CN203904488U - Electroplating suspension device for PCBs (Printed Circuit Boards) - Google Patents
Electroplating suspension device for PCBs (Printed Circuit Boards) Download PDFInfo
- Publication number
- CN203904488U CN203904488U CN201420311911.1U CN201420311911U CN203904488U CN 203904488 U CN203904488 U CN 203904488U CN 201420311911 U CN201420311911 U CN 201420311911U CN 203904488 U CN203904488 U CN 203904488U
- Authority
- CN
- China
- Prior art keywords
- pcbs
- suspension
- pcb board
- electroplated
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an electroplating suspension device for PCBs (Printed Circuit Boards). The electroplating suspension device comprises a suspension frame body, wherein the suspension frame body is provided with a plurality of connecting rods for clamping to-be-electroplated PCBs; each connecting rod is composed of a lower clamping rod and an upper power rod; the suspension frame body is provided with a suspension roller and a suspension rod; the suspension roller is provided with stop blocks for fixing the positions of the to-be-electroplated PCBs; the connecting rods are connected to the suspension rod by virtue of rotating shafts. When the electroplating suspension device for the PCBs is applied, the PCBs are clamped between the stop blocks and grinding wheel balls and can be conveniently taken and placed under the actions of tension springs and the connecting rods, and meanwhile, the plurality of PCBs can be electroplated, so that the working efficiency is increased.
Description
Technical field
the utility model relates to a kind of plating suspension system of pcb board.
Background technology
In traditional electrical depositing process, being plated workpiece is negative electrode, is positioned in electroplate liquid, anode is placed in the both sides of plating tank, in the process of energising, live metal ion, to cathodic migration, obtains will being deposited on workpiece surface with the form of metal simple-substance after electronics, thereby reaches the object of plating.In the time electroplating, need a kind of device that can be used in carry and plated workpiece, the existing plating hanging part using picks and places inconvenience, and electroplating efficiency is lower.
Summary of the invention
the purpose of this utility model is to provide a kind of plating suspension system that can conveniently pick and place the high and pcb board that can electroplate multiple products of PCB electroplated plate, working efficiency simultaneously.
The plating suspension system of a kind of pcb board of the present utility model, comprises suspension support body, and described suspension support body is provided with several for clamping the connecting rod of electroplated pcb board, and described connecting rod is made up of the clamping bar of bottom and the power rail on top; Described suspension support body is provided with hangs roller and peg, described extension roller is provided with the block for fixing electroplated pcb board position, described connecting rod is connected on peg by rotating shaft, the end of described power rail connects cylinder by cylinder axis, described power rail drives motion by cylinder, and described cylinder is connected on cylinder frame.
The end of described clamping bar is provided with the spherule that high-abrasive material is made.
The spherule that described high-abrasive material is made is emery wheel ball.
The use of the plating suspension system of the utility model pcb board, can be picked and placeed easily pcb board and can be electroplated multiple pcb boards by the effect of extension spring and connecting rod simultaneously, has improved electroplating efficiency.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure:
1. hang support body
2. cylinder; 21. cylinder axis
3. power rail
4. clamping bar
5. peg
6. block
7. electroplated pcb board
8. emery wheel ball
9. hang roller
10. cylinder frame
Embodiment
As shown in Figure 1, the plating suspension system of a kind of pcb board of the present utility model, comprise and hang support body 1, described suspension support body 1 is provided with several for clamping the connecting rod of electroplated pcb board 7, and these several connecting rods are made up of the clamping bar 4 of bottom and the power rail 3 on top; Described suspension support body 1 is provided with hangs roller 9 and peg 5, hang roller 9 and be provided with the block 6 for fixing electroplated pcb board 7 positions, described connecting rod is connected on peg 5 by rotating shaft, the end of described power rail 3 connects cylinder 2 by cylinder axis 21, power rail 3 drives motion by cylinder 2, and cylinder 2 is connected on cylinder frame 10; The end of clamping bar 4 is provided with emery wheel ball 8 more firmly to clamp pcb board 7.Plating of the present utility model is hung the device of pcb board in the time of application, and pcb board 7 is clamped between block 6 and emery wheel ball 8, can be picked and placeed easily pcb board and can be electroplated multiple pcb boards by the effect of extension spring and connecting rod simultaneously, has improved working efficiency.
Claims (3)
1. the plating suspension system of a pcb board, comprise and hang support body (1), it is characterized in that, described suspension support body (1) is provided with several for clamping the connecting rod of electroplated pcb board (7), and described connecting rod is made up of the clamping bar (4) of bottom and the power rail (3) on top; Described suspension support body (1) is provided with hangs roller (9) and peg (5), described extension roller (9) is provided with the block (6) for fixing electroplated pcb board (7) position, described connecting rod is connected on peg (5) by rotating shaft, the end of described power rail (3) connects cylinder (2) by cylinder axis (21), described power rail (3) drives motion by cylinder (2), and described cylinder (2) is connected on cylinder frame (10).
2. the plating suspension system of pcb board as claimed in claim 1, is characterized in that, the end of described clamping bar (4) is provided with the spherule that high-abrasive material is made.
3. the plating suspension system of pcb board as claimed in claim 1 or 2, is characterized in that, the spherule that described high-abrasive material is made is emery wheel ball (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420311911.1U CN203904488U (en) | 2014-06-13 | 2014-06-13 | Electroplating suspension device for PCBs (Printed Circuit Boards) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420311911.1U CN203904488U (en) | 2014-06-13 | 2014-06-13 | Electroplating suspension device for PCBs (Printed Circuit Boards) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203904488U true CN203904488U (en) | 2014-10-29 |
Family
ID=51778779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420311911.1U Expired - Fee Related CN203904488U (en) | 2014-06-13 | 2014-06-13 | Electroplating suspension device for PCBs (Printed Circuit Boards) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203904488U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104988569A (en) * | 2015-06-30 | 2015-10-21 | 苏州华日金菱机械有限公司 | Electroplating frame capable of shaking up and down |
-
2014
- 2014-06-13 CN CN201420311911.1U patent/CN203904488U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104988569A (en) * | 2015-06-30 | 2015-10-21 | 苏州华日金菱机械有限公司 | Electroplating frame capable of shaking up and down |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141029 Termination date: 20150613 |
|
| EXPY | Termination of patent right or utility model |