CN107630245A - A kind of electroplating circuit board for improving electroplating quality has with plating smelting - Google Patents
A kind of electroplating circuit board for improving electroplating quality has with plating smelting Download PDFInfo
- Publication number
- CN107630245A CN107630245A CN201710897516.4A CN201710897516A CN107630245A CN 107630245 A CN107630245 A CN 107630245A CN 201710897516 A CN201710897516 A CN 201710897516A CN 107630245 A CN107630245 A CN 107630245A
- Authority
- CN
- China
- Prior art keywords
- fixed
- plating
- electroplating
- smelting
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Have the invention discloses a kind of electroplating circuit board for improving electroplating quality with plating smelting, has body including smelting, the smelting tool body interior is provided with electroplate liquid, iron plating is fixed with by fixed mount on the smelting tool body interior both sides table wall, air agitator is provided with the smelting tool body bottom portion center, L-type support is fixed with the smelting tool bodies top center, dc source is fixed with the top of the L bracket, the preceding surface of the dc source is provided with control button, positive terminal and negative terminal, the L bracket bottom is fixed with hanger by YQ telescopic cylinders, anode is nested and fixed in the iron plating outer surface.In the present invention, the plating smelting tool of the electroplating circuit board is symmetrically arranged with two iron platings in smelting tool body interior both sides first, improve its electroplating efficiency, it is easy to hanger both sides fixing circuit board electroplating velocity consistent, secondly it is socketed with anode on iron plating, for the earth of positive pole caused by collection plating, anode sludge-polluted electroplate liquid is prevented.
Description
Technical field
The present invention relates to plating smelting tool technical field, more particularly to a kind of electroplating circuit board plating for improving electroplating quality
Smelting has.
Background technology
During plating, coated metal or other insoluble materials do anode, and workpiece to be plated does negative electrode, the sun of coated metal from
Son is reduced to form coating in workpiece surface to be plated.To exclude the interference of other cations, and coating is set uniformly, firmly to need to use
The solution of the cation containing coated metal cooks electroplate liquid, to keep the concentration of coated metal cation constant.The purpose of plating be
The coat of metal is plated on base material, changes substrate surface property or size.Plating can strengthen the corrosion resistance of metal, and (coated metal is more
Using corrosion resistant metal), increase hardness, prevent from wearing away, improve electric conductivity, slickness, heat resistance and surface aesthetic.
But the plating smelting of existing electroplating circuit board tool is in use there is in place of some shortcomings, typically
A mostly iron plating, plating volume speed is slower, and secondly electroplate liquid lacks corresponding stirring and set, and causes the quality of plating not
It is high.
The content of the invention
The invention aims to solve shortcoming present in prior art, and a kind of raising electroplating quality proposed
Electroplating circuit board has with plating smelting.
To achieve these goals, present invention employs following technical scheme：A kind of plating circuit for improving electroplating quality
Plate has with plating smelting, including smelting tool body, and the smelting tool body interior is provided with electroplate liquid, the smelting tool body interior both sides table
Iron plating is fixed with by fixed mount on wall, air agitator is provided with the smelting tool body bottom portion center, the smelting tool is originally
L-type support is fixed with body top center, dc source, the preceding surface of the dc source are fixed with the top of the L bracket
Control button, positive terminal and negative terminal are provided with, the L bracket bottom is fixed with extension by YQ- telescopic cylinders
Frame, grip block is fixed with the hanger, anode is nested and fixed in the iron plating outer surface, and the grip block passes through fixation
Bolt is fixed with auxiliary clamping plate.
As further describing for above-mentioned technical proposal：
The positive terminal is provided with two altogether, and two positive terminals are symmetricly set on negative terminal or so two
Side.
As further describing for above-mentioned technical proposal：
Described two iron platings are fixedly connected with two positive terminals respectively by wire.
As further describing for above-mentioned technical proposal：
The hanger is fixedly connected by wire with negative terminal.
As further describing for above-mentioned technical proposal：
The grip block is provided with six altogether, and six grip blocks are equidistantly fixed on the effect two of hanger by connecting rod
Side.
In the present invention, the plating smelting tool of the electroplating circuit board is symmetrically arranged with two in smelting tool body interior both sides first
Iron plating, its electroplating efficiency is improved, the circuit board electroplating speed for being easy to hanger both sides to fix is consistent, is secondly socketed on iron plating
There is anode, for the earth of positive pole caused by collection plating, prevent anode sludge-polluted electroplate liquid, be additionally provided with air agitator,
For stirring the cation inside electroplate liquid, the quality of its plating is improved, last hanger is fixed on L-shaped by YQ- telescopic cylinders
On support, the height of hanger can be adjusted by the lifting of YQ- telescopic cylinders, it is convenient that circuit board is carried out by hanger
Fixed and taking-up, the liquid level that can also have body interior electroplate liquid according to smelting adjust the height of hanger, further improve what is electroplated
Quality.
Brief description of the drawings
Fig. 1 is the structural representation that a kind of electroplating circuit board for improving electroplating quality proposed by the present invention electroplates smelting tool；
Fig. 2 is the structural representation of iron plating of the present invention；
Fig. 3 is the structural representation of grip block of the present invention.
Marginal data：
1- smeltings tool body, 2- fixed mounts, 3- iron platings, 4- electroplate liquids, 5- air agitators, 6-L types support, 7- direct currents
Source, 8- control buttons, 9- negative terminals, 10- positive terminals, 11-YQ- telescopic cylinders, 12- hangers, 13- grip blocks, 14-
Anode, 15- auxiliary clamping plate, 16- fixing bolts.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.
Reference picture 1-3, a kind of electroplating circuit board for improving electroplating quality use plating smelting to have, including smelting tool body 1, and smelting tool is originally
Body 1 is internally provided with electroplate liquid 4, and smelting has is fixed with iron plating 3, smelting tool body on the inside both sides table wall of body 1 by fixed mount 2
Air agitator 5 is provided with 1 bottom centre, L-type support 6 is fixed with the smelting tool top center of body 1, the top of L bracket 6 is solid
Surely there is dc source 7, the preceding surface of dc source 7 is provided with control button 8, positive terminal 10 and negative terminal 9, L-shaped
The bottom of support 6 is fixed with hanger 12 by YQ- telescopic cylinders 11, and grip block 13, the appearance surface cover of iron plating 3 are fixed with hanger 12
Connect and be fixed with anode 14, grip block 13 is fixed with auxiliary clamping plate 15 by fixing bolt 16.
Positive terminal 10 is provided with two altogether, and two positive terminals 10 are symmetricly set on negative terminal 9 or so
Both sides, two iron platings 3 are fixedly connected with two positive terminals 10 respectively by wire, and hanger 12 is connect by wire and negative pole
Terminal 9 is fixedly connected, and grip block 13 is provided with six altogether, and six grip blocks 13 are equidistantly fixed on hanger 12 by connecting rod
Act on both sides.
Operation principle：In use, circuit board is fixed on hanger 12 by grip block 13 and auxiliary clamping plate 15 first, so
Declined afterwards by YQ- telescopic cylinders 11, circuit board fixed on hanger 12 is placed in the electroplate liquid 4 inside smelting tool body 1, this
When dc source 7 opened by control button 8 on dc source 7, now can to carry out carrying out electroplating activity to circuit board,
During plating, air agitator 5 can be opened, electroplate liquid 4 is stirred, improves the quality of plating, after the completion of plating,
Control YQ- telescopic cylinders 11 that hanger 12 is lifted out into smelting tool body 1 again, circuit board is taken out from hanger 12, whole device is complete
Operation.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (5)
1. a kind of electroplating circuit board for improving electroplating quality has with plating smelting, including smelting tool body (1), it is characterised in that described
Smelting tool body (1) is internally provided with electroplate liquid (4), is fixed on the internal both sides table wall of smelting tool body (1) by fixed mount (2)
There is iron plating (3), air agitator (5), smelting tool body (1) top are provided with described smelting tool body (1) bottom centre
L-type support (6) is fixed with center, dc source (7) is fixed with the top of the L bracket (6), the dc source (7)
Preceding surface is provided with control button (8), positive terminal (10) and negative terminal (9), and L bracket (6) bottom passes through
YQ- telescopic cylinders (11) are fixed with hanger (12), grip block (13) are fixed with the hanger (12), the iron plating (3) is outside
Anode (14) is nested and fixed in surface, and the grip block (13) is fixed with auxiliary clamping plate (15) by fixing bolt (16).
2. a kind of electroplating circuit board for improving electroplating quality according to claim 1 has with plating smelting, it is characterised in that institute
State positive terminal (10) and be provided with two altogether, and two positive terminals (10) are symmetricly set on negative terminal (9) left and right
Both sides.
3. a kind of electroplating circuit board of raising electroplating quality according to claim 1 and 2 has with plating smelting, its feature exists
In described two iron platings (3) are fixedly connected with two positive terminals (10) respectively by wire.
4. a kind of electroplating circuit board for improving electroplating quality according to claim 1 has with plating smelting, it is characterised in that institute
Hanger (12) is stated to be fixedly connected with negative terminal (9) by wire.
5. a kind of electroplating circuit board for improving electroplating quality according to claim 1 has with plating smelting, it is characterised in that institute
State grip block (13) and be provided with six altogether, and six grip blocks (13) are equidistantly fixed on the effect two of hanger (12) by connecting rod
Side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710897516.4A CN107630245A (en) | 2017-09-28 | 2017-09-28 | A kind of electroplating circuit board for improving electroplating quality has with plating smelting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710897516.4A CN107630245A (en) | 2017-09-28 | 2017-09-28 | A kind of electroplating circuit board for improving electroplating quality has with plating smelting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107630245A true CN107630245A (en) | 2018-01-26 |
Family
ID=61102867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710897516.4A Withdrawn CN107630245A (en) | 2017-09-28 | 2017-09-28 | A kind of electroplating circuit board for improving electroplating quality has with plating smelting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107630245A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513448A (en) * | 2018-04-23 | 2018-09-07 | 苏州普瑞得电子有限公司 | A kind of computer circuit board electroplate jig |
| CN108691006A (en) * | 2018-08-31 | 2018-10-23 | 高益群 | A kind of electroplanting device |
| CN116377546A (en) * | 2023-06-02 | 2023-07-04 | 昆山永生涂装有限公司 | Electroplating equipment |
-
2017
- 2017-09-28 CN CN201710897516.4A patent/CN107630245A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513448A (en) * | 2018-04-23 | 2018-09-07 | 苏州普瑞得电子有限公司 | A kind of computer circuit board electroplate jig |
| CN108513448B (en) * | 2018-04-23 | 2023-12-15 | 苏州普瑞得电子有限公司 | Circuit board electroplating jig for computer |
| CN108691006A (en) * | 2018-08-31 | 2018-10-23 | 高益群 | A kind of electroplanting device |
| CN116377546A (en) * | 2023-06-02 | 2023-07-04 | 昆山永生涂装有限公司 | Electroplating equipment |
| CN116377546B (en) * | 2023-06-02 | 2023-12-08 | 昆山永生涂装有限公司 | Electroplating equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107630245A (en) | A kind of electroplating circuit board for improving electroplating quality has with plating smelting | |
| CN207919004U (en) | A kind of plating smelting tool of electroplating circuit board | |
| CN208995626U (en) | A kind of internal and external anode rack plating apparatus of rotatable cathode | |
| CN202626337U (en) | Special hanging tool for electroplating long-rod workpiece | |
| CN206580909U (en) | Anode titanium basket for electroplating | |
| CN109321951B (en) | A kind of preparation method of the high-strength high-conductivity copper based nano composite material based on plating | |
| CN214168183U (en) | Metal electroplating device | |
| CN208087778U (en) | Plating 3D rocking equipments | |
| CN209128576U (en) | A kind of electroplating device | |
| CN206654963U (en) | A kind of electroplating connecting rods baffle plate | |
| CN205241839U (en) | Integration formula stopper braking piston hard chrome plating hanger | |
| CN208933519U (en) | A kind of barrel plating bright nickel device | |
| CN208235016U (en) | A kind of full-automatic hang plating production line | |
| CN209989489U (en) | Auxiliary cathode hanger | |
| CN208218984U (en) | The liftable electroplanting device of station | |
| CN208666867U (en) | A kind of hanger | |
| CN110656367A (en) | Suspension bracket for electroplating | |
| CN109023490A (en) | Polished rod bolt electroplating tooling fixture | |
| CN206902270U (en) | A kind of hardware electroplating machine | |
| CN1300384C (en) | Method and apparatus for electroplating | |
| CN216237329U (en) | Electroplating processing device for hardware plate | |
| CN217579114U (en) | Portable electroplating device | |
| CN108950661A (en) | A kind of electroplating device | |
| CN215517698U (en) | Electroplating device for repairing printed circuit board | |
| CN221254751U (en) | Electroplating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180126 |
|
| WW01 | Invention patent application withdrawn after publication |