CN204058637U - A kind of micro electric coating apparatus of short run pcb board - Google Patents
A kind of micro electric coating apparatus of short run pcb board Download PDFInfo
- Publication number
- CN204058637U CN204058637U CN201420475883.7U CN201420475883U CN204058637U CN 204058637 U CN204058637 U CN 204058637U CN 201420475883 U CN201420475883 U CN 201420475883U CN 204058637 U CN204058637 U CN 204058637U
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- China
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- cell body
- plating tank
- pcb board
- coating apparatus
- short run
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Abstract
The utility model discloses a kind of micro electric coating apparatus of short run pcb board, comprise plating tank, described plating tank mainly comprises cell body and is arranged on two anode copper conducting rods on cell body, negative electrode flies target and swing motor, cell body interior dimensions is: 1000 × 800 × 1500mm, in described cell body, the quantity of titanium basket bag is 8, be provided with corresponding small-sized filter and motor-generator set, the positive pole jointed anode copper conducting rod of described motor-generator set, negative pole connects negative electrode and flies target, described small-sized filter comprises base, cartridge filter and recycle pump, bottom described minifilters, water inlet pipe is set, top sets out water pipe, described water inlet pipe and the rising pipe the other end stretch into plating tank inside.Solve the power consumption when carrying out veneer or a small amount of plate plating of existing plating tank equipment not to be directly proportional to output, and the quality problems that during small serial production, product plating is uneven, improve the covering power to sample plane and covering power.
Description
Technical field
The utility model belongs to pcb board electroplating device design field, is specifically related to a kind of micro electric coating apparatus of short run pcb board.
Background technology
In PCB making processes, have a procedure to be called electro-coppering, equipment used commonly upright plating line, wide 5.5m, about length 50m, may be used for large volume production, also can be used for small serial production.Current density has very large significant variable on electroplating operations, and the tissue of such as coating, the distribution of thickness, current efficiency etc., all have very large relation.And in the manufacturing processed of pcb board, generally pursue mass production, Common platings groove is often hung and is produced 10-12 part product, this equipment can not well control for the current density in electroplate liquid, the thickness of the same a collection of product copper film sometimes produced is all inconsistent, and sometimes need production sample plane, only need 1-3 plate, if use this device fabrication, can not completely hang, equipment capacity can be wasted, can cause current density skewness more during this device fabrication short run sample, the two ends current density of sample plane is large, and coating is thick simultaneously.
Application number is in the Chinese patent of " CN201420123885.X ", disclose the utility model patent that name is called " plating tank of homogeneous current distribution ", the plating tank of a kind of homogeneous current distribution of this announcement, comprise plating tank body, two anode rods are fixedly mounted on the upper limb of two sidewalls of plating tank body, the positive plate being arranged on both sides in plating tank body hangs on anode rod, two cathode copper seats are fixedly mounted on the upper limb of plating tank body two end walls, the overhead gage of two pieces of close electroplate liquid liquid level settings is opposing parallel to be installed on the positive plate of both sides, two pieces of lower baffle plates being arranged on plating tank body bottom portion are opposing parallel to be installed on the positive plate of both sides, overhead gage and lower baffle plate are provided with the through hole of uniform array.Although this plating tank can slow down the situation of workpiece upper and lower two ends electric current distribution inequality, but still plating tank can not be solved be discontented with the problem that extension can waste equipment capacity, and veneer or few plate operation time impact on current density.
Utility model content
For the technical problem of above-mentioned existence, the utility model discloses and a kind ofly carry clean coating vacuum sampling device, be not directly proportional to output to solve the power consumption when carrying out veneer or a small amount of plate plating of existing plating tank equipment, and the quality problems that during small serial production, product plating is uneven, devise a kind of miniature electroplating device, and supporting corresponding filter and motor-generator set, be specifically designed to the plating of the PCB sample version of short run, decrease energy waste, improve covering power and the covering power of product plating, ensure the unity of quality product.
A kind of micro electric coating apparatus of short run pcb board, comprise plating tank, described plating tank mainly comprises cell body and is arranged on two anode copper conducting rods on cell body, negative electrode flies target and swing motor, described swing motor connects negative electrode and flies target, described conductive anode rod hangs with the blue bag of titanium, in the blue bag of described titanium, copper ball is housed, described negative electrode flies target arranges conductive fixture, cell body interior dimensions is: 1000 × 800 × 1500mm, in described cell body, the quantity of titanium basket bag is 8, be provided with corresponding small-sized filter and motor-generator set, the positive pole jointed anode copper conducting rod of described motor-generator set, negative pole connects negative electrode and flies target, bottom described minifilters, water inlet pipe is set, top sets out water pipe, described water inlet pipe and the rising pipe the other end stretch into plating tank inside.
Further, described small-sized filter comprises base, cartridge filter and recycle pump.
Further, described cartridge filter inside arranges filtration cotton core.
Further, the quantity of described conductive fixture can adjust according to the size and number of required plated item, and concrete scope is 1-5.
The utility model, by reducing the cell body size of plating tank, reduces the quantity of the blue bag of titanium, makes it meet the production of short run PCB sample plane, decreases equipment power consumption accordingly; This equipment can carry out the adjustment of the blue bag quantity and spacing of titanium according to the size of plating pcb board, the current density making it produce in electroplate liquid is more even, ensures the thickness evenness of PCB sample plane overlay coating; Small-sized filter, according to plating tank capacity corresponding configuration, can filter the electroplate liquid in plating tank and reflux, remove impurity wherein.Motor-generator set can convert alternating-current to direct current, carries out the adjustment of electric current according to the size of plating sample plane.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of integral device figure of micro electric coating apparatus of short run pcb board;
Fig. 2 is the structural representation of plating tank;
Fig. 3 is the structural representation of small-sized filter.
Embodiment
The utility model discloses a kind of micro electric coating apparatus of short run pcb board, be specifically designed to the plating of the PCB sample version of short run, decrease energy waste, improve covering power and the covering power of product plating, ensure the unity of quality product.
Below in conjunction with the accompanying drawing in the utility model, be clearly and completely described the technical scheme in the utility model, obviously, described is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of the utility model protection.
See Fig. 1, shown in Fig. 2 and Fig. 3, a kind of micro electric coating apparatus of short run pcb board, comprise plating tank 2, described plating tank 2 mainly comprises cell body 22 and is arranged on two anode copper conducting rods 23 on cell body 22, negative electrode flies target 24 and swing motor 21, described swing motor 21 connects negative electrode and flies target 24, described conductive anode rod 23 hangs with the blue bag 25 of titanium, in the blue bag 25 of described titanium, copper ball is housed, described negative electrode flies target 24 arranges conductive fixture 26, cell body 22 interior dimensions is: 1000 × 800 × 1500mm, in described cell body 22, the quantity of titanium basket bag 25 is 8, reduce cell body 22 size of plating tank, reduce the quantity of the blue bag 25 of titanium, it is made to meet the production of short run PCB sample plane, decrease equipment power consumption accordingly, be provided with corresponding small-sized filter 1 and motor-generator set 3, the positive pole 31 jointed anode copper conducting rod 23 of described motor-generator set 3, negative pole 32 connects negative electrode and flies target 24, and motor-generator set 3 can convert alternating-current to direct current, carries out the adjustment of electric current according to the size of plating sample plane, described small-sized filter 1 comprises base 11, cartridge filter 12 and recycle pump 13, bottom described minifilters 1, water inlet pipe 16 is set, top sets out water pipe 15, described water inlet pipe 16 and rising pipe 15 the other end stretch into plating tank inside, small-sized filter 1 is according to plating tank capacity corresponding configuration, can filter the electroplate liquid in plating tank and reflux again, remove impurity wherein, described cartridge filter inside is arranged filters cotton core 14.The quantity of described conductive fixture 26 can adjust according to the size and number of required plated item, and concrete scope is 1-5.This equipment can carry out the adjustment of blue bag 25 quantity and spacing of titanium according to the size of plating pcb board, the current density making it produce in electroplate liquid is more even, ensures the thickness evenness of PCB sample plane overlay coating.
The throughput of this equipment is:
Maximum product size: 22*24inch;
Thickness of slab 0.4-3.2mm;
Aspect ratio: 10:1;
Covering power: 85%;
Covering power: 88%.
Known by describing above, the utility model has the advantage of: the production having adapted to short run PCB sample plane, easy and simple to handle, decrease equipment power consumption; Improve the homogeneity of current density in plating tank, make the consistence between all even sample plane of the maintenance of the plating thickness in sample plane; Improve the regulating power of plating tank, can adjust accordingly according to the sample of plating.
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, some simple deduction or replace can also be made, all should be considered as belonging to protection domain of the present utility model.
Claims (4)
1. the micro electric coating apparatus of a short run pcb board, comprise plating tank, described plating tank mainly comprises cell body and is arranged on two anode copper conducting rods on cell body, negative electrode flies target and swing motor, described swing motor connects negative electrode and flies target, described conductive anode rod hangs with the blue bag of titanium, in the blue bag of described titanium, copper ball is housed, described negative electrode flies target arranges conductive fixture, it is characterized in that, cell body interior dimensions is: 1000 × 800 × 1500mm, in described cell body, the quantity of titanium basket bag is 8, be provided with corresponding small-sized filter and motor-generator set, the positive pole jointed anode copper conducting rod of described motor-generator set, negative pole connects negative electrode and flies target, bottom described minifilters, water inlet pipe is set, top sets out water pipe, described water inlet pipe and the rising pipe the other end stretch into plating tank inside.
2. the micro electric coating apparatus of a kind of short run pcb board according to claim 1, is characterized in that, described small-sized filter comprises base, cartridge filter and recycle pump.
3. the micro electric coating apparatus of a kind of short run pcb board according to claim 1, is characterized in that, described cartridge filter inside arranges filtration cotton core.
4. the micro electric coating apparatus of a kind of short run pcb board according to claim 1, is characterized in that, the quantity of described conductive fixture can adjust according to the size and number of required plated item, and concrete scope is 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420475883.7U CN204058637U (en) | 2014-08-21 | 2014-08-21 | A kind of micro electric coating apparatus of short run pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420475883.7U CN204058637U (en) | 2014-08-21 | 2014-08-21 | A kind of micro electric coating apparatus of short run pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204058637U true CN204058637U (en) | 2014-12-31 |
Family
ID=52200187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420475883.7U Expired - Fee Related CN204058637U (en) | 2014-08-21 | 2014-08-21 | A kind of micro electric coating apparatus of short run pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204058637U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105316737A (en) * | 2015-11-23 | 2016-02-10 | 深圳崇达多层线路板有限公司 | High density interconnector (HDI) board blind hole electroplating device |
| CN108251885A (en) * | 2018-01-29 | 2018-07-06 | 东莞市鑫弘机械科技有限公司 | A kind of mode of connection for improving electroplating evenness |
| CN108315808A (en) * | 2018-05-09 | 2018-07-24 | 东莞市威力固电路板设备有限公司 | A kind of electroplating production facility |
-
2014
- 2014-08-21 CN CN201420475883.7U patent/CN204058637U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105316737A (en) * | 2015-11-23 | 2016-02-10 | 深圳崇达多层线路板有限公司 | High density interconnector (HDI) board blind hole electroplating device |
| CN108251885A (en) * | 2018-01-29 | 2018-07-06 | 东莞市鑫弘机械科技有限公司 | A kind of mode of connection for improving electroplating evenness |
| CN108251885B (en) * | 2018-01-29 | 2019-08-23 | 东莞市鑫弘机械科技有限公司 | A kind of mode of connection improving electroplating evenness |
| CN108315808A (en) * | 2018-05-09 | 2018-07-24 | 东莞市威力固电路板设备有限公司 | A kind of electroplating production facility |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20190821 |