CN108796588A - Conductive structure and electroplating device - Google Patents
Conductive structure and electroplating device Download PDFInfo
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- CN108796588A CN108796588A CN201810805519.5A CN201810805519A CN108796588A CN 108796588 A CN108796588 A CN 108796588A CN 201810805519 A CN201810805519 A CN 201810805519A CN 108796588 A CN108796588 A CN 108796588A
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- Prior art keywords
- conduct piece
- conductive
- sliding
- sliding part
- conductive structure
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The present invention provides a kind of conductive structure and electroplating devices, wherein, conductive structure is used for board transmission electric signal, conductive structure includes the conduction rack made of conductive material and multigroup is installed on conduction rack and the conductive component of distance setting, each conductive component includes being movably installed on conduction rack and being electrically connected the first conduct piece with conduction rack, with the setting of conduction rack spacing and the sliding part made of conductive material, act on the first conduct piece with elastic restoring force and its elastic restoring force so that the first conduct piece and sliding part press fit elastic component, the sliding surface that sliding part has the first conduct piece of direction and is slidably matched with the first conduct piece, first conduct piece has the mating surface being slidably matched with sliding surface, sliding surface and mating surface are plane, sliding part is connect with circuit board.The technical issues of conductive structure of the present invention can easy to produce poor contact to avoid conductive structure.
Description
Technical field
The invention belongs to equipment technical field more particularly to a kind of conductive structure and electroplating device is electroplated.
Background technology
Plating is exactly so that the surface of metal or other materials product is adhered to layer of metal film using electrolysis, in circuit board
Production field, it usually needs the processing such as heavy copper are carried out to circuit board using electroplating technology.Electroplating device is generally comprised for conduction
Conductive structure, existing conductive structure easy tos produce poor contact problem.
Invention content
The purpose of the present invention is to provide a kind of conductive structures, it is intended to solve conductive structure in the prior art and easy to produce and connect
Touch bad technical problem.
The invention is realized in this way a kind of conductive structure, for board transmission electric signal, conductive structure include by
Conduction rack made of conductive material and it is multigroup be installed on conduction rack and the conductive component of distance setting, each conductive component
Include being movably installed on conduction rack and being electrically connected the first conduct piece, with the setting of conduction rack spacing and by conduction with conduction rack
Sliding part made of material, there is elastic restoring force and its elastic restoring force to act on the first conduct piece so that the first conduct piece with
The elastic component of sliding part press fit, the sliding that sliding part has the first conduct piece of direction and is slidably matched with the first conduct piece
Face, the first conduct piece have the mating surface being slidably matched with sliding surface, and sliding surface and mating surface are plane, sliding part and circuit
Plate connects.
Further, sliding part is formed with sliding slot of the notch towards the first conduct piece, and sliding surface is set to the slot bottom of sliding slot,
Sliding part further includes the accommodating structure being fixedly connected with the end of slot bottom, and the level height of accommodating structure is high less than the level of slot bottom
Degree.
Further, accommodating structure include one with slot bottom flat part disposed in parallel and be connected to flat part and slot bottom end
Between interconnecting piece, the level height of flat part is less than the level height of slot bottom.
Further, the lower section of sliding part adjacent thereto is stretched into flat part.
Further, the slot bottom in each conductive component is respectively positioned on same plane, and the flat part in each conductive component is respectively positioned on
In same plane, the interconnecting piece in each conductive component is arranged in parallel.
Further, conductive component further includes the mounting bracket for being fixed on conduction rack and being used to install the first conduct piece, the
In on mounting bracket, elastic component is installed on mounting bracket and coordinates with the first conduct piece elastic compression joint the rotational installation of one conduct piece.
Further, mounting bracket includes the mounting plate for being fixedly connected with conduction rack and mounting plate two sides fixation company
Two first mounting ears of sliding part are connect and stretch to, the first mounting ear is arranged in pairs, and conductive component further includes one for rotating
The axis pin of first conduct piece is installed, axis pin passes through the first conduct piece and connect with two first mounting ears.
Further, mounting bracket further includes two second installations that sliding part is fixedly connected with and stretched to mounting plate two sides
Ear, the second mounting ear and the first mounting ear correspond and spacing is arranged, and the second mounting ear is arranged in pairs, and conductive component is also
Including one and first the setting of conduct piece spacing the second conduct piece and one for being rotatablely installed the axis pin of the second conduct piece, axis pin
It is connect across the second conduct piece and with two second mounting ears.
Further, the rear end of the first conduct piece and the second conduct piece is formed with a ramp structure.
The present invention also provides a kind of electroplating devices, including installation part, the Duo Gean that connecting plate and each connecting plate are all connected with
Loaded on being made of conductive material with the fixture of clamping circuit board and above-mentioned conductive structure, installation part and fixture on installation part,
Connecting plate is corresponded with sliding part and is installed.
The present invention having the technical effect that compared with the existing technology：Sliding part have towards the first conduct piece and with first conduction
The sliding surface that part is slidably matched, the first conduct piece have the mating surface being slidably matched with sliding surface, and sliding surface and mating surface are
Plane, in sliding part sliding process, sliding part and the first conduct piece are plane-plane contact, and contact area is big, can avoid contact
It is bad, it can ensure that electric signal is stablized and be conducted from the first conduct piece to sliding part, (batch processing is when to circuit board batch processing
Electroplating processes are carried out to multiple circuit boards simultaneously), it is ensured that the energization that each circuit board can be stablized, and then improve each electricity
The electroplating effect of road plate and improve consistency with batch circuit board electroplating effect；The elastic restoring force effect that elastic component generates
In the first conduct piece so that the first conduct piece and sliding part press fit, make the first conduct piece begin in the sliding process of sliding part
Eventually with sliding part press fit, i.e., in sliding process, sliding part and the first conduct piece remain plane-plane contact, avoid sliding
Part due to being caused to swing by other influences such as mechanical oscillation, than avoid sliding part swing caused by first lead
Electric part reduces with sliding part contact area and poor contact, and therefore, the conductive structure of the embodiment of the present invention can ensure that first leads
The contact that electric part is stablized with sliding part can avoid poor contact, and then improves the electroplating quality of single circuit board and improve same
Criticize the electroplating effect consistency of the secondary circuit plate of plating.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to the embodiment of the present invention or the prior art
Attached drawing needed in description is briefly described, it should be apparent that, drawings described below is only the present invention's
Some embodiments for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other attached drawings.
Fig. 1 is the stereogram of conductive structure provided in an embodiment of the present invention.
Fig. 2 is the stereogram exploded view of conductive structure provided in an embodiment of the present invention.
Fig. 3 is the stereogram exploded view of conductive component provided in an embodiment of the present invention
Reference sign：
| 100 | Conductive structure | 28 | Interconnecting piece | |
| 11 | Conduction rack | 29 | Mounting bracket | |
| 20 | Conductive component | 31 | Mounting plate | |
| 21 | First conduct piece | 32 | First mounting ear | |
| 22 | Second conduct piece | 33 | Second mounting ear | |
| 23 | Sliding part | 34 | Axis pin | |
| 24 | Sliding slot | 35 | Elastic component | |
| 25 | Sliding surface | 36 | First conductor wire | |
| 26 | Accommodating structure | 37 | Second conductor wire | |
| 27 | Flat part |
Specific implementation mode
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it should be noted that when element is referred to as " being fixed on " or " being set to " another yuan
Part, it directly on another element or can be connected on another element.It is known as and " connects when an element
In " another element, it can be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on ... shown in the drawings or position are closed
System, is merely for convenience of description of the present invention and simplification of the description, not indicating or implying the indicated device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
For the ordinary skill in the art, it can understand above-mentioned term in the present invention as the case may be
Concrete meaning.
It should also be noted that, in the embodiment of the present invention, defined according to the XYZ rectangular coordinate systems established in Fig. 3：It is located at
The side of X-axis positive direction is defined as front, and rear is defined as positioned at the side of X-axis negative direction；It is fixed positioned at the side of Y-axis positive direction
Justice is right, and left is defined as positioned at the side of Y-axis negative direction；It is defined as top positioned at the side of Z axis positive direction, is located at Z axis
The side of negative direction is defined as lower section.
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.
As shown in Figure 1 to Figure 3, the embodiment of the present invention provides a kind of conductive structure 100, is used for board transmission telecommunications
Number, as shown in Figure 1 to Figure 3, conductive structure 100 includes the conduction rack 11 made of conductive material and multigroup is installed on conduction rack 11
The conductive component 20 of upper and distance setting, each conductive component 20 include be movably installed on conduction rack 11 and with conduction
Frame 11 be electrically connected the first conduct piece 21, with 11 spacing of conduction rack setting and the sliding part 23 made of conductive material, have bullet
Property restoring force and its elastic restoring force acts on the first conduct piece 21 so that the first conduct piece 21 and 23 press fit of sliding part
Elastic component 35, the sliding surface 25 that sliding part 23 has the first conduct piece 21 of direction and is slidably matched with the first conduct piece 21, first
Conduct piece 21 has the mating surface (not shown) being slidably matched with sliding surface 25, and sliding surface 25 and mating surface are plane, sliding
Part 23 is connect with circuit board.
In this embodiment, conductive structure 100 includes the conduction rack 11 made of conductive material and multigroup is installed on conduction
On frame 11 and distance setting conductive component 20, each conductive component 20 include be movably installed on conduction rack 11 and with
Conduction rack 11 is electrically connected the first conduct piece 21, is arranged with 11 spacing of conduction rack and the sliding part 23 made of conductive material, cunning
Moving part 23 is connect with circuit board, and the driving effect of 23 driven power of sliding part is slided along the directions V relative to the first conduct piece 21, sliding
Moving part 23 drive circuit board motion simultaneously circuit board is delivered to plating station, in this process, electric signal by conduction rack 11 successively
To the first conduct piece 21, the conduction of sliding part 23 until by the electric signal conduct on circuit board so that circuit board is electroplated.
In this embodiment, the cunning that sliding part 23 has the first conduct piece 21 of direction and is slidably matched with the first conduct piece 21
Dynamic face 25, the first conduct piece 21 have the mating surface being slidably matched with sliding surface 25, and sliding surface 25 and mating surface are plane,
In 23 sliding process of sliding part, sliding part 23 and the first conduct piece 21 are plane-plane contact, and contact area is big, can avoid contact not
It is good, it can ensure that electric signal is steadily conducted from the first conduct piece 21 to sliding part 23, when to circuit board batch processing (at this batch
Reason is simultaneously to multiple circuit boards progress electroplating processes), it is ensured that the energization that each circuit board can be stablized, and then improve every
The electroplating effect of one circuit board and improve consistency with batch circuit board electroplating effect.
In this embodiment, the elastic restoring force that elastic component 35 generates acts on the first conduct piece 21 so that the first conduct piece
21 with 23 press fit of sliding part, make the first conduct piece 21 is crimped with sliding part 23 always to match in the sliding process of sliding part 23
Close, i.e., in sliding process, sliding part 23 and the first conduct piece 21 remain plane-plane contact, avoid sliding part 23 due to by
The influence of the other factors such as mechanical oscillation causes to swing, than avoid sliding part 23 swing caused by it is first conductive
Part 21 and 23 contact area of sliding part reduce and poor contact, and therefore, the conductive structure 100 of the embodiment of the present invention can ensure the
The contact that one conduct piece 21 is stablized with sliding part 23 can avoid poor contact, so improve the electroplating quality of single circuit board with
And it improves with batch consistency of the electroplating effect of the secondary circuit plate of plating.
Further, as shown in Fig. 2, adjacent two sliding part 23 is intervally installed, the first conduct piece 21 is in the length in the directions V
Degree is more than the gap of adjacent two sliding part 23, in 23 sliding process of sliding part, 23 synchronous slide of each sliding part, and each sliding part
23 sliding speed all same, when gap one first conduct piece 21 of face of adjacent two sliding part 23, the first conduct piece 21 is in V
The length in direction is more than the gap of adjacent two sliding part 23, it is ensured that the first conduct piece 21 can keep steady always with sliding part 23
Fixed contact, and then ensure the conduction that electric signal can be stablized in the electroplating process of circuit board, to which circuit board can be improved
Electroplating effect.
Further, sliding part 23 is formed with sliding slot 24 of the notch towards the first conduct piece 21, and sliding surface 25 is set to cunning
The slot bottom of slot 24, sliding part 23 further include the accommodating structure 26 being fixedly connected with the end of slot bottom, and the level of accommodating structure 26 is high
Level height of the degree less than slot bottom.
In this embodiment, the elastic restoring force that elastic component 35 generates acts on the first conduct piece 21 so that the first conduct piece
21 with 23 press fit of sliding part, during sliding part 23 slide, the first conduct piece 21 always it is opposite with slot bottom slides, cunning
First conduct piece 21 can be limited in sliding slot 24 by the cell wall of slot 24 with the cooperation of elastic component 35, avoid the first conduct piece 21 by sliding slot
It is gone out to the left or to the right in 24, if the first conduct piece 21 is gone out out of sliding slot 24 can cause the first conduct piece 21 and sliding part 23
Contact area reduces, and then can cause the first conduct piece 21 and 23 poor contact of sliding part, in other words, the cell wall of sliding slot 24 with
First conduct piece 21 is limited in sliding slot 24 by the cooperation of elastic component 35, can be improved electric between the first conduct piece 21 and sliding part 23
The stability of conduction, and then the electroplating effect of circuit board is improved, the one of same batch circuit board electroplating effect further can be improved
Cause property.
In this embodiment, sliding part 23 is slided relative to the first conduct piece 21, due to sliding part 23 and the first conduct piece
There is friction between 21, therefore, will produce powder, since sliding part 23 and the first conduct piece 21 are made of conductive material, therefore,
The powder is also conductive powder can influence the electroplating quality of circuit board if the powder falls to circuit board, in sliding part 23
In sliding process, which is fallen down by the gap location of adjacent two sliding part 23, since sliding part 23 further includes the end with slot bottom
The accommodating structure 26 being fixedly connected, the level height of accommodating structure 26 are less than the level height of slot bottom, which can connect
Firmly powder avoids powder from falling to circuit board, and then improves electroplating quality.
Further, accommodating structure 26 include one with slot bottom flat part 27 disposed in parallel and be connected to flat part 27 and slot
Interconnecting piece 28 between bottom end, the level height of flat part 27 are less than the level height of slot bottom.
In this embodiment, accommodating structure 26 include one with slot bottom flat part 27 disposed in parallel and be connected to flat part 27
Interconnecting piece 28 between slot bottom end, the level height of flat part 27 are less than the level height of slot bottom, and powder is slided by adjacent two
The gap location of moving part 23 is fallen, and is dropped down onto on interconnecting piece 28, or is tumbled from interconnecting piece 28 to flat part 27.
Further, the lower section of sliding part 23 adjacent thereto is stretched into flat part 27, and flat part 27 can be improved and connect gear powder
Effect and reliability.
Further, the slot bottom in each conductive component 20 is respectively positioned on same plane, the flat part 27 in each conductive component 20
It is respectively positioned in same plane, the interconnecting piece 28 in each conductive component 20 is arranged in parallel.
Further, conductive component 20 further includes the installation be fixed on conduction rack 11 and be used to install the first conduct piece 21
Frame 29, the rotational installation of the first conduct piece 21 on mounting bracket 29, elastic component 35 be installed on mounting bracket 29 and with the first conduct piece
21 elastic compression joints coordinate.In this embodiment, mounting bracket 29 and conduction rack 11 are fixedly mounted, the rotational installation of the first conduct piece 21 in
On mounting bracket 29, the first conduct piece 21 can be installed to conduction rack 11.
Further, as shown in figure 3, mounting bracket 29 includes the mounting plate 31 and peace for being fixedly connected with conduction rack 11
31 two sides of loading board are fixedly connected and stretch to two first mounting ears 32 of sliding part 23, and the first mounting ear 32 is arranged in pairs,
Conductive component 20 further includes one for be rotatablely installed the axis pin 34 of the first conduct piece 21, axis pin 34 across the first conduct piece 21 and with
Two first mounting ears 32 connect.
Further, elastic component 35 be two-way torsional spring, elastic component 35 be sheathed on axis pin 34 and with the first conduct piece 21
Top elastic compression joint.
Further, mounting bracket 29 further includes two second that sliding part 23 is fixedly connected with and stretched to 31 two sides of mounting plate
Mounting ear 33, the second mounting ear 33 and the first mounting ear 32 correspond and spacing is arranged, and the second mounting ear 33 is set in pairs
Set, conductive component 20 further include one and the setting of 21 spacing of the first conduct piece the second conduct piece 22 and one for being rotatablely installed the
The axis pin 34 of two conduct pieces 22, axis pin 34 pass through the second conduct piece 22 and are connect with two second mounting ears 33.
In this embodiment, the second conduct piece 22 is installed on by an axis pin 34 on two second mounting ears 33, and second is conductive
Part 22 is electrically connected with sliding part 23, can increase the stability of sliding part 23 and the conduction of 11 electric signal of conduction rack.
Further, each conductive component 20 include first conductor wire 36 being connect with the first conduct piece 21 and with
Second conductor wire 37 of the second conduct piece 22 connection, the first conductor wire 36 and the second conduction are connect with conduction rack 11, and first leads
Electric wire 36 is for being electrically connected the first conduct piece 21 and conduction rack 11, and the second conductor wire 37 is for being electrically connected the second conduct piece 22
With conduction rack 11.
Further, conductive component 20 further include set it is another be set to axis pin 34 on and with 22 press fit of the second conduct piece
Elastic component 35.
Further, adjacent two sliding part 23 is intervally installed, and length of second conduct piece 22 in the directions V is more than adjacent
The gap of two sliding parts 23, in 23 sliding process of sliding part, 23 synchronous slide of each sliding part, and the sliding speed of each sliding part 23
All same is spent, when gap one second conduct piece 22 of face of adjacent two sliding part 23, the second conduct piece 22 is in the length in the directions V
More than the gap of adjacent two sliding part 23, it is ensured that the second conduct piece 22 can keep stable contact with sliding part 23 always,
And then ensure the conduction that electric signal can be stablized in the electroplating process of circuit board, to which the electroplating effect of circuit board can be improved.
Further, the rear end of the first conduct piece 21 and the second conduct piece 22 is formed with a ramp structure.Cunning can be increased
Smoothness when moving part 23 slides avoids the rear end of the first conduct piece 21 and the second conduct piece 22 and the front end of sliding part 23 from occurring
Interference.
Other embodiments of the invention also provide a kind of electroplating device, as shown in figure 3, electroplating device include connecting plate, with it is each
Installation part that connecting plate is all connected with, it is multiple be installed on installation part with the fixture of clamping circuit board and above-mentioned conductive structure 100,
Installation part and fixture are made of conductive material, and connecting plate is corresponded with sliding part 23 and installed.
In this embodiment, the structural member that installation part is integral, and installation part is made of conductive material, multiple circuit boards
It is installed on installation part by fixture, and fixture is made of conductive material, as long as one in multiple connecting plates and sliding part
23 normal power-ups, then installation part can electric signal conduct on circuit board for plating, electricity when improving circuit board electroplating operation
The reliability of signal transduction, and when electroplating activity, install to the electricity all same of each circuit board on installation part, can be improved
With the consistency of batch circuit board electroplating effect.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (10)
1. a kind of conductive structure is used for board transmission electric signal, which is characterized in that the conductive structure includes by conduction material
Conduction rack made of matter and it is multigroup be installed on the conduction rack and the conductive component of distance setting, each conductive group
Part includes being movably installed on the conduction rack and being electrically connected between the first conduct piece and the conduction rack with the conduction rack
Away from setting and the sliding part made of conductive material, that there is elastic restoring force and its elastic restoring force to act on described first is conductive
Part so that first conduct piece and the sliding part press fit elastic component, the sliding part have is led towards described first
Electric part and the sliding surface being slidably matched with first conduct piece, first conduct piece has to be slidably matched with the sliding surface
Mating surface, the sliding surface and the mating surface are plane, and the sliding part is connect with the circuit board.
2. conductive structure as described in claim 1, which is characterized in that the sliding part is formed with notch and is led towards described first
The sliding slot of electric part, the sliding surface are set to the slot bottom of the sliding slot, and the sliding part further includes solid with the end of the slot bottom
Surely the accommodating structure connected, the level height of the accommodating structure are less than the level height of the slot bottom.
3. conductive structure as claimed in claim 2, which is characterized in that the accommodating structure includes one parallel with the slot bottom setting
The flat part set and the interconnecting piece being connected between the flat part and the slot bottom end, the level height of the flat part are low
In the level height of the slot bottom.
4. conductive structure as claimed in claim 3, which is characterized in that the sliding part adjacent thereto is stretched into the flat part
Lower section.
5. conductive structure as claimed in claim 3, which is characterized in that the slot bottom in each conductive component is respectively positioned on together
One plane, the flat part in each conductive component are respectively positioned in same plane, the company in each conductive component
Socket part is arranged in parallel.
6. the conductive structure as described in any one of claim 1 to 5, which is characterized in that the conductive component further includes solid
Due to the mounting bracket on the conduction rack and for installing first conduct piece, the first conduct piece rotational installation is in described
On mounting bracket, the elastic component is installed on the mounting bracket and coordinates with the first conduct piece elastic compression joint.
7. conductive structure as claimed in claim 6, which is characterized in that the mounting bracket includes for being fixed with the conduction rack
The mounting plate of connection, two first mounting ears for being fixedly connected with the mounting plate two sides and stretching to the sliding part, described
One mounting ear is arranged in pairs, and the conductive component further includes an axis pin for being rotatablely installed first conduct piece, institute
Axis pin is stated across the first conduct piece and is connect with two first mounting ears.
8. conductive structure as claimed in claim 7, which is characterized in that the mounting bracket further includes and the mounting plate two sides
Two second mounting ears of the sliding part are fixedly connected with and stretch to, second mounting ear is corresponded with first mounting ear
And spacing is arranged, second mounting ear is arranged in pairs, and the conductive component further includes between one and first conduct piece
The second conduct piece away from setting and an axis pin for being rotatablely installed second conduct piece, the axis pin pass through the second conduction
Part is simultaneously connect with two second mounting ears.
9. conductive structure as claimed in claim 8, which is characterized in that after first conduct piece and second conduct piece
End is formed with a ramp structure.
10. a kind of electroplating device, which is characterized in that installation part, the Duo Gean being all connected with including connecting plate, with each connecting plate
Loaded on the fixture of circuit board described in clamping and conductive as in one of claimed in any of claims 1 to 9 being tied on the installation part
Structure, the installation part and the fixture are made of conductive material, and the connecting plate is corresponded with the sliding part and installed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810805519.5A CN108796588A (en) | 2018-07-20 | 2018-07-20 | Conductive structure and electroplating device |
| PCT/CN2019/096334 WO2020015673A1 (en) | 2018-07-20 | 2019-07-17 | Conductive structure and electric plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810805519.5A CN108796588A (en) | 2018-07-20 | 2018-07-20 | Conductive structure and electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108796588A true CN108796588A (en) | 2018-11-13 |
Family
ID=64077241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810805519.5A Pending CN108796588A (en) | 2018-07-20 | 2018-07-20 | Conductive structure and electroplating device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108796588A (en) |
| WO (1) | WO2020015673A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020015673A1 (en) * | 2018-07-20 | 2020-01-23 | 东莞宇宙电路板设备有限公司 | Conductive structure and electric plating device |
| CN115058755A (en) * | 2022-04-10 | 2022-09-16 | 惠州市本正智能设备有限公司 | Electroplating device and conductive structure thereof |
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| CN205616981U (en) * | 2016-04-08 | 2016-10-05 | 竞铭机械(深圳)有限公司 | Electroplating rack electrically conducts mechanism |
| CN208857379U (en) * | 2018-07-20 | 2019-05-14 | 东莞宇宙电路板设备有限公司 | Conductive structure and electroplating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104562160A (en) * | 2015-02-06 | 2015-04-29 | 苏州创峰光电科技有限公司 | Electroplating clamp conductive device |
| CN205616984U (en) * | 2016-04-08 | 2016-10-05 | 竞铭机械(深圳)有限公司 | Continuous electroplating drive mechanism |
| CN205774864U (en) * | 2016-06-29 | 2016-12-07 | 竞铭机械(深圳)有限公司 | A kind of volume to volume plating pusher-type conductive mechanism |
| CN208562567U (en) * | 2018-07-02 | 2019-03-01 | 东莞宇宙电路板设备有限公司 | Circuit board electroplating transportation system |
| CN108796588A (en) * | 2018-07-20 | 2018-11-13 | 东莞宇宙电路板设备有限公司 | Conductive structure and electroplating device |
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2018
- 2018-07-20 CN CN201810805519.5A patent/CN108796588A/en active Pending
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2019
- 2019-07-17 WO PCT/CN2019/096334 patent/WO2020015673A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205616981U (en) * | 2016-04-08 | 2016-10-05 | 竞铭机械(深圳)有限公司 | Electroplating rack electrically conducts mechanism |
| CN208857379U (en) * | 2018-07-20 | 2019-05-14 | 东莞宇宙电路板设备有限公司 | Conductive structure and electroplating device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020015673A1 (en) * | 2018-07-20 | 2020-01-23 | 东莞宇宙电路板设备有限公司 | Conductive structure and electric plating device |
| CN115058755A (en) * | 2022-04-10 | 2022-09-16 | 惠州市本正智能设备有限公司 | Electroplating device and conductive structure thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020015673A1 (en) | 2020-01-23 |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181113 |
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| RJ01 | Rejection of invention patent application after publication |