CN104532327B - The uniform anode baffle of a kind of plating - Google Patents
The uniform anode baffle of a kind of plating Download PDFInfo
- Publication number
- CN104532327B CN104532327B CN201410816739.XA CN201410816739A CN104532327B CN 104532327 B CN104532327 B CN 104532327B CN 201410816739 A CN201410816739 A CN 201410816739A CN 104532327 B CN104532327 B CN 104532327B
- Authority
- CN
- China
- Prior art keywords
- anode baffle
- baffle
- plating
- anode
- uniform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
Abstract
The invention discloses the uniform anode baffle of a kind of plating, it is characterized in that: including: scaffold (1), the two ends, left and right of described scaffold (1) are provided with the draw-in groove (2) for inserting anode baffle (3), described anode baffle (3) is empty van structure, described anode baffle (3) includes left anode baffle (6) and right anode baffle (7), one end of described left anode baffle (6) and right anode baffle (7) is provided with the socket (5) for inserting adjustable plate (4), it is positioned at described left anode baffle (6) to be connected by handle (8) with the end of the described adjustable plate (4) of right anode baffle (7).The one that the present invention provides electroplates uniform anode baffle, and uniformly, perforate big I adjusted in concert, yield rate is high, good looking appearance, and low cost is suitable for wide popularization and application in plating.
Description
Technical field
The present invention relates to the uniform anode baffle of a kind of plating, belong to technical field of plating equipment.
Background technology
In the prior art, two side-walls in electroplating bath are provided with two positive plates be arrangeding in parallel, and workpiece hangs on the hanger between two positive plates as negative electrode and is immersed in electroplate liquid, and after energising, metal ion concentration realizes plating at surface of the work.Electroplating bath close to bottom liquid level position and electroplating bath being the position that in electric field, the density of electric fluxline is maximum, electric current is maximum, highest current density, referred to as high current density region, and electroplating bath medium position is the position that the density of electric fluxline is minimum, electric current is minimum, and electric current density is minimum, referred to as low current density district.The plated film of the workpiece of high current density region is thicker, sometimes there is also " burning " long burr phenomena because electric current is big, impact assembling and outward appearance, and the workpiece plated film in low current density district is relatively thin, impact assembling or properties of product, it is therefore desirable to the coating film thickness taking measures to make the workpiece of high/low currents density region is uniform.
Galvanic anode baffle plate is to be added in the electric lines of force division board between workpiece to be plated (i.e. negative electrode) and plated metal source (i.e. anode) in electroplating bath.Its effect is: control electric lines of force uniformity by the size arranging position of opening and hole, it is ensured that workpiece to be plated coating is uniform, makes plated metal source consumption be controlled under conditions of ensureing thickness of coating quality.
The perforate size of current galvanic anode baffle plate is the most fixed, i.e. perforate size is unadjustable, it is impossible to effectively regulate thickness of coating according to the demand of workpiece to be plated.
Currently also occurring in that the perforate size adjustable galvanic anode baffle plate of minority, but two anode baffle can not regulate perforate size simultaneously, the coating causing workpiece to be plated two sides is inconsistent, has a strong impact on quality and the outward appearance of product.
Summary of the invention
The technical problem to be solved is to provide a kind of perforate size uniform anode baffle of adjustable plating;Further, it is provided that the uniform anode baffle of plating of the perforate big I adjusted in concert of a kind of two anode baffle.
For solving above-mentioned technical problem, the technical solution used in the present invention is:
The uniform anode baffle of a kind of plating, it is characterized in that: including: scaffold, the two ends, left and right of described scaffold are provided with the draw-in groove for inserting anode baffle, described anode baffle is empty van structure, described anode baffle includes left anode baffle and right anode baffle, one end of described left anode baffle and right anode baffle is provided with the socket for inserting adjustable plate, it is positioned at described left anode baffle to be connected by handle with the end of the described adjustable plate of right anode baffle, some through holes it are provided with in described anode baffle, the block of some sizes for regulating described through hole it is provided with on described adjustable plate.
Described scaffold is positioned in electroplating bath, and positive plate is set in parallel in the left and right sides of scaffold.
Described through hole is identical with the number of described block and position one_to_one corresponding.
The shape of described block includes square, circular or oval, is connected by longitudinal bracing bar and cross-brace bar one between some described blocks.
The middle part of described scaffold is the platform for placing plating piece.
The bottom of described anode baffle is provided with the card article for inserting described draw-in groove.
The length of described card article is less than the length of described draw-in groove.
Described handle includes being individually fixed in described left anode baffle and the parallel-segment of right anode baffle end and for connecting the segmental arc of described parallel-segment end.
Little 1 ~ the 2mm in gap of the more described socket of thickness of described adjustable plate.
The one that the present invention provides electroplates uniform anode baffle, the setting of adjustable plate, it is achieved that the regulation of hole size, therefore can regulate hole size according to the demand of workpiece to be plated, uniform to realize the coating of workpiece to be plated;It is positioned at the setting that described left anode baffle is connected by handle with the end of the described adjustable plate of right anode baffle, achieve left anode baffle and the gearing of right anode baffle, left anode baffle and the adjusted in concert of right anode baffle can be realized by push and pull bar, therefore the thickness of coating that achieves workpiece to be plated two sides is consistent, especially for thickness of coating requires high accurate workpiece to be plated, this setting is greatly improved end product quality and outward appearance;Being equipped with of draw-in groove and card article, the lead-in mode making the present invention is insertion method, and anode baffle boot speed is fast, imports convenient and convenient takes out.The one that the present invention provides electroplates uniform anode baffle, and uniformly, perforate big I adjusted in concert, yield rate is high, good looking appearance, and low cost is suitable for wide popularization and application in plating.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention;
Fig. 2 is the structural representation of adjustable plate in the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings the present invention is further described.
As shown in Figure 1 and 2, the uniform anode baffle of a kind of plating, it is characterized in that: including: scaffold 1, the two ends, left and right of described scaffold 1 are provided with the draw-in groove 2 for inserting anode baffle 3, described anode baffle 3 is empty van structure, described anode baffle 3 includes left anode baffle 6 and right anode baffle 7, one end of described left anode baffle 6 and right anode baffle 7 is provided with the socket 5 for inserting adjustable plate 4, it is positioned at described left anode baffle 6 to be connected by handle 8 with the end of the described adjustable plate 4 of right anode baffle 7, some through holes 9 it are provided with in described anode baffle 3, the block 10 of some sizes for regulating described through hole 9 it is provided with on described adjustable plate 4.
Described through hole 9 is identical with the number of described block 10 and position one_to_one corresponding.
The shape of described block 10 includes square, circular or oval, is connected by longitudinal bracing bar 11 and cross-brace bar 12 one between some described blocks 10.
The middle part of described scaffold 1 is the platform 13 for placing plating piece.
The bottom of described anode baffle 3 is provided with the card article 14 for inserting described draw-in groove 2.
The length of described card article 14 is less than the length of described draw-in groove 2.
Described handle 8 includes being individually fixed in described left anode baffle 6 and the parallel-segment 15 of right anode baffle 7 end and for connecting the segmental arc 16 of described parallel-segment 15 end.
Little 1 ~ the 2mm in gap of the more described socket of thickness 5 of described adjustable plate 4.
The above is only the preferred embodiment of the present invention; it is noted that, for those skilled in the art; under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (6)
1. electroplate uniform anode baffle for one kind, it is characterized in that: including: scaffold (1), the two ends, left and right of described scaffold (1) are provided with the draw-in groove (2) for inserting anode baffle (3), described anode baffle (3) is empty van structure, described anode baffle (3) includes left anode baffle (6) and right anode baffle (7), one end of described left anode baffle (6) and right anode baffle (7) is provided with the socket (5) for inserting adjustable plate (4), it is positioned at described left anode baffle (6) to be connected by handle (8) with the end of the described adjustable plate (4) of right anode baffle (7), some through holes (9) it are provided with in described anode baffle (3), the block (10) of some sizes for regulating described through hole (9) it is provided with on described adjustable plate (4);Described through hole (9) is identical with the number of described block (10) and position one_to_one corresponding;The middle part of described scaffold (1) is for placing the platform of plating piece (13).
The uniform anode baffle of a kind of plating the most according to claim 1, it is characterized in that: the shape of described block (10) includes square, circular or oval, connected by longitudinal bracing bar (11) and cross-brace bar (12) one between some described blocks (10).
The uniform anode baffle of a kind of plating the most according to claim 1, it is characterised in that: the bottom of described anode baffle (3) is provided with the card article (14) for inserting described draw-in groove (2).
The uniform anode baffle of a kind of plating the most according to claim 3, it is characterised in that: the length of described card article (14) is less than the length of described draw-in groove (2).
The uniform anode baffle of a kind of plating the most according to claim 1, it is characterised in that: described handle (8) includes the parallel-segment (15) being individually fixed in described left anode baffle (6) and right anode baffle (7) end and is used for connecting the segmental arc (16) of described parallel-segment (15) end.
The uniform anode baffle of a kind of plating the most according to claim 1, it is characterised in that: the little 1 ~ 2mm in gap of the more described socket of the thickness (5) of described adjustable plate (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410816739.XA CN104532327B (en) | 2014-12-24 | 2014-12-24 | The uniform anode baffle of a kind of plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410816739.XA CN104532327B (en) | 2014-12-24 | 2014-12-24 | The uniform anode baffle of a kind of plating |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104532327A CN104532327A (en) | 2015-04-22 |
CN104532327B true CN104532327B (en) | 2016-08-24 |
Family
ID=52847940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410816739.XA Expired - Fee Related CN104532327B (en) | 2014-12-24 | 2014-12-24 | The uniform anode baffle of a kind of plating |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104532327B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106149033A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
CN115838960A (en) * | 2022-01-26 | 2023-03-24 | 先进半导体材料(安徽)有限公司 | Electroplating device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW448931U (en) * | 1997-09-09 | 2001-08-01 | Guan Jin Kuen | Continuously vertical electroplating device |
US6811669B2 (en) * | 2002-08-08 | 2004-11-02 | Texas Instruments Incorporated | Methods and apparatus for improved current density and feature fill control in ECD reactors |
TWI324641B (en) * | 2006-11-03 | 2010-05-11 | Advanced Semiconductor Eng | Electroplating device and louver |
CN201420100Y (en) * | 2009-03-27 | 2010-03-10 | 东莞市宏德电子设备有限公司 | Lifting mechanism for automatically adjusting anode baffle and floating frame |
TWM390952U (en) * | 2010-06-01 | 2010-10-21 | Chin Poon Industrial Co Ltd | Electroplating floating frame and guiding track having cathode shielding effect |
CN101962795B (en) * | 2010-08-30 | 2012-06-06 | 昆山元茂电子科技有限公司 | Scaffold arranged in electroplating bath and provided with hole on side edge |
CN201817561U (en) * | 2010-10-28 | 2011-05-04 | 南通华达微电子集团有限公司 | Opening shape-adjustable electroplate anode baffle |
CN202465928U (en) * | 2011-12-31 | 2012-10-03 | 利德科技发展有限公司 | Anode baffling plate |
CN103215618A (en) * | 2012-01-18 | 2013-07-24 | 昆山允升吉光电科技有限公司 | Method for adjusting shape of open pore of electroformed anode baffle plate |
CN202881424U (en) * | 2012-07-27 | 2013-04-17 | 依利安达电子(昆山)有限公司 | Anode baffle for electroplating |
KR101472637B1 (en) * | 2012-12-27 | 2014-12-15 | 삼성전기주식회사 | Electro Plating Cover Plate and Electro Plating Device having it |
KR200480245Y1 (en) * | 2013-02-20 | 2016-04-28 | 프로세스 어드밴스 테크놀러지 리미티드 | Plating of injection epuipment box |
CN204491014U (en) * | 2014-12-24 | 2015-07-22 | 昆山元茂电子科技有限公司 | The uniform anode baffle of a kind of plating |
-
2014
- 2014-12-24 CN CN201410816739.XA patent/CN104532327B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN104532327A (en) | 2015-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104532327B (en) | The uniform anode baffle of a kind of plating | |
CN102828211B (en) | Electro-plating method | |
CN204491014U (en) | The uniform anode baffle of a kind of plating | |
CN101962795B (en) | Scaffold arranged in electroplating bath and provided with hole on side edge | |
CN203625508U (en) | Improved electroplating apparatus | |
CN211848180U (en) | Electroplating device | |
CN202881424U (en) | Anode baffle for electroplating | |
CN105543940B (en) | A kind of device and method of lifting VCP plating line electroplating evenness | |
CN105332039B (en) | A kind of electrode quick replacement device | |
CN204455338U (en) | For the electroplating clamp of printed circuit board (PCB) | |
CN203007458U (en) | PCB (Printed Circuit Board) electroplating bath with movable cathode | |
CN109023458B (en) | A kind of electroplanting device and method of PCB circuit board | |
CN204058637U (en) | A kind of micro electric coating apparatus of short run pcb board | |
CN202626340U (en) | Partial electroplate equipment for column-shaped part | |
CN203728948U (en) | Electroplating bath with uniformly distributed current | |
CN202643877U (en) | Printed-circuit board electroplating hanging-board structure | |
CN204982110U (en) | Energy saving and emission reduction joins in marriage and plates anchor clamps | |
CN203904487U (en) | Device used for hanging and mounting workpieces during electroplating | |
CN211471608U (en) | Laboratory operation platform for electroplating process | |
CN209810536U (en) | Multi-roller automatic feeding coating device | |
CN205133785U (en) | Automatic circulation constant temperature electrolysis machine | |
CN206635440U (en) | A kind of metalwork surface film coating device | |
CN205171002U (en) | Hang electrotinplate device | |
CN220433018U (en) | Flow equalization electroplating device | |
CN220579429U (en) | Film water electroplating device with function of deplating conductive roller coating |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160824 Termination date: 20181224 |
|
CF01 | Termination of patent right due to non-payment of annual fee |