CN115573019B - Electroplating cabinet for lead frame - Google Patents
Electroplating cabinet for lead frame Download PDFInfo
- Publication number
- CN115573019B CN115573019B CN202211575708.0A CN202211575708A CN115573019B CN 115573019 B CN115573019 B CN 115573019B CN 202211575708 A CN202211575708 A CN 202211575708A CN 115573019 B CN115573019 B CN 115573019B
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- plate
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- fixedly connected
- lead frame
- cavity
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- 238000009713 electroplating Methods 0.000 title claims abstract description 29
- 238000009434 installation Methods 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 claims description 8
- 238000001125 extrusion Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 10
- 238000007789 sealing Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000001174 ascending effect Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 241000417436 Arcotheres Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a lead frame electroplating cabinet, which comprises a bottom box and an installation cavity fixedly communicated with the upper end of the bottom box, wherein a fixed plate is fixedly connected in the installation cavity, a placing plate is connected in the installation cavity in a sliding manner, a clamping part is installed on the placing plate and comprises sliding rods, square plates, clamping plates, transverse plates, L-shaped plates and inclined rods, the transverse plates are respectively arranged on the placing plate in an equidistant array mode, the two sliding rods are respectively and fixedly connected to the two ends of the transverse plates, the sliding rods are connected to the placing plate in a sliding manner, the square plates are fixedly connected to the transverse plates, and the two L-shaped plates are both fixedly connected to the square plates.
Description
Technical Field
The invention relates to the technical field of lead frame electroplating, in particular to a lead frame electroplating cabinet.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a lead-out end of an internal circuit of a chip and an external lead by means of a bonding material to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks, and is an important basic material in the electronic information industry.
When the existing lead frame is electroplated, the lead frame is placed in liquid for electroplating treatment in most of time, and when the lead frame is taken out from the liquid, the surface of the lead frame is always required to wait for the excessive liquid to automatically fall into electroplating liquid to take away the lead frame, so that more time is delayed, and the subsequent rapid processing of the lead frame is not facilitated.
Disclosure of Invention
The invention aims to solve the following defects in the prior art, and provides a lead frame electroplating cabinet which aims to solve the problems that more redundant liquid is adhered to the surface of a lead frame, the redundant liquid is required to automatically fall into electroplating liquid to take away the lead frame, so that more time is delayed, and the subsequent rapid processing of the lead frame is not facilitated.
In order to achieve the purpose, the invention adopts the following technical scheme:
a lead frame electroplating cabinet comprises a bottom box and an installation cavity fixedly communicated with the upper end of the bottom box, wherein a fixing plate is fixedly connected in the installation cavity;
the mounting cavity is internally and slidably connected with a placing plate, a clamping part is arranged on the placing plate and comprises sliding rods, square plates, clamping plates, transverse plates, L-shaped plates and inclined rods, the transverse plates are respectively arrayed on the placing plate in an equidistant mode, the two sliding rods are respectively and fixedly connected to two ends of each transverse plate, the sliding rods are slidably connected to the placing plate, the square plates are fixedly connected to the transverse plates, the two L-shaped plates are both fixedly connected to the square plates, the two clamping plates are both slidably connected to the square plates, and the inclined rods are hinged between the clamping plates and the placing plate;
the fixed plate is provided with a pressing part, the pressing part comprises a sealing cavity, a piston plate, a pressing plate and a pushing plate, the sealing cavity is fixedly connected onto the fixed plate, one end of the piston plate is slidably connected into the sealing cavity, one end of the fixed plate is provided with a groove, one end of each of the pressing plates is hinged into the groove, and the pushing plate is fixedly connected onto the other end of the piston plate.
Preferably, the clamping member includes first springs, and the first springs are fixedly connected between the horizontal plate and the placing plate, respectively.
Preferably, the pressing element further includes a rotating rod and a torsion spring, the rotating rod is fixedly connected between the two pressing plates, and the two torsion springs are respectively and fixedly connected between the rotating rod and the fixing plate.
Preferably, the T-shaped plates are fixedly connected to two opposite side walls of the installation cavity respectively, the T-shaped plates are provided with driving parts respectively, each driving part comprises a triangular plate, an arc-shaped plate and a rotating wheel, the triangular plate is fixedly connected to the T-shaped plates, the arc-shaped plates are rotatably connected to the triangular plates, and the rotating wheels are rotatably connected to one ends of the arc-shaped plates.
Preferably, the driving part further comprises a rotating shaft and a closed cavity, the rotating shaft is connected to the rotating wheel in a sliding mode, the closed cavity is connected to the side wall of the installation cavity in a sliding mode, and one end, far away from the rotating wheel, of the rotating shaft is connected to the side wall of the closed cavity in a threaded mode.
Preferably, the two ends of the bottom box are respectively fixedly connected with a telescopic cavity, the upper end of the telescopic cavity is fixedly connected with a connecting rod, the bottom box is slidably connected with a storage cavity, the storage cavity is fixedly connected between the two connecting rods, and the closed cavity is fixedly communicated with the telescopic cavity through a gas pipe.
Preferably, fixedly connected with backup pad on the set-square, fixedly connected with drum in the backup pad, sliding connection has the stripper bar in the backup pad, stripper bar upper end sliding connection be in the drum, stripper bar lower extreme sliding connection be in the arc other end, the arc with fixedly connected with second spring between the backup pad, the drum with fixed intercommunication has the intake pipe between the sealed chamber.
Compared with the prior art, the invention has the beneficial effects that:
1. drive arc one end all the time and have ascending trend under the pulling force of second spring to the runner can tightly be extruded on placing the board, has fixed effect to placing the board, reaches the stable electroplating process of lead frame.
2. When the diaphragm moves down, receive the extrusion of down tube and promote the splint and remove, can extrude the L template with the lead frame at splint removal in-process to have the effect fixed to the lead frame centre gripping.
3. Can toward sealing the intracavity when the pivot is rotatory and removing to carry the gas that seals the intracavity to flexible intracavity through the gas-supply pipe, and flexible intracavity extends because of gaseous increasing, thereby can promote the connecting rod and shift up, and the storage chamber shifts up along with two connecting rods, and the cooperation lead frame moves down, thereby the lead frame can remove and electroplate to the storage intracavity, makes in the entering plating solution that the lead frame can be stable.
4. Move to the maximum position on the diaphragm when, can produce vibrations, and lead frame to on the L template has the vibrations effect, can just break away from the lead frame fast with lead frame surface adhesion's plating solution and avoid waiting, can go up the lead frame and move the back, remove fast and take away, the plating solution that breaks away from the lead frame simultaneously can fall into the storage intracavity, the effect of the material of sparingly electroplating has, through along with moving up of diaphragm, thereby splint keep away from the L template and do not have the effect of centre gripping to the lead frame, be convenient for take away the lead frame after electroplating.
Drawings
FIG. 1 is a schematic front view of a lead frame electroplating cabinet according to the present invention;
FIG. 2 is a schematic diagram of an L-shaped board structure of a lead frame electroplating cabinet according to the present invention;
FIG. 3 is a schematic view of a pressing plate structure of a lead frame electroplating cabinet according to the present invention;
fig. 4 is a schematic diagram of a cylinder structure of a lead frame electroplating cabinet according to the present invention.
In the figure: 1 installation cavity, 2 fixed plates, 3 sealed cavities, 4 storage cavities, 5 bottom boxes, 6 telescopic cavities, 7 connecting rods, 8 gas conveying pipes, 9 closed cavities, 10 first springs, 11 transverse plates, 12 placing plates, 13 bumps, 14 cylinders, 15 gas inlet pipes, 16 triangular plates, 17 arc-shaped plates, 18 rotating shafts, 19 inclined rods, 20 square plates, 21 clamping plates, 22 sliding rods, 23L-shaped plates, 24 pressing plates, 25 rotating rods, 26 torsion springs, 27 pushing plates, 28 piston plates, 29 rotating wheels, 30 supporting plates, 31 second springs, 32 extrusion rods and 33T-shaped plates.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, a lead frame electroplating cabinet comprises a bottom case 5 and an installation cavity 1 fixedly communicated with the upper end of the bottom case 5, wherein a fixed plate 2 is fixedly connected in the installation cavity 1, and the fixed plate 2 is used for pressing a transverse plate 11;
sliding connection places board 12 in installation cavity 1, place board 12 and be horizontal slip in installation cavity 1, place and install clamping part on board 12, clamping part includes slide bar 22, square board 20, splint 21, diaphragm 11, L template 23, down tube 19, a plurality of diaphragms 11 are the equidistance array respectively on placing board 12, two slide bar 22 are fixed connection respectively at diaphragm 11 both ends, diaphragm 11 is with sliding connection from top to bottom on placing board 12 through both ends fixed connection's slide bar 22, slide bar 22 sliding connection is on placing board 12, square board 20 fixed connection is on diaphragm 11, two equal fixed connection of L template 23 are on square board 20, the lead frame can be placed to L template 23 lower extreme, splint 21 is when to the square removal of L template 23, can carry out the centre gripping to the lead frame upper end, reach the fixed effect to the lead frame, two equal sliding connection of splint 21 are on square board 20, down tube 19 articulates between splint 21 and placing board 12, compare in placing board 12 when moving down at diaphragm 11 and square board 20, splint 21 can receive the spacing template of down tube 19, thereby promote the splint 21 to the direction removal of L23.
The fixing plate 2 is provided with a pressing part, the pressing part comprises a sealing cavity 3, a piston plate 28, a pressing plate 24 and a push plate 27, the sealing cavity 3 is fixedly connected on the fixing plate 2, one end of the piston plate 28 is slidably connected in the sealing cavity 3, one end of the fixing plate 2 is provided with a groove, one end of each of the two pressing plates 24 is hinged in the groove, the push plate 27 is fixedly connected at the other end of the piston plate 28, the sealing cavity 3 increases gas and pushes the piston plate 28 to move, the piston plate 28 can push the pressing plate 24 to be changed from an inclined state to a horizontal state with the push plate 27 in various countries, the transverse plate 11 moving downwards can be extruded in the process that the pressing plate 24 is changed from the inclined state to the horizontal state, meanwhile, along with the movement of the placing plate 12, the transverse plate enters the lower side of the fixing plate 2, when the transverse plate 11 is pressed to the lower side of the fixing plate 2 once, the lead frame can be quickly fixed, and along with the upward movement of the storage cavity 4, the lead frame can slowly enter the storage cavity 4 for electroplating, the rotating rod 25 and the rotating spring 26 is fixedly connected between the rotating rod 24, and the pressing plate 24 is not reset state when the pressing plate 24 is changed into the horizontal pressing plate 24.
Fixed being connected with T template 33 on 1 two relative lateral walls in installation cavity respectively, driver part is installed respectively to two T templates 33, driver part includes set-square 16, arc 17, runner 29, set-square 16 fixed connection is on T template 33, arc 17 rotates to be connected on set-square 16, runner 29 rotates to be connected at arc 17 wherein one end, driver part still includes pivot 18, closed chamber 9, 18 sliding connection of pivot is on runner 29, 9 sliding connection of closed chamber is on 1 lateral wall in installation cavity, 18 one end threaded connection who keeps away from runner 29 of pivot is on the 9 lateral walls in closed chamber, when runner 29 is rotatory, can be to 9 inside removal in closed chamber, and extrude the gas in the closed chamber 9.
5 both ends of under casing are the flexible chamber 6 of fixedly connected with respectively, and 6 upper ends fixedly connected with connecting rod 7 in flexible chamber, and 5 sliding connection of under casing have storage chamber 4, and the flourishing plating solution of storage chamber 4 dress, 4 fixed connection of storage chamber between two connecting rods 7, and it has gas-supply pipe 8 to seal fixed intercommunication between chamber 9 and the flexible chamber 6, and the gas that seals in the chamber 9 passes through gas-supply pipe 8 and transmits to flexible chamber 6 in, and flexible chamber 6 extends and promotes storage chamber 4 and moves upward.
Fixedly connected with backup pad 30 on the set-square 16, fixedly connected with drum 14 on the backup pad 30, sliding connection has the stripper bar 32 on the backup pad 30, stripper bar 32 upper end sliding connection is in drum 14, stripper bar 32 lower extreme sliding connection is at the arc 17 other end, fixedly connected with second spring 31 between arc 17 and the backup pad 30, it has intake pipe 15 to be fixed the intercommunication between drum 14 and the sealed chamber 3, second spring 31 has ascending pulling force to the one end of arc 17 all the time.
In the invention, when the electroplating device is used, the placing plate 12 is pulled firstly, so that the placing plate 12 slides towards the direction far away from the installation cavity 1, a plurality of lead frames are placed on the L-shaped plates 23 respectively, then the placing plate 12 is pushed to move towards the direction close to the installation cavity 1, the rotating wheel 29 is pushed to move upwards along with the movement of the placing plate 12, so that the placing plate 12 is positioned at the lower side of the rotating wheel 29, the arc-shaped plate 17 rotates due to the upward movement of the rotating wheel 29, the other one moves downwards, the extrusion rod 32 is pulled to move downwards in the cylinder 14, the second spring 31 is stretched, one end of the arc-shaped plate 17 is driven to have an upward trend under the pulling force of the second spring 31, and therefore, the rotating wheel 29 can be tightly extruded on the placing plate 12, the placing plate 12 has a fixing effect, and stable electroplating processing of the lead frames is achieved.
Meanwhile, along with the movement of the placing plate 12, the rotating wheel 29 is limited by the bump 13, so that the arc-shaped plate 17 swings back and forth, thereby pushing the extruding rod 32 to slide up and down on the cylinder 14, when the extruding rod 32 slides up on the cylinder 14, gas in the cylinder 14 can be pushed to be conveyed into the sealed cavity 3 through the air inlet pipe 15, and the piston plate 28 and the pushing plate 27 are pushed to move, so that the pushing plate 27 extrudes the two pressing plates 24, so that the pressing plates 24 have an inclined state and are pressed to a horizontal state, and simultaneously the rotating rod 25 is driven to rotate and the torsion spring 26 is driven to twist, so that the transverse plates 11 which move forward are extruded to move down in the rotating process of the pressing plates 24, and the first spring 10 is extruded, and when the transverse plates 11 move down, the L-shaped plate 23 and the lead frame can be pushed to move down, along with the reciprocating up and down movement of the arc-shaped plate 17, so that the pressing plates 24 can swing back and forth and pressurize the transverse plates 11, thereby the transverse plates 11 can be sequentially pressed to the lower sides of the fixing plates 2 and slide on the lower surface of the fixing plate 2, and when the transverse plates 11 move down, the inclined rod 19 pushes the lead frame 21 to move, and the lead frame 23 to fix the lead frame, thereby the lead frame 23 and fix the lead frame.
Simultaneously can drive the pivot 18 rotatory when runner 29 is rotatory, pivot 18 and one of them lateral wall threaded connection of closed chamber 9, consequently can move in closed chamber 9 when pivot 18 is rotatory, and carry the gas in the closed chamber 9 to flexible chamber 6 in through gas-supply pipe 8, and stretch out and draw back in the chamber 6 because of the gas increase extension, thereby can promote connecting rod 7 and move up, and storage chamber 4 moves up along with two connecting rods 7, and the cooperation lead frame moves down, thereby the lead frame can move and electroplate in the storage chamber 4, make the lead frame can be stable in the entering plating solution.
When needs take out lead frame, place the square removal that board 12 kept away from installation cavity 1 at this pulling, and make diaphragm 11 keep away from fixed plate 2 in proper order, when fixed plate 2 was kept away from to diaphragm 11, diaphragm 11 shifts up fast under the elasticity of first spring 10, when moving to the maximum position on diaphragm 11, can produce vibrations, and have the vibrations effect to the lead frame on the L template 23, can just break away from the lead frame fast with lead frame surface attached plating solution and avoid waiting, can move the back on the lead frame, remove fast and take away, the plating solution that breaks away from the lead frame simultaneously can fall into storage cavity 4, the effect of electroplating material sparingly has, through shifting up along with diaphragm 11, thereby splint 21 keeps away from L template 23 and does not have the effect of centre gripping to the lead frame, be convenient for take away the lead frame after electroplating.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. A lead frame electroplating cabinet comprises a bottom box (5) and an installation cavity (1) fixedly communicated with the upper end of the bottom box (5), and is characterized in that a fixing plate (2) is fixedly connected in the installation cavity (1);
the mounting structure is characterized in that a placing plate (12) is connected in the mounting cavity (1) in a sliding manner, a clamping part is mounted on the placing plate (12), the clamping part comprises sliding rods (22), square plates (20), clamping plates (21), transverse plates (11), L-shaped plates (23) and inclined rods (19), the transverse plates (11) are arranged on the placing plate (12) in an equidistant array mode respectively, the two sliding rods (22) are fixedly connected to two ends of the transverse plates (11) respectively, the sliding rods (22) are connected to the placing plate (12) in a sliding manner, the square plates (20) are fixedly connected to the transverse plates (11), the two L-shaped plates (23) are fixedly connected to the square plates (20), the two clamping plates (21) are connected to the square plates (20) in a sliding manner, and the inclined rods (19) are hinged between the clamping plates (21) and the placing plate (12);
install the pressing part on fixed plate (2), the pressing part includes sealed chamber (3), piston board (28), presses pressing plate (24), push pedal (27), sealed chamber (3) fixed connection in fixed plate (2) are last, wherein one end sliding connection of piston board (28) is in sealed chamber (3), fixed plate (2) wherein one end is seted up flutedly, two press pressing plate (24) wherein one end articulate respectively in the recess, push pedal (27) fixed connection be in the piston board (28) other end.
2. Lead frame plating cabinet according to claim 1, characterized in that said clamping means comprise first springs (10), a plurality of said first springs (10) being fixedly connected between said horizontal plate (11) and said placing plate (12), respectively.
3. The lead frame electroplating cabinet according to claim 1, wherein the pressing element further comprises a rotating rod (25) and a torsion spring (26), the rotating rod (25) is fixedly connected between the two pressing plates (24), and the two torsion springs (26) are respectively and fixedly connected between the rotating rod (25) and the fixing plate (2).
4. Lead frame electroplating cabinet according to claim 1, characterized in that two opposite side walls of the mounting cavity (1) are fixedly connected with T-shaped plates (33), two T-shaped plates (33) are respectively provided with a driving part, the driving part comprises a triangular plate (16), an arc-shaped plate (17) and a rotating wheel (29), the triangular plate (16) is fixedly connected to the T-shaped plates (33), the arc-shaped plate (17) is rotatably connected to the triangular plate (16), and the rotating wheel (29) is rotatably connected to one end of the arc-shaped plate (17).
5. Lead frame electroplating cabinet according to claim 4, characterized in that the driving part further comprises a rotating shaft (18) and a closed cavity (9), the rotating shaft (18) is slidably connected to the rotating wheel (29), the closed cavity (9) is slidably connected to the side wall of the mounting cavity (1), and one end of the rotating shaft (18) far away from the rotating wheel (29) is screwed to the side wall of the closed cavity (9).
6. The lead frame electroplating cabinet according to claim 5, characterized in that two ends of the bottom box (5) are respectively and fixedly connected with a telescopic cavity (6), the upper end of the telescopic cavity (6) is fixedly connected with a connecting rod (7), the bottom box (5) is slidably connected with a storage cavity (4), the storage cavity (4) is fixedly connected between the two connecting rods (7), and a gas pipe (8) is fixedly communicated between the closed cavity (9) and the telescopic cavity (6).
7. The lead frame electroplating cabinet according to claim 4, characterized in that a supporting plate (30) is fixedly connected to the triangular plate (16), a cylinder (14) is fixedly connected to the supporting plate (30), an extrusion rod (32) is slidably connected to the supporting plate (30), the upper end of the extrusion rod (32) is slidably connected to the inside of the cylinder (14), the lower end of the extrusion rod (32) is slidably connected to the other end of the arc-shaped plate (17), a second spring (31) is fixedly connected between the arc-shaped plate (17) and the supporting plate (30), and an air inlet pipe (15) is fixedly communicated between the cylinder (14) and the sealed cavity (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211575708.0A CN115573019B (en) | 2022-12-09 | 2022-12-09 | Electroplating cabinet for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211575708.0A CN115573019B (en) | 2022-12-09 | 2022-12-09 | Electroplating cabinet for lead frame |
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| Publication Number | Publication Date |
|---|---|
| CN115573019A CN115573019A (en) | 2023-01-06 |
| CN115573019B true CN115573019B (en) | 2023-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211575708.0A Active CN115573019B (en) | 2022-12-09 | 2022-12-09 | Electroplating cabinet for lead frame |
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| US8298395B2 (en) * | 1999-06-30 | 2012-10-30 | Chema Technology, Inc. | Electroplating apparatus |
| JP6234731B2 (en) * | 2013-08-08 | 2017-11-22 | 上村工業株式会社 | Holder with clamper |
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| JP2006237269A (en) * | 2005-02-24 | 2006-09-07 | Sumitomo Metal Electronics Devices Inc | Printed wiring board and printed wiring board holding tool for holding the same |
| WO2008081490A1 (en) * | 2007-01-03 | 2008-07-10 | Occleppo S.R.L. | Gripping device and clamping pincers with double cathode contact on both sides of a dielectric substratum to be electroplated |
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| JP2012087367A (en) * | 2010-10-20 | 2012-05-10 | Mitomo Semicon Engineering Kk | Continuous partial-plating device, and continuous partial-plating method using the same |
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| CN114059134A (en) * | 2021-11-15 | 2022-02-18 | 东莞奥美特科技有限公司 | High-density multi-row frame electroplating device |
| CN217733319U (en) * | 2022-05-31 | 2022-11-04 | 东莞奥美特科技有限公司 | Double-side hanging plating device for integrated circuit lead frame |
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| Publication number | Publication date |
|---|---|
| CN115573019A (en) | 2023-01-06 |
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Denomination of invention: A lead frame electroplating cabinet Effective date of registration: 20231007 Granted publication date: 20230217 Pledgee: Ningbo Yinzhou Rural Commercial Bank Co.,Ltd. Zhonggongmiao Branch Pledgor: NINGBO DEZHOU PRECISION ELECTRONIC CO.,LTD. Registration number: Y2023330002221 |
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