CN208562567U - Circuit board electroplating transportation system - Google Patents
Circuit board electroplating transportation system Download PDFInfo
- Publication number
- CN208562567U CN208562567U CN201821050763.7U CN201821050763U CN208562567U CN 208562567 U CN208562567 U CN 208562567U CN 201821050763 U CN201821050763 U CN 201821050763U CN 208562567 U CN208562567 U CN 208562567U
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- electroplating
- circuit board
- conductive slider
- transportation system
- rack
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Abstract
The utility model provides a kind of circuit board electroplating transportation system, including electroplating bath；The Electroplating Rack being set to above the electroplating bath, the Electroplating Rack include conductive slider；It is set to the conveying device above electroplating bath and for driving the Electroplating Rack mobile；Support post, and it is set to the electric installation on support post and being located above the Electroplating Rack, the electric installation includes conducting block, the conductive slider and the conducting block sliding contact and being formed is electrically connected, and is separately provided for preventing conductive slider from contacting the rib that the dust generated is fallen into the electroplating bath with conducting block in the opposite sides of the conductive slider.Circuit board electroplating transportation system provided by the utility model, effectively prevent dust be easy to fall into electroplating bath pollute electroplate liquid so as to cause the board quality after plating is poor and electroplate liquid needs re-replace caused by waste the problem of, substantially increase electroplating quality and save production cost.
Description
Technical field
The utility model belongs to circuit board electroplating technical field, is to be related to a kind of circuit board electroplating conveying more specifically
System.
Background technique
Circuit board in electroplating process, it usually needs using Electroplating Rack by circuit board clamping, and will plating
Conducting block sliding contact on copper shoe and electric installation on hanger will finally be folded with to realize the conduction of Electroplating Rack
The Electroplating Rack of circuit board immerses in the electroplate liquid of electroplating bath, so that electroplate liquid is uniformly distributed on circuit boards to complete plating
Process.
However in the movable friction process between copper shoe and conducting block, it will usually dust is generated, in the shifting of copper shoe
During dynamic, dust, which is easy to fall, pollutes electroplate liquid in electroplating bath, to cause that the circuit board after plating is bad and scrap or electricity
Plating solution pollution needs again filtration treatment clean or even whole cylinder electroplate liquid cannot be used and replace electroplate liquid, causes unnecessary waste.
Utility model content
The purpose of this utility model is to provide a kind of circuit board electroplating transportation systems, to solve circuit in the prior art
Plate be electroplated transportation system there are dust be easy to fall into electroplating bath pollute electroplate liquid so as to cause the board quality after plating compared with
The technical issues of waste caused by difference and electroplate liquid needs re-replace.
In order to achieve the above purposes, the technical solution adopted by the utility model is: provides a kind of circuit board electroplating transportation system,
Include:
For accommodating the electroplating bath of electroplate liquid；
It is set to above the electroplating bath and is used for the Electroplating Rack of suspension circuit plate, the Electroplating Rack includes conductive sliding
Block；
It is set to the conveying device above the electroplating bath and for driving the Electroplating Rack mobile；
Support post, and,
It is set to the electric installation on the support post and being located above the Electroplating Rack, the electric installation includes
Conducting block, the conductive slider and the conducting block sliding contact and being formed are electrically connected, in the opposite sides of the conductive slider
It is separately provided for preventing conductive slider from contacting the rib that the dust generated is fallen into the electroplating bath with conducting block.
Further, the rib and the conductive slider, which enclose, is configured to U-shaped groove, and the conducting block is located at the U-shaped
In groove.
Further, the circuit board electroplating transportation system further includes the powder for preventing from falling from the conductive slider
Dirt falls into the electroplating bath and connects dirt device, and the dirt device that connects is set on the support post and is located at described conductive sliding
Between block and the electroplating bath.
Further, the circuit board electroplating transportation system further includes being used to support the support plate of the Electroplating Rack, institute
It states support plate to be set on the support post, and the bottom end of the conductive slider is slidably connected with the support plate, it is described to connect
Dirt device is between the support plate and the electroplating bath.
Further, the circuit board electroplating transportation system further includes for removing the clear of the dust on the conductive slider
Clean device, the electroplating bath, the cleaning device are set gradually along the direction that the Electroplating Rack moves.
Further, the cleaning device include air intake duct that suction nozzle, one end are connect with the suction nozzle and with it is described
The blower of the other end connection of air intake duct.
Further, filter is provided between the air intake duct and the blower.
Further, the end of the suction nozzle is provided with for protruding into the hair in the conductive slider convenient for the suction nozzle
Brush.
Further, the electric installation further include for providing towards the elastic force on the direction of the conductive slider so that
It obtains the conducting block and compresses the elastic component being connected on the conductive slider.
Further, the conveying device includes endless apron and the drive for driving the endless apron rotation
Dynamic device, the endless apron are connected and fixed with the Electroplating Rack.
The beneficial effect of circuit board electroplating transportation system provided by the utility model is: compared with prior art, this reality
Transportation system is electroplated with Novel circuit board, prevents conductive slider by being separately provided in the opposite sides of conductive slider
The rib that the dust generated is fallen into the electroplating bath is contacted with conducting block, is easy to fall into electroplating bath to effectively prevent dust
Middle pollution electroplate liquid is poor so as to cause the board quality after plating and electroplate liquid needs to re-replace caused waste
Problem substantially increases electroplating quality and saves production cost.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the top view of circuit board electroplating transportation system provided by the embodiment of the utility model；
Fig. 2 is the sectional structure chart of the line A-A along Fig. 1；
Fig. 3 is partial enlargement diagram of the Fig. 2 at B；
Fig. 4 is the partial structural diagram of circuit board electroplating transportation system provided by the embodiment of the utility model；
Fig. 5 is the structural schematic diagram of cleaning device used by the utility model embodiment.
Wherein, each appended drawing reference in figure:
10- electroplating bath；20- Electroplating Rack；21- conductive slider；22- rib；23- clamping device；30- conveying device；31-
Endless apron；40- support frame；50- electric installation；51- conducting block；52- elastic component；53- mounting rack；54- rotation axis；55-
Metal connecting plate；60- circuit board；70- connects dirt device；80- support plate；90- cleaning device；91- suction nozzle；92- air intake duct；95-
Hairbrush.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and beneficial effect is more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
Also referring to Fig. 1 to Fig. 5, now circuit board electroplating transportation system provided by the utility model is illustrated.Institute
Stating circuit board electroplating transportation system includes electroplating bath 10, several Electroplating Racks 20, conveying device 30 and electric installation 50.Institute
Electroplating bath 10 is stated for accommodating electroplate liquid.Electroplating Rack 20 is set to 10 top of electroplating bath and is used for suspension circuit plate 60,
Each Electroplating Rack 20 includes conductive slider 21.Conveying device 30 is for driving each Electroplating Rack 20 to move over electroplating bath
10.Electric installation 50 is set to 10 top of electroplating bath.Electric installation 50 include conducting block 51, each conductive slider 21 respectively with conduction
51 sliding contact of block simultaneously forms electrical connection, is separately provided for preventing conductive slider 21 in the opposite sides of each conductive slider 21
The rib 22 that the dust generated is fallen into the electroplating bath 10 is contacted with conducting block 51.Wherein, the opposite sides of conductive slider 21
Refer to the two sides on the direction vertical with 20 moving direction of Electroplating Rack, the extending direction and Electroplating Rack 20 of rib 22 are mobile
Direction is consistent.Conductive slider 21 is contacted with conducting block 51 so that Electroplating Rack 20 electrically conducts to realize plating work.
Circuit board electroplating transportation system provided by the utility model, compared with prior art, the circuit board of the utility model
Transportation system, which is electroplated, prevents conductive slider 21 and conducting block by being separately provided in the opposite sides of conductive slider 21
The dust that 51 contacts generate falls into the rib 22 in the electroplating bath 10, is easy to fall into electroplating bath 10 to effectively prevent dust
Middle pollution electroplate liquid is poor so as to cause the board quality after plating and electroplate liquid needs to re-replace caused waste
Problem substantially increases electroplating quality and saves production cost.
Further, referring to Figure 2 together to Fig. 3, as circuit board electroplating transportation system provided by the utility model
A kind of specific embodiment, the bottom surface of two ribs 22 and the conductive slider 21 on each conductive slider 21, which is enclosed, to be configured to
U-shaped groove, the conducting block 51 are slideably positioned in the U-shaped groove, so as to stop because of conductive slider 21 and conducting block
The dust that 51 sliding contacts cause friction to generate is fallen into electroplating bath 10.
Further, a kind of specific embodiment as circuit board electroplating transportation system provided by the utility model, institute
It states conductive slider 21 and the conducting block 51 is metallic conduction block, such as conductive slider 21 can be copper conducting block, so as to
Improve electric conductivity.Electroplating Rack 20 is set as multiple, so that the plating of multiple circuit boards may be implemented in the same time
Work.
Further, referring to Figure 2 together to Fig. 3, as circuit board electroplating transportation system provided by the utility model
A kind of specific embodiment, each Electroplating Rack 20 further include the clamping device 23 for clamping circuit board.Pass through clamping device 23
Circuit board is fixed on Electroplating Rack 20 and with 20 synchronizing moving of Electroplating Rack.
Further, referring to Figure 2 together to Fig. 3, as circuit board electroplating transportation system provided by the utility model
A kind of specific embodiment, each Electroplating Rack 20 further include connecing dirt device 70, it is described connect dirt device 70 be installed on it is described defeated
21 lower section of conductive slider is sent on device 30 and be set to, connects dirt device 70 and can receive respectively to fall from corresponding conductive slider 21
The dust fallen is to prevent from falling into the electroplating bath 10 from the dust fallen on the conductive slider 21.Since circuit board electroplating is defeated
Send the Electroplating Rack 20 of system be it is multiple, there are certain gap between the conductive slider 21 on two neighboring Electroplating Rack 20,
The dust that conductive slider 21 and the friction of conducting block 51 generate is easy to fall into electroplating bath 10 from the gap, therefore in order to further
The dust for effectivelying prevent conductive slider 21 and the friction of conducting block 51 to generate is fallen into electroplating bath 10, and the present embodiment is by further increasing
If connecing dirt device 70.
Further, referring to Figure 2 together to Fig. 3, as circuit board electroplating transportation system provided by the utility model
A kind of specific embodiment, the circuit board electroplating transportation system further include support plate 80, and support plate 80 is each for support respectively
Electroplating Rack 20 prevents Electroplating Rack 20 toward tenesmus.Specifically, each support plate 80 is installed in the conveying device 30, and each
The bottom surface of the conductive slider 21 is connected with the support plate 80 sliding, and the dirt device 70 that connects specifically is mounted on the support plate
80 lower sections.Since the bottom surface of conductive slider 21 is slided in support plate 80, the friction between conductive slider 21 and support plate 80 is same
Sample, which can generate dust and fall into electroplating bath 10, pollutes electroplate liquid.Therefore dirt device 70 will be connect to be arranged under the support plate 80
Side, can further effectively prevent the contaminated possibility of electroplate liquid.
Further, also referring to Fig. 1, Fig. 5, as circuit board electroplating transportation system provided by the utility model one
Kind specific embodiment, the circuit board electroplating transportation system further includes for removing the clear of the dust on the conductive slider 21
Clean device 90, the electroplating bath 10, the cleaning device 90 are set gradually along the direction that the Electroplating Rack 20 moves.Work as electricity
When plating hanger 20 is moved to the position at 90 place of cleaning device, the dust on conductive slider 21 can be cleared away by cleaning device 90,
It avoids a large amount of accumulation of dust and falls into electroplating bath 10 and pollute electroplate liquid.
Further, also referring to Fig. 1, Fig. 5, as circuit board electroplating transportation system provided by the utility model one
Kind of specific embodiment, the cleaning device 90 includes suction nozzle 91, the air intake duct that connect with the suction nozzle 91, the sanitizer cartridge
Setting further includes the blower (not shown) connecting with the other end of the air intake duct 92.When needing to clear away the powder on conductive slider 21
When dirt, blower can be started, and the dust on conductive slider 21 is siphoned away by suction nozzle 91, to reach clean purpose.
Further, also referring to Fig. 1, Fig. 5, as circuit board electroplating transportation system provided by the utility model one
Kind specific embodiment, the end of the suction nozzle 91 are provided with hairbrush 95, and hairbrush 95 can extend into the two of each conductive slider 21
Between rib 22, so that cleaning is more thorough.
Further, referring to Figure 2 together to Fig. 3, as circuit board electroplating transportation system provided by the utility model
A kind of specific embodiment, the electric installation 50 further include elastic component 52, and the setting of elastic component 52 can be provided described in
Elastic force on the direction of conductive slider 21 so that the compression of the conducting block 51 is connected on the conductive slider 21, so as to
The steady contact for guaranteeing conductive slider 21 and conducting block 51 is played and stablizes smoothness that is conductive and improving the movement of conductive slider 21,
The case where avoiding the occurrence of clamping stagnation generation.In the present embodiment, elastic component 52 is torsional spring.Electric installation 50 further include mounting rack 53,
The rotation axis 54 installed is crossed at, the torsion spring set is set in rotation axis 54, and the both ends of torsional spring are separately fixed at peace
It shelves on 53,51 sets of the conducting block is connected and fixed on torsional spring, and with torsional spring, so that conducting block 51 can be in torsional spring
Certain angle is spun upside down under effect around rotation axis 54, wherein the shifting of the axis direction and Electroplating Rack 20 of rotation axis 54
Dynamic direction is vertical.
Further, referring to Figure 2 together to Fig. 4, as circuit board electroplating transportation system provided by the utility model
A kind of specific embodiment, the quantity of the electric installation 50 be it is multiple, multiple electric installations 50 are fixedly connected on metal connection
On plate 55, on the one hand metal connecting plate 55 can be used for fixed electric installation 50, on the other hand can be transferred to principal current more
A electric installation 50, so that Electroplating Rack 20 is conductive, to complete electroplating process.
Further, also referring to Fig. 1 to Fig. 3, as circuit board electroplating transportation system provided by the utility model
A kind of specific embodiment, the conveying device 30 is including endless apron 31 and for driving 31 turns of the endless apron
Dynamic driving device (not shown), the endless apron 31 are connected and fixed with the Electroplating Rack 20, pass through circulation conveying
Band 31 drives Electroplating Rack 20 mobile, to complete electroplating process.Driving device can drive driving wheel rotation using motor, pass
The mode that driving wheel drives endless apron 31 to rotate again.The conveying device further includes support frame 40, the endless apron 31
It is installed on support frame as described above 40, the electric installation 50 is mounted on support frame as described above 40.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. circuit board electroplating transportation system, it is characterised in that: include:
For accommodating the electroplating bath of electroplate liquid；
For several Electroplating Racks of suspension circuit plate, each Electroplating Rack includes conductive slider；
For driving each Electroplating Rack to move over the conveying device of the electroplating bath；And
Electric installation is set to above the electroplating bath, and electric installation includes conducting block, and each conductive slider is led with described respectively
Electric block sliding contact simultaneously forms electrical connection；
It is separately provided for preventing the conductive slider from contacting with the conducting block in the opposite sides of each conductive slider
The dust of generation falls into the rib in the electroplating bath.
2. circuit board electroplating transportation system as described in claim 1, it is characterised in that: two institutes on each conductive slider
The top surface for stating rib and the conductive slider, which is enclosed, is configured to U-shaped groove, and the conducting block is slideably positioned in the U-shaped groove.
3. circuit board electroplating transportation system as described in claim 1, it is characterised in that: each Electroplating Rack further includes being used for
It is described to prevent the dust fallen from the conductive slider from falling into that the dust fallen from the corresponding conductive slider is received respectively
Dirt device is connect in electroplating bath, the dirt device that connects is installed in the conveying device and is set to immediately below the conductive slider.
4. circuit board electroplating transportation system as described in claim 1, it is characterised in that: the circuit board electroplating transportation system is also
Support plate including supporting each Electroplating Rack respectively, each support plate are installed in the conveying device, and each described
The bottom surface of conductive slider is connected with the corresponding support plate.
5. circuit board electroplating transportation system as described in claim 1, it is characterised in that: the circuit board electroplating transportation system is also
Including the cleaning device for removing the dust on each conductive slider, the electroplating bath, the cleaning device are along described
The mobile direction of Electroplating Rack is set gradually.
6. circuit board electroplating transportation system as claimed in claim 5, it is characterised in that: the cleaning device include suction nozzle and
The air intake duct of the suction nozzle connection.
7. circuit board electroplating transportation system as claimed in claim 6, it is characterised in that: the end of the suction nozzle, which is provided with, to be used for
Protrude into the hairbrush between two ribs of each conductive slider.
8. such as the described in any item circuit board electroplating transportation systems of claim 1-7, it is characterised in that: the electric installation also wraps
It includes for providing towards the elastic force on the direction of the conductive slider so that conducting block compression is connected to the conductive cunning
Elastic component on block.
9. such as the described in any item circuit board electroplating transportation systems of claim 1-7, it is characterised in that: the conveying device includes
Endless apron and driving device for driving endless apron rotation, the endless apron and plating extension
Frame is connected and fixed.
10. circuit board electroplating transportation system as claimed in claim 9, it is characterised in that: the conveying device further includes support
Frame, the endless apron are installed on support frame as described above, and the electric installation is mounted on support frame as described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821050763.7U CN208562567U (en) | 2018-07-02 | 2018-07-02 | Circuit board electroplating transportation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821050763.7U CN208562567U (en) | 2018-07-02 | 2018-07-02 | Circuit board electroplating transportation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208562567U true CN208562567U (en) | 2019-03-01 |
Family
ID=65491014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821050763.7U Active CN208562567U (en) | 2018-07-02 | 2018-07-02 | Circuit board electroplating transportation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208562567U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110484961A (en) * | 2019-08-30 | 2019-11-22 | 苏州铭电机械科技有限公司 | A kind of FPC electroplating system |
| WO2020015672A1 (en) * | 2018-07-20 | 2020-01-23 | 东莞宇宙电路板设备有限公司 | Electroplating device and electroplating apparatus |
| WO2020015673A1 (en) * | 2018-07-20 | 2020-01-23 | 东莞宇宙电路板设备有限公司 | Conductive structure and electric plating device |
| CN113635005A (en) * | 2021-10-14 | 2021-11-12 | 江苏铭瀚智能科技有限公司 | Sheet metal part machining process and machining equipment |
-
2018
- 2018-07-02 CN CN201821050763.7U patent/CN208562567U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020015672A1 (en) * | 2018-07-20 | 2020-01-23 | 东莞宇宙电路板设备有限公司 | Electroplating device and electroplating apparatus |
| WO2020015673A1 (en) * | 2018-07-20 | 2020-01-23 | 东莞宇宙电路板设备有限公司 | Conductive structure and electric plating device |
| CN110484961A (en) * | 2019-08-30 | 2019-11-22 | 苏州铭电机械科技有限公司 | A kind of FPC electroplating system |
| CN113635005A (en) * | 2021-10-14 | 2021-11-12 | 江苏铭瀚智能科技有限公司 | Sheet metal part machining process and machining equipment |
| CN113635005B (en) * | 2021-10-14 | 2022-02-08 | 江苏铭瀚智能科技有限公司 | Sheet metal part machining process and machining equipment |
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