CN107287634A - A kind of uniform diode lead electroplating machine of high-efficiency electroplating - Google Patents
A kind of uniform diode lead electroplating machine of high-efficiency electroplating Download PDFInfo
- Publication number
- CN107287634A CN107287634A CN201710518019.9A CN201710518019A CN107287634A CN 107287634 A CN107287634 A CN 107287634A CN 201710518019 A CN201710518019 A CN 201710518019A CN 107287634 A CN107287634 A CN 107287634A
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- CN
- China
- Prior art keywords
- electroplating
- axle
- shakes
- oscillator
- biography
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
The invention discloses a kind of uniform diode lead electroplating machine of high-efficiency electroplating, it is by electroplating machine body, electroplating bath, variable rheostat, hydraulic drive axle, oscillator, biography is shaken axle, vibration plating motor, shake sieve and conductive nail composition, described electroplating machine body lower end is provided with electroplating bath, plating trench bottom is provided with conductive nail, electroplating machine body upper end is provided with vibration plating motor, vibration plating motor is fixedly connected with oscillator, oscillator lower end is connected with hydraulic lifting axle upper end, hydraulic lifting axle lower end and biography the axle upper end that shakes are connected, biography shake axle lower end with shake sieve be connected, variable rheostat is installed on vibration plating motor.Beneficial effect by above-mentioned technology is using vibration electroplating machine, two oscillators, two hydraulic lifting axles and variable rheostat, lifting shaft drives the sieve motion lead that shakes not allow the flexible quality for ensureing lead from top to bottom, and electroplating thickness can be made uniform, coefficient of alteration is few, additionally it is possible to improve the velocity of rotation of vibration electroplating machine so as to improve electroplating efficiency by increasing electric current.
Description
Technical field
The present invention relates to electroplating machine field, and in particular to a kind of uniform diode lead electroplating machine of high-efficiency electroplating.
Background technology
Diode lead electroplating machine has the methods such as barrel plating formula and rack plating, and plating is applied to be influenceed nothing by factors such as shape, sizes
Method or should not fill extension finding plating, it with early stage finding plating using rack plating or basketry plating by the way of compared with, saving
Labour, improves labor productivity, and plating piece surface quality also greatly improves, and rack plating is clamping workpiece in hanger
On, suitable big part is few per a collection of product quantity that can be plated, the technique that more than 10 μm of thickness of coating.But it is electric in the prior art
The method of plating, easily bends the lead of diode, and plating thickness is uneven when plating, and diode changes system
Big unstable, the problem of the easily causing off quality of number.
The content of the invention
It is an object of the invention to provide a kind of uniform diode lead electroplating machine of high-efficiency electroplating, using vibration electroplating machine,
The mode of two oscillators and variable rheostat, lifting shaft drives diode lead when shaking sieve motion plating to be not easy from top to bottom
Bending ensures the quality of lead, and electroplating thickness can be made uniform, and coefficient of alteration is few, additionally it is possible to improve vibration by increasing electric current
The velocity of rotation of electroplating machine is so as to improve electroplating efficiency.
The technical solution adopted in the present invention is：A kind of uniform diode lead electroplating machine of high-efficiency electroplating, is by electroplating
Machine body, electroplating bath, variable rheostat, hydraulic drive axle, oscillator, biography shake axle, vibration plating motor, shake sieve and conductive nail composition,
It is characterized in that：Described electroplating machine body lower end is provided with electroplating bath, and plating trench bottom is provided with conductive nail, described plating
Machine body upper end is provided with vibration plating motor, and vibration plating motor is fixedly connected with oscillator, oscillator lower end and hydraulic pressure liter
The connection of axle upper end drops, hydraulic lifting axle lower end and biography the axle upper end that shakes be connecteds, the biography axle lower end that shakes is connected with shaking to sieve, and described vibration is electric
Variable rheostat is installed on plating motor, variable rheostat is electrically connected with the power supply.
Described conductive nail is a kind of negative electrode conductive nail, and the diode shaken in sieve is anode.
Described oscillator is provided with left oscillator and right oscillator.
The described biography axle that shakes shakes axle and right biography is shaken axle provided with left biography.
The described sieve that shakes shakes sieve provided with shake sieve and the right side of a left side.
The beneficial effects of the invention are as follows：A kind of uniform diode lead electroplating machine of high-efficiency electroplating, using vibration electroplating machine,
The mode of two oscillators and variable rheostat, lifting shaft drives diode lead when shaking sieve motion plating to be not easy from top to bottom
Bending ensures the quality of lead, and electroplating thickness can be made uniform, and coefficient of alteration is few, additionally it is possible to improve vibration by increasing electric current
The velocity of rotation of electroplating machine is so as to improve electroplating efficiency.
Brief description of the drawings
Fig. 1 is structural representation of the invention；
1- electroplating machine bodies；2- electroplating baths；A 3- left sides shake sieve；4- is left to pass the axle that shakes；The left oscillators of 5-；6- vibration plating motors；7- is right
Oscillator；8- is right to pass the axle that shakes；The 9- right sides shake sieve；10- conductive nails；The right hydraulic lifting axles of 11-；The left hydraulic lifting axles of 12-；13- variable resistances
Case；14- shakes sieve；15- passes the axle that shakes；16- hydraulic lifting axles；17- oscillators.
Embodiment
Below in conjunction with the accompanying drawings 1 and embodiment the present invention is further illustrated.
As shown in figure 1, of the invention：A kind of uniform diode lead electroplating machine of high-efficiency electroplating, be by electroplating machine body 1,
Electroplating bath 2, variable rheostat 13, hydraulic lifting axle 16, oscillator 17, pass the axle 16 that shakes, vibration plating motor 6, shake sieve 14 and conductive nail
10 compositions, it is characterised in that：The described lower end of electroplating machine body 1 is provided with electroplating bath 2, and the bottom of electroplating bath 2 is provided with conductive nail
10, the described upper end of electroplating machine body 1 is provided with vibration plating motor 6, and vibration plating motor 6 is fixedly connected with oscillator 17,
The lower end of oscillator 17 is connected with the upper end of hydraulic lifting axle 16, and the lower end of hydraulic lifting axle 16 and the biography upper end of axle 15 that shakes are connected, and biography is shaken axle
15 lower ends are connected with the sieve 14 that shakes, and install variable rheostat 13 on described vibration plating motor 6, variable rheostat 13 is electrically connected with the power supply.
Described conductive nail 10 is a kind of negative electrode conductive nail, and the diode shaken in sieve 10 is anode, and described oscillator 14 shakes provided with a left side
Swing device 5 and right oscillator 7, the biography axle 15 that shakes shakes axle 4 and right biography is shaken axle 8 provided with left biography, the sieve 14 that shakes shaken provided with a left side sieve 3 and the right side shake sieve 9,
Hydraulic lifting axle 16 is provided with left hydraulic lifting axle 12 and right hydraulic lifting axle 11.Described oscillatory type plating motor 6 works, by electricity
Oscillator 17 in machine drives biography to shake axle 15, vibration is passed to the sieve 14 that shakes, the diode shaken in sieve 14 is by vibration, to electroplate
Liquid is medium, and conductive nail 10 is in negative electrode, the ion in positively charged diode absorption electroplate liquid, so that plating work is carried out,
And oscillatory type plating motor 6 is additionally provided with variable rheostat 13, can adjust the size of electric current, improve shaking for oscillatory type plating motor 6
Dynamic frequency is so as to improve electroplating efficiency.
Certainly, above-mentioned technical proposal is the preferred forms of the present invention, under the spiritual background without departing from the present invention
Any improvement done, is within the scope of the present invention.
Claims (5)
1. a kind of uniform diode lead electroplating machine of high-efficiency electroplating, is passed by electroplating machine body, electroplating bath, variable rheostat, hydraulic pressure
Moving axis, oscillator, biography shake axle, vibration plating motor, shake sieve and conductive nail composition, it is characterised in that：Described electroplating machine body
Lower end is provided with electroplating bath, and plating trench bottom is provided with conductive nail, and described electroplating machine body upper end is provided with vibration plating electricity
Machine, vibration plating motor is fixedly connected with oscillator, and oscillator lower end is connected with hydraulic lifting axle upper end, hydraulic lifting axle lower end
Be connected with the biography axle upper end that shakes, biography shakes axle lower end and the sieve that shakes be connected, and described vibration is electroplated and variable rheostat is installed on motor, variable rheostat and
Power supply is electrically connected with.
2. the uniform diode lead electroplating machine of a kind of high-efficiency electroplating according to claim 1, it is characterised in that：Described
Conductive nail is a kind of negative electrode conductive nail, and the diode shaken in sieve is anode.
3. the uniform diode lead electroplating machine of a kind of high-efficiency electroplating according to claim 1, it is characterised in that：Described
Oscillator is provided with left oscillator and right oscillator.
4. the uniform diode lead electroplating machine of a kind of high-efficiency electroplating according to claim 1, it is characterised in that：Described
The biography axle that shakes shakes axle and right biography is shaken axle provided with left biography.
5. the uniform diode lead electroplating machine of a kind of high-efficiency electroplating according to claim 1, it is characterised in that：Described
The sieve that shakes shakes sieve provided with shake sieve and the right side of a left side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710518019.9A CN107287634A (en) | 2017-06-29 | 2017-06-29 | A kind of uniform diode lead electroplating machine of high-efficiency electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710518019.9A CN107287634A (en) | 2017-06-29 | 2017-06-29 | A kind of uniform diode lead electroplating machine of high-efficiency electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107287634A true CN107287634A (en) | 2017-10-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710518019.9A Pending CN107287634A (en) | 2017-06-29 | 2017-06-29 | A kind of uniform diode lead electroplating machine of high-efficiency electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107287634A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110965096A (en) * | 2020-01-06 | 2020-04-07 | 台州市椒江南屯电子有限公司 | Semiconductor lead electroplating equipment |
-
2017
- 2017-06-29 CN CN201710518019.9A patent/CN107287634A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110965096A (en) * | 2020-01-06 | 2020-04-07 | 台州市椒江南屯电子有限公司 | Semiconductor lead electroplating equipment |
| CN110965096B (en) * | 2020-01-06 | 2020-11-27 | 泰州市昶宇电气科技有限公司 | Semiconductor lead electroplating equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171024 |