WO2020015672A1

WO2020015672A1 - Electroplating device and electroplating apparatus

Info

Publication number: WO2020015672A1
Application number: PCT/CN2019/096332
Authority: WO
Inventors: 陈德和
Original assignee: 东莞宇宙电路板设备有限公司
Priority date: 2018-07-20
Filing date: 2019-07-17
Publication date: 2020-01-23
Also published as: CN108823630A

Abstract

The present application provides an electroplating device and an electroplating apparatus. The electroplating device comprises a driving mechanism, a mounting part drivingly connected to the driving mechanism and made of a conductive material, and a plurality of clamps fixedly mounted on the mounting part; the plurality of clamps is made of the conductive material, and each clamp is electrically connected to the mounting part and is configured to clamp a circuit board; the mounting part is suspended above an electroplating tank; the driving mechanism is configured to drive the mounting part to drive the clamp and the circuit board to move together, and to enable the circuit board to move into the electroplating tank.

Description

Plating equipment and plating equipment

This application claims priority from a Chinese patent application filed with the Chinese Patent Office on July 20, 2018, with application number 201810804272.5, the entire contents of which are incorporated herein by reference.

Technical field

The present application belongs to the technical field of circuit board production equipment, for example, relates to a plating device and a plating equipment.

Background technique

Electroplating is the use of electrolysis to make a metal film on the surface of a metal or other material. In the field of circuit board production, electroplating is usually used to process copper on the circuit board.

The electroplating equipment generally includes a driving mechanism, a driving mechanism connected to the driving mechanism, a fixture fixed to the driving mechanism and used to clamp the circuit board, and an electroplating bath for electroplating reaction. The driving mechanism drives the clamping to the fixture through the driving mechanism. The upper circuit board enters the plating bath to perform the plating reaction. When the electroplating equipment in the related art performs electroplating on the circuit boards, the consistency of the plating effect of the same batch of circuit boards is poor, such as the copper thickness value of the same batch of circuit boards after plating. The difference is large, causing the risk of bad or even scrap.

Summary of the invention

The present application provides an electroplating device and electroplating equipment, which aims to solve the problem of poor consistency of the electroplating effect of the same batch of circuit boards in the related art.

The electroplating device of the present application comprises a driving mechanism, a mounting member driven by the driving mechanism and made of a conductive material, and a plurality of clamps fixedly mounted on the mounting member. Each of the clamps is made of a conductive material, and each clamp It is electrically connected with the mounting part, the mounting part is suspended above the electroplating bath, and the driving mechanism is arranged to drive the mounting part to move, so that the fixture and the circuit board are moved together by the movement of the mounting part, and the circuit board is moved into the electroplating bath.

The present application also provides a plating equipment, which includes a plating bath and the above-mentioned plating device, and the plating device is configured to cooperate with the plating bath to plate a circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of a front view of an electroplating device according to an embodiment of the present application; FIG.

2 is a perspective view of an electroplating device provided by an embodiment of the present application;

3 is an exploded perspective view of an electroplating device according to an embodiment of the present application;

4 is a schematic diagram of a conductive structure provided by an embodiment of the present application;

FIG. 5 is a schematic diagram of a driving mechanism according to an embodiment of the present application.

Reference sign description:

11. Mounting parts; 12. Mounting surface; 21; Fixture; 22; First clamping part; 23. Guide part;

24. The second clamping portion; 25. The elastic member; 30. The conductive structure; 31. The conductive block;

32, conductive slider; 33, conductive frame; 36, connecting plate; 41, guide structure; 42, linear track;

43, the first guide plate; 44, the second guide plate; 45, the roller; 46, the annular groove; 49, the rotating shaft;

50. Driving mechanism.

detailed description

Hereinafter, embodiments of the present application will be described in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary, and are intended to explain the present application, and should not be construed as limiting the present application.

In the description of this application, when an element is referred to as being "fixed to" or "disposed to" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

The terms "length", "width", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom" " The directions or positional relations indicated by “inside” and “outside” are based on the positional or positional relations shown in the drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific The orientation and construction and operation in a specific orientation cannot be understood as a limitation on this application.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality" is two or more, unless specifically defined otherwise.

For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

The electroplating device in the related technology generally includes a driving mechanism, a driving mechanism connected to the driving mechanism, a clamp fixed to the driving mechanism and used to clamp a circuit board, connected to the driving mechanism and electrically connected to a power source to conduct conduction to the driving structure. The conductive structure and the electroplating cell used for the electroplating reaction. The transmission mechanism includes a plurality of hangers independent of each other and connected to the driving mechanism. Each hanger is electrically connected to the conductive structure to conduct electrical signals to the fixture. The hangers are connected in parallel with each other, and each hanger is connected in series with the fixture mounted on it. If one or more of the multiple hangers are loosened from the conductive structure and cause a poor contact, the poorly contacted hangers The applied voltage (or current) is different from the voltage (or current) of other racks in normal contact, resulting in different plating reaction times for circuit boards clamped on different racks, and the plating effect of the same batch of circuit boards will appear larger. Fluctuations, such as large differences in copper thickness after circuit board electroplating, cause the risk of failure or even scrap.

Therefore, as shown in FIG. 1 to FIG. 5, an embodiment of the present application provides a plating device that cooperates with a plating bath (not shown) to plate a circuit board. As shown in FIGS. 1 to 5, the plating device includes a driver Mechanism 50, a mounting member 11 connected to the driving mechanism 50 and made of conductive material, a plurality of clamps 21 fixedly mounted on the mounting member 11, multiple clamps 21 are made of a conductive material, and each clamp 21 is connected with the mounting The component 11 is electrically connected, and is configured to clamp a circuit board (not shown). The mounting component 11 is suspended above the electroplating tank. The driving mechanism 50 is configured to drive the mounting component 11 to move the fixture 21 and the circuit through the movement of the mounting component 11. The boards are moved together, and the circuit board is moved into the plating bath.

In this embodiment, the electroplating device includes a driving mechanism 50, a mounting member 11 drivingly connected to the driving mechanism 50, and a plurality of jigs 21 fixedly mounted on the mounting member 11 to clamp the circuit board. During the plating operation, the driving mechanism 50 generates The driving force drives the mounting member 11 to move. The mounting member 11 drives the clamp 21 and the circuit board clamped on the clamp 21 to move. The mounting member 11 drives the circuit board into the plating bath. The mounting member 11 is suspended above the plating bath, which can be avoided. The mounting member 11 interferes with the plating bath to ensure that the circuit board can smoothly enter the plating bath for the plating reaction.

In this embodiment, a plurality of jigs 21 for clamping circuit boards are fixedly mounted on the mounting piece 11, the mounting piece 11 is energized, each jig 21 is electrically connected to the mounting piece 11, and a plurality of jigs 21 are connected in parallel to each other and installed. The piece 11 is connected in series with the fixture 21 components formed by all the fixtures 21, so the voltage and current on each fixture 21 are the same, which can improve the consistency of the plating effect of the circuit board. Since multiple fixtures 21 are fixed on the mounting piece 11, When the mounting member 11 is powered on normally, multiple fixtures 21 are powered on normally. Since the mounting member 11 is an integral structural member, to ensure that the mounting member 11 is powered on normally, it is only necessary to ensure that any position on the mounting member 11 is maintained with the power supply. Good contact is enough, and as long as there is a poor contact between the rack and the power supply in the related technology, the plating time of the circuit board on the rack and other circuit boards is not consistent. Compared with the related technology, the mounting member 11 in the embodiment of the present application The stability and reliability of the connection to the power supply are improved. Therefore, the plating apparatus in the embodiment of the present application can avoid the inconsistency in the plating time of multiple circuit boards. Voltage, current, and plating time are consistent, thereby improving the consistency of the effect of plating the plurality of circuit boards, thereby ensuring uniform copper thickness after the same batch plated board.

The circuit board has a front surface and a back surface disposed opposite to the front surface. The electroplating bath has a plurality of first anodes extending along one plane and a plurality of second anodes extending along the other plane. The first anode and the second anode The first anode and the second anode are arranged at a distance from each other, with the front side facing the first anode and the opposite side facing the second anode.

In one embodiment, the mounting member 11 includes a mounting surface 12. The mounting surface 12 is a flat surface. The extension surface of the mounting surface 12 intersects the plating bath. A plurality of clamps 21 are fixed on the mounting surface 12.

In this embodiment, the mounting member 11 includes a mounting surface 12, the mounting surface 12 is a flat surface, the extension surface of the mounting surface 12 intersects the plating bath, and a plurality of clamps 21 are fixed on the mounting surface 12 and fixed on the clamp 21 The circuit boards are all in the same plane. When multiple circuit boards are placed in the plating bath, they are also in the same plane. The distances to the fronts of multiple circuit boards are equal. Because the voltages and currents of the multiple circuit boards are the same, the speed of multiple cation electrophoresis is the same. The quantity is the same, so the copper thickness of the front side of the multiple circuit boards is the same. It can be seen that the copper thickness of the opposite side of the multiple circuit boards is also the same, so that the plating effect of the multiple circuit boards is the same.

In the related art, multiple hangers are independent of each other. Due to other reasons of assembly, the circuit boards installed on each hanger may have a surface difference between each other (that is, multiple circuit boards are not moved on the same plane), which may easily cause card boards. risks of.

In this embodiment, the circuit boards fixed on the clamp 21 are all located in the same plane, which can avoid the phenomenon of card board.

In an embodiment, as shown in FIGS. 2 and 3, the clamp 21 includes a first clamping portion 22 fixedly connected to the mounting member 11 and energized, and a second clamping portion 24 hingedly mounted on the first clamping portion 22. And an elastic member 25 elastically abutting between the first clamping portion 22 and the second clamping portion 24 to maintain the clamped state of the first clamping portion 22 and the second clamping portion 24.

In this embodiment, the second clamping portion 24 and the first clamping portion 22 are hingedly installed, and the external force drives the second clamping portion 24 to open relative to the first clamping portion 22 so that the second clamping portion 24 and the second The distance between the clamping portions 24 allows the circuit board to be inserted, and the elastic member 25 elastically abuts between the first clamping portion 22 and the second clamping portion 24 to keep the first clamping portion 22 and the second clamping The clamping state of the portion 24 can ensure that the circuit board is clamped in the clamp 21.

In an embodiment, as shown in FIGS. 2 and 3, the elastic member 25 is a spring, and the clamp 21 further includes a guide portion 23 fixedly connected to the first clamping portion 22 or the second clamping portion 24. The guide portion 23 is provided. Between the first clamping portion 22 and the second clamping portion 24, an elastic member 25 is sleeved on the outer periphery of the guide portion 23.

In an embodiment, as shown in FIGS. 1 to 5, the electroplating device further includes a conductive structure 30. The conductive structure 30 includes a plurality of conductive blocks 31 electrically connected to a power source and a plurality of conductive sliders mounted on the mounting member 11. 32. The mounting member 11 is electrically connected to the power source through at least a pair of conductive sliders 32 and a conductive block 31 which are mutually conductive.

In the related art, a plurality of hangers are respectively connected to a power source through a conductive slider 32. If a conductive failure occurs between the conductive slider 32 and the conductive block 31, the circuit board on the hanger will have a conductive failure and affect the Plating of circuit boards on the rack.

In this embodiment, a plurality of conductive sliders 32 are mounted on the mounting member 11. Among any of the plurality of conductive sliders 32 and the plurality of conductive blocks 31, when any pair of the conductive sliders 32 and the conductive blocks 31 are electrically connected, it is guaranteed that The power supply of the mounting member 11 is normal, and the power supply of the mounting member 11 is normal, which can ensure that each fixture 21 is powered on normally, thereby ensuring that the circuit boards clamped on each fixture 21 can perform the plating reaction normally, thereby improving the same batch. The circuit board has the same plating effect.

In one embodiment, the conductive structure 30 further includes a conductive frame 33 electrically connected to the power source, and conductive wires corresponding to the one-to-one correspondence with the plurality of conductive blocks 31 and electrically connected. Each conductive line is fixedly connected to the conductive frame 33 and Electrically conductive.

In an embodiment, as shown in FIG. 2 to FIG. 3, the electroplating device further includes a guide structure 41 disposed above the electroplating bath. The guide structure 41 includes a linear track 42, and is mounted on the mounting member 11 and guides and cooperates with the linear guide rail. A plurality of rollers 45 and a plurality of rotating shafts 49 for mounting the rollers 45 to the mounting member 11 are connected in a one-to-one correspondence with the plurality of rollers 45. The plurality of rollers 45 are located at the same horizontal height, and each of the rollers 45 An annular groove 46 is provided on the top. The linear guide includes a first guide plate 43 and a second guide plate 44 extending along two parallel straight lines in the same plane. The first guide plate 43 and the second guide plate 44 are spaced up and down. The widths of the plate 43 and the second guide plate 44 are set to match the groove width of each annular groove 46. The first guide plate 43 is vertically inserted into each annular groove 46 from above the roller 45, and the second guide plate 44 Each ring groove 46 is inserted vertically downward from the bottom of the roller 45, and the second guide plate 44 is press-fitted with the groove bottom of the ring groove 46.

In this embodiment, the roller 45 rolls forward, and multiple rollers 45 are located at the same level, which can increase the stability of the mounting member 11 during the movement with the roller 45 and prevent the mounting member 11 from moving up and down during the movement. The linear guide includes a first guide plate 43 and a second guide plate 44 extending along two parallel straight lines in the same plane. The first guide plate 43 and the second guide plate 44 are spaced up and down to allow the roller 45 to roll in. The first guide plate 43 is inserted vertically into the annular groove 46 from above the roller 45, and the second guide plate 44 is inserted vertically into the annular groove 46 from below the roller 45, and the widths of the first guide plate 43 and the second guide plate 44 are both The matching arrangement with the groove width of the annular groove 46 can prevent the mounting member 11 from swinging left and right during rolling. The second guide plate 44 is press-fitted with the groove bottom of the annular groove 46 to prevent the roller 45 from driving the mounting member 11 downward. .

In an embodiment, the notch of the annular groove 46 is configured as a horn opening, and the width of the horn opening gradually expands outward in the radial direction.

In one embodiment, the conductive structure 30 further includes a plurality of connection plates 36 drivingly connected to the driving structure and fixedly mounting the mounting member 11, the plurality of conductive blocks 31 and the plurality of connection plates 36 are arranged one-to-one correspondingly, and the plurality of conductive blocks 31 are respectively fixed to a plurality of connection plates 36.

In one embodiment, a plurality of rollers 45 are provided in a one-to-one correspondence with a plurality of connecting plates 36, and the rotating shaft 49 passes through the mounting member 11, the connecting plate 36, and the roller 45, respectively, so that the roller 45 is mounted on the mounting member 11 and the connecting plate 36. .

In an embodiment, the mounting member 11 has a certain structural strength and can bear weight, such as a mounting fixture 21 and a circuit board, and the mounting member 11 also has a certain toughness and can be processed into a ring-shaped structural member connected end to end.

Another embodiment of the present application further provides an electroplating apparatus, which includes an electroplating bath and the above-mentioned electroplating device, and the electroplating device is configured to cooperate with the electroplating bath to electroplate a circuit board.

Claims

An electroplating device includes a driving mechanism (50), a mounting member (11) drivingly connected to the driving mechanism (50) and made of a conductive material, and a plurality of clamps fixedly mounted on the mounting member (11) (21) The plurality of clamps (21) are made of a conductive material, and each clamp (21) is electrically connected to the mounting member (11), and is configured to clamp a circuit board, and the mounting member (11) Suspended above the plating bath, the driving mechanism (50) is configured to drive the mounting member (11) to move the clamp (21) and the circuit board through the movement of the mounting member (11). And move the circuit board into the electroplating bath.
The electroplating device according to claim 1, wherein the mounting member (11) includes a mounting surface (12), the mounting surface (12) is a flat surface, and an extension surface of the mounting surface (12) and the plating The pools intersect, and the plurality of clamps (21) are fixedly connected to the mounting surface (12).
The electroplating apparatus according to claim 1, wherein the jig (21) includes a first clamping portion (22) fixedly connected to the mounting member (11) and energized, and the first clamping portion ( 22) A second clamping portion (24) hingedly mounted and elastically abutting between the first clamping portion (22) and the second clamping portion (24) to hold the first clamping portion (22) An elastic member (25) in a clamped state with the second clamping portion (24).
The electroplating device according to claim 3, wherein the elastic member (25) is a spring, and the clamp (21) further includes a first clamping portion (22) or a second clamping portion ( 24) A fixedly connected guide portion (23), the guide portion (23) is disposed between the first clamping portion (22) and the second clamping portion (24), and the elastic member (25 ) Is sleeved on the outer periphery of the guide portion (23).
The electroplating device according to any one of claims 1 to 4, further comprising a conductive structure (30), the conductive structure (30) including a plurality of conductive blocks (31) electrically connected to a power source and a plurality of The conductive slider (32) on the mounting member (11), and the mounting member (11) is connected to the power source through at least one pair of the conductive slider (32) and the conductive block (31) which are mutually conductive. Electrical connection.
The electroplating device according to claim 5, wherein the conductive structure (30) further comprises a conductive frame (33) electrically connected to the power source and a one-to-one correspondence with the plurality of conductive blocks (31) and Each of the electrically connected conductive wires is fixedly connected to the conductive frame (33) and is electrically conductive.
The electroplating apparatus according to claim 5, wherein the conductive structure (30) further comprises a connecting plate (36) drivingly connected to the driving mechanism (50), and the mounting member (11) is fixedly connected to the Connection plate (36).
The electroplating device according to any one of claims 1 to 4, further comprising a guide structure (41) provided above the electroplating bath, the guide structure (41) comprising a linear track (42), mounted on the A plurality of rollers (45) on the mounting member (11) and guiding and matching with the linear guide rail (42), and a plurality of rotating shafts (49) for mounting the rollers (45) to the mounting member (11) ), The plurality of rotating shafts (49) and the plurality of rollers (45) are connected in a one-to-one correspondence, the plurality of rollers (45) are located at the same horizontal height, and each of the rollers (45) is provided with an annular groove ( 46), the linear guide (42) includes a first guide plate (43) and a second guide plate (44) extending along two parallel straight lines in the same plane, and the first guide plate (43) and the first guide plate (43) Two guide plates (44) are spaced up and down, and the widths of the first guide plate (43) and the second guide plate (44) are matched with the groove width of each annular groove (46). A guide plate (43) is inserted vertically downward into each annular groove (46) from above the roller (45), and the second guide plate (44) is inserted vertically upward from below the roller (45) Within each annular groove (46) The second guide plate (44) and the bottom of each annular groove (46) of the press-fit.
The electroplating device according to claim 8, wherein the notch of the annular groove (46) is provided as a horn opening, and the width of the horn opening gradually expands radially outward.
An electroplating apparatus, comprising an electroplating bath and the electroplating device according to any one of claims 1 to 9, the electroplating device is arranged to cooperate with the electroplating bath to electroplate a circuit board.