CN202576630U - Electroplating fixture for manufacturing printed circuit board (PCB) - Google Patents
Electroplating fixture for manufacturing printed circuit board (PCB) Download PDFInfo
- Publication number
- CN202576630U CN202576630U CN 201220140083 CN201220140083U CN202576630U CN 202576630 U CN202576630 U CN 202576630U CN 201220140083 CN201220140083 CN 201220140083 CN 201220140083 U CN201220140083 U CN 201220140083U CN 202576630 U CN202576630 U CN 202576630U
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- edge strip
- pcb
- electroplating
- electroplating clamp
- utility
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Abstract
The utility model provides an electroplating fixture for manufacturing a printed circuit board (PCB). The electroplating fixture comprises a first metal edge strip, a plurality of metal clips and two second metal edge strips, the first edge strip is electrically connected with a negative pole of a direct current power supply, the plurality of metal clips are distributed on the first edge strip and used for clamping the PCB which is being manufactured, and the two second metal edge strips are used for hanging the first edge strip and being electrically connected with the negative pole through the first edge strip. According to the electroplating fixture for manufacturing the PCB, the two edge strips are added so that the problem that electroplating copper at two ends of the negative pole is thick in relevant art is solved, and electroplating qualities of the PCB are improved.
Description
Technical field
The utility model relates to printed substrate (PCB) field, in particular to the electroplating clamp that is used for manufacturing PCB.
Background technology
In the making processes of PCB (abbreviating circuit card as), also need electro-coppering behind the heavy copper, thick and plate face copper is thick to increase hole wall copper.Fig. 1 shows according to the PCB of correlation technique and electroplates synoptic diagram, wherein, with PCB in making sheet as negative electrode, copper coin is as anode, through constantly separating out copper at the negative electrode place, thick in order to the copper that increases PCB.
For with PCB in making sheet as negative electrode, need PCB be connected to the negative pole of direct supply in making sheet through electroplating clamp (abbreviating anchor clamps as), Fig. 2 shows the link plate synoptic diagram in making sheet according to the PCB of correlation technique.
The contriver finds that the plating PCB of the electroplating clamp made of Fig. 2 is in uneven thickness in the electro-coppering of making sheet, and thicker than the electro-coppering of other positions in the electro-coppering at the two ends of negative electrode (being the a-quadrant among Fig. 2), this quality to PCB has caused adverse influence.
The utility model content
The utility model aims to provide a kind of electroplating clamp that is used to make printed substrate, electroplates problem with the PCB that solves correlation technique.
In the embodiment of the utility model; A kind of electroplating clamp that is used for manufacturing PCB is provided; It comprises first edge strip and the clip that is distributed in a plurality of metals on first edge strip of the metal that is used to be electrically connected dc power cathode, and clip is used for clamping PCB in making sheet, also comprises: second edge strip of two metals; Be used for articulating respectively first edge strip, and be electrically connected negative pole through first edge strip.
This electroplating clamp is electroplated thicker problem because increased by two second edge strips so overcome the negative electrode two ends of correlation technique, has improved the PCB electroplating quality.
Description of drawings
Accompanying drawing described herein is used to provide the further understanding to the utility model, constitutes the application's a part, and illustrative examples of the utility model and explanation thereof are used to explain the utility model, do not constitute the improper qualification to the utility model.In the accompanying drawings:
The PCB that Fig. 1 shows according to correlation technique electroplates synoptic diagram;
Fig. 2 shows the link plate synoptic diagram in making sheet according to the PCB of correlation technique;
Fig. 3 shows the plating distribution map of the electric field in making sheet according to the PCB of correlation technique;
Fig. 4 shows the link plate synoptic diagram in making sheet according to the PCB of the utility model embodiment;
Fig. 5 shows the structure iron according to second edge strip of the utility model embodiment.
Embodiment
Below with reference to accompanying drawing and combine embodiment, specify the utility model.
Utility model people anatomizes the link plate working order of the electroplating clamp of Fig. 2, has obtained the plating distribution map of the electric field of PCB according to correlation technique as shown in Figure 3 in making sheet.Utility model people finds that the electric field line distribution of correlation technique is uneven, and in the negative plate mid-way (being the B zone), electric field line distribution is even, and electric field line distribution is closeer relatively at the two ends of plate (being the a-quadrant).Because electric field line is inhomogeneous, cause PCB uneven at the electroplating current density of making sheet different positions, finally cause the electro-coppering thickness ununiformity of different positions.The position that electric field line is close, current density is high, so at the two ends of negative electrode, electro-coppering thickness is higher relatively, influences the difficulty that circuit is made.
Utility model people is according to above analytical results, and the electroplating clamp to correlation technique in an embodiment of the utility model improves.Fig. 4 shows the link plate synoptic diagram in making sheet according to the PCB of the utility model embodiment; The electroplating clamp of Fig. 4 comprises first edge strip 10 and the clip 20 that is distributed in a plurality of metals on first edge strip 10 of the metal that is used to be electrically connected dc power cathode; Clip 20 is used for clamping PCB in making sheet; Also comprise: second edge strip 30 of two metals is used for articulating respectively first edge strip 10, and is electrically connected negative pole through first edge strip 10.
As shown in Figure 4; When electroplating PCB in making sheet; Can second edge strip 30 be hung over the two ends of PCB in making sheet, because second edge strip 30 is metal materials, so can attract the part electric field line; Thereby can evacuate be collected at originally PCB at the making sheet two ends electric field line of (being the A district), thereby make that the electric field line distribution of PCB in making sheet is more even.Therefore this electroplating clamp is through having done simple improvement to former electroplating clamp; Cost is very little; Electroplate edge strip through increasing, can solve the uneven problem of the medium-term and long-term plating that exists of correlation technique, make the PCB in the plating can both remain on copper facing under the more consistent current density condition at link plate frame two ends; Improve the thick homogeneity of electro-coppering, obtained the major progress that improves the PCB electroplating quality.
Preferably, the length of second edge strip 30 is scalable.Like this can free adjustment length, thus keep consistent with PCB length on the making sheet vertical direction.
Fig. 5 shows the structure iron according to second edge strip of the utility model embodiment, and each second edge strip 30 includes: two tinsels 32 have rectangular draw-in groove respectively in the centre; Screw 34 passes rectangular draw-in groove, is used to tighten two tinsels 32 of connection.
Preferably, each second edge strip 30 includes two screws 34.
Preferably, second edge strip 30 adopts stainless steel.
Through fastening screw and draw-in groove, alignment jig edge strip integral length freely is so that adapt to different PCB length; This stainless steel conduction edge strip of while; When the copper that plates is thicker, can reuse behind the copper removal, can reuse in theory unlimitedly.
From above description, can find out; The utility model the above embodiments are electroplated edge strip through adopt stainless steel identical with plate length, conduction at the electroplating clamp two ends; Thereby PCB is in making sheet in protection; Make the PCB in the plating can both remain on copper facing under the more consistent current density condition, improve electro-coppering thick evenly, improve effectively in the circuit making processes because the etching that plate face copper thickness ununiformity causes is clean, circuit is wide or defective such as meticulous.
The preferred embodiment that the above is merely the utility model is not limited to the utility model, and for a person skilled in the art, the utility model can have various changes and variation.All within the spirit and principle of the utility model, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection domain of the utility model.
Claims (5)
1. electroplating clamp that is used to make printed substrate; The clip (20) that it comprises first edge strip (10) of the metal that is used to be electrically connected dc power cathode and is distributed in a plurality of metals on said first edge strip (10); Said clip (20) is used for clamping printed circuit board in making sheet, and said electroplating clamp is characterised in that also and comprises:
Second edge strip (30) of two metals is used for articulating respectively said first edge strip (10), and is electrically connected said negative pole through said first edge strip (10).
2. electroplating clamp according to claim 1 is characterized in that, the length of said second edge strip (30) is scalable.
3. electroplating clamp according to claim 2 is characterized in that, each said second edge strip (30) includes:
Two tinsels (32) have rectangular draw-in groove respectively in the centre;
Screw (34) passes said rectangular draw-in groove, is used to tighten connection said two tinsels (32).
4. electroplating clamp according to claim 3 is characterized in that, each said second edge strip (30) includes two said screws (34).
5. electroplating clamp according to claim 1 is characterized in that, said second edge strip (30) is a stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220140083 CN202576630U (en) | 2012-04-01 | 2012-04-01 | Electroplating fixture for manufacturing printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220140083 CN202576630U (en) | 2012-04-01 | 2012-04-01 | Electroplating fixture for manufacturing printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202576630U true CN202576630U (en) | 2012-12-05 |
Family
ID=47246060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220140083 Expired - Lifetime CN202576630U (en) | 2012-04-01 | 2012-04-01 | Electroplating fixture for manufacturing printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202576630U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104178786A (en) * | 2013-05-21 | 2014-12-03 | 北大方正集团有限公司 | Electroplating method for making printed circuit board (PCB) |
| CN108754588A (en) * | 2018-06-22 | 2018-11-06 | 莆田市涵江区依吨多层电路有限公司 | A kind of ultra-thin PCB gantry plating production method |
| CN111139513A (en) * | 2019-11-21 | 2020-05-12 | 浙江通泰轴承有限公司 | Hanging rack |
| CN114075689A (en) * | 2020-08-21 | 2022-02-22 | 深南电路股份有限公司 | Control method for electroplating PCB and electroplating system |
-
2012
- 2012-04-01 CN CN 201220140083 patent/CN202576630U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104178786A (en) * | 2013-05-21 | 2014-12-03 | 北大方正集团有限公司 | Electroplating method for making printed circuit board (PCB) |
| CN108754588A (en) * | 2018-06-22 | 2018-11-06 | 莆田市涵江区依吨多层电路有限公司 | A kind of ultra-thin PCB gantry plating production method |
| CN111139513A (en) * | 2019-11-21 | 2020-05-12 | 浙江通泰轴承有限公司 | Hanging rack |
| CN114075689A (en) * | 2020-08-21 | 2022-02-22 | 深南电路股份有限公司 | Control method for electroplating PCB and electroplating system |
| CN114075689B (en) * | 2020-08-21 | 2022-11-22 | 深南电路股份有限公司 | Control method for electroplating PCB and electroplating system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121205 |