CN107541766A - Oscillating diode electroplating machine - Google Patents
Oscillating diode electroplating machine Download PDFInfo
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- CN107541766A CN107541766A CN201710528687.XA CN201710528687A CN107541766A CN 107541766 A CN107541766 A CN 107541766A CN 201710528687 A CN201710528687 A CN 201710528687A CN 107541766 A CN107541766 A CN 107541766A
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- axle
- electroplating
- electroplating machine
- oscillator
- vibration
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Abstract
The invention discloses oscillating diode electroplating machine, it is by electroplating machine body, electroplating bath, variable rheostat, hydraulic drive axle, oscillator, biography is shaken axle, vibration plating motor, shake sieve and conductive nail composition, described electroplating machine body lower end is provided with electroplating bath, plating trench bottom is provided with conductive nail, electroplating machine body upper end is provided with vibration plating motor, vibration plating motor is fixedly connected with oscillator, oscillator lower end is connected with hydraulic lifting axle upper end, hydraulic lifting axle lower end and biography the axle upper end that shakes are connected, biography shake axle lower end and shake sieve connection, variable rheostat is installed on vibration plating motor.Beneficial effect by above-mentioned technology is using vibration electroplating machine, two oscillators, two hydraulic lifting axles and variable rheostat, lifting shaft drives the sieve motion lead that shakes not allow the flexible quality for ensureing lead from top to bottom, and electroplating thickness can be made uniform, coefficient of alteration is few, additionally it is possible to improves electroplating efficiency by increasing the velocity of rotation of electric current raising vibration electroplating machine.
Description
Technical field
The present invention relates to electroplating machine field, and in particular to oscillating diode electroplating machine.
Background technology
Diode lead electroplating machine has the methods of barrel plating formula and rack plating, and plating is applied to be influenceed nothing by factors such as shape, sizes
Method or should not fill extension finding plating, it with early stage finding plating using rack plating or basketry plating by the way of compared with, saving
Labour, improves labor productivity, and plating piece surface quality also greatly improves, and rack plating is clamping workpiece in hanger
On, suitable big part is few per a collection of product quantity that can be plated, the technique that more than 10 μm of thickness of coating.It is but electric in the prior art
The method of plating, easily bend the lead of diode, and plating thickness is uneven when plating, and diode changes system
Number is big unstable, easily causes the problem of off quality.
The content of the invention
It is an object of the invention to provide oscillating diode electroplating machine, using vibration electroplating machine, two oscillators and variable rheostat
Mode, lifting shaft drive from top to bottom shake sieve motion plating when diode lead do not allow it is flexible guarantee lead matter
Amount, and can make that electroplating thickness is uniform, and coefficient of alteration is few, additionally it is possible to the velocity of rotation of vibration electroplating machine is improved by increasing electric current
So as to improve electroplating efficiency.
The technical solution adopted in the present invention is：Oscillating diode electroplating machine, it is by electroplating machine body, electroplating bath, variable resistance
Case, hydraulic drive axle, oscillator, biography shake axle, vibration plating motor, shake sieve and conductive nail composition, it is characterised in that：Described electricity
Plating machine body lower end is provided with electroplating bath, and plating trench bottom is provided with conductive nail, and described electroplating machine body upper end, which is provided with, to shake
Plating motor is swung, vibration plating motor is fixedly connected with oscillator, and oscillator lower end is connected with hydraulic lifting axle upper end, hydraulic pressure liter
Drop axle lower end and biography the axle upper end that shakes be connecteds, and biography shakes axle lower end and the sieve that shakes connects, and described vibration is electroplated and installs variable rheostat on motor,
Variable rheostat is electrically connected with the power supply.
Described conductive nail is a kind of negative electrode conductive nail, and the diode to shake in sieve is anode.
Described oscillator is provided with left oscillator and right oscillator.
The described biography axle that shakes is provided with that left biography shakes axle and right biography is shaken axle.
The described sieve that shakes is provided with shake sieve and the right side of a left side and shaken sieve.
The beneficial effects of the invention are as follows：Oscillating diode electroplating machine, using vibration electroplating machine, two oscillators and variable rheostat
Mode, lifting shaft drive from top to bottom shake sieve motion plating when diode lead do not allow it is flexible guarantee lead matter
Amount, and can make that electroplating thickness is uniform, and coefficient of alteration is few, additionally it is possible to the velocity of rotation of vibration electroplating machine is improved by increasing electric current
So as to improve electroplating efficiency.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
1- electroplating machine bodies；2- electroplating baths；A 3- left sides shake sieve；4- is left to pass the axle that shakes；The left oscillators of 5-；6- vibration plating motors；7- is right
Oscillator；8- is right to pass the axle that shakes；The 9- right sides shake sieve；10- conductive nails；The right hydraulic lifting axles of 11-；The left hydraulic lifting axles of 12-；13- variable resistances
Case；14- shakes sieve；15- passes the axle that shakes；16- hydraulic lifting axles；17- oscillators.
Embodiment
Below in conjunction with the accompanying drawings 1 and embodiment the present invention is further illustrated.
It is as shown in figure 1, of the invention：Oscillating diode electroplating machine, it is by electroplating machine body 1, electroplating bath 2, variable rheostat 13, liquid
Pressure lifting shaft 16, oscillator 17, pass shake axle 16, vibration plating motor 6, shake sieve 14 and conductive nail 10 form, it is characterised in that：Institute
The lower end of electroplating machine body 1 stated is provided with electroplating bath 2, and the bottom of electroplating bath 2 is provided with conductive nail 10, described electroplating machine body 1
Upper end is provided with vibration plating motor 6, and vibration plating motor 6 is fixedly connected with oscillator 17, the lower end of oscillator 17 and hydraulic pressure liter
The connection of axle 16 upper end dropped, and the lower end of hydraulic lifting axle 16 and the biography upper end of axle 15 that shakes be connecteds, are passed the lower end of axle 15 that shakes and are sieved 14 with shaking and be connected, institute
Variable rheostat 13 is installed on the vibration plating motor 6 stated, variable rheostat 13 is electrically connected with the power supply.Described conductive nail 10 is a kind of cloudy
Pole conductive nail, the diode in sieve 10 that shakes are anode, and described oscillator 14 is provided with left oscillator 5 and right oscillator 7, passes the axle that shakes
15 are provided with that left biography shakes axle 4 and right biography is shaken axle 8, the sieve 14 that shakes be provided with a left side shake sieve 3 and the right side shake sieve 9, hydraulic lifting axle 16 is provided with left hydraulic pressure
Lifting shaft 12 and right hydraulic lifting axle 11.Described oscillatory type plating motor 6 works, and drives biography to shake by the oscillator 17 in motor
Axle 15, vibration is passed to the sieve 14 that shakes, the diode to shake in sieve 14 is by vibration, and using electroplate liquid as medium, conductive nail 10 is in the moon
Pole, positively charged diode adsorb the ion in electroplate liquid, and so as to carry out plating work, and oscillatory type plating motor 6 is also
Provided with variable rheostat 13, the size of electric current can be adjusted, improves the vibration frequency of oscillatory type plating motor 6 so as to improve plating effect
Rate.
Certainly, above-mentioned technical proposal is the preferred forms of the present invention, under the spiritual background without departing from the present invention
Any improvement done, is within the scope of the present invention.
Claims (5)
1. oscillating diode electroplating machine, be by electroplating machine body, electroplating bath, variable rheostat, hydraulic drive axle, oscillator, biography shake axle,
Vibration plating motor, shake sieve and conductive nail composition, it is characterised in that：Described electroplating machine body lower end is provided with electroplating bath, electricity
Plating trench bottom is provided with conductive nail, and described electroplating machine body upper end is provided with vibration plating motor, and vibration plating motor is with shaking
Swing device to be fixedly connected, oscillator lower end is connected with hydraulic lifting axle upper end, and hydraulic lifting axle lower end and biography the axle upper end that shakes are connected, and are passed
Shake axle lower end and shake sieve connection, described vibration plating motor on variable rheostat is installed, variable rheostat is electrically connected with the power supply.
2. oscillating diode electroplating machine according to claim 1, it is characterised in that：Described conductive nail is that a kind of negative electrode is led
Electricity nail, the diode to shake in sieve is anode.
3. oscillating diode electroplating machine according to claim 1, it is characterised in that：Described oscillator is provided with left oscillator
With right oscillator.
4. oscillating diode electroplating machine according to claim 1, it is characterised in that：The described biography axle that shakes is provided with left biography and shaken axle
The axle that shakes is passed with right.
5. oscillating diode electroplating machine according to claim 1, it is characterised in that：The described sieve that shakes is provided with a left side and shaken sieve and the right side
Shake sieve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710528687.XA CN107541766A (en) | 2017-07-01 | 2017-07-01 | Oscillating diode electroplating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710528687.XA CN107541766A (en) | 2017-07-01 | 2017-07-01 | Oscillating diode electroplating machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107541766A true CN107541766A (en) | 2018-01-05 |
Family
ID=60970567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710528687.XA Pending CN107541766A (en) | 2017-07-01 | 2017-07-01 | Oscillating diode electroplating machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107541766A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108677244A (en) * | 2018-06-05 | 2018-10-19 | 陈涛 | A kind of semiconductor diode production technology |
| CN108796592A (en) * | 2018-06-05 | 2018-11-13 | 陈涛 | A kind of semiconductor diode electroplating processes system |
| CN110592634A (en) * | 2019-10-22 | 2019-12-20 | 常州顺烨电子有限公司 | Semiconductor diode electroplating treatment system |
-
2017
- 2017-07-01 CN CN201710528687.XA patent/CN107541766A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108677244A (en) * | 2018-06-05 | 2018-10-19 | 陈涛 | A kind of semiconductor diode production technology |
| CN108796592A (en) * | 2018-06-05 | 2018-11-13 | 陈涛 | A kind of semiconductor diode electroplating processes system |
| CN110592634A (en) * | 2019-10-22 | 2019-12-20 | 常州顺烨电子有限公司 | Semiconductor diode electroplating treatment system |
| CN110592634B (en) * | 2019-10-22 | 2020-10-02 | 常州顺烨电子有限公司 | Semiconductor diode electroplating treatment system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180105 |