CN202297814U - Electroplating conductive device of lead frame of integrated circuit - Google Patents
Electroplating conductive device of lead frame of integrated circuit Download PDFInfo
- Publication number
- CN202297814U CN202297814U CN 201120402016 CN201120402016U CN202297814U CN 202297814 U CN202297814 U CN 202297814U CN 201120402016 CN201120402016 CN 201120402016 CN 201120402016 U CN201120402016 U CN 201120402016U CN 202297814 U CN202297814 U CN 202297814U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- integrated circuit
- conductive device
- bus
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to an electroplating conductive plate of a lead frame of an integrated circuit, which comprises an upper mould and a lower mould, wherein the upper mould is provided with a conductive bar therein; the conductive bar is provided with two wiring terminals; at least three pins are transversally arranged on the conductive bar; the end of each of the pins extends to the bottom of the upper mould; and the lower mould is provided with an anode plate therein. The electroplating conductive device of the lead frame of the integrated circuit disclosed by the utility model is suitable for electroplating the lead frame of the integrated circuit and capable of realizing uniform distribution of current density in the lead frame, so that a silver layer on the lead frame is uniform in thickness, in this way, consumption of silver is reduced and the production cost is lowered.
Description
Technical field
The utility model relates to a kind of plated conductive device of circuit lead frame.
Background technology
Circuit lead frame is the basic element of character of making the IC semiconductor assembly.For satisfying the demand of making IC semiconductor, the surface local zone of circuit lead frame needs plated metal silver.It is fine and smooth, even that this silver layer requires, otherwise can influence the life-span of IC semiconductor assembly.
Circuit lead frame is when electroplating at present; At first lead frame is sent between the upper die and lower die, lead frame is pushed down, in the energising of the both sides of lead frame through upper die and lower die; Plating liquid begins to electroplate then, and the product of electroplating after finishing cleans the back oven dry with clear water.
Its shortcoming is: because in the energising of the both sides of lead frame; The electric current distribution that is arranged in lead frame is inhomogeneous, thereby can cause the silver thickness on lead frame inhomogeneous, but also can strengthen the loss of silver; Lasting high along with the silver-colored valency in the world equals to increase production cost.
The utility model content
The utility model technical problem to be solved is: a kind of plated conductive device that can make the uniform circuit lead frame of silver thickness is provided.
For addressing the above problem; The technical scheme that the utility model adopts is: the plated conductive device of circuit lead frame, comprise upper die and lower die, and be provided with bus in the said patrix; Bus is provided with two terminal studs; The bus upper edge is transversely arranged to be provided with at least three pins, and the end of pin is extended down to the bottom of patrix, is provided with positive plate in the said counterdie.
The both sides of said bus are respectively along the transversely arranged pin that is provided with.
The beneficial effect of the utility model is: the plated conductive device of above-mentioned circuit lead frame, it is simple in structure, easy to use, with low cost.It can make the electric current distribution that is arranged in lead frame even, thereby makes the silver thickness on the lead frame even, and reduces the loss of silver, thereby reduces production cost.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Among the figure: 1, patrix, 2, counterdie, 3, bus, 4, terminal stud, 5, pin, 6, circuit lead frame, 7, positive plate.
Embodiment
Through specific embodiment the plated conductive device of the utility model circuit lead frame is done further to describe in detail below.
As shown in Figure 1; The plated conductive device of circuit lead frame; Comprise patrix 1 and counterdie 2, be provided with bus 3 in the said patrix 1, bus 3 is provided with two terminal studs 4; Along transversely arranged at least three pins 5 that are provided with, the end of pin 5 is extended down to the bottom of patrix 1 respectively in the both sides of bus 3.The both sides of bus 3 are respectively along the transversely arranged six roots of sensation pin 5 that is provided with in the present embodiment.Be provided with positive plate 7 in the said counterdie 2.
The principle of work of the utility model is: when circuit lead frame 6 is electroplated; At first lead frame 6 is sent between patrix 1 and the counterdie 2, through patrix 1 and counterdie 2 lead frame 6 is pushed down, pin 5 ends that be extended down to patrix 1 bottom this moment contact with lead frame 6; The negative pole of on two terminal studs 4 of bus 3, connecting with the mains; On positive plate 7, connect positive pole, energising and plating liquid begin to electroplate, and the product of electroplating after finishing cleans the back oven dry with clear water.Owing to contact with lead frame along transversely arranged a plurality of pins 5, thereby make the electric current distribution that is arranged in lead frame 6 even, thereby make the silver thickness on the lead frame 6 even, and reduce the loss of silver, thereby reduce production cost.
The above embodiments are the principle and the effect thereof of illustrative the invention only, and the embodiment of part utilization, but not is used to limit the utility model; Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model creation design, can also make some distortion and improvement, these all belong to the protection domain of the utility model.
Claims (2)
1. the plated conductive device of circuit lead frame; Comprise upper die and lower die; It is characterized in that: be provided with bus in the said patrix, bus is provided with two terminal studs, and the bus upper edge is transversely arranged to be provided with at least three pins; The end of pin is extended down to the bottom of patrix, is provided with positive plate in the said counterdie.
2. the plated conductive device of circuit lead frame according to claim 1 is characterized in that: the both sides of said bus are respectively along the transversely arranged pin that is provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120402016 CN202297814U (en) | 2011-10-21 | 2011-10-21 | Electroplating conductive device of lead frame of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120402016 CN202297814U (en) | 2011-10-21 | 2011-10-21 | Electroplating conductive device of lead frame of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202297814U true CN202297814U (en) | 2012-07-04 |
Family
ID=46366748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120402016 Expired - Lifetime CN202297814U (en) | 2011-10-21 | 2011-10-21 | Electroplating conductive device of lead frame of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202297814U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102383160A (en) * | 2011-10-21 | 2012-03-21 | 顺德工业(江苏)有限公司 | Electroplating electric-conducting device for integrated circuit lead frame |
| CN103469289A (en) * | 2013-09-27 | 2013-12-25 | 铜陵丰山三佳微电子有限公司 | Integrated circuit lead frame plate type electroplating clamp |
| CN112176378A (en) * | 2020-11-09 | 2021-01-05 | 镇江锦兴表面工程技术有限公司 | Tool jig for electroplating lead frame and use method thereof |
-
2011
- 2011-10-21 CN CN 201120402016 patent/CN202297814U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102383160A (en) * | 2011-10-21 | 2012-03-21 | 顺德工业(江苏)有限公司 | Electroplating electric-conducting device for integrated circuit lead frame |
| CN103469289A (en) * | 2013-09-27 | 2013-12-25 | 铜陵丰山三佳微电子有限公司 | Integrated circuit lead frame plate type electroplating clamp |
| CN112176378A (en) * | 2020-11-09 | 2021-01-05 | 镇江锦兴表面工程技术有限公司 | Tool jig for electroplating lead frame and use method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120704 |