CN202214431U - Copper foil electroplating bath - Google Patents
Copper foil electroplating bath Download PDFInfo
- Publication number
- CN202214431U CN202214431U CN 201120327680 CN201120327680U CN202214431U CN 202214431 U CN202214431 U CN 202214431U CN 201120327680 CN201120327680 CN 201120327680 CN 201120327680 U CN201120327680 U CN 201120327680U CN 202214431 U CN202214431 U CN 202214431U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- bath
- liquid
- hair
- hair side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a copper foil electroplating bath, which comprises a bath body and a first hair-side anode plate. A bath entering conductive roller and a bath exiting conductive roller are arranged on two sides above the bath body, an immersed roller and electroplating liquid are arranged in the bath body, and the first hair-side anode plate is arranged inside the bath body and arranged below a copper foil hair side which is immersed in the electroplating liquid and between the bath entering conductive roller and the immersed roller. The anode plates are arranged below the copper foil hair sides immersed in the electroplating liquid, and electroplating current of a copper foil between the bath exiting conductive roller and the immersed roller rises to 650A, so that produced copper foil hair side is better in solidification effect, the quality of the copper foil is improved extremely, and huge economic loss caused by shedding of copper skin is eliminated.
Description
Technical field
The utility model relates to a kind of plating tank, relates in particular to a kind of Copper Foil plating tank.
Background technology
In the Copper Foil process of manufacture, during postprocessor operation 35um hair paper tinsel, when speed surpasses 25m/min, very easily produce the red point of hair side at hair side, promptly the copper sheet obscission has seriously influenced quality product and corporate image, has caused great financial loss.As shown in Figure 1; Existing Copper Foil plating tank comprises cell body 1, advances groove conductive rollers 2, goes out groove conductive rollers 3, Copper Foil 4 and liquid lower roll 6; Be provided with electroplate liquid 5 in the cell body 1; Advance groove conductive rollers 2, go out groove conductive rollers 3 and liquid lower roll 6 and make in the Copper Foil 4 immersion plating liquid 5 and electroplate, and be used to that the galvanized electric current of Copper Foil is 500A between groove conductive rollers 3 and the liquid lower roll 6.
The utility model content
The purpose of the utility model provides a kind of Copper Foil plating tank, can carry out through plating tank increasing in the process of electro-coppering at Copper Foil and electroplate firmness, avoids Copper Foil the copper sheet obscission in the post-processed process, to occur.
The utility model adopts following technical proposals:
A kind of Copper Foil plating tank; Comprise cell body; Both sides, cell body top are provided with into the groove conductive rollers and go out the groove conductive rollers; Be provided with liquid lower roll and electroplate liquid in the cell body, also comprise the first hair side positive plate of cell body set inside, the first hair side positive plate is arranged on the into Copper Foil hair side below of the immersion plating liquid between the groove conductive rollers and liquid lower roll.
The Copper Foil hair side below that goes out the immersion plating liquid between groove conductive rollers and the liquid lower roll is provided with the second hair side positive plate.
Be used to that the galvanized electric current of Copper Foil is 650A between groove conductive rollers and the liquid lower roll.
The utility model is through being provided with positive plate below the Copper Foil hair side of immersion plating liquid; To go out simultaneously that the galvanized electric current of Copper Foil is increased to 650A between groove conductive rollers and the liquid lower roll; Make the Copper Foil hair side solidification effect of producing better; Greatly improve quality product, eliminated the tremendous economic loss that comes off and cause because of copper sheet.
Description of drawings
Fig. 1 is the structural representation of existing Copper Foil plating tank;
Fig. 2 is the structural representation of the utility model.
Embodiment
As shown in Figure 2; The utility model comprises cell body 1; Both sides, cell body 1 top are provided with into groove conductive rollers 2 and go out groove conductive rollers 3; Be provided with liquid lower roll 6 and electroplate liquid 5, the first hair side positive plates 7 in the cell body 1 and be arranged on the into Copper Foil 4 hair sides below of the immersion plating liquid 5 between the groove conductive rollers 2 and liquid lower roll 6, the Copper Foil 4 hair sides below that goes out the immersion plating liquid 5 between groove conductive rollers 3 and the liquid lower roll 6 is provided with the second hair side positive plate 8.When carrying out the Copper Foil plating, the first hair side positive plate 7 and the second hair side positive plate 8 are anode, can electroplate once more Copper Foil 4 hair sides, form bigger specific surface area, reach better electroplating effect.Show through test of many times; When the Copper Foil that goes out the immersion plating liquid 5 between groove conductive rollers 3 and the liquid lower roll 64 carries out galvanized electric current when being 650A; The copper sheet obscission appears in Copper Foil 4 thoroughly to be eliminated; The antistripping value of Copper Foil 4 improves greatly, has greatly improved quality product, has eliminated the tremendous economic loss that comes off and cause because of copper sheet.
Claims (3)
1. Copper Foil plating tank; Comprise cell body; Both sides, cell body top are provided with into the groove conductive rollers and go out the groove conductive rollers; Be provided with liquid lower roll and electroplate liquid in the cell body, it is characterized in that: also comprise the first hair side positive plate of cell body set inside, the first hair side positive plate is arranged on the into Copper Foil hair side below of the immersion plating liquid between the groove conductive rollers and liquid lower roll.
2. Copper Foil plating tank according to claim 1 is characterized in that: the Copper Foil hair side below that goes out the immersion plating liquid between groove conductive rollers and the liquid lower roll is provided with the second hair side positive plate.
3. Copper Foil plating tank according to claim 2 is characterized in that: be used to that the galvanized electric current of Copper Foil is 650A between groove conductive rollers and the liquid lower roll.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120327680 CN202214431U (en) | 2011-09-02 | 2011-09-02 | Copper foil electroplating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120327680 CN202214431U (en) | 2011-09-02 | 2011-09-02 | Copper foil electroplating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202214431U true CN202214431U (en) | 2012-05-09 |
Family
ID=46013693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120327680 Expired - Fee Related CN202214431U (en) | 2011-09-02 | 2011-09-02 | Copper foil electroplating bath |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202214431U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104911661A (en) * | 2015-07-07 | 2015-09-16 | 安徽铜冠铜箔有限公司 | Surface treatment device capable of reducing copper powder on rough surface of copper foil |
-
2011
- 2011-09-02 CN CN 201120327680 patent/CN202214431U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104911661A (en) * | 2015-07-07 | 2015-09-16 | 安徽铜冠铜箔有限公司 | Surface treatment device capable of reducing copper powder on rough surface of copper foil |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120509 Termination date: 20140902 |
|
| EXPY | Termination of patent right or utility model |