CN201933182U - Novel clamp capable of improving efficiency for electroplating printed circuit board - Google Patents

Novel clamp capable of improving efficiency for electroplating printed circuit board Download PDF

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Publication number
CN201933182U
CN201933182U CN2011200040439U CN201120004043U CN201933182U CN 201933182 U CN201933182 U CN 201933182U CN 2011200040439 U CN2011200040439 U CN 2011200040439U CN 201120004043 U CN201120004043 U CN 201120004043U CN 201933182 U CN201933182 U CN 201933182U
Authority
CN
China
Prior art keywords
pwb
novel clamp
wiring board
efficiency
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011200040439U
Other languages
Chinese (zh)
Inventor
常文智
崔青鹏
彭涛
田维丰
张岩生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Suntak Multilayer PCB Co Ltd
Original Assignee
Shenzhen Suntak Multilayer PCB Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Suntak Multilayer PCB Co Ltd filed Critical Shenzhen Suntak Multilayer PCB Co Ltd
Priority to CN2011200040439U priority Critical patent/CN201933182U/en
Application granted granted Critical
Publication of CN201933182U publication Critical patent/CN201933182U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a printed circuit, in particular to a novel clamp in the printed circuit, which can improve the efficiency and is used for electroplating a printed circuit board. The utility model provides the novel clamp which can improve the efficiency, is used for electroplating the printed circuit board and comprises a hanging board and clamping heads, wherein each clamping head is provided with a boss, and the boss is provided with friction convex parts. The novel clamp has the beneficial effects that: the friction convex parts are arranged on the boss of each clamp head to increase the clamping force of each clamping head for the printed circuit board, and the phenomenon of board falling can be avoided.

Description

The printed-wiring board (PWB) that can raise the efficiency is electroplated and is used novel clamp
Technical field
The utility model relates to printed wiring, relates in particular to a kind of printed-wiring board (PWB) plating novel clamp of raising the efficiency in the printed wiring.
Background technology
Printed-wiring board (PWB) (Printed Circuit Board is called for short PCB) is the important electron parts, is the supporter of electronic devices and components, is the supplier that electronic devices and components are electrically connected.Electroplating then is to utilize electrolysis process, and metal or alloy is deposited on the plating piece surface, forms the process for treating surface of metal plating.When the Electroplating Production of printed-wiring board (PWB), need printed-wiring board (PWB) to be fixed on the negative electrode of electroplating cylinder with anchor clamps, after connecting power supply, metal ion is reduced into metal on the printed-wiring board (PWB) of sense of current at negative electrode, at present, existing anchor clamps are not enough to the holding force of printed-wiring board (PWB), and board falling takes place easily.
Summary of the invention
Not enough in order to solve in the prior art anchor clamps to the holding force of printed-wiring board (PWB), the problem of board falling takes place easily, the utility model provides a kind of and has been not easy to take place printed-wiring board (PWB) that board falling can raise the efficiency again and electroplates and use novel clamp.
The utility model provides a kind of printed-wiring board (PWB) of raising the efficiency to electroplate and has used novel clamp, comprises suspension plate and chuck, and described chuck is provided with boss, and described boss is provided with friction protrusion portion.
As further improvement of the utility model, described friction protrusion portion is the double wedge line.
As further improvement of the utility model, described friction protrusion portion is a wave double wedge line.
As further improvement of the utility model, described wave double wedge line has two at least.
As further improvement of the utility model, described wave double wedge line is evenly distributed on the described boss.
As further improvement of the utility model, described wave double wedge line be arranged in parallel.
As further improvement of the utility model, described friction protrusion portion is a ball shape.
As further improvement of the utility model, described friction protrusion portion is evenly distributed on the described boss.
The beneficial effects of the utility model are: by such scheme, friction protrusion portion is set on the boss of chuck, to increase the holding force of chuck to printed-wiring board (PWB), can avoids the generation of board falling phenomenon.
Description of drawings
Fig. 1 is that a kind of printed-wiring board (PWB) of raising the efficiency of the utility model is electroplated the structural representation with novel clamp.
Embodiment
Below in conjunction with description of drawings and embodiment the utility model is further specified.
Drawing reference numeral among Fig. 1 is: suspension plate 1; Boss 2; Friction protrusion portion 3.
As shown in Figure 1, a kind of printed-wiring board (PWB) of raising the efficiency is electroplated and is used novel clamp, comprise suspension plate 1 and chuck, described chuck is provided with boss 2, described boss 2 is provided with friction protrusion portion 3, wherein, during plating, described suspension plate 1 can be suspended on electroplating device fly the crust on, come the clamping printed-wiring board (PWB) by described chuck, and increase the frictional force of chuck and printed-wiring board (PWB) by the friction protrusion portion 3 on the boss 2, thus increase the holding force of chuck to printed-wiring board (PWB), can avoid the generation of board falling phenomenon.
As shown in Figure 1, described friction protrusion portion 3 is the double wedge line.
As shown in Figure 1, described friction protrusion portion 3 is a wave double wedge line.
As shown in Figure 1, described wave double wedge line has two at least.
As shown in Figure 1, described wave double wedge line is evenly distributed on the described boss 2.
As shown in Figure 1, described wave double wedge line be arranged in parallel.
As shown in Figure 1, described friction protrusion portion 3 is a ball shape.
As shown in Figure 1, described friction protrusion portion 3 is evenly distributed on the described boss 2.
A kind of printed-wiring board (PWB) of raising the efficiency that the utility model provides is electroplated and is used novel clamp, on the boss 2 of chuck friction protrusion portion 3 is set, and to increase the holding force of chuck to printed-wiring board (PWB), can avoid the generation of board falling phenomenon.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection domain of the present utility model.

Claims (8)

1. the printed-wiring board (PWB) that can raise the efficiency is electroplated and is used novel clamp, and it is characterized in that: comprise suspension plate (1) and chuck, described chuck is provided with boss (2), and described boss (2) is provided with friction protrusion portion (3).
2. electroplate according to the described printed-wiring board (PWB) of raising the efficiency of claim 1 and use novel clamp, it is characterized in that: described friction protrusion portion (3) is the double wedge line.
3. electroplate according to the described printed-wiring board (PWB) of raising the efficiency of claim 2 and use novel clamp, it is characterized in that: described friction protrusion portion (3) is wave double wedge line.
4. electroplate according to the described printed-wiring board (PWB) of raising the efficiency of claim 3 and use novel clamp, it is characterized in that: described wave double wedge line has two at least.
5. electroplate according to the described printed-wiring board (PWB) of raising the efficiency of claim 4 and use novel clamp, it is characterized in that: described wave double wedge line is evenly distributed on the described boss (2).
6. electroplate according to the described printed-wiring board (PWB) of raising the efficiency of claim 5 and use novel clamp, it is characterized in that: described wave double wedge line be arranged in parallel.
7. electroplate according to the described printed-wiring board (PWB) of raising the efficiency of claim 1 and use novel clamp, it is characterized in that: described friction protrusion portion (3) is ball shape.
8. electroplate according to the described printed-wiring board (PWB) of raising the efficiency of claim 1 and use novel clamp, it is characterized in that: described friction protrusion portion (3) is evenly distributed on the described boss (2).
CN2011200040439U 2011-01-07 2011-01-07 Novel clamp capable of improving efficiency for electroplating printed circuit board Expired - Fee Related CN201933182U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200040439U CN201933182U (en) 2011-01-07 2011-01-07 Novel clamp capable of improving efficiency for electroplating printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200040439U CN201933182U (en) 2011-01-07 2011-01-07 Novel clamp capable of improving efficiency for electroplating printed circuit board

Publications (1)

Publication Number Publication Date
CN201933182U true CN201933182U (en) 2011-08-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011200040439U Expired - Fee Related CN201933182U (en) 2011-01-07 2011-01-07 Novel clamp capable of improving efficiency for electroplating printed circuit board

Country Status (1)

Country Link
CN (1) CN201933182U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102703960A (en) * 2012-07-04 2012-10-03 中国振华集团群英无线电器材厂 Winding-free electroplating clamp of relay base
CN103361706A (en) * 2013-07-11 2013-10-23 东莞市五株电子科技有限公司 Fixture for electroplating circuit board
CN106163127A (en) * 2016-07-15 2016-11-23 深圳崇达多层线路板有限公司 A kind of printed circuit board coating process baking box
CN111647933A (en) * 2019-03-04 2020-09-11 联策科技股份有限公司 Asymmetric water seal conductive clamp

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102703960A (en) * 2012-07-04 2012-10-03 中国振华集团群英无线电器材厂 Winding-free electroplating clamp of relay base
CN102703960B (en) * 2012-07-04 2014-07-30 中国振华集团群英无线电器材厂 Winding-free electroplating clamp of relay base
CN103361706A (en) * 2013-07-11 2013-10-23 东莞市五株电子科技有限公司 Fixture for electroplating circuit board
CN103361706B (en) * 2013-07-11 2016-08-31 东莞市五株电子科技有限公司 Circuit board electroplating fixture
CN106163127A (en) * 2016-07-15 2016-11-23 深圳崇达多层线路板有限公司 A kind of printed circuit board coating process baking box
CN111647933A (en) * 2019-03-04 2020-09-11 联策科技股份有限公司 Asymmetric water seal conductive clamp

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110817

Termination date: 20170107

CF01 Termination of patent right due to non-payment of annual fee