CN208250445U - A kind of efficient circuit board electroplating device - Google Patents
A kind of efficient circuit board electroplating device Download PDFInfo
- Publication number
- CN208250445U CN208250445U CN201820606086.6U CN201820606086U CN208250445U CN 208250445 U CN208250445 U CN 208250445U CN 201820606086 U CN201820606086 U CN 201820606086U CN 208250445 U CN208250445 U CN 208250445U
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- Prior art keywords
- circuit board
- fixedly connected
- shell
- pipe
- close
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- Expired - Fee Related
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- 238000009713 electroplating Methods 0.000 title claims abstract description 42
- 229910000831 Steel Inorganic materials 0.000 claims description 13
- 239000010959 steel Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 7
- 230000000452 restraining effect Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 25
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000007747 plating Methods 0.000 description 12
- 239000002184 metal Substances 0.000 description 6
- 230000005611 electricity Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a kind of efficient circuit board electroplating devices, including body, upper surface on the body close to left side is fixedly connected with control panel, upper surface on the body close to right side offers electroplating bath, upper surface on the body close to the back side is fixedly connected with manipulator, upper surface on the body close to right side is fixedly connected with placement mechanism, and the placement mechanism includes rectangular tube and shell.The utility model, pass through being used cooperatively for above structure, it solves in actual use, since manipulator will complete the circuit board after being electroplated after taking out in electroplating bath, a large amount of electroplate liquid is remained on circuit board, to avoid electroplate liquid from dripping wantonly with the movement of circuit board, manipulator clamping circuit board is needed to stay for some time above electroplating bath, no longer continuously backwardness carries out next step operation to liquid to be electroplated again, as a result it is easy to cause circuit board electroplating inefficient, a large amount of electric power resources are consumed, the problem of making troubles to production.
Description
Technical field
The utility model relates to board production technical field, specially a kind of efficient circuit board electroplating device.
Background technique
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique of the surface of metal or other materials product attachment layer of metal film is set to prevent metal oxygen to play using electrolysis
The effects of changing, improving wearability, electric conductivity, reflective, corrosion resistance and having improved aesthetic appearance, such as Chinese patent CN204825081U institute
A kind of disclosed circuit board electroplating device hangs on the first plating beam by the first plating beam, the second plating beam and interval
And being used cooperatively between the structures such as beam multiple metal accommodation apparatus in electrical contact is electroplated with described first, improve printing electricity
The electroplating evenness of road plate and the stability of circuit board electroplating processing quality realize the promotion of product qualification rate and production efficiency,
And the circuit board electroplating device is not equipped with manipulator, cannot free control circuit go deep into electroplating bath or by circuit board from plating
It is taken out in slot, cannot achieve the automation of electroplanting device, cost of labor is higher, and working efficiency is lower, thus it has been proposed that a kind of
Circuit board electroplating device, a kind of electroplanting device for board production as disclosed in Chinese patent CN207047354U lead to
It crosses between the structures such as electric power connection line, support leg, body, control panel, timing knob, work warning light, manipulator, electroplating bath
Be used cooperatively, realize the automation of electroplanting device, reduce cost of labor, improve work efficiency, but actually using
In, since manipulator will complete the circuit board after being electroplated after taking out in electroplating bath, a large amount of electroplate liquid is remained on circuit board, is
Electroplate liquid is avoided to drip wantonly with the movement of circuit board, when manipulator clamping circuit board being needed to stop one section above electroplating bath
Between, no longer continuously backwardness carries out next step operation to liquid to be electroplated again, is as a result easy to cause circuit board electroplating inefficient, consumes
A large amount of electric power resources, make troubles to production.
Utility model content
The purpose of this utility model is to provide a kind of efficient circuit board electroplating devices, improve to conventional apparatus,
It solves in actual use, it is residual on circuit board since manipulator will complete the circuit board after being electroplated after taking out in electroplating bath
A large amount of electroplate liquid is stayed, to avoid electroplate liquid from dripping wantonly with the movement of circuit board, needs manipulator clamping circuit board in electricity
It stays for some time above coating bath, no longer continuously backwardness carries out next step operation to liquid to be electroplated again, is as a result easy to cause circuit
Plate electroplating efficiency is not high, consumes a large amount of electric power resources, the problem of making troubles to production.
To achieve the above object, the utility model provides the following technical solutions: a kind of efficient circuit board electroplating device, packet
Body is included, the upper surface in close left side is fixedly connected with control panel on the body, the upper table on close right side on the body
Face offers electroplating bath, and the upper surface at the close back side is fixedly connected with manipulator, close right side on the body on the body
Upper surface be fixedly connected with placement mechanism.
The placement mechanism includes rectangular tube and shell, and the bottom of the shell is fixedly connected with the upper surface of body, institute
The upper surface for stating shell offers through-hole, and the shell is fixedly connected with the bottom of rectangular tube by through-hole, is leaned on the shell
Through-hole is offered on the left of nearly bottom, the shell is fixedly connected with pipe one by through-hole, and the left end of the pipe one is fixedly connected
There is pipe two, the inner wall of close bottom is fixedly connected with stainless (steel) wire on the rectangular tube, and close bottom is interior on the rectangular tube
Wall is fixedly connected with block, and the right side of the block and the surface activity of circuit board connect, close to top on the rectangular tube
Inner wall is fixedly connected with fixed block, and support plate, the left side of the support plate and circuit are connected on the left of the fixed block
The surface activity of plate connects.
Preferably, the shell is right angled triangle shell, and the inclined-plane of shell is towards the right side.
Preferably, the bottom on the shell close to inclined-plane is fixedly connected with triangle fixed block, and the triangle is fixed
Inclined-plane on block is fixedly connected with the inclined-plane of shell, and the lower surface of triangle fixed block is fixedly connected with the upper surface of body.
Preferably, the inner wall on the pipe two close to right end is fixedly connected with restraining position ring block, the right side activity of the stop collar
It is connected with filter screen, the right side of the filter screen is flexibly connected with the left end of pipe one.
Preferably, the inner wall on the pipe two close to right end offers internal screw thread, the surface of close left end on the pipe one
External screw thread, the pipe one and pipe two is offered to be threadedly coupled by internal screw thread and external screw thread.
Preferably, the side of the fixed block offers through-hole, and the fixed block is connected with motion bar by through-hole,
It is fixedly connected on the right side of the left end of the motion bar and support plate, the right end of the motion bar is fixedly connected with baffle, the gear
It is fixedly connected with reset spring on the left of plate, is fixedly connected on the right side of the left end of the reset spring and fixed block.
Compared with prior art, the beneficial effects of the utility model are as follows:
One, the utility model faces the circuit board after the completion of plating in time by the setting of placement mechanism
When placement, and by circuit board surface drip electroplate liquid be back in electroplating bath, not to the remaining electroplate liquid of circuit board surface
Again next step operation can be carried out to circuit board after continuous drippage.
Two, the utility model makes placement mechanism and rectangular tube establish connection by shell, passes through rectangular tube, shell, Guan Yi
Circuit board after the completion of plating is placed in placement mechanism, circuit board surface by being used cooperatively between pipe two and stainless (steel) wire
Remaining electroplate liquid can pass through stainless (steel) wire and flow to Guan Yizhong along the inner wall of shell, make electroplate liquid again finally by pipe two
It flow in electroplating bath.
Three, the utility model passes through being used cooperatively between rectangular tube, block, fixed block, support plate and stainless (steel) wire, when
Circuit board is by between the mechanical block being manually placed on rectangular tube inner wall and support plate, by block to the bottom on the left of circuit board
It is supported and fixed block is supported the top on the right side of circuit board, make circuit board is tiltable to be placed in rectangular tube,
It recycles stainless (steel) wire to carry out the support of bottom to circuit board, makes what circuit board can be stable to be placed in rectangular tube.
Four, the utility model solves in actual use, by being used cooperatively between above structure due to manipulator
Will complete plating after circuit board from electroplating bath take out after, a large amount of electroplate liquid is remained on circuit board, for avoid electroplate liquid with
The movement of circuit board and drip wantonly, need manipulator clamping circuit board to stay for some time above electroplating bath, liquid to be electroplated
No longer continuously backwardness carries out next step operation again, is as a result easy to cause circuit board electroplating inefficient, consumes a large amount of electric power moneys
Source, the problem of making troubles to production.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the front view of the utility model placement mechanism；
Fig. 3 is the top view of the utility model rectangular tube；
Fig. 4 is the cross-sectional view of two front view of the utility model pipe；
Fig. 5 is the enlarged drawing of structure at the utility model A；
Fig. 6 is front view when the utility model circuit board is in slant setting.
In figure: 1- body, 2- control panel, 3- electroplating bath, 4- manipulator, 5- placement mechanism, 6- rectangular tube, 7- shell,
8- pipe one, 9- pipe two, 10- stainless (steel) wire, 11- block, 12- fixed block, 13- support plate, 14- triangle fixed block, 15- limit
Ring, 16- filter screen, 17- internal screw thread, 18- external screw thread, 19- motion bar, 20- baffle, 21- reset spring.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1 to Fig. 6 is please referred to, the utility model provides a kind of technical solution: a kind of efficient circuit board electroplating device, packet
Body 1 is included, body 1 plays the role of support and protection internal element, and the upper surface in close left side is fixedly connected with control on body 1
Panel 2 processed carries out control manipulation to manipulator 4 by control panel 2, and the upper surface on close right side offers plating on body 1
Circuit board is placed on the electroplating operations realized in electroplating bath 3 to circuit board, fixed on body 1 close to the upper surface at the back side by slot 3
It is connected with manipulator 4, the pick-and-place to circuit board is realized by manipulator 4, is fixedly connected on body 1 close to the upper surface on right side
Placement mechanism 5 allows the circuit board after the completion of plating to carry out interim placement in time by the setting of placement mechanism 5, and
The electroplate liquid that circuit board surface drips is back in electroplating bath 3, is no longer continuously dripped to the remaining electroplate liquid of circuit board surface
After can to circuit board carry out next step operation.
Placement mechanism 5 includes rectangular tube 6 and shell 7, so that placement mechanism 5 and rectangular tube 6 is established connection, shell by shell 7
Body 7 is right angled triangle shell, and the inclined-plane of shell 7 is towards the right side, is right angled triangle shell by shell 7, and the inclined-plane of shell 7
Towards right setting, the electroplate liquid that the circuit board being placed in rectangular tube 6 is dripped can be fallen on the inner wall on 7 inclined-plane of shell, so
It is flow in the pipe 1 of bottom afterwards, the bottom on shell 7 close to inclined-plane is fixedly connected with triangle fixed block 14, and triangle is fixed
Inclined-plane on block 14 is fixedly connected with the inclined-plane of shell 7, and the lower surface of triangle fixed block 14 and the upper surface of body 1 are fixed
Connection can increase the contact area between body 1 by the setting of triangle fixed block 14, while provide branch for shell 7
Support, the bottom of shell 7 is fixedly connected with the upper surface of body 1, and the upper surface of shell 7 offers through-hole, shell 7 by through-hole and
The bottom of rectangular tube 6 is fixedly connected, and offers through-hole on the left of bottom on shell 7, shell 7 is fixedly connected with by through-hole
Pipe 1, the left end of pipe 1 are fixedly connected with pipe 29, and the inner wall of close right end is fixedly connected with restraining position ring block 15 on pipe 29, limits
The right side of ring 15 is connected with filter screen 16, and the right side of filter screen 16 is flexibly connected with the left end of pipe 1, passes through stop collar 15
Filter screen 16 is clamped with the left end of pipe 1, when the electroplate liquid of recycling flow to filter screen 16, one can be carried out to electroplate liquid
Secondary filtering, contaminant filter is come out, and the inner wall on pipe 29 close to right end offers internal screw thread 17, the table of close left end on pipe 1
Face offers external screw thread 18, pipe 1 and pipe 29 and is threadedly coupled by internal screw thread 17 and external screw thread 18, passes through the interior spiral shell on pipe 29
Being used cooperatively between the external screw thread 18 on line 17 and pipe 1 is detachably connected so that realizing between pipe 1 and pipe 29, from
And the convenient impurity that periodically filter screen 16 is replaced and be will filter out removes, the inner wall on rectangular tube 6 close to bottom is solid
Surely it is connected with stainless (steel) wire 10, the circuit board after the completion of plating is placed in placement mechanism 5, the remaining plating of circuit board surface
Liquid can pass through stainless (steel) wire 10 and flow in pipe 1 along the inner wall of shell 7, flow to electroplate liquid again finally by pipe 29
In electroplating bath 3, the inner wall on rectangular tube 6 close to bottom is fixedly connected with block 11, when circuit board is placed on rectangle by manipulator 4
Between block 11 and support plate 13 on 6 inner wall of pipe, the bottom on the left of circuit board is supported and is fixed by block 11
Block 12 is supported the top on the right side of circuit board, makes circuit board is tiltable to be placed in rectangular tube 6, recycles stainless (steel) wire
10 pairs of circuit boards carry out the support of bottom, make what circuit board can be stable to be placed in rectangular tube 6, the right side of block 11 and circuit board
Surface activity connection, the inner wall on rectangular tube 6 close to top is fixedly connected with fixed block 12, and the side of fixed block 12 offers
Through-hole, fixed block 12 are connected with motion bar 19, the fixed company in the left end of motion bar 19 and the right side of support plate 13 by through-hole
It connects, the right end of motion bar 19 is fixedly connected with baffle 20, and the left side of baffle 20 is fixedly connected with reset spring 21, reset spring 21
Left end be fixedly connected with the right side of fixed block 12, pass through block 11, fixed block 12, motion bar 19, baffle 20, reset spring 21
And being used cooperatively between support plate 13, circuit board can be clamped and be supported by block 11 and support plate 13, and circuit board is made
On the tiltable stainless (steel) wire 10 being placed in rectangular tube 6, while reset spring 21 is absorbable and filters out in placement circuit
Plate makes the vibration generated, and the left side of fixed block 12 is connected with support plate 13, the left side of support plate 13 and the surface of circuit board
It is flexibly connected.
Working principle: the efficient circuit board electroplating device when in use, when circuit board is placed on rectangular tube by manipulator 4
Between block 11 on 6 inner walls and support plate 13, the bottom on the left of circuit board is supported by block 11 and fixed block
Top on the right side of 12 pairs of circuit boards is supported, and makes circuit board is tiltable to be placed in rectangular tube 6, recycles stainless (steel) wire 10
The support that bottom is carried out to circuit board makes what circuit board can be stable to be placed in rectangular tube 6, the remaining electroplate liquid of circuit board surface
It can be flow in pipe 1 across stainless (steel) wire 10 and along the inner wall of shell 7, so that electroplate liquid is flow to electricity again finally by pipe 29
In coating bath 3.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of efficient circuit board electroplating device, including body (1), the upper surface on the body (1) close to left side is fixed
It is connected with control panel (2), the upper surface on the body (1) close to right side offers electroplating bath (3), on the body (1)
Upper surface close to the back side is fixedly connected with manipulator (4), it is characterised in that: close to the upper surface on right side on the body (1)
It is fixedly connected with placement mechanism (5)；
The placement mechanism (5) includes rectangular tube (6) and shell (7), the upper surface of the bottom and body (1) of the shell (7)
It is fixedly connected, the upper surface of the shell (7) offers through-hole, and the shell (7) is solid by the bottom of through-hole and rectangular tube (6)
It is fixed to connect, through-hole is offered on the left of bottom on the shell (7), the shell (7) is fixedly connected with pipe by through-hole
One (8), the left end of the pipe one (8) are fixedly connected with pipe two (9), and the inner wall of close bottom is fixed on the rectangular tube (6) connects
It is connected to stainless (steel) wire (10), the inner wall on the rectangular tube (6) close to bottom is fixedly connected with block (11), the block (11)
Right side and the surface activity of circuit board connect, the inner wall on the rectangular tube (6) close to top is fixedly connected with fixed block
(12), it is connected with support plate (13) on the left of the fixed block (12), the left side of the support plate (13) and circuit board
Surface activity connection.
2. a kind of efficient circuit board electroplating device according to claim 1, it is characterised in that: the shell (7) is straight
Angle triangle shell, and the inclined-plane of shell (7) is towards the right side.
3. a kind of efficient circuit board electroplating device according to claim 1, it is characterised in that: leaned on the shell (7)
The bottom on nearly inclined-plane is fixedly connected with triangle fixed block (14), the inclined-plane on the triangle fixed block (14) and shell (7)
Inclined-plane be fixedly connected, and the lower surface of triangle fixed block (14) is fixedly connected with the upper surface of body (1).
4. a kind of efficient circuit board electroplating device according to claim 1, it is characterised in that: leaned on the pipe two (9)
The inner wall of nearly right end is fixedly connected restraining position ring block (15), is connected with filter screen (16), institute on the right side of the stop collar (15)
The right side for stating filter screen (16) is flexibly connected with the left end of pipe one (8).
5. a kind of efficient circuit board electroplating device according to claim 1, it is characterised in that: leaned on the pipe two (9)
The inner wall of nearly right end offers internal screw thread (17), and the surface on the pipe one (8) close to left end offers external screw thread (18), described
Pipe one (8) and pipe two (9) are threadedly coupled by internal screw thread (17) and external screw thread (18).
6. a kind of efficient circuit board electroplating device according to claim 1, it is characterised in that: the fixed block (12)
Side offers through-hole, and the fixed block (12) is connected with motion bar (19) by through-hole, a left side for the motion bar (19)
It holds and is fixedly connected on the right side of support plate (13), the right end of the motion bar (19) is fixedly connected with baffle (20), the baffle
(20) it is fixedly connected on the left of reset spring (21), the left end of the reset spring (21) and the right side of fixed block (12) are fixed
Connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820606086.6U CN208250445U (en) | 2018-04-26 | 2018-04-26 | A kind of efficient circuit board electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820606086.6U CN208250445U (en) | 2018-04-26 | 2018-04-26 | A kind of efficient circuit board electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208250445U true CN208250445U (en) | 2018-12-18 |
Family
ID=64637408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820606086.6U Expired - Fee Related CN208250445U (en) | 2018-04-26 | 2018-04-26 | A kind of efficient circuit board electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208250445U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110306230A (en) * | 2019-06-26 | 2019-10-08 | 南安易盾格商贸有限公司 | A kind of electroplating device of flexible circuit board manufacture |
| CN111455440A (en) * | 2020-05-18 | 2020-07-28 | 华福(上海)环保科技有限公司 | Electroplating equipment and electroplating method thereof |
| CN115573019A (en) * | 2022-12-09 | 2023-01-06 | 宁波德洲精密电子有限公司 | Electroplating cabinet for lead frame |
-
2018
- 2018-04-26 CN CN201820606086.6U patent/CN208250445U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110306230A (en) * | 2019-06-26 | 2019-10-08 | 南安易盾格商贸有限公司 | A kind of electroplating device of flexible circuit board manufacture |
| CN111455440A (en) * | 2020-05-18 | 2020-07-28 | 华福(上海)环保科技有限公司 | Electroplating equipment and electroplating method thereof |
| CN111455440B (en) * | 2020-05-18 | 2021-03-26 | 华福(上海)环保科技有限公司 | Electroplating equipment and electroplating method thereof |
| CN115573019A (en) * | 2022-12-09 | 2023-01-06 | 宁波德洲精密电子有限公司 | Electroplating cabinet for lead frame |
| CN115573019B (en) * | 2022-12-09 | 2023-02-17 | 宁波德洲精密电子有限公司 | Electroplating cabinet for lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190826 Address after: 341600 Shuidong Avenue, Xinfeng County Industrial Park, Ganzhou City, Jiangxi Province Patentee after: Xinfeng Kangda Electronics Co., Ltd. Address before: No. 37, Panjiacun, Datang Town, Zhuji City, Shaoxing City, Zhejiang Province, 311800 Patentee before: Yuan Haixiang |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181218 Termination date: 20210426 |