CN202085439U - Fixing structure for conductive gasket - Google Patents
Fixing structure for conductive gasket Download PDFInfo
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- CN202085439U CN202085439U CN2011201939875U CN201120193987U CN202085439U CN 202085439 U CN202085439 U CN 202085439U CN 2011201939875 U CN2011201939875 U CN 2011201939875U CN 201120193987 U CN201120193987 U CN 201120193987U CN 202085439 U CN202085439 U CN 202085439U
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- conductive gasket
- block
- supporting bracket
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- floor
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Abstract
The utility model discloses a fixing structure for a conductive gasket, which is arranged in one casing of electronic equipment and used for fixing the conductive gasket. The fixing structure comprises a plurality of connectors and a plurality of fixing units, wherein, the fixing units are in one-to-one correspondence with the connectors and are arranged on one bottom surface of the casing, baseplates corresponding to the fixing units are different from each other in height, each fixing unit comprises two support plates and a support block, the two support plates are arranged vertical to one bottom surface of the casing, the bottom surfaces of the corresponding connectors are supported by the support plates, the support block is arranged on the bottom surface and positioned between the support plates, the support block is lower than the support plates, the support block and the support plates form an accommodating space, the upper surfaces of the support plates of the fixing units are identical in height, and the conductive gasket is arranged in the accommodating space and fixed on the support blocks. Due to the adoption of the technical scheme, a good grounding property of the conductive gasket is ensured, possible errors in the assembly process are reduced, the production cost is saved, and the production efficiency is improved.
Description
Technical field
The utility model relates to the internal structure of electronic device shell, relates in particular to the bottom in the electronic device shell, a kind of fixed structure of input/output interface below.
Background technology
The technical program relates to the element of the EMI/ESD problem of a kind of solution electronic device shell (for example notebook computer).
EMI is the abbreviation of electromagnetic interference (Electromagnetic Interference), is meant after electromagnetic wave and the electronic component effect and the interference phenomenon that produces that two kinds of conducted interference and radiated interference are arranged.Conducted interference is meant by conducting medium the signal on the electric network is coupled to another electric network.Radiated interference is meant that interference source is coupled to another electric network to its signal by the space, in High-Speed PCB and system design, the pin of high-frequency signal line, integrated circuit, all kinds of connectors etc. all may become the radiated interference source with antenna performance, and the energy launching electromagnetic wave also influences other system or the operate as normal of interior other subsystems of native system.
ESD represents static discharge (Electro-StaticDischarge).There are many factors can influence the accumulation of electric charge, comprise contact pressure, coefficient of friction and separating rate etc.Electrostatic charge is accumulation constantly, up to the effect that causes charge generation stop, electric charge is released or reach enough intensity can puncture ambient substance till.After dielectric was breakdown, electrostatic charge can obtain balance very soon, and the quick neutralization of this electric charge just is called static discharge.Because quick discharge voltage on very little resistance, vent discharge fails to be convened for lack of a quorum very big, may surpass 20 amperes, if this discharge is undertaken by integrated circuit or other Electrostatic Discharge Sensitives, so big electric current will cause serious harm to the circuit that is designed to conducting microampere only or milliampere level electric current.For example, for computer, the static that wherein big and small chip or integrated circuit are easy to be produced unintentionally damages.
In order to prevent that electronic equipment from being damaged by the static of accumulation or by electromagnetic interference, prior art often adopts conductive gasket, and it is located in the electronic device shell as a conductive barrier, is used to block the EMI/ESD energy, constitute a conductive path, thereby rely on ground connection that the EMI/ESD energy is discharged.
Conductive gasket is the known elements of a kind of those skilled in that art, it claims EMI gasket again, often be filled in place, electronic device shell slit, the conduction continuity that can keep the place, slit, reduce the contact resistance at hole, slit, groove place, thereby reduce the voltage at joint two ends, reduce the electromagnetic leakage in slit.Electroconductive gasket material mainly contains: conductive rubber, woven wire, metallic elastic liner, conductive fabric etc.
Conducting foam is a kind of of conductive gasket, and it is made through after a series of processing by parcel conduction outsourcing material on the flame-retardant sponge.Wherein, flame-retardant sponge generally adopts polyurethane as material, so it has excellent elasticity and anti-flammability.Outsourcing material is generally the structure that contains the ambrose alloy coat of metal, so it has good electrical conductivity.In addition, conducting foam also has following advantage: the extraordinary shield effectiveness of low-pressure, and screening effectiveness surpasses 90dB; Flexible, in light weight; The anticorrosion nickel coating can be prevented electrochemical corrosion; Low surface contacted resistance; Pressure-sensitive fast fixing; Can be according to the length of client's needs design appointment; The fire prevention of UL level.In addition, conducting foam can also be easy to be fixed on easily by mode such as gluing needs on the shielding device.Its used thickness is in extensive range, and compression zone big (maximum can be compressed to original thickness 60%) therefore has very strong applicability.In addition, conducting foam has the long-term serviceability that very low residual deformation has also guaranteed product.Therefore, because conducting foam has high performance price ratio, so it is widely used on the electronic products such as PDP TV, LCD display, LCD TV, mobile phone, notebook, MP3, communication cabinet, Medical Instruments.
Fig. 1 has shown the conducting foam of being located at Laptop case inside.As shown in Figure 1, the bottom in the existing Laptop case 1 is provided with the plate 2 that plurality of vertical is provided with, these plates 2 that vertically are provided with in twos one group form some grooves 3.Visible among Fig. 1 have three grooves 3, and the position of these three grooves 3 is corresponding with three openings 4 being located at Laptop case 1 side respectively, and promptly each groove 3 corresponding opening 4 is provided with, and opening 4 is located at the top of groove 3, is used to be provided with connector.Conducting foam 5 as shown in Figure 1 just correspondence is located in these grooves 3.(not shown) when the electronic component such as USB flash disk inserts notebook computer by the connector on Laptop case 1 sidewall, the metallic conduction part of electronic component is just by being pressed on the conducting foam 5, with conducting foam 5 to the certain amount of lower compression, produce certain elastic deformation, this moment, conducting foam 5 contacted with electronic component, form circuit pathways, thereby realize the ground connection of electronic component, rely on ground connection to discharge the electrostatic charge of accumulation, prevent that electrostatic charge from causing damage to integrated circuit in the notebook computer or chip.
Yet existing this setup has the bad shortcoming of ground connection property.As shown in Figure 1, its bottom edge of existing Laptop case is generally circular arc, and promptly the bottom edge place of Laptop case 1 is curved surface and on-plane surface.Simultaneously as shown in Figure 1, in order to mate with different electronic component, the size of each opening 4 also is different, so just cause from the lower edge of each opening 4 also inconsistent to the height of notebook casing bottom surface, be each opening 4 the lower edge not in one plane, this and then the spaces that caused placing in each groove 3 conducting foams 5 are inequality, and the lower surface of the conducting foam 5 that contacts with Laptop case 1 bottom surface is planes, but not curved surface, therefore be easy to cause the loose contact of conducting foam 5 and Laptop case bottom surface, thereby can't play the effect of ground connection.
Existing this setup also needs to select for use multiple conducting foam 5 corresponding each opening 4 to be provided with, and the thickness of the conducting foam 5 that promptly corresponding three openings 4 as shown in Figure 1 are provided with is inconsistent.This is because in order to realize good EMI/ESD effect, the openings 4 of corresponding different sizes, and the decrement that needs to guarantee conducting foam 5 is within the specific limits.This just makes the conducting foam 5 that is used for notebook computer can't realize unitizing, and has caused the increase of production cost, assembly defect also easily takes place on the production line of notebook computer simultaneously, thereby cause the reduction of production efficiency and the increase of production cost.
Summary of the invention
The purpose of this utility model provides a kind of fixed structure that is used for conductive gasket, by this structure is arranged between electronic device shell and the conductive gasket, accommodation space size unanimity feasible corresponding each opening (being used to be provided with connector), that be used to be provided with conductive gasket, thereby make when the conductive gasket that adopts consistency of thickness is located in the accommodation space of each opening not of uniform size of correspondence respectively, just can guarantee all have extraordinary ground connection property by the electronic component of each connector access.
The utility model provides a kind of fixed structure that is used for conductive gasket according to the foregoing invention purpose, is located in the casing of an electronic equipment, is used for fixing conductive gasket, and this fixed structure comprises: a plurality of connectors; A plurality of fixed cells.Fixed cell is corresponding one by one with connector, be arranged on the bottom surface of this casing, and the base plate height difference of each fixed cell correspondence, each fixed cell comprises: two supporting brackets, bottom surface perpendicular to this casing is provided with, and supporting bracket supports the lower surface of corresponding connector; And a back-up block, be located on this bottom surface, between supporting bracket, and the height of back-up block is lower than the height of supporting bracket, and back-up block and supporting bracket form an accommodation space; Wherein, the upper level of the supporting bracket of each fixed cell is identical, conductive gasket is arranged in the accommodation space and is fixed on the back-up block, when connector was not arranged on the supporting bracket, conductive gasket was in the nature of not having compression, and it highly is higher than the height of supporting bracket, when connector is arranged on the supporting bracket, conductive gasket will be compressed in the accommodation space, and its upper surface and connector lower surface electrically connect, and it is highly consistent with the height of supporting bracket.
The technical program by in electronic device shell, the position of corresponding each connector is provided with back-up block, make that the specification of being located at the conductive gasket on each back-up block is unified, particularly the thickness of each conductive gasket is identical, does not promptly need the conductive gasket according to the size customization different size of each opening.When the socket end of different electronic components inserts in the electronic device shell (also can be described as electronic device shell) by each connector, the socket end in contact of each electronic component is located at the upper surface (upper surface of each conductive gasket is positioned at the same plane of sustained height) of each conductive gasket on the back-up block, and then depress each conductive gasket, make each conductive gasket that roughly the same elastic deformation take place, make circuit turn-on, conductive gasket ground connection, thus play effect with electronic component ground connection.
Preferably, described back-up block comprises the floor that plurality of parallel is provided with, and the upper surface of described each floor is in the same plane, and the bottom of described each floor is mated and is connected with the bottom surface of electronic device shell.That is to say, this back-up block is not to be a solid chunk, it comprises a plurality of floors that are set up in parallel and the space between the floor, and this makes that whole back-up block quality under the situation of given volume is less, thereby helps alleviating the weight of whole electric equipment casing.Certainly, the upper edge of each floor need be in same plane, could make the lower surface that is positioned over the conductive gasket on the floor upper edge to contact well with the upper edge of each floor like this.
Preferably, described back-up block also comprises at least one fixed head, described fixed head and described corresponding each interior floor of bracer, be right-angled intersection or approximate right-angled intersection setting, molding structure becomes one, and the upper edge of the upper edge of described fixed head and described and its each floor that intersects is on same plane.。That is to say that this at least one fixed head can be set to the form of right-angled intersection or be called vertical setting with floor, if promptly floor is vertical the setting, fixed head just is a horizontally set so; Can be set to the form of approximate right-angled intersection, this moment, fixed head and floor were not vertically disposed yet, and the angle that forms between fixed head and the floor is acute angle (perhaps being the obtuse angle).Said fixing plate and floor arranged in a crossed manner, no matter be right-angled intersection or approximate right-angled intersection, can both guarantee that relative displacement does not take place the floor that respectively is set up in parallel each other, can also increase the pressure that floor can bear simultaneously, make the structure of whole back-up block stable more and firm.The number of fixed head can be provided with according to the production requirement to electronic device shell, and promptly the number of fixed head can be one, two or more.When being provided with two or more fixed head, preferably also should be arranged in parallel side by side between each fixed head, a plurality of like this fixed heads and floor have just formed fenestral fabric, thereby make this back-up block have the most firm structure.The upper edge of fixed head can be concordant with the upper edge of floor, also can be lower than the upper edge of floor, but should not be higher than the upper edge of floor, thereby guarantee to be located at the upper edge maintenance excellent contact of conductive gasket and floor on the floor.
Alternatively, described back-up block is fixedlyed connected with the bottom surface of electronic device shell non-dismountablely.When back-up block is fixedlyed connected with the bottom surface of electronic device shell non-dismountablely, the bottom surface of back-up block and the electronic device shell structure that can be formed in one, thus reduce assemble flow on the electronic equipment production line, reduce the production time, enhance productivity.
Preferably, the described fixed structure that is used for conductive gasket more comprises a baffle plate, surround described accommodation space jointly with described two supporting brackets, and be connected with described back-up block, fixedly connected with the bottom surface of electronic device shell in the bottom that reaches described baffle plate, described two supporting brackets and described shutter configuration are to prevent that conductive gasket of being located in it is shifted.
The utility model makes a plurality of conductive gaskets that are used for electronic equipment can adopt with a kind of specifications and models by a fixed structure that comprises some back-up blocks is set between conductive gasket and electronic device shell, thereby has reduced the production cost of electronic equipment.Because the conductive gasket of each opening on the corresponding electronic device shell is with a kind of specifications and models, also avoids recurrent loading error on the electronic equipment production line, thereby improved the qualification rate of electronic equipment simultaneously, improved production efficiency.In addition, because each conductive gasket is consistent apart from the distance of each opening lower edge of its correspondence, and the contact-making surface of conductive gasket and back-up block be the plane to the plane, guaranteed that also the contact of conductive gasket and back-up block is good, stopped the bad problem of ground connection property that causes because of loose contact.
Description of drawings
Come the fixed structure that is used for conductive gasket described in the utility model is described further below in conjunction with the drawings and specific embodiments.
Fig. 1 is provided with schematic diagram for the structure of the groove that is used to be provided with conductive gasket in the existing notebook computer.
Fig. 2 is the structural representation of a kind of preferred implementation of fixed structure described in the utility model.
Embodiment
Below in conjunction with a kind of preferably execution mode of the technical program the utility model is done further introduction.This preferred embodiment in, electronic device shell is the casing of notebook computer.This preferred embodiment in, fixed structure comprises three connectors and three fixed cells corresponding with it, but it should be noted that, does not limit for the number of connector that is comprised in the fixed structure or fixed cell, promptly is not defined as three.As shown in Figure 2, this fixed structure that is used for conductive gasket is located at Laptop case 1, the side of Laptop case 1 is provided with three opening (not shown), be used to be provided with three connectors 31,32 and 33 that connect the peripheral hardware electronic component, the connectivity port of these three connectors not of uniform size is respectively applied for and different peripheral hardware electronic component (not shown) couplings.In this preferred implementation, the bottom surface of this Laptop case 1, the bottom edge place 11 that is connected with the side that is provided with opening is curved surface or cambered surface, and on-plane surface.Fixed structure in the present embodiment just is located in the bottom edge place 11.As shown in Figure 2, this fixed structure comprises three fixed cells 21,22 and 23, three connectors 31,32 and 33, wherein, three fixed cells are corresponding one by one with three connectors respectively, and three connectors respectively correspondence be positioned on three fixed cells, in addition, fixed cell is arranged on the bottom surface of this casing and is fixedly connected with it, and the base plate height difference of each fixed cell correspondence.For three fixed cells 21,22,23, respectively have two supporting brackets, as 211,221 and 231, and these two supporting brackets 211 (221 or 231) are corresponding setting in twos, and the upper level of supporting bracket 211,221 and 231 is identical, promptly is on the same horizontal plane.In addition, these three fixed cells 21,22 and 23 also comprise three back-up blocks 212 respectively, 222 and 232, be located on the bottom surface also fixedly connected with it respectively, three back-up blocks 212,222 and 232 lay respectively at two supporting brackets 211, between two supporting brackets 221 and two supporting brackets 231, in addition, it should be noted that, this back-up block 212,222 and 232 height is lower than supporting bracket 211 respectively, 221 and 231 height, thereby make back-up block 212,222 and 232 respectively with supporting bracket 211,221 and 231 form an accommodation space, what also need emphasize is, supporting bracket 211,221 and 231 upper level is identical, promptly is on the same horizontal plane.This preferred embodiment in, the conductive gasket (not shown) is arranged at back-up block 212, on 222 and 232, connector 31,32,33 are arranged at supporting bracket 211 respectively, on 221 and 231, and, when connector 31,32 and 33 are not arranged at supporting bracket 211, in the time of on 221 and 231, conductive gasket is in the nature of not having compression, it highly is higher than supporting bracket 211,221 and 231 height, when connector 31,32 and 33 are arranged at supporting bracket 211, in the time of on 221 and 231, conductive gasket will be compressed in the accommodation space, its upper surface and connector 31,32 and 33 lower surfaces electrically connect, and it is highly with supporting bracket 211,221 and 231 height is consistent.In order better to be fixed at the conductive gasket (not shown) on the back-up block, prevent that conductive gasket from relatively moving in trench structure, the inner surface of supporting bracket 21 also respectively is provided with two location-plates that are set up in parallel, and inner surface with supporting bracket is vertical is provided with for it.As shown in Figure 2, supporting bracket 211,221 and 231 bottom surface are arc, and the arc of the bottom edge 11 of this arc and Laptop case 1 is fitted fully.For three back-up blocks 212,222 and 232 include three floors (floor 234 in the back-up block 232 only is shown among the figure) and two fixed head (not shown)s, here only describe with back-up block 232, other two back-up blocks 212 and 222 floors that had, the structure of fixed head is similar to back-up block 232, do not repeat them here, for back-up block 232, it has three floors 234 and is set parallel to each other, its be provided with direction and supporting bracket 231 that direction is set is identical, be that floor 234 be arranged in parallel with supporting bracket 231, two fixed heads are set parallel to each other, in two fixed heads each all vertically runs through three floors 234, with the floor 234 common fenestral fabrics that form, it should be noted that, the number of floor 234 and fixed head is not as limit, and the floor 5 that forms fenestral fabric is not vertically to be provided with fixed head 6, as long as the two formation fenestral fabric arranged in a crossed manner just can guarantee to support the block structured steadiness.The upper edge of three floors 234 evenly is in the same plane, the upper edge of fixed head is also concordant with the upper edge of floor 5, this setup make conductive gasket and the contacting of floor upper edge on the upper edge be located at floor 234 be the plane to the plane, thereby guaranteed that conductive gasket and floor 234 have excellent contact.Still as shown in Figure 2, as can be seen from the figure, the bottom surface of floor 234 is an arc, the arc of the bottom edge 11 of itself and Laptop case 1 is fitted fully, and fixedly connected, thereby guaranteed that floor 234 is connected with the contact of the bottom surface of Laptop case 1 with the bottom surface of Laptop case 1.This preferred embodiment in, back-up block 212,222 and 232 all is configured to above-mentioned this latticed, make that whole back-up block quality under the situation of given volume is less, thereby help alleviating the quality of whole notebook computer, can also reduce simultaneously and make the required raw material of back-up block.Of particular note, also be very importantly simultaneously, no matter what kind of the concrete structure of back-up block is, three back-up blocks 212,222 and 232 upper surface all should be on the same level height, i.e. three back-up blocks 212,222 with 232 upper surface should be identical apart from the height of the lower edge of three openings, could guarantee that like this conductive gasket thickness of being located on each back-up block is identical, be same specifications and models in other words, thereby guarantee to pass through three connectors 31 when the socket end of peripheral hardware electronic component, during 32 and 33 access notebook computers, it all can contact with the upper surface of each conductive gasket, and conductive gasket depressed certain amount, make each conductive gasket that roughly the same elastic deformation take place, make circuit turn-on, conductive gasket ground connection, thus play effect with electronic component ground connection.Therefore, preferably in the execution mode, be arc at this owing to be provided with the bottom surface of the notebook casing of back-up block, the height that then constitutes the floor of each back-up block is different, in order to the upper surface that guarantees back-up block 212,222 and 232 on same level height.
In above-mentioned preferably execution mode, integrated formed structure can be fixedlyed connected non-dismountablely or constitute to back-up block 212,222 with 232 with the bottom surface of Laptop case 1, thereby reduce the assemble flow on the notebook computer production line, reduce the production time, enhance productivity; Also can removably connect, this is to consider that the damage that causes owing to various situations may take place back-up block, thereby conveniently damaged part is changed.
Be noted that above enumerate only for specific embodiment of the utility model, obviously the utility model is not limited to above embodiment, and many similar variations are arranged thereupon.If those skilled in the art all should belong to protection range of the present utility model from all distortion that the disclosed content of the utility model directly derives or associates.
Claims (6)
1. a fixed structure that is used for conductive gasket is located in the casing of an electronic equipment, is used for fixing conductive gasket, it is characterized in that described fixed structure comprises:
A plurality of connectors;
A plurality of fixed cells, corresponding one by one with described connector, described fixed cell is arranged on the bottom surface of this casing, and the base plate height difference of each described fixed cell correspondence, and each fixed cell comprises:
Two supporting brackets, perpendicular to the bottom surface setting of this casing, described supporting bracket supports the lower surface of corresponding described connector; And a back-up block, be located on this bottom surface, between described supporting bracket, and the height of described back-up block is lower than the height of described supporting bracket, and described back-up block and described supporting bracket form an accommodation space;
Wherein, the upper level of the described supporting bracket of each described fixed cell is identical, described conductive gasket is arranged in the described accommodation space and is fixed on the described back-up block, when described connector is not arranged on the described supporting bracket, described conductive gasket is in the nature of not having compression, it highly is higher than the height of described supporting bracket, when described connector is arranged on the described supporting bracket, described conductive gasket will be compressed in the described accommodation space, its upper surface and connector lower surface electrically connect, and it is highly consistent with the height of described supporting bracket.
2. the fixed structure that is used for conductive gasket as claimed in claim 1, it is characterized in that, described back-up block comprises the floor that plurality of parallel is provided with, and the upper surface of described each floor is in the same plane, and the bottom of described each floor is mated and is connected with the bottom surface of electronic device shell.
3. the fixed structure that is used for conductive gasket as claimed in claim 2, it is characterized in that, described back-up block comprises at least one fixed head, described fixed head and described corresponding each interior floor of bracer, be right-angled intersection or approximate right-angled intersection setting, the molding structure that becomes one, and the upper edge of the upper edge of described fixed head and described and its each floor that intersects is on same plane.
4. the fixed structure that is used for conductive gasket as claimed in claim 1 is characterized in that, the upper surface of described back-up block is a plane, its lower surface be one with electronic device shell in the face of bottom surface coupling, the upper surface of described each back-up block is in the same plane.
5. as any described fixed structure that is used for conductive gasket in the claim 1,3, it is characterized in that described back-up block is fixedlyed connected with the bottom surface of electronic device shell non-dismountablely.
6. the fixed structure that is used for conductive gasket as claimed in claim 1 is characterized in that described fixed cell also comprises a baffle plate, and this baffle plate is connected with described back-up block, and it is fixedlyed connected with the bottom surface in the electronic device shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201939875U CN202085439U (en) | 2011-06-10 | 2011-06-10 | Fixing structure for conductive gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201939875U CN202085439U (en) | 2011-06-10 | 2011-06-10 | Fixing structure for conductive gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202085439U true CN202085439U (en) | 2011-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201939875U Expired - Fee Related CN202085439U (en) | 2011-06-10 | 2011-06-10 | Fixing structure for conductive gasket |
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| Country | Link |
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| CN (1) | CN202085439U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312465A (en) * | 2016-11-08 | 2017-01-11 | 维沃移动通信有限公司 | Terminal shell and manufacturing method thereof and mobile terminal |
| CN110942609A (en) * | 2019-12-04 | 2020-03-31 | 安徽农业大学 | Low-power consumption telemetering equipment and system for agricultural condition monitoring |
-
2011
- 2011-06-10 CN CN2011201939875U patent/CN202085439U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312465A (en) * | 2016-11-08 | 2017-01-11 | 维沃移动通信有限公司 | Terminal shell and manufacturing method thereof and mobile terminal |
| CN110942609A (en) * | 2019-12-04 | 2020-03-31 | 安徽农业大学 | Low-power consumption telemetering equipment and system for agricultural condition monitoring |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111221 Termination date: 20140610 |