CN104562091A - Embedded type electrodeposition two-pole and four-contact conducting device in electrolytic cell - Google Patents
Embedded type electrodeposition two-pole and four-contact conducting device in electrolytic cell Download PDFInfo
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- CN104562091A CN104562091A CN201410848423.9A CN201410848423A CN104562091A CN 104562091 A CN104562091 A CN 104562091A CN 201410848423 A CN201410848423 A CN 201410848423A CN 104562091 A CN104562091 A CN 104562091A
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Abstract
The invention relates to an embedded type electrodeposition two-pole and four-contact conducting device in an electrolytic cell. The embedded type electrodeposition two-pole and four-contact conducting device mainly comprises a bottom auxiliary conducting device and a main conducting board, wherein the main conducting board is embedded in the bottom auxiliary conducting device, the bottom auxiliary conducting device consists of a plurality of auxiliary conducting copper bars and an insulating layer, the auxiliary conducting copper bars are embedded in ribs on the two long edges of the insulating layer to form an integral structure, and a plurality of boss contact surfaces are arranged on the upper surface of the main conducting board; concave-convex alternate structures are arranged on the short edges at the two ends of the bottom auxiliary conducting device, convex parts are positioning strips, and concave parts are draining grooves. The embedded type electrodeposition two-pole and four-contact conducting device has the benefits that the structure successfully solves the problem that the mounting width among the electrolytic cell is insufficient; the insulating protective layer structures on the two sides of the conducting contact surfaces of the auxiliary conducting copper bars effectively reduce cathode and anode short-circuiting probability; the positioning precision of pole plates is improved.
Description
Technical field
The present invention relates to electric installation structure between the groove in non-ferrous metal electrolytic refining technique, dipolar four-contact electric conduction device between especially a kind of embedded electrodeposition electrolyzer.
Background technology
Because the state of the art of non-ferrous metal metallurgy equipment constantly promotes, the auxiliary facility of some reasons can not meet the demand of actual use.In electrorefining, there is Similar Problems equally, wherein the technical renovation of electrolyzer just facilitates the technology upgrading of electric installation.Traditional electrolyzer adopts cement to build, and then do Corrosion Protection of Fiber Reinforced Plastics, this structure trough rim thickness is large, antiseptic property is poor, heat insulation effect is general, so started in recent years to occur large quantities of resin electrolyzer, its principal feature was exactly trough rim thickness thin (being about the half of cement tub), antiseptic property is strong, easy construction.But the installation width that the consequent is electric installation between groove is heavily compressed, and existing electric installation cannot meet installation requirements, so it is very urgent to design a kind of demand that can meet the electric installation being arranged on resin electrolyzer.
Summary of the invention
The present invention will solve the shortcoming of above-mentioned prior art, provides that a kind of structure is simple, dipolar four-contact electric conduction device between performance better embedded electrodeposition electrolyzer.
The present invention solves the technical scheme that its technical problem adopts: dipolar four-contact electric conduction device between this embedded electrodeposition electrolyzer, mainly comprise bottom and teach electric installation and led panel, led panel is embedded in bottom and teaches in electric installation, bottom teaches electric installation to be made up of auxiliary conducting copper and insulation layer, several auxiliary conducting coppers are embedded on the fin on insulation layer two long limits, become integral structure, the upper surface of led panel is provided with several boss contact surfaces.Described bottom teaches the minor face place, two ends of electric installation to be provided with concavo-convex alternate shape structure, and bossing is positioning strip, and groove part is sump pit.
The conductive contact surfaces both sides of described auxiliary conducting copper are provided with insulating protective layer, and auxiliary conducting copper is monoblock type, and the part of its conductive contact surfaces is stretched out outside insulation layer, and rest part is embedded in insulation layer.
Described boss contact surface is by impact briquetting, and the top of boss contact surface is identical with the height on auxiliary conducting copper contact surface top.
The effect that the present invention is useful is: structure of the present invention successfully solves a difficult problem of installing short of width between electrolytic bath; The insulation protection Rotating fields of auxiliary conducting copper conductive contact surfaces both sides, effectively reduces the probability of cathode and anode short circuit; Improve the positioning precision of pole plate.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is decomposition texture schematic diagram of the present invention;
Fig. 3 is that electric installation partial enlarged drawing is taught in bottom;
Fig. 4 is led panel partial enlarged drawing.
Description of reference numerals: fin 1, electric installation 2 is taught in bottom, led panel 3, auxiliary conducting copper 4, insulation layer 5, positioning strip 6, sump pit 7, insulating protective layer 8, boss contact surface 9.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described:
As shown in the figure, dipolar four-contact electric conduction device between this embedded electrodeposition electrolyzer, mainly comprise bottom and teach electric installation 2 and led panel 3, led panel 3 is embedded in bottom and teaches in electric installation 2, form the structure formation of double-deck superposition, bottom teaches electric installation 2 to be made up of auxiliary conducting copper 4 and insulation layer 5, several auxiliary conducting coppers 4 are embedded on the fin 1 on insulation layer 5 two long limits, become integral structure, the conductive contact surfaces both sides of auxiliary conducting copper 4 are provided with insulating protective layer 8, can effectively avoid because of the moon, the short circuit phenomenon that plate contacts and causes, auxiliary conducting copper 4 is monoblock type, the part of its conductive contact surfaces is stretched out outside insulation layer 5, rest part is embedded in insulation layer 5.Bottom teaches the minor face place, two ends of electric installation 2 to be provided with concavo-convex alternate shape structure, bossing is positioning strip 6, and groove part is sump pit 7, can ensure that led panel 3 can not be moved after mounting, ensure that the positioning precision of electric installation, in turn ensure that scavenging solution can be effectively emptying simultaneously.The upper surface of led panel 3 is provided with several boss contact surfaces.Boss contact surface 9 is by impact briquetting, and the top of boss contact surface 9 is identical with the height on auxiliary conducting copper 4 contact surface top.
The center of the conductive contact surfaces of electric installation 2 is taught not on the same line in led panel 3 and bottom, and wherein bottom teaches the contact surface of electric installation 2 in outside, and the contact surface of led panel 3 is in inner side;
In addition to the implementation, the present invention can also have other embodiments.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop on the protection domain of application claims.
Claims (3)
1. dipolar four-contact electric conduction device between an embedded electrodeposition electrolyzer, mainly comprise bottom and teach electric installation (2) and led panel (3), it is characterized in that: led panel (3) is embedded in bottom and teaches in electric installation (2), bottom teaches electric installation (2) to be made up of auxiliary conducting copper (4) and insulation layer (5), several auxiliary conducting coppers (4) are embedded on the fin (1) on insulation layer (5) two long limits, become integral structure, the upper surface of led panel (3) is provided with several boss contact surfaces; Described bottom teaches the minor face place, two ends of electric installation (2) to be provided with concavo-convex alternate shape structure, and bossing is positioning strip (6), and groove part is sump pit (7).
2. dipolar four-contact electric conduction device between embedded electrodeposition electrolyzer according to claim 1; it is characterized in that: the conductive contact surfaces both sides of described auxiliary conducting copper (4) are provided with insulating protective layer (8); auxiliary conducting copper (4) is monoblock type; the part of its conductive contact surfaces stretches out insulation layer (5) outward, and rest part is embedded in insulation layer (5).
3. dipolar four-contact electric conduction device between embedded electrodeposition electrolyzer according to claim 1, it is characterized in that: described boss contact surface (9) is by impact briquetting, and the top of boss contact surface (9) is identical with the height on auxiliary conducting copper (4) contact surface top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410848423.9A CN104562091B (en) | 2014-12-30 | 2014-12-30 | Embedded type electrodeposition two-pole and four-contact conducting device in electrolytic cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410848423.9A CN104562091B (en) | 2014-12-30 | 2014-12-30 | Embedded type electrodeposition two-pole and four-contact conducting device in electrolytic cell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104562091A true CN104562091A (en) | 2015-04-29 |
| CN104562091B CN104562091B (en) | 2017-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410848423.9A Active CN104562091B (en) | 2014-12-30 | 2014-12-30 | Embedded type electrodeposition two-pole and four-contact conducting device in electrolytic cell |
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| CN (1) | CN104562091B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105063668A (en) * | 2015-09-07 | 2015-11-18 | 无锡斯普流体设备有限公司 | Novel copper electric-conducting bar |
| CN108385136A (en) * | 2018-05-11 | 2018-08-10 | 三门三友科技股份有限公司 | A kind of three layers of full coverage type bipolar four-contact electrodeposition, Inter-electrolytic-bconductive conductive device |
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| CN1382832A (en) * | 2002-03-01 | 2002-12-04 | 吴用 | Two-electrode four-contact electric conducting device and method for electric deposition tank or electrolyzer |
| CN201890939U (en) * | 2010-11-16 | 2011-07-06 | 金川集团有限公司 | Current-conducting plate between copper electrolytic cells |
| CN202337843U (en) * | 2011-11-26 | 2012-07-18 | 重庆华浩冶炼有限公司 | Electrode plate fixing device of electrolytic tank |
| CN103122467A (en) * | 2013-02-05 | 2013-05-29 | 杭州三耐环保科技有限公司 | Inter-electrolytic-bath conductive device with homopolar communication circuit |
| CN203976943U (en) * | 2014-05-28 | 2014-12-03 | 九星控股集团有限公司 | A kind of special-shaped auxiliary conductive plate structure between groove for electrolysis |
| CN204385304U (en) * | 2014-12-30 | 2015-06-10 | 三门三友冶化技术开发有限公司 | Dipolar four-contact electric conduction device between embedded electrodeposition electrolyzer |
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2014
- 2014-12-30 CN CN201410848423.9A patent/CN104562091B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1382832A (en) * | 2002-03-01 | 2002-12-04 | 吴用 | Two-electrode four-contact electric conducting device and method for electric deposition tank or electrolyzer |
| CN201890939U (en) * | 2010-11-16 | 2011-07-06 | 金川集团有限公司 | Current-conducting plate between copper electrolytic cells |
| CN202337843U (en) * | 2011-11-26 | 2012-07-18 | 重庆华浩冶炼有限公司 | Electrode plate fixing device of electrolytic tank |
| CN103122467A (en) * | 2013-02-05 | 2013-05-29 | 杭州三耐环保科技有限公司 | Inter-electrolytic-bath conductive device with homopolar communication circuit |
| CN203976943U (en) * | 2014-05-28 | 2014-12-03 | 九星控股集团有限公司 | A kind of special-shaped auxiliary conductive plate structure between groove for electrolysis |
| CN204385304U (en) * | 2014-12-30 | 2015-06-10 | 三门三友冶化技术开发有限公司 | Dipolar four-contact electric conduction device between embedded electrodeposition electrolyzer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105063668A (en) * | 2015-09-07 | 2015-11-18 | 无锡斯普流体设备有限公司 | Novel copper electric-conducting bar |
| CN108385136A (en) * | 2018-05-11 | 2018-08-10 | 三门三友科技股份有限公司 | A kind of three layers of full coverage type bipolar four-contact electrodeposition, Inter-electrolytic-bconductive conductive device |
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| Publication number | Publication date |
|---|---|
| CN104562091B (en) | 2017-04-12 |
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Address after: 317103 Zhejiang Province, Taizhou City, the county side of the pavilion Industrial Development Zone Applicant after: SANMEN SANYOU TECHNOLOGY CO., LTD. Address before: 317103 Industrial Park, Ting Ting, three counties, Zhejiang, Taizhou Applicant before: Sanmen Sanyou Metallurgy & Chemical Technologies Co., Ltd. |
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