CN110592634B - Semiconductor diode electroplating treatment system - Google Patents

Semiconductor diode electroplating treatment system Download PDF

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Publication number
CN110592634B
CN110592634B CN201911005805.4A CN201911005805A CN110592634B CN 110592634 B CN110592634 B CN 110592634B CN 201911005805 A CN201911005805 A CN 201911005805A CN 110592634 B CN110592634 B CN 110592634B
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electroplating
fixed
pipe
fixedly connected
servo motor
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CN110592634A (en
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江俊
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Jiangsu shunye Electronic Co.,Ltd.
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Changzhou Shunye Electronic Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/22—Apparatus for electrolytic coating of small objects in bulk having open containers
    • C25D17/26—Oscillating baskets
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Abstract

The invention discloses a semiconductor diode electroplating treatment system which comprises an electroplating pool, wherein a conductive nail is fixedly arranged on an inner bottom wall pipe of the electroplating pool, supporting plates are fixedly connected to the surface of the electroplating pool, and the two supporting plates are symmetrically distributed by taking the axis of the electroplating pool as the center. This semiconductor diode electroplating treatment system, through setting up electric telescopic handle, first servo motor and second servo motor all pass through the electric wire and can compile PLC controller electric connection, when electroplating, can compile PLC controller automatic control electroplating time, after electroplating the completion, can compile PLC controller automatic control second servo motor reversal, drive screwed pipe upward movement, drive electroplating box and electroplating pool separation, automatic control first servo motor and electric telescopic handle stop work simultaneously, thereby solved operating personnel and needed always by the electroplating machine, cause the extravagant problem of manpower resources to wait, the effect of using manpower resources sparingly and improvement work efficiency has been reached.

Description

Semiconductor diode electroplating treatment system
Technical Field
The invention relates to the technical field of semiconductor diodes, in particular to a semiconductor diode electroplating treatment system.
Background
A semiconductor diode refers to a two-terminal electronic device that utilizes semiconductor characteristics. The most common semiconductor diodes are PN junction diodes and metal semiconductor contact diodes. They have in common the asymmetry of the current-voltage characteristic, i.e. the current exhibits a good conductivity in one direction and a high resistance in the opposite direction. Can be used for rectification, wave detection, voltage stabilization, constant current, variable capacitance, switching, luminescence, photoelectric conversion and the like. The tunnel diode of ultrahigh frequency amplification or ultrahigh speed switch can be made by using the tunnel effect of carriers in the highly doped PN junction.
The diode lead electroplating machine has the methods of barrel plating, rack plating and the like, the barrel plating is suitable for electroplating small parts which cannot be or are not suitable to be hung under the influence of factors such as shape, size and the like, compared with the method of rack plating or basket plating adopted by the early small part electroplating, the barrel plating saves labor force, improves labor production efficiency, greatly improves the surface quality of plated parts, and is a process that workpieces are clamped on a rack, the barrel plating is suitable for large parts, the number of products which can be plated in each batch is small, and the plating thickness is more than 10 mu m. However, in the electroplating method in the prior art, the diode lead enters the electroplating bath for electroplating through the electroplating box or the vibrating screen, the position of the electroplating box or the vibrating screen in the electroplating bath is fixed, so that the thickness of the electroplating layer is not uniform during electroplating, manual whole-process control is performed in the electroplating process, and in the diode lead electroplating process, an operator needs to wait beside the electroplating machine all the time, so that the problem of manpower resource waste is caused.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a semiconductor diode electroplating treatment system which has the characteristics of saving human resources and enabling diode electroplating to be more uniform.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a semiconductor diode electroplating treatment system, includes the electroplating bath, and the interior diapire wall pipe fixed mounting of electroplating bath has electrically conductive nail, and the fixed surface of electroplating bath is connected with the backup pad, and two backup pads use the axis of electroplating bath to be the symmetric distribution as the center, and the top fixedly connected with install bin of backup pad, the inner wall fixedly connected with drive arrangement of install bin, drive arrangement include fixing bearing, and two fixing bearing use the axis of install bin to be the symmetric distribution as the center.
The fixed surface of backup pad is connected with the fixed plate, and the fixed surface of fixed plate installs electric telescopic handle, and electric telescopic handle's one end fixedly connected with push rod, the spout has been seted up to the fixed surface of backup pad, the both ends of push rod all with the inner wall sliding connection of spout.
Furthermore, a first servo motor is fixedly mounted on the inner wall of the mounting box, a rotating shaft is fixedly connected to the inner ring of the fixed bearing, one end of the rotating shaft is fixedly connected with an output shaft of the first servo motor through a coupler, a mounting pipe is connected to the surface of the rotating shaft in a threaded manner, the surface of the mounting pipe is rectangular, and the surface of the mounting pipe is slidably connected with the inner wall of the mounting box;
through above-mentioned technical scheme, the surface of installation pipe is the rectangle form, and with the inner wall sliding connection of install bin, has when pivot screw thread rotates the installation pipe, guarantees that the installation pipe can carry out the horizontal direction motion, can not appear following the pivot and carry out the characteristics of circumferential motion, and the connection of the stationary mast of being convenient for is fixed.
Furthermore, a stroke groove is fixedly formed in the inner bottom wall of the installation box, one end of the stroke groove extends to the surface of the installation box, fixed columns are fixedly connected to the surface of the installation tube, the four fixed columns are symmetrically distributed by taking the axis of the installation tube as the center, connecting springs are fixedly sleeved on the surfaces of the fixed columns, and one ends of the connecting springs extend to the surface of the installation box through the stroke groove;
through above-mentioned technical scheme, coupling spring has the flexibility when increasing installation pipe and fixed union coupling, when guaranteeing push rod and fixed pipe contact promotion, fixed pipe can produce the effect of rocking.
Furthermore, a connecting column is fixedly connected to the inner wall of the connecting spring, a fixing tube is fixedly connected to one end of the connecting column, a first travel switch and a second travel switch are fixedly mounted on the lower surface of the mounting box respectively, and the first travel switch and the second travel switch are electrically connected with the first servo motor through electric wires;
through the technical scheme, the first travel switch and the second travel switch have the characteristic of automatically controlling the forward and reverse rotation of the first servo motor to drive the electroplating box to reciprocate.
Furthermore, the surface of the fixed pipe is fixedly connected with baffle plates, the two baffle plates respectively correspond to the first travel switch and the second travel switch, the inner wall of the fixed pipe is fixedly provided with a second servo motor, the inner wall of the fixed pipe is fixedly provided with a stop limiting groove, the inner top wall and the inner bottom wall of the stop limiting groove are respectively fixedly provided with a first limit switch and a second limit switch, and the first limit switch and the second limit switch are both electrically connected with the second servo motor through electric wires;
through the technical scheme, the first limit switch and the second limit switch have the effect of automatically controlling the second servo motor to stop rotating forward and backward.
Furthermore, a programmable PLC controller is fixedly installed on the surface of the supporting plate, the electric telescopic rod, the first servo motor and the second servo motor are electrically connected with the programmable PLC controller through electric wires, and an output shaft of the second servo motor is fixedly connected with a threaded rod through a coupler;
through the technical scheme, the programmable PLC controller has the effect of automatically controlling the first servo motor, the electric telescopic rod and the second servo motor to work and stop.
Furthermore, the surface of the threaded rod is in threaded connection with a threaded pipe, the surface of the threaded pipe is in sliding connection with the inner wall of the fixed pipe, the surface of the threaded pipe is fixedly connected with a limiting block, and the surface of the limiting block is in sliding connection with the inner wall of the stopping limiting groove;
through above-mentioned technical scheme, stopper and locking spacing groove cooperation have and prevent the screwed pipe, carry out circumferential motion under the screw thread of threaded rod rotates, keep the characteristics of vertical motion from top to bottom.
Furthermore, one end of the threaded pipe extends to the surface of the fixed pipe, one end of the threaded pipe is fixedly connected with a connecting plate, and the lower surface of the connecting plate is fixedly connected with a steel wire rope;
through above-mentioned technical scheme, the connecting plate has the characteristics of being convenient for install wire rope.
Furthermore, the four steel wire ropes are symmetrically distributed by taking the axis of the connecting plate as the center, and one end of each steel wire rope is fixedly connected with an electroplating box;
through above-mentioned technical scheme, wire rope is connected with the electroplating box, when avoiding push rod and fixed pipe contact to promote, the electroplating box produces great rocking, guarantees its characteristics of carrying out the less rocking of range in the electroplating bath.
Furthermore, through holes are fixedly formed in the surface of the electroplating box, a plurality of through holes are uniformly distributed in the surface of the electroplating box, stirring spines are fixedly connected to the surface of the electroplating box, the stirring spines are uniformly distributed in the surface of the electroplating box, and the surface of each stirring spine is in a triangular pyramid shape;
through above-mentioned technical scheme, the stirring thorn has the effect of stirring the plating solution and puncturing the bubble in the plating solution.
In conclusion, the invention has the following beneficial effects:
1. through setting up drive arrangement, first servo motor drives fixed pipe and electroplating box horizontal direction reciprocating motion, and second servo motor drives the electroplating box and gets into to electroplate the diode in the electroplating bath, and the electroplating in-process, electroplating box horizontal direction reciprocating motion in the electroplating bath, electric telescopic handle drive the fixed pipe vibrations of push rod promotion, drive the electroplating box and rock in the electroplating bath to have the characteristics that reach more even electroplating effect.
2. Through setting up electric telescopic handle, first servo motor and second servo motor all pass through the electric wire and can compile PLC controller electric connection, when electroplating, can compile PLC controller automatic control and electroplate time, after electroplating the completion, can compile PLC controller automatic control second servo motor reversal, drive screwed pipe upward movement, drive electroplating box and electroplating pool separation, automatic control first servo motor and electric telescopic handle stop work simultaneously, thereby it needs to wait by the electroplating machine always to have solved operating personnel, cause the extravagant problem of manpower resources, the effect of using manpower resources sparingly and improvement work efficiency has been reached.
3. The utility model discloses a electroplating tank, including electroplating tank, electric telescopic handle, stirring thorn, a plurality of stirring thorn and electric telescopic handle, the fixed surface that sets up electroplating tank stirs the thorn, and a plurality of stirring thorn are at electroplating tank's surperficial evenly distributed, and when using, electroplating tank horizontal direction reciprocating motion in electroplating tank, and promote electroplating tank through electric telescopic handle and rock, and the stirring thorn on electroplating tank surface has and stirs the plating solution in the electroplating tank, and punctures the bubble in the plating solution, reaches better electroplating effect.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the structure of FIG. 1 at A according to the present invention;
FIG. 3 is a sectional view of the structure of the plating bath according to the present invention;
FIG. 4 is a perspective view of the structure of the electroplating tank of the present invention;
FIG. 5 is a perspective view of a stationary tube structure according to the present invention;
FIG. 6 is a perspective view of the structure of the electroplating tank of the present invention.
In the figure: 1. an electroplating pool; 2. a conductive nail; 3. a support plate; 4. installing a box; 5. fixing the bearing; 6. a fixing plate; 7. an electric telescopic rod; 8. a chute; 9. a first servo motor; 10. a rotating shaft; 11. installing a pipe; 12. a stroke slot; 13. fixing a column; 14. a connecting spring; 15. connecting columns; 16. a fixed tube; 17. a first travel switch; 18. a second travel switch; 19. a baffle plate; 20. a second servo motor; 21. a stop limit groove; 22. a first limit switch; 23. a second limit switch; 24. a PLC controller can be programmed; 25. a threaded rod; 26. a threaded pipe; 27. a limiting block; 28. a connecting plate; 29. a wire rope; 30. electroplating box; 31. a through hole; 32. the thorn is agitated.
Detailed Description
Example (b):
the invention is described in further detail below with reference to figures 1-6.
A semiconductor diode electroplating treatment system comprises an electroplating pool 1, wherein a conductive nail 2 is fixedly installed on an inner bottom wall pipe of the electroplating pool 1, supporting plates 3 are fixedly connected to the surface of the electroplating pool 1, the two supporting plates 3 are symmetrically distributed by taking the axis of the electroplating pool 1 as the center, an installation box 4 is fixedly connected to the top of each supporting plate 3, a driving device is fixedly connected to the inner wall of the installation box 4, each driving device comprises a fixed bearing 5, and the two fixed bearings 5 are symmetrically distributed by taking the axis of the installation box 4 as the center;
as shown in fig. 3, a fixing plate 6 is fixedly connected to the surface of the supporting plate 3, an electric telescopic rod 7 is fixedly mounted on the surface of the fixing plate 6, one end of the electric telescopic rod 7 is fixedly connected with a push rod, a sliding groove 8 is fixedly formed in the surface of the supporting plate 3, and both ends of the push rod are slidably connected with the inner wall of the sliding groove 8;
as shown in fig. 1-4, a first servo motor 9 is fixedly installed on the inner wall of an installation box 4, a rotating shaft 10 is fixedly connected to an inner ring of a fixed bearing 5, one end of the rotating shaft 10 is fixedly connected to an output shaft of the first servo motor 9 through a coupler, an installation pipe 11 is connected to the surface of the rotating shaft 10 in a threaded manner, the surface of the installation pipe 11 is rectangular, the surface of the installation pipe 11 is slidably connected to the inner wall of the installation box 4, a stroke groove 12 is fixedly formed in the inner bottom wall of the installation box 4, one end of the stroke groove 12 extends to the surface of the installation box 4, fixed columns 13 are fixedly connected to the surface of the installation pipe 11, four fixed columns 13 are symmetrically distributed around the axis of the installation pipe 11, a connecting spring 14 is fixedly sleeved on the surface of each fixed column 13, and one end of the connecting spring 14 extends to;
as shown in fig. 1 to 4, a connecting column 15 is fixedly connected to an inner wall of a connecting spring 14, a fixing tube 16 is fixedly connected to one end of the connecting column 15, a first travel switch 17 and a second travel switch 18 are respectively and fixedly installed on a lower surface of the installation box 4, the first travel switch 17 and the second travel switch 18 are both electrically connected to the first servo motor 9 through electric wires, a baffle 19 is fixedly connected to a surface of the fixing tube 16, the two baffles 19 respectively correspond to the first travel switch 17 and the second travel switch 18, a second servo motor 20 is fixedly installed on an inner wall of the fixing tube 16, a stop limiting groove 21 is fixedly formed in the inner wall of the fixing tube 16, a first limit switch 22 and a second limit switch 23 are respectively and fixedly installed on an inner top wall and an inner bottom wall of the stop limiting groove 21, and the first limit switch 22 and the second limit switch 23 are both electrically connected to the second servo motor 20 through electric wires;
as shown in fig. 1, 4-6, the programmable PLC controller 24, the electric telescopic rod 7, the first servo motor 9 and the second servo motor 20 are electrically connected with the programmable PLC 24 through electric wires, an output shaft of the second servo motor 20 is fixedly connected with a threaded rod 25 through a coupler, the surface of the threaded rod 25 is in threaded connection with a threaded pipe 26, the surface of the threaded pipe 26 is in sliding connection with the inner wall of the fixed pipe 16, the surface of the threaded pipe 26 is fixedly connected with a limiting block 27, the surface of the limiting block 27 is in sliding connection with the inner wall of the stop limiting groove 21, one end of the threaded pipe 26 extends to the surface of the fixed pipe 16, one end of the threaded pipe 26 is fixedly connected with a connecting plate 28, the lower surface of the connecting plate 28 is fixedly connected with steel wire ropes 29, the four steel wire ropes 29 are symmetrically distributed by taking the axis of the connecting plate 28 as the center, and;
as shown in fig. 6, through holes 31 are fixedly formed in the surface of the electroplating tank 30, a plurality of through holes 31 are uniformly distributed on the surface of the electroplating tank 30, stirring spines 32 are fixedly connected to the surface of the electroplating tank 30, a plurality of stirring spines 32 are uniformly distributed on the surface of the electroplating tank 30, and the surface of each stirring spine 32 is in a triangular pyramid shape;
through the arrangement of the driving device, the first servo motor 9 drives the fixed pipe 16 and the electroplating box 30 to reciprocate horizontally, the second servo motor 20 drives the electroplating box 30 to enter the electroplating pool 1 to electroplate the diode, in the electroplating process, the electroplating box 30 reciprocates horizontally in the electroplating pool 1, the electric telescopic rod 7 drives the push rod to push the fixed pipe 16 to vibrate and drive the electroplating box 30 to shake in the electroplating pool 1, and therefore the diode electroplating device has the characteristic of achieving a more uniform electroplating effect;
by arranging the electric telescopic rod 7, the first servo motor 9 and the second servo motor 20 which are electrically connected with the programmable PLC controller 24 through electric wires, the programmable PLC controller 24 automatically controls the electroplating time during electroplating, and after electroplating is finished, the programmable PLC controller 24 automatically controls the second servo motor 20 to rotate reversely to drive the threaded pipe 26 to move upwards to drive the electroplating box 30 to be separated from the electroplating pool 1, and simultaneously automatically controls the first servo motor 9 and the electric telescopic rod 7 to stop working, so that the problem that an operator needs to wait beside the electroplating machine all the time to cause waste of human resources is solved;
the fixed surface through setting up electroplating tank 30 is connected with stirs thorn 32, a plurality of stir thorn 32 in electroplating tank 30's surperficial evenly distributed, when using, electroplating tank 30 horizontal direction reciprocating motion in electroplating pool 1, and it rocks to promote electroplating tank 30 through electric telescopic handle 7, the stirring on electroplating tank 30 surface pricks 32 in electroplating pool 1, the plating solution that has in the electroplating pool 1 stirs, and prick the bubble in the plating solution, reach better electroplating effect.
The working principle is as follows: when the diode electroplating device is used, the diode is placed in the electroplating tank 30, the PLC 24 is used for controlling and starting the first servo motor 9, the electric telescopic rod 7 and the second servo motor 20, the output shaft of the second servo motor 20 drives the threaded rod 25 to rotate through the coupler, the threaded rod 25 rotates the threaded pipe 26 in a threaded mode, the threaded pipe 26 moves downwards and extends out of the fixed pipe 16 under the matching of the limiting block 27 and the stop limiting groove 21, the threaded pipe 26 moves downwards to drive the connecting plate 28 and the electroplating tank 30 to enter the electroplating tank 1, after the surface of the limiting block 27 is contacted with the second limiting switch 23, the second servo motor 20 pauses, and the diode is electroplated in the electroplating tank 1; an output shaft of the first servo motor 9 drives the rotating shaft 10 to rotate through the coupler, threads of the rotating shaft 10 drive the mounting pipe 11 to move, the mounting pipe 11 drives the fixed column 13 and the fixed pipe 16 to move in the horizontal direction, when the mounting pipe 11 drives the fixed pipe 16 and the baffle plate 19 to move horizontally and contact with the first travel switch 17, the first servo motor 9 rotates reversely to drive the fixed pipe 16 and the electroplating box 30 to move horizontally in the electroplating pool 1 in the reverse direction, and after the baffle plate 19 contacts with the second travel switch 18, the first servo motor 9 rotates forwards again to drive the electroplating box 30 to move back and forth in the electroplating pool 1 in the horizontal direction; the electric telescopic rod 7 drives the push rod to slide on the inner wall of the sliding groove 8 under the control of the programmable PLC 24, the surface of the push rod is in contact with the surface of the fixed pipe 16, the fixed pipe 16 is pushed to vibrate, and the electroplating box 30 is driven to rock in the electroplating pool 1.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.

Claims (7)

1. A semiconductor diode electroplating treatment system comprises an electroplating pool (1), and is characterized in that: the electroplating device is characterized in that conductive nails (2) are fixedly arranged on an inner bottom wall pipe of the electroplating pool (1), supporting plates (3) are fixedly connected to the surface of the electroplating pool (1), the two supporting plates (3) are symmetrically distributed by taking the axis of the electroplating pool (1) as the center, an installation box (4) is fixedly connected to the top of each supporting plate (3), a driving device is fixedly connected to the inner wall of the installation box (4), the driving device comprises fixed bearings (5), and the two fixed bearings (5) are symmetrically distributed by taking the axis of the installation box (4) as the center;
the surface of the supporting plate (3) is fixedly connected with a fixing plate (6), the surface of the fixing plate (6) is fixedly provided with an electric telescopic rod (7), one end of the electric telescopic rod (7) is fixedly connected with a push rod, the surface of the supporting plate (3) is fixedly provided with a sliding groove (8), and two ends of the push rod are both connected with the inner wall of the sliding groove (8) in a sliding manner;
a first servo motor (9) is fixedly mounted on the inner wall of the mounting box (4), a rotating shaft (10) is fixedly connected to the inner ring of the fixed bearing (5), one end of the rotating shaft (10) is fixedly connected with an output shaft of the first servo motor (9) through a coupler, a mounting pipe (11) is in threaded connection with the surface of the rotating shaft (10), the surface of the mounting pipe (11) is rectangular, and the surface of the mounting pipe (11) is in sliding connection with the inner wall of the mounting box (4);
a stroke groove (12) is fixedly formed in the inner bottom wall of the installation box (4), one end of the stroke groove (12) extends to the surface of the installation box (4), fixed columns (13) are fixedly connected to the surface of the installation pipe (11), the four fixed columns (13) are symmetrically distributed by taking the axis of the installation pipe (11) as the center, a connecting spring (14) is fixedly sleeved on the surface of each fixed column (13), and one end of each connecting spring (14) extends to the surface of the installation box (4) through the stroke groove (12);
the inner wall fixedly connected with spliced pole (15) of connecting spring (14), the fixed pipe of one end fixedly connected with (16) of spliced pole (15), the lower surface of install bin (4) is fixed mounting respectively has first travel switch (17) and second travel switch (18), first travel switch (17) and second travel switch (18) are all through electric wire and first servo motor (9) electric connection.
2. The semiconductor diode plating processing system of claim 1, wherein: fixed surface of fixed pipe (16) is connected with baffle (19), two baffle (19) are corresponding with first travel switch (17) and second travel switch (18) respectively, the inner wall fixed mounting of fixed pipe (16) has second servo motor (20), the inner wall of fixed pipe (16) is fixed and has been seted up locking spacing groove (21), the interior roof and the interior diapire of locking spacing groove (21) are fixed mounting respectively has first limit switch (22) and second limit switch (23), first limit switch (22) and second limit switch (23) are all through electric wire and second servo motor (20) electric connection.
3. The semiconductor diode plating processing system of claim 2, wherein: the surface fixed mounting of backup pad (3) has PLC controller (24) can compile, electric telescopic handle (7), first servo motor (9) and second servo motor (20) all through the electric wire with can compile PLC controller (24) electric connection, the output shaft of second servo motor (20) passes through shaft coupling fixedly connected with threaded rod (25).
4. The semiconductor diode plating processing system of claim 3, wherein: the surface threaded connection of threaded rod (25) has screwed pipe (26), the surface of screwed pipe (26) and the inner wall sliding connection of fixed pipe (16), the fixed surface of screwed pipe (26) is connected with stopper (27), the surface of stopper (27) and the inner wall sliding connection of locking spacing groove (21).
5. The semiconductor diode plating processing system of claim 4, wherein: one end of the threaded pipe (26) extends to the surface of the fixed pipe (16), one end of the threaded pipe (26) is fixedly connected with a connecting plate (28), and the lower surface of the connecting plate (28) is fixedly connected with a steel wire rope (29).
6. The semiconductor diode plating processing system of claim 5, wherein: the four steel wire ropes (29) are symmetrically distributed by taking the axis of the connecting plate (28) as the center, and one ends of the steel wire ropes (29) are fixedly connected with electroplating boxes (30).
7. The semiconductor diode plating processing system of claim 6, wherein: the surface of the electroplating box (30) is fixed and provided with a plurality of through holes (31), the through holes (31) are uniformly distributed on the surface of the electroplating box (30), the surface of the electroplating box (30) is fixedly connected with stirring thorns (32), the stirring thorns (32) are uniformly distributed on the surface of the electroplating box (30), and the surface of the stirring thorns (32) is in a triangular pyramid shape.
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CN111215716B (en) * 2020-02-18 2022-03-18 江苏工程职业技术学院 Automatic tin soldering device for circuit board
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107541766A (en) * 2017-07-01 2018-01-05 张晓宇 Oscillating diode electroplating machine
CN108796592A (en) * 2018-06-05 2018-11-13 陈涛 A kind of semiconductor diode electroplating processes system
CN110329789A (en) * 2019-07-30 2019-10-15 南京涵铭置智能科技有限公司 A kind of automatic adjustable industrial robot

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160308100A1 (en) * 2015-04-17 2016-10-20 Chipmos Technologies Inc Semiconductor package and method of manufacturing thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107541766A (en) * 2017-07-01 2018-01-05 张晓宇 Oscillating diode electroplating machine
CN108796592A (en) * 2018-06-05 2018-11-13 陈涛 A kind of semiconductor diode electroplating processes system
CN108796592B (en) * 2018-06-05 2019-08-13 吉林瑞能半导体有限公司 A kind of semiconductor diode electroplating processes system
CN110329789A (en) * 2019-07-30 2019-10-15 南京涵铭置智能科技有限公司 A kind of automatic adjustable industrial robot

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