fixed connection with the conductive frame, two first sides of the mounting plate that are fixedly connected to both sides of the mounting plate and extend toward the sliding member. Mounting ears, the first mounting ears are arranged in pairs, the conductive components further include a pin for rotationally mounting the first conductive member, the pin passing through the first conductive member and connecting with the first One mounting ear connection. The conductive structure according to item 7 of the scope of the patent application, wherein the mounting bracket further includes two second mounting ears which are fixedly connected to both sides of the mounting plate and extend toward the slider, and the second mounting ears and the The first mounting ears correspond to each other and are arranged at intervals. The second mounting ears are arranged in pairs. The conductive components further include a second conductive member disposed at a distance from the first conductive member and a second mounting member for rotatingly mounting the first mounting member. The pins of the two conductive members pass through the second conductive members and are connected to the second mounting ears. The conductive structure according to item 8 of the scope of the patent application, wherein the rear end of the first conductive member and the second conductive member are formed with an inclined surface structure. A plating equipment, characterized in that it comprises a connecting plate, a mounting piece connected to the connecting plate, a plurality of jigs mounted on the mounting piece to clamp a circuit board, and items 1 to 9 as in the scope of patent application In the conductive structure described in any one of the foregoing, the mounting member and the clamps are made of a conductive material, and the connecting plate and the sliding member are installed correspondingly to each other.