CN102828211B - Electro-plating method - Google Patents
Electro-plating method Download PDFInfo
- Publication number
- CN102828211B CN102828211B CN201210314019.4A CN201210314019A CN102828211B CN 102828211 B CN102828211 B CN 102828211B CN 201210314019 A CN201210314019 A CN 201210314019A CN 102828211 B CN102828211 B CN 102828211B
- Authority
- CN
- China
- Prior art keywords
- plating piece
- plating
- antianode
- pair
- baffle plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a kind of electro-plating method, comprise: an antianode and plating piece are put into the electroplating bath that fills electroplate liquid, a described antianode is separately positioned on the left and right sides of described plating piece and is electrically connected with the positive pole of power supply respectively, and the negative pole electric connection of described plating piece and power supply is using as negative electrode; A pair of the first baffle plate is arranged between a described antianode and one end of close described plating piece; According to the plating area requirement of described plating piece, control the subregion that described a pair of the first baffle plate blocks described plating piece; Power-on, electroplates described plating piece. Electro-plating method of the present invention by arranging the first baffle plate between an antianode, can adjust flexibly directly just right region of plating piece and anode, thereby can optionally complete the uniformly-coating of plating piece part, also can complete the uniformly-coating of plating piece entirety, improve electroplating quality, its scope of application is wider, and practicality is significantly improved.
Description
Technical field
The present invention relates to a kind of electro-plating method of the plating area that can control plating piece.
Background technology
Refer to Fig. 1, a kind of electroplating device 1 of prior art comprises electroplating bath 10, plating piece 12 andAntianode 14. In described electroplating bath 10, be loaded with electroplate liquid, a described antianode 14 respectively with power supplyPositive pole be electrically connected, described plating piece 12 is electrically connected and conduct in electroplating process with the negative pole of power supplyNegative electrode. After power-on, in the plating that utilizes described electroplating device 1 to electroplate described plating piece 12In method, the metal cation in electroplate liquid is attracted by the negative electrical charge on described plating piece 12 surfaces, therebyThe surface of described plating piece 12 forms coating gradually.
In the electro-plating method of prior art, because the area of described plating piece 12 sometimes can be less than described sunThe area of the utmost point 14, therefore may cause the thickness of coating of each several part up and down of described plating piece 12 inhomogeneous,Especially in the thickness of coating of end positions up and down and the thickness of coating in centre position of described plating piece 12Inconsistent, affect electroplating quality.
Summary of the invention
The technical problem that the present invention mainly solves is that the thickness of coating that existing electro-plating method forms differsCause.
In order to solve the problems of the technologies described above, the embodiment of the invention discloses a kind of electro-plating method, comprising:
One antianode and plating piece are put into the electroplating bath that fills electroplate liquid, and a described antianode is established respectivelyPut in the left and right sides of described plating piece and be electrically connected respectively described plating piece and power supply with the positive pole of power supplyNegative pole be electrically connected using as negative electrode;
A pair of the first baffle plate is arranged between a described antianode and one end of close described plating piece;
According to the plating area requirement of described plating piece, control described a pair of the first baffle plate and block described plating pieceSubregion;
Power-on, electroplates described plating piece.
In a preferred embodiment of the present invention, a described antianode is arranged in parallel.
In a preferred embodiment of the present invention, the area of described anode be more than or equal to described plating piece withThe area of the parallel maximum cross-section of described anode.
In a preferred embodiment of the present invention, described a pair of the first baffle plate is by one first driving mechanism controlSystem, described the first driving mechanism drives described a pair of overhead gage to move up and down.
In a preferred embodiment of the present invention, described the first driving mechanism comprise the first drive motors andHead rod, described head rod keeps off with described the first drive motors and described a pair of first respectivelyPlate connects.
In a preferred embodiment of the present invention, the upper end of the upper end of described plating piece and a described antianodeConcordant, the lower end of described plating piece is higher than the lower end of a described antianode, and described the first baffle plate is arranged on instituteState the lower end of plating piece.
In a preferred embodiment of the present invention, also comprise a pair of second baffle is arranged on described a pair ofThe other end of also close described plating piece between anode, and according to the plating area requirement of described plating piece, controlMake the subregion that described a pair of the first baffle plate and described a pair of second baffle block respectively described plating piece.
In a preferred embodiment of the present invention, described a pair of second baffle is by one second driving mechanism controlSystem, described the second driving mechanism drives described a pair of second baffle to move up and down.
In a preferred embodiment of the present invention, described the second driving mechanism comprise the second drive motors andThe second connecting rod, described the second connecting rod keeps off with described the second drive motors and described a pair of second respectivelyPlate connects;
In a preferred embodiment of the present invention, the upper end of described plating piece is upper lower than a described antianodeEnd, the lower end of described plating piece is higher than the lower end of a described antianode.
Electro-plating method of the present invention by arranging overhead gage, lower baffle plate, Ke Yiling between an antianodeThe region that adjustment plating piece alive and anode are direct just right, thus the equal of plating piece part can optionally be completedEven plating, also can complete the uniformly-coating of plating piece entirety, improves electroplating quality, and its scope of applicationExtensively, practicality is significantly improved.
Brief description of the drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, will describe embodiment belowIn the accompanying drawing of required use be briefly described, apparently, the accompanying drawing in the following describes is onlyBe some embodiments of the present invention, for those of ordinary skill in the art, do not paying creativenessUnder the prerequisite of work, can also obtain according to these accompanying drawings other accompanying drawing, wherein:
Fig. 1 is a kind of structural representation of electroplating device of prior art;
Fig. 2 is the structural representation of the electroplating device that electro-plating method a kind of and of the present invention is relevant;
Fig. 3 is the another kind of structural representation of the electroplating device relevant to electro-plating method of the present invention;
Fig. 4 is the structural representation of another state of electroplating device shown in Fig. 3.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is enteredRow is described clearly and completely, and obviously, described embodiment is only a part of embodiment of the present invention,Instead of whole embodiment. Based on the embodiment in the present invention, those of ordinary skill in the art are not havingHave and make all other embodiment that obtain under creative work prerequisite, all belong to the present invention protectionScope.
The embodiment of the invention discloses a kind of electro-plating method, comprising:
One antianode and plating piece are put into the electroplating bath that fills electroplate liquid, and a described antianode is established respectivelyPut in the left and right sides of described plating piece and be electrically connected respectively described plating piece and power supply with the positive pole of power supplyNegative pole be electrically connected using as negative electrode;
A pair of the first baffle plate is arranged between a described antianode and one end of close described plating piece;
According to the plating area requirement of described plating piece, control described a pair of the first baffle plate and block described plating pieceSubregion;
Power-on, electroplates described plating piece.
Refer to Fig. 2, Fig. 2 discloses the knot of the electroplating device that electro-plating method a kind of and of the present invention is relevantStructure schematic diagram, described electroplating device 2 comprises electroplating bath 20, an antianode 21, plating piece 22 and baffle plateMechanism.
Described electroplating bath 20 is used for splendid attire electroplate liquid.
Described plating piece 22 is electrically connected using as negative electrode with the negative pole of power supply (not indicating), described a pair ofAnode 21 is separately positioned on the left and right sides of described plating piece 22 and is electrically connected with the positive pole of power supply respectively.In the present embodiment, a described antianode 21 is arranged in parallel, thereby can ensure described a pair of sunBetween the utmost point 21 and described plating piece 22, form uniform electric field, and the area of described anode 21 is greater than etc.Area in described plating piece 22 in the maximum cross-section parallel with described anode 21. In the present embodiment,The upper end of described plating piece 22 is concordant with the upper end of a described antianode 21, and the lower end of described plating piece 22 is highIn the lower end of a described antianode 21.
Described baffle mechanism comprises a pair of lower baffle plate 24 and lower driving mechanism 26. Described a pair of lower baffle plate24 are arranged on the left and right sides of described plating piece 22 and lay respectively between a described antianode 21. Wherein,Described a pair of lower baffle plate 24 is separately positioned on the both sides, lower end of described plating piece 22. Described plate washer 24 is to adoptForm with erosion resisting insulation materials processing.
Described lower driving mechanism 26 drives described a pair of lower baffle plate 24 to move up and down, wherein, described underDriving mechanism 26 comprises lower drive motors 262 and lower connecting rod 264, and described lower connecting rod 264 respectivelyBe connected with described lower drive motors 262 and described a pair of lower baffle plate 24.
Before described plating piece 22 is electroplated, described lower drive motors 262 drives described lower connecting rod 264 to be withMoving described lower baffle plate 24 moves up, until the upper end of described lower baffle plate 24 and described plating piece 22 underHold level with both hands together, then power-on is electroplated. Due to upper end and a described antianode of described plating piece 2221 upper end is concordant, and the upper end of described lower baffle plate 24 is concordant with the lower end of described plating piece 22, thereforeDescribed plating piece 22 can obtain up and down thickness of coating uniformly in electroplating process, and electroplating quality is better.
In addition, electroplating relevant electroplating device to the present invention can also be for another kind of structure, as Fig. 3 andShown in Fig. 4, the baffle mechanism of described electroplating device 3 is except comprising a pair of lower baffle plate 34 and lower driving machineOutside structure 36, also comprise a pair of overhead gage 33 and upper driving mechanism 35, and the upper end of plating piece 32 is lowIn the upper end of an antianode 31, the lower end of plating piece 32 is higher than the lower end of an antianode 31.
Concrete, described a pair of overhead gage 33 and described a pair of lower baffle plate 34 are arranged on described plating piece 32The left and right sides and lay respectively between a described antianode 31. Wherein, described a pair of overhead gage 33Be separately positioned on the both sides, upper end of described plating piece 32, described in described a pair of lower baffle plate 34 is separately positioned onThe both sides, lower end of plating piece 32.
Described upper driving mechanism 35 drives described a pair of overhead gage 33 to move up and down, wherein, described onDriving mechanism 35 comprises drive motors 352 and upper connecting rod 354, and described upper connecting rod 354 respectivelyBe connected with described upper drive motors 352 and described a pair of overhead gage 33. Described plate washer 33,34 is allAdopt erosion resisting insulation materials processing to form.
Described lower driving mechanism 36 drives described a pair of lower baffle plate 34 to move up and down, wherein, described underDriving mechanism 36 comprises lower drive motors 362 and lower connecting rod 364, and described lower connecting rod 364 respectivelyBe connected with described lower drive motors 362 and described a pair of lower baffle plate 34.
Similarly, before described plating piece 32 is electroplated, described upper drive motors 352 drives described upper companyExtension bar 354 drives described overhead gage 33 to move downward or upward, and described lower drive motors 362 drives instituteState lower connecting rod 364 and drive described lower baffle plate 34 to move up or down, make described plating piece 32 completeEntirely directly just to a described antianode 31, and the just area to described plating piece 32 of a described antianode 31Corresponding to the area of described plating piece 32, thereby complete the overall uniformly-coating of plating piece 32, as Fig. 3 instituteShow.
Same, in the time that plating piece 32 needs parcel plating, described upper drive motors 352 drive described onConnecting rod 354 drives described overhead gage 33 to move down, described lower drive motors 362 drive described underConnecting rod 364 drives described lower baffle plate 34 to move up, so that described plating piece 32 is needed to the district of electroplatingTerritory is just to a described antianode 31, and described plating piece 32 does not need the region of electroplating by described upper gearPlate 33 and described lower baffle plate 34 block respectively, thereby complete the local uniform plating of plating piece 32, as figureShown in 4.
Compared to prior art, electro-plating method of the present invention by between an antianode, arrange overhead gage,Lower baffle plate, can adjust directly just right region of plating piece and anode flexibly, thereby can be optionally completeBecome the uniformly-coating of plating piece part, also can complete the uniformly-coating of plating piece entirety, improve electroplating quality,Its scope of application is wider, and practicality is significantly improved.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, allEquivalent structure or the conversion of equivalent flow process that utilizes description of the present invention and accompanying drawing content to do, or directlyOr be indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present inventionIn.
Claims (5)
1. an electro-plating method, is characterized in that, comprising:
One antianode and plating piece are put into the electroplating bath that fills electroplate liquid, and a described antianode is established respectivelyPut in the left and right sides of described plating piece and be electrically connected respectively described plating piece and power supply with the positive pole of power supplyNegative pole be electrically connected using as negative electrode;
A pair of the first baffle plate is arranged between a described antianode and one end of close described plating piece, instituteState a pair of the first baffle plate by one first driving mechanisms control, described the first driving mechanism drives described a pair ofOverhead gage moves up and down;
Described the first driving mechanism comprises the first drive motors and head rod, described head rodBe connected with described the first drive motors and described a pair of the first baffle plate respectively;
According to the plating area requirement of described plating piece, control described a pair of the first baffle plate and block described plating pieceSubregion;
A pair of second baffle is arranged between a described antianode and the other end of close described plating piece,And according to the plating area requirement of described plating piece, control described a pair of the first baffle plate and described a pair of secondBaffle plate blocks respectively the subregion of described plating piece; Described a pair of second baffle is by one second driving mechanismControl, described the second driving mechanism drives described a pair of second baffle to move up and down;
Described the second driving mechanism comprises the second drive motors and the second connecting rod, described the second connecting rodBe connected with described the second drive motors and described a pair of second baffle respectively;
In the time that plating piece needs parcel plating, upper drive motors drives upper connecting rod to drive overhead gage to moving downMoving, lower drive motors drives lower connecting rod to drive lower baffle plate to move up, so that described plating piece is needed to electricityThe region of plating is just to an antianode, and plating piece does not need the region of electroplating to divide by overhead gage and lower baffle plateDo not block;
Power-on, electroplates described plating piece.
2. electro-plating method according to claim 1, is characterized in that, a described antianode is mutualBe arranged in parallel.
3. electro-plating method according to claim 1, is characterized in that, the area of described anode is largeIn equaling the area of described plating piece in the maximum cross-section parallel with described anode.
4. electro-plating method according to claim 1, is characterized in that, the upper end of described plating piece withThe upper end of a described antianode is concordant, and the lower end of described plating piece is higher than the lower end of a described antianode, instituteState the lower end that the first baffle plate is arranged on described plating piece.
5. electro-plating method according to claim 1, is characterized in that, the upper end of described plating piece is lowIn the upper end of a described antianode, the lower end of described plating piece is higher than the lower end of a described antianode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210314019.4A CN102828211B (en) | 2012-08-30 | 2012-08-30 | Electro-plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210314019.4A CN102828211B (en) | 2012-08-30 | 2012-08-30 | Electro-plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102828211A CN102828211A (en) | 2012-12-19 |
| CN102828211B true CN102828211B (en) | 2016-05-04 |
Family
ID=47331507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210314019.4A Active CN102828211B (en) | 2012-08-30 | 2012-08-30 | Electro-plating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102828211B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103603024A (en) * | 2013-12-02 | 2014-02-26 | 昆山亿诚化工容器有限公司 | Electroplating device capable of realizing uniform electroplated layer thickness |
| CN103774203B (en) * | 2014-01-16 | 2016-08-24 | 黄海 | A kind of full-automatic PCB electroplating system |
| CN104878424B (en) * | 2015-04-29 | 2017-12-19 | 深圳崇达多层线路板有限公司 | A kind of method of raising PCB upright plating line electrodeposited coating uniformities |
| CN107604399A (en) * | 2017-10-31 | 2018-01-19 | 广东骏亚电子科技股份有限公司 | A kind of electro-plating method based on ultrasonic wave |
| CN107916443A (en) * | 2017-12-11 | 2018-04-17 | 常德力元新材料有限责任公司 | Electroplating bath for continuous ribbon-like materials |
| CN111394758B (en) * | 2020-05-14 | 2023-11-03 | 绍兴上虞顺风金属表面处理有限公司 | Electroplating process and equipment based on metal surfacing field |
| CN112779591A (en) * | 2021-01-29 | 2021-05-11 | 昆山东威科技股份有限公司 | Anode structure, electrode mechanism and electroplating system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10140393A (en) * | 1996-11-08 | 1998-05-26 | Hitachi Cable Ltd | Electroplating device |
| CN1539030A (en) * | 2001-07-25 | 2004-10-20 | 夏普株式会社 | Plating method and plating apparatus |
| JP2005029863A (en) * | 2003-07-10 | 2005-02-03 | Ebara Corp | Plating apparatus |
| CN101054701A (en) * | 2007-02-08 | 2007-10-17 | 上海美维科技有限公司 | Method of increasing electroplating evenness |
| CN101260553A (en) * | 2008-04-18 | 2008-09-10 | 深圳市兴森快捷电路科技股份有限公司 | Electroplating device for printed breadboard |
| CN201424517Y (en) * | 2009-03-10 | 2010-03-17 | 深圳大学反光材料厂 | Improved electroplating device |
| CN201793790U (en) * | 2010-08-24 | 2011-04-13 | 小康汽车产业（集团）有限公司 | Galvanic anode controllable shielding device |
| CN202017059U (en) * | 2011-03-23 | 2011-10-26 | 深圳崇达多层线路板有限公司 | Electroplating equipment with baffle plates |
-
2012
- 2012-08-30 CN CN201210314019.4A patent/CN102828211B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10140393A (en) * | 1996-11-08 | 1998-05-26 | Hitachi Cable Ltd | Electroplating device |
| CN1539030A (en) * | 2001-07-25 | 2004-10-20 | 夏普株式会社 | Plating method and plating apparatus |
| JP2005029863A (en) * | 2003-07-10 | 2005-02-03 | Ebara Corp | Plating apparatus |
| CN101054701A (en) * | 2007-02-08 | 2007-10-17 | 上海美维科技有限公司 | Method of increasing electroplating evenness |
| CN101260553A (en) * | 2008-04-18 | 2008-09-10 | 深圳市兴森快捷电路科技股份有限公司 | Electroplating device for printed breadboard |
| CN201424517Y (en) * | 2009-03-10 | 2010-03-17 | 深圳大学反光材料厂 | Improved electroplating device |
| CN201793790U (en) * | 2010-08-24 | 2011-04-13 | 小康汽车产业（集团）有限公司 | Galvanic anode controllable shielding device |
| CN202017059U (en) * | 2011-03-23 | 2011-10-26 | 深圳崇达多层线路板有限公司 | Electroplating equipment with baffle plates |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102828211A (en) | 2012-12-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102828211B (en) | Electro-plating method | |
| CN103603024A (en) | Electroplating device capable of realizing uniform electroplated layer thickness | |
| CN204982125U (en) | Cathode current segmentation adjusting mechanism for perpendicular continuous electroplating production line of PCB | |
| CN207862471U (en) | A kind of environmental-protecting type full-automatic rolling-plating equipment | |
| CN201809473U (en) | Movable substrate clamping mechanism for electroplating of substrates | |
| CN105543940B (en) | A kind of device and method of lifting VCP plating line electroplating evenness | |
| CN203904493U (en) | Combined anode device for nickel plating in oil tank | |
| CN202658257U (en) | Electroplating hanging tool allowing contact point of strip-type workpiece to be automatically replaced | |
| CN201933182U (en) | Novel clamp capable of improving efficiency for electroplating printed circuit board | |
| CN202808969U (en) | Electroplating equipment | |
| CN201180162Y (en) | Mobile cathode shading device | |
| CN203559143U (en) | Aluminum substrate electroplating and oxidating equipment | |
| CN203904490U (en) | Electroplating and clamping device of PCB | |
| CN109137053A (en) | A kind of electroplanting device | |
| CN202297814U (en) | Electroplating conductive device of lead frame of integrated circuit | |
| CN205241839U (en) | Integration formula stopper braking piston hard chrome plating hanger | |
| CN204455338U (en) | For the electroplating clamp of printed circuit board (PCB) | |
| CN104532327B (en) | The uniform anode baffle of a kind of plating | |
| CN203021667U (en) | Electrochemical processing device | |
| CN201785521U (en) | Electroplating device | |
| CN203683717U (en) | Stainless steel electropolishing device with adjustable space between electrolysis rods | |
| CN204661843U (en) | A kind of positive plate | |
| CN208604234U (en) | It is a kind of based on multi-field Novel electric plated pen | |
| CN207933547U (en) | A kind of electroplating device elevating mechanism | |
| CN205420575U (en) | Plate electroplating pen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |